Abstract: An electrically conductive composite article consisting essentially of a main body composed of a polytetrafluoroethylene material and a plurality of electrically conductive particles, wherein an elastomer material is disposed within the main body.

Abstract: A thermoplastic compound useful in filling pores and voids in wooden materials, particularly edge regions, wherein the thermoplastic compound comprises a blend of two copolyesters and optionally fillers, wherein the first copolyester has a melting point of 140° C. to 260° C. and a glass transition temperature of −10° C. to 80° C., and wherein the second copolyester has a melting point of 120° C. to 190° C. and a glass transition temperature of −70° C. to 10° C. Also, a method of filling pores in a wooden material comprising using a thermoplastic compound having a softening point of 140° C. to 200° C., an open time of 2 to 15 seconds, and a viscosity number of 30 to 150 ml/g, with the thermoplastic compound preferably being a blend of two different copolyesters, wherein the application of such thermoplastic compounds enable the surfaces of chipboard panels and the like to be smoothed in a continuous one-pass process.

Abstract: A document feed component is presented comprising a foamed epichlorohydrin elastomer, a curing agent, and a blowing agent, wherein the document feed component has a dynamic coefficient of friction in the range of about 1.0 to about 3.0, a Shore O hardness in the range of about 2 to about 85, a compression set of less than about 12%, and a resistance to wear of less than about 0.05 g/hr. The elastomer optionally further includes activators, polymerization accelerators, and a filler material. An important feature of the present invention is that the use of a foamed epichlorohydrin elastomer does not require the use of processing aids and migratory additives.

Abstract: Three-phase composite materials system having a low dielectric constant and physico-chemical properties suitable for IC fabrication conditions, and a method for making such materials, are disclosed. The three-phase composite material includes an organic phase, an inorganic phase and a void phase. The organic phase is in the form of an organic polymer matrix, the void phase is represented by microporosity present in the matrix, and the inorganic phase is implemented as inorganic particles that are coupled, via a coupling agent, to the organic matrix. The low dielectric constant of the composite is attributable to the microporous organic polymer matrix. The inorganic particles are responsible, at least in part, for providing thermal stability and other required physico-chemical properties to the composite.