Abstract: A glass-ceramic composition contains first ceramic particles principally containing forsterite; second ceramic particles principally containing at least one selected from the group consisting of calcium titanate, strontium titanate, and titanium oxide; and borosilicate glass particles containing about 3% to 15% lithium oxide, about 20% to 50% magnesium oxide, about 15% to 30% boron oxide, about 10% to 45% silicon oxide, about 6% to 20% zinc oxide, 0% to about 15% aluminum oxide, and at least one additive selected from the group consisting of calcium oxide, barium oxide, and strontium oxide on a weight basis. The content of the borosilicate glass particles is about 3% or more; the lower limit of the content of the additive is about 2%; and the upper limit of the additive content is about 15%, about 25%, or about 25% when the additive is calcium oxide, barium oxide, or strontium oxide, respectively, on a weight basis.

Abstract: A process for the production of a decorative glass element, in which a surface structure is introduced, preferably in an irregular pattern, into one or more regions of the surface of a glass body by mechanical and/or chemical treatment, wherein a coating (4, 4?) is applied region-wise to the surface of the glass body (6).

Abstract: An insulating ceramic composition forming insulating ceramic layers (3) stacked in a multilayer ceramic substrate (2) used in a monolithic ceramic electronic component, such as a multilayer ceramic module (1). The insulating ceramic composition contains a first ceramic powder mainly containing forsterite, a second ceramic powder mainly containing at least one compound selected from the group consisting of CaTiO3, SrTiO3, and TiO2, and a borosilicate glass powder. The borosilicate glass powder contains 3 to 15 percent by weight of lithium in terms of Li2O, 30 to 50 percent by weight of magnesium in terms of MgO, 15 to 30 percent by weight of boron in terms of B2O3, 10 to 35 percent by weight of silicon in terms of SiO2, 6 to 20 percent by weight of zinc in terms of ZnO, and 0 to 15 percent by weight of aluminum in terms of Al2O3. The insulating ceramic composition can be fired at a temperature of 1000° C.

Abstract: An artificial receptor comprises a non-biological surface having unique surface electrical properties that vary over its extent, the electrical properties being such as to configure an electrical field about the surface to provide specific binding for a target moiety such as a biological moiety.

Abstract: A first ceramic substrate includes a substrate (2) and a glaze layer (3), wherein the glaze layer has a surface having an Ra of 0.02 ?m or less and a Ry of 0.25 ?m or less. A second ceramic substrate is formed by subjecting a glass layer (24) formed on a surface of a substrate (2) to heating-and-pressurizing treatment, thereby forming a glaze layer (3) on the substrate (2), and planarization-polishing the surface of the glaze layer. A third ceramic substrate includes a substrate (2), a glaze layer (3) containing substantially no pores formed on the substrate (2) and the surface thereof being planarization-polished, and a wiring pattern (21), wherein at least one first end of the wiring pattern is exposed to the glaze layer (3) surface of the substrate (1), and at least one second end is exposed to another surface of the substrate (1).

Abstract: A ceramic substrate for a thin film electronic component, a production method thereof, and a thin film electronic component using the ceramic substrate A first substrate (1) includes a dense glass-ceramic mixed layer (33) containing glass in its surface portion. A second substrate is prepared such that a glass layer (32) formed on a surface of a substrate base portion (2) is subjected to a heat-pressure treatment so as to form or rather partly change the glass portion (32) into a dense glass-ceramic mixed layer (33) in which glass is dispersed into a surface portion of the substrate base portion (2). A surface of the dense glass-ceramic mixed layer (33) is then subjected to grinding or rather polishing to flatten and expose a surface of the dense glass-ceramic mixed layer (32). A third substrate includes a substrate base portion (2) having a dense glass-ceramic mixed layer (33) containing glass on a surface portion in one face side, and a wiring pattern (21) formed inside the substrate base portion (2).

Abstract: A composite structure comprising at least one transparent or translucent panel member having at least two surfaces to said panel member wherein at least one of said surfaces has a adhesive and/or sealant comprising a hot melt vulcanizate composition disposed on at least a portion thereof; wherein said hot melt vulcanizate composition is made by the process comprising: In one embodiment herein there is provided a hot melt vulcanizate composition made by the process comprising: a) producing a reaction product (i) from (1) at least one first resin selected from the group consisting of thermoplastic polymer and elastomeric polymer, (2) at least one unsaturated carboxylic acid anhydride, (3) at least one alkylamine possessing two or more amine functionalities, and optionally (4) at least one free-radical generating catalyst, and wherein said reaction product (i) optionally further comprises, at least one first additive; and, optionally, b) blending said reaction product (i) with at least one second resin select

Abstract: Disclosed is a wallcovering assembly consisting of a base material and at least one ceramic coating/topcoat with or without an optional ceramic interlayer.

Abstract: The invention relates to a ceramic green body consisting of at least two ceramic bodies that are bonded together. The invention is characterized in that the green body is produced using an adhesive tape that consists of an adhesive film located on a release liner.

Abstract: A dielectric ceramic composition, comprising a main component including at least a dielectric oxide having a composition expressed by [(CaxSr1-x)O]m[(TiyZr1-y-zHfz)O2], a first subcomponent including a Mn oxide and/or an Al oxide and a glass component, wherein “m”, “x”, “y” and “z” indicating composition mole ratios in the formula included in the main component are in relationships of 0.90?m?1.04, preferably 1.005?m?1.025, 0.5?x<1, preferably 0.6?x?0.9, 0.01?y?0.10, preferably 0.02?y?0.07 and 0<z?0.20, preferably 0<z?0.10.

Abstract: A method for making a glazed panel, such as a stained glass window, using a hot melt adhesive instead of a conventional, noisome, slow-drying putty, includes the provision of a glass pane, such as a leaded or stained glass pane, having a peripheral margin, a soft metal came, such as a lead came, having a U-shaped channel configured to receive the peripheral margin of the glass pane, and an elongated strip of a hot melt adhesive disposed in the channel of the came. The glass pane is heated, e.g., with a hot air gun, to a temperature above the melting point of the adhesive and its peripheral margin is then inserted into the channel of the came such that the heated peripheral margin of the glass causes the adhesive to melt and adhere the peripheral margin of the glass pane to the interior surface of the channel of the came.

Abstract: A dielectric material comprising: a glass powder constituted of a glass comprising Si, B and an alkali metal element, the glass being amorphous in sintering at a temperature of 1,050° C. or lower; and a ceramic filler comprising at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and an alkali metal element, wherein when a total sum of Si converted into SiO2, B converted into B2O3 and the alkali metal element converted into A2O, wherein A represents an alkali metal element, all of which are contained in the glass, is 100 mole %, the content of the alkali metal element converted into A2O, which is contained in the glass, is 0.5 mole % or less; and when a total sum of at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and the alkali metal element converted into A2O, all of which are contained in the ceramic filler, is 100 mole %, a content of the alkali metal element converted into A2O, which is contained in the ceramic filler, is 0.5 mole % or less.

Abstract: A thick film composition consisting essentially of: a) electrically conductive powder; b) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO2 during firing and any one of the following compounds: Sb2O3, CO3O4, PbO, Fe2O3, SnO2, ZrO2, MnO, CuOx and mixtures thereof; and c) an organic medium.

Abstract: The hue variable retroreflective sheet of the present invention includes: a surface layer (1) composed of at least one layer; and a plurality of retroreflective elements (3, 4, 5) that are positioned beneath the surface layer, wherein the retroreflective elements (3, 4, 5) retroreflect incident light toward a light source direction, at least one layer of the surface layer (1) is an optical coherent layer that changes in color depending on a point of view, and in which an optical coherent coloring material with a core material having a surface that is covered with one or more substantially transparent coating layer is dispersed, and mirror-reflects the incident light toward a direction opposite to the light source side, at least one layer of the retroreflective sheet is a colored layer containing a coloring material that colors retroreflected light, and the retroreflected light and the mirror-reflected light provide different hues.

Abstract: A composite material with a porous inorganic-nonmetallic matrix and a second material, is characterized in that the porous inorganic-nonmetallic matrix has a bending strength of ?40 MPa as measured according to ISO 6 872; the second material is an organic material which at least partly fills the pores of the porous matrix; and the composite material has a modulus of elasticity, E, of ?25 GPa as measured according to ISO 10 477.

Abstract: A fiber sheet composed of knitted, woven, or non-woven fiber, which is resistant against contamination, and such contamination is easily washed off, and is durable, and suitable for use as materials to make curtains, tapestries, screens, flags, wallpaper, and sliding screen door (fusuma), for both indoor and outdoor environments. The fiber sheet is coated on its both sides of the fiber by ceramics composed of oxidized, nitrogenous, or carbonized forms of metals such as tin, titanium, aluminum, and other metals, forming a thin contamination resistant coating. Typically, the contamination resistant coating comprises SiO2 or SnO2 or a combination/mixture of the two substances, and such coating is hard and is superior in protection against contamination.

Abstract: A copper conducting wire structure is for use in the thin-film-transistor liquid crystal display (LCD) device. The copper conducting wire structure includes at least a buffer layer and a copper layer. A fabricating method of the copper conducting wire structure includes the following steps. At first, a glass substrate is provided. Next, the buffer layer is formed on the glass substrate. The buffer layer is comprised of a copper nitride. At last, the copper layer is formed on the buffer layer.

Abstract: A high-strength, low-temperature-sintered ceramic composition having a structure comprising a SrAl2Si2O8 crystal and an Al2O3 crystal, the SrAl2Si2O8 crystal being composed of hexagonal SrAl2Si2O8 alone or hexagonal SrAl2Si2O8 and monoclinic SrAl2Si2O8, and a peak intensity ratio represented by I101/(I101+I002)×100 being 5% or more in an X-ray diffraction measurement by a Cu—K? line, wherein I101 represents a peak intensity of a (101) plane of the hexagonal SrAl2Si2O8, and I002 represents a peak intensity of a (002) plane of the monoclinic SrAl2Si2O8.

Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C.

Abstract: There is provided a multilayer ceramic device enabling achievement of secure electric connection via electroconductive members in through holes and reduction in the thickness of internal electrodes during manufacturing. In multilayer piezoelectric device 1, a melting point of a material of the electroconductive members in the through holes is higher than a melting point of a material of the internal electrodes 2 and others. For this reason, the electroconductive members in the through holes have a contraction percentage in baking smaller than that of the internal electrodes 2 and others. Therefore, contraction of the electroconductive members is relatively constricted in baking, so as to decrease the difference of contraction percentages in baking between green sheets intended for piezoelectric layers 3 and others, and the electroconductive members in the through holes. This results in preventing breakage of the electrical connection via the electroconductive members in the through holes.

Abstract: A low temperature sintering ceramic composition that can be sintered at a temperature equal to or less than 1000° C. and has low dielectric constant and dielectric loss in a high frequency region of 17 Ghz or more, an electronic component using the same and a method of fabricating the low temperature sintering ceramic are provided. The composition comprises MgO and SiO2 in sum total in the range of from 64.0 to 99.2% by mass; Bi2O3 in the range of from 0.4 to 33.0% by mass; Li2O in the range of from 0.4 to 3.0% by mass; and MgO and SiO2 are contained in the molar ratio of from 2:1 to 2:3.5, at least part thereof being contained as a complex oxide of Mg and Si.

Abstract: An interface forming method includes forming a first layer containing a first chemical element and chemisorbing on the first layer an interface layer containing at least one monolayer of the first chemical element intermixed with a second chemical element different from the first chemical element. A second layer comprising the second chemical element can be formed on the interface layer. The first layer might not substantially contain the second chemical element, the second layer might not substantially contain the first chemical element, or both. An apparatus can include a first layer containing a first chemical element, an interface layer chemisorbed on the first layer, and a second layer containing a second element on the interface layer. The interface layer can contain at least one monolayer of the first chemical element intermixed with a second chemical element different from the first chemical element.

Abstract: A ceramic laminate body, a gas sensor element employing such a ceramic laminate body and related manufacturing method are disclosed as including first and second ceramic sheets, made of material compositions different from each other, and an intermediate bonding layer, bonding the first and second ceramic sheets to each other so as to form a closed hollow space between the first and second ceramic sheets. The intermediate bonding layer has a multilayer structure including first and second unit intermediate layers laminated on each other such that innermost end portions of the first and second unit intermediate layers are displaced from each other to adapt a difference in degreasing contraction rates of associated component parts.

Abstract: A laminate includes a first ceramic green sheet, a second ceramic green sheet, and a conductor layer. The first ceramic green sheet includes ceramic powder and an organic binder and has a firing shrinkage end temperature T3. The second ceramic green sheet includes ceramic powder and an organic binder and has a firing shrinkage start temperature T2 that is higher than the firing shrinkage end temperature T3 of the first ceramic green sheet. The conductor layer includes metal powder and an organic binder and has a firing shrinkage end temperature T4 that is lower than the firing shrinkage start temperature T2 of the second ceramic green sheet.

Abstract: A method of forming a conductive pattern on a substrate. The method comprising providing a substrate carrying a conductive layer; forming a first portion of the conductive pattern by exposing the conductive layer to a laser and controlling the laser to remove conductive material around the edge(s) of desired conductive region(s) of the first portion; and laying down an etch resistant material on the conductive layer, the etch resistant material defining a second portion of the conductive pattern, removing conductive material from those areas of the second portion not covered by the etch resistant material, and then removing the etch resistant material.

Abstract: A dielectric ceramic composition characterized as containing a dielectric material which contains a dielectric composition represented by the compositional formula a.Li2O-b.(CaO1?x—SrOx)-c.R2O3-d.TiO2 (wherein x satisfies 0?x<1; R is at least one selected from La, Y and other rare-earth metals; and a, b, c and d satisfy 0?a?20 mol %, 0?b?45 mol %, 0<c?20 mol % and 40?d?80 mol %) and at least one of oxides of Group 4 and Group 14 metallic elements of the Periodic Table.

Abstract: Disclosed herein is a rigid flexible PCB having openings. The rigid flexible PCB includes a flexible section with flexibility and rigid sections being formed at the edges of the flexible section with mechanical stiffness. The flexible section comprises a flexible plane. The flexible plane comprises a base insulating layer; a wire conducting layer being adhered to one of the top side and the bottom side of the base insulating layer; and a plane conducting layer adhered to the other of the top side and the bottom side of the base insulating layer. The plane conducting layer has a plurality of openings being formed as a mesh structure. According to the rigid flexible PCB of the invention, the flexibility of the flexible section and the characteristic impedance of signal wire traces may be improved.

Abstract: A thick film composition consisting essentially of: a) electrically conductive powder; b) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO2 during firing; and c) an organic medium.

Abstract: There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate 12 is bonded to one side of a ceramic substrate 10, and a heat sink plate (metal base plate) 14 is bonded to the other side thereof. On the heat sink plate 14, a work-hardened layer 16 is formed by shot peening. On the metal circuit plate 12 of the metal/ceramic bonding substrate, semiconductor chips (Si chips) 18 are soldered (solder layer 20). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer 16) of the power module, a radiating fin 26 is mounted via a thermal grease 24 by means of screws 22 or the like.

Abstract: The composite dielectric of the present invention contains an aromatic liquid crystal polyester and a dielectric ceramic powder arranged in the aromatic liquid crystal polyester, wherein the dielectric ceramic powder exhibits a Q value greater than 650 at a frequency of 1 GHz by perturbation. A wiring board comprising a composite dielectric sheet made of a composite dielectric having such a characteristic exhibits a high dielectric constant and a low dielectric dissipation factor, thereby yielding less transmission loss, and thus can favorably be used in electronic instruments driven in high-frequency regions.

