Abstract: Heat-shrinkable polyester films comprising a base film having a shrink in each direction of less than 5% at 100° C. and of at least 5% at 150° C. and at least a heat-sealable coating on at least one surface of the base film are disclosed. The film is heat-sealable and peelable in particular to polyester containers. The invention further relates to packages comprising a container, a product and the heat-shrinkable polyester film sealed onto the container. The packages are suitable for use with ready-prepared foods, so-called “ready-meals”, which are intended to be warmed in a microwave or in a conventional oven.

Abstract: The invention relates to an edge trim for pieces of furniture, comprising a molten film. In order to improve a generic edge trim such that the same is more versatile and can especially be mounted on a wider selection of surfaces, the molecular structure of the molten film contains both polar and non-polar parts.

Abstract: A method for reinforcing, baffling and/or sealing components of an automotive vehicle is disclosed. The method includes providing a carrier and disposing masses of expandable material onto the carrier. The method further provides for providing a fastener connected to the carrier.

Abstract: A process for the production of a polymeric film comprising a copolyester having an acid component and a diol component, said acid component comprising a dicarboxylic acid and a sulfomonomer containing a sulfonate group attached to the aromatic nucleus of an aromatic dicarboxylic acid, said process comprising the steps of: (i) melt-extruding a layer of said copolyester; (ii) stretching the extrudate in at least one direction; (iii) heat-setting the film by raising the temperature of the stretched film to a temperature T1 in a first heating zone such that (TM?T1 is in the range of from 5 to 30° C., and then raising the temperature of the film to a temperature T2 in a second heating zone such that (TM?T2 is in the range of from 0 to 10° C.

Abstract: Hot-melt pressure-sensitive adhesive (HMPSA) composition comprising: a) 25 to 50% of a styrene block copolymer chosen from the group comprising SIS, SIBS, SEBS and SEPS block copolymers; b) 35 to 75% of a compatible tackifying resin having a softening temperature of between 80 and 150° C. and an acid number of less than 20; and c) 0.5 to 20% of one or more carboxylic acids, the hydrocarbon chain of which comprises 6 to 54 carbon atoms. Multilayer system comprising an HMPSA layer, a printable support layer and an adjacent protective layer. Corresponding self-adhesive label and process for recycling a labeled article, with debanding of said label by immersing the article in a hot basic aqueous solution.

Abstract: A surface-treated metal material is obtained by forming an inorganic surface-treating layer containing at least Zr, O and F as chief components but without containing phosphoric acid ions on the surfaces of a metal by the cathodic electrolysis or by forming an inorganic surface-treating layer containing at least Zr, O and F as chief components and having an atomic ratio of P and Zr of 0?P/Zr<0.6 in the uppermost surface on the surfaces of the metal by the cathodic electrolysis at a low cost featuring high productivity, environmental friendliness, scar resistance, adhesion, workability and intimate fitting. By using a metal material obtained by coating the surface-treated metal material with an organic resin and, particularly, with a polyester resin, a metal can or a can lid exhibits excellent adhesion and corrosion resistance even at portions that are worked to a high degree. Further, the can lid exhibits excellent opening performance even after the sterilization by heating.

Abstract: Disclosed herein is a heat bonding film, which includes a hot-melt adhesive film and a protective layer disposed on the hot-melt adhesive film. The hot-melt adhesive film exhibits an adhesive property after being heated. While an outer surface of the protective layer is heated, the heat bonding film may be attached onto an object through the adhesive property provided by the hot-melt adhesive film.

Abstract: This invention relates to polyolefin compositions. In particular, the invention pertains to elastic polymer compositions that can be more easily processed on cast film lines, extrusion lamination or coating lines due to improved resistance to draw resonance. The compositions of the present invention preferably comprise an elastomeric polyolefin resin and a high pressure low density type resin.

Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organic phosphine compound (D) as a thermal curing accelerator, and the content of the organic phosphine compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.

Abstract: An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise.

Abstract: A packaging material for oily or greasy food items includes one or more features for resisting penetration, masking penetration, or for a combination of resisting and masking penetration by the oily or greasy substance.

Abstract: A laminating film and methods of use with xerographic prints. The laminating film comprises an adhesion promoter comprising a hydrolytic silane compound that imparts improved adhesion and which can be used in laminating applications conducted at high and as well as low temperature ranges.