Abstract: The present invention relates to a low-temperature sintered barium titanate microwave dielectric ceramic material. The host matrix thereof can be represented by BaxTiyMzOx+2y+k, where x is 1˜6, y is 1˜17, z is 0˜1, k is 0˜3, M is an element substituting the Ba or Ti ion, for example selected from an alkali metal, an alkaline-earth metal, a transition group or a rare earth group, and preferably Ba2Ti9O20 or the host matrix containing Zr, Sn, Zn, etc. According to the present invention, a low melting glass is added and a subsequent milling operation is performed to reduce the sintering temperature of the microwave dielectric ceramic material to less than 1,000° C. The low melting glass can be for example the Ba—B—Si—Li glass, Ba—B—Zn—Si—Li glass, Ba—B—Si—Li—Cu glass or Cu—B—Zn—Si—Li glass.

Abstract: A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zirconia or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at a relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.

Abstract: A dielectric ceramic composition which can be sintered at such a temperature of about 800 to 1000° C. as to permit incorporation of and multilayer formation with a low resistant conductor such as Ag or Cu by the simultaneous sintering with the low resistant conductor, which is sintered to form dielectric ceramics having a dielectric constant ?r of not more than 10, and a resonator having a large Q×f0 value and an absolute value in temperature coefficient ?f of resonance frequency f0 of not more than 20 ppm/° C., the value being easy to be controlled. The dielectric ceramic composition contains a glass component in an amount of 5 to 150 parts by weight based on 100 parts by weight of a main component represented by general formula: aZnAl2O4-bZn2SiO4-cTiO2-dZn2TiO4, in which the molar fractions of respective components a, b, c, and d satisfy 5.0?a?80.0 mol % 5.0?b?70.0 mol %, 5.0?c?27.5 mol %, 0?d?30.

Abstract: A multilayer ceramic substrate which is obtained by firing multilayers of ceramic green sheets each having a dielectric layer, made of a glass-ceramic material comprising a mixture of alumina and a glass containing at least Si and Ca, and an electrode layer made of Ag and formed on the dielectric layer. The dielectric layer after firing includes anorthite (CaAl2Si2O8) crystals having a grain size of up to 84 nm.

Abstract: A printed circuit board for an electronic circuit, especially for the ultra-high frequencies located in the GHz range that comprises at least one conductor layer, which is arranged on top of an insulating layer and which is flatly joined to said insulating layer. Improved mechanical, thermal and electrical properties are attained by virtue of the fact that the insulating layer is a thin glass layer.

Abstract: A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate; the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes; wherein a coefficient ?1 of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient ?2 of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions: ?1<?2 ?2??1?9×10?6/° C.

Abstract: In a Group-III-element nitride semiconductor device including a Group-III-element nitride crystal layer stacked on a Group-III-element nitride crystal substrate, the substrate is produced by allowing nitrogen of nitrogen-containing gas and a Group III element to react with each other to crystallize in a melt (a flux) containing at least one of alkali metal and alkaline-earth metal, and a thin film layer is formed on the substrate and the thin film has a lower diffusion coefficient than that of the substrate with respect to impurities contained in the substrate. The present invention provides a semiconductor device in which alkali metal is prevented from diffusing.

Abstract: A dielectric ceramic composition comprising 100 moles of barium titanate as the main component, and furthermore comprising with respect to 100 moles of the main component 0.1 to 3 moles of a first subcomponent including a magnesium oxide, 0.01 to 0.5 mole (note that 0.5 is not included) of a second subcomponent including a yttrium oxide, 0.01 to 0.2 mole of a third subcomponent including a vanadium oxide, and 0.5 to 10 moles of a glass component including a silicon oxide as the main component; wherein a manganese oxide and a chrome oxide are substantially not included, and an average particle diameter of dielectric particles is 0.35 ?m or smaller.

Abstract: An oxide porcelain composition includes at least one metal element selected from Al, Si, Ba, B and Cr. The oxide porcelain composition contains about 11.5 weight percent to 60.0 weight percent of Al, in the form of Al2O3; about 4.0 weight percent to 70.0 weight percent of Si, in the form of SiO2; about 4.0 weight percent to 40.0 weight percent of Ba, in the form of BaO; about 1.0 weight percent to 30.0 weight percent of B, in the form of B2O3; and about 0.3 weight percent to 3.0 weight percent of Cr, in the form of Cr2O3.

Abstract: A ceramic fiber composite comprises ceramic fibers bonded together by an at least partially ceramic binder formed from a nanoclay and at least one of a ceramic precursor material or a ceramic material. The present invention also concerns methods of forming ceramic fiber composites and burners containing them.

Abstract: A formed substrate, wherein the surface of the valve-acting metal having a dielectric film is at least partially covered with an oxide comprising Si, valve-acting metal element and oxygen, preferably, wherein the content of Si in the formed foil having an aluminum oxide dielectric film decreases continuously from the surface of the dielectric film toward the inner part in some regions in the aluminum dielectric film thickness; a method for producing the formed substrate; and a solid electrolytic capacitor comprising a solid electrolyte on the formed substrate. A solid electrolytic capacitor manufactured by using a formed substrate according to the present invention, improved in adhesion to an electrically conducting polymer (solid electrolyte) with its area coverage contacting the polymer being sufficiently large, is increased in the electrostatic capacitance among individual capacitors and improved in the LC yield as compared with capacitors otherwise manufactured.

Abstract: The present invention relates to a display and a method for making the display comprising a substrate, an electrically modulated imaging layer, a first transparent conductive layer, and a dark light absorbing layer comprising a binder and a blend of nonconductive colorants and conductive colorants, wherein the conductive colorant is present in an amount less than 25% by weight.

Abstract: In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.

Abstract: Processes for depositing nanowires on a substrate and nanowire-based devices that can be formed using these processes are described. In one embodiment, a process includes forming an organic layer on an electrically conductive layer formed on the substrate. The organic layer includes a first region and a second region. The first region has an affinity for the nanowires and is electrically conductive. The process also includes contacting the organic layer with a composition including the nanowires dispersed in a compatible solvent for a time sufficient to selectively deposit at least one of the nanowires on the first region of the organic layer.

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract: To provide a ceramic composition and a ceramic wiring board that can be formed by the firing at a low temperature of 1,000° C. or less, has high strength and is advantageous when electronic component regions utilizing a ceramic layer are formed thereon. A raw ceramic material or calcined powder thereof having a composition consisting of 100 parts by mass of a main component that consists of 52 to 62% by mass of SiO2, 12 to 22% by mass of MgO, and 21 to 32% by mass of CaO and 0.5 to 3 parts by mass of a boron component in terms of the oxide form is molded and fired to obtain a ceramic composition that contains a diopside crystal as a primary crystal. By forming a wiring layer with conductive material on a substrate made of the ceramic composition, a ceramic wiring board is obtained.

Abstract: Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.

Abstract: A sintered ceramic has a porosity of greater than about 30 percent and less than about 80 percent by volume. Pores are filled with an epoxy resin. A filling factor of the epoxy resin is about 40 percent by volume or more. A monolithic ceramic electronic component having an inner electrode, for example, a chip inductor is manufactured with such a porous sintered ceramic. When a direct current is superimposed, the resulting monolithic ceramic electronic component has a substantially unchanged self-resonant frequency and also has a rate of decrease in impedance of about 50 percent or less at 100 MHz.

Abstract: A flexible thin layer open liquid state electrochemical cell which can be used as a primary or rechargeable power supply for various miniaturized and portable electrically powered devices of compact design. The cell includes a wet electrolyte, yet maintains a fexible, thin and open configuration, thus devoid of accumulation of gases upon storage. The cell comprising a first layer of insoluble negative pole, a second layer of insoluble positive pole and a third layer of aqueous electrolyte, the third layer being disposed between the first and second layers and including a deliquescent material for keeping the open cell wet at all times; an electroactive soluble material for obtaining required ionic conductivity; and, a watersoluble polymer for obtaining a required viscosity for adhering the first and second layers to the third layer. The electrochemical cell of the present invention is preferably produced using a suitable printing technology.

Abstract: Refractory coatings comprising unstabilized zirconia, silica, and, optionally, zircon and/or mullite are disclosed herein. The unstabilized zirconia, silica, and optional zircon and/or mullite are applied as a slurry onto ceramic substrates such as silicon carbide and fired. The refractory coatings of the present invention maintained good edge definition and color when applied to ceramic substrates and subjected to temperatures over 1100° C.