Abstract: There is provided an adhesive film for a semiconductor, which can be attached to a semiconductor wafer at low temperature and which allows semiconductor chips to be obtained at high yield from the semiconductor wafer while sufficiently inhibiting generation of chip cracks and burrs. The adhesive film for a semiconductor comprises a polyimide resin that can be obtained by reaction between a tetracarboxylic dianhydride containing 4,4?-oxydiphthalic dianhydride represented by chemical formula (I) below and a diamine containing a siloxanediamine represented by the following general formula (II) below, and that can be attached to a semiconductor wafer at 100° C. or below.

Abstract: This invention relates to an in-mold label comprising a core layer with a first and second surface and a heat seal layer on the first surface of the core layer, wherein the heat seal layer comprises a polyolefin, having a peak melt temperature of less than about 110° C. and where less than about 25% of the polyolefin melts at a temperature of less than 50° C. as measured by differential scanning calorimetry. The label may also contain a skin layer on the second surface of the core layer. The invention also relates to plastic substrates bonded to the label. In another aspect, the present invention also relates to a process for in-mold labeling and a process for preparing an in-mold label. The labels and processes provide reduced amounts of one or more of the following: blisters, both before and after bonding, shrinkage, bagginess and gage bands.

Abstract: The present invention provides a masking media for heat activated graphics. The masking media includes a film having a first release surface, an opposite. treated surface, and a two-part adhesive applied to the treated surface. The adhesive is adapted to secure graphics to the film to enable the graphics to be hot-pressed onto a fabric substrate. The adhesive includes acrylic and isocyanate in a ratio of isocyanate to acrylic of at least about 1.1%. The media can be wound upon itself with the adhesive contacting the release surface and subsequently being unwound with the adhesive releasing from the release surface.

Abstract: The present invention is drawn to a strip tape which does not undergo lowering of bonding force and which does not cause pollution of the natural environment, working environment, etc. The strip tape includes a center layer containing a polar resin, and at least one polyolefin layer laminated, via a bonding layer, on each face of the center layer. The bonding layer contains an ethylene-methacrylic acid-alkyl acrylate random copolymer. Since the strip tape includes a center layer and at least one polyolefin layer, the interlayer bonding force of the strip tape is high, the bonding strength between the center layer and the polyolefin layer can be increased, and the waterproofing property of the strip tape can be enhanced. Even when a packaging container including the strip tape is heated or cooled sharply during use, the interlayer bonding force of the strip tape is not lowered.

Abstract: Pressure sensitive adhesives and methods, wherein the adhesives include a silicone tackifying resin and a polydiorganosiloxane polyurea copolymer. The tack of these adhesives is improved by the use of a processing aid, such as a plasticizer.

Abstract: The present invention relates to a biaxially oriented polyester film, which a) has a base layer B, which includes a yellow dye and a red dye, b) has, on each side of the base layer B, at least one layer (A or C) which includes, based on the weight of layer A or C, less than 0.01% by weight of the yellow dye and less than 0.01% by weight of the red dye, and c) the film has one absorption maximum lying at from 400 to 500 nm in the UV/visible spectrum from 400 to 800 nm. Preferred dyes are anthraquinone dyes and perinone dyes; the polyester is preferably PET. After metallization or lamination, the film has a gold appearance, and is a suitable packaging material.

Abstract: The invention relates to sheet materials, having at least one layer of an adhesive mass, within which heat can be produced, wherein the adhesive mass is a hot melt adhesive mass and a PTC resistor.

Abstract: Tearable security laminates. More specifically, the present invention relates to a security card, comprising: a plastic card having edges; and a tearable security laminate attached to the plastic card by an adhesive layer, where the security laminate is tearable along an edge of the plastic card. In addition, the invention relates to methods of making security cards.

Abstract: The invention relates to a heat-sealable packaging material and a sealed package formed from the same, especially for packaging foodstuffs. The packaging material comprises a base layer of paper or board and polymeric heat-sealable layers on one side of the base layer or, preferably, on both sides thereof. According to the invention, at least two layers of ethylene vinyl alcohol copolymer (EVOH) with different fractions of ethylene monomer are arranged on the packaging material to provide an oxygen barrier. The layers can locate against each other without a tie layer between them. The heat-sealable polymer can be a polyolefin, and, in addition, other polymeric barrier layers can be incorporated into the material to improve its oxygen, fat and aroma tightness.

Abstract: The invention relates to a blister top foil for sealing with respect to an existing blister bottom foil, wherein the blister top foil comprises at least the following layers, seen from the outside to the inside of the finished pack: possibly a layer of printing undercoat lacquer (c), a layer of printing primer (d), a layer of adhesive (e), a layer of plastic film (f), a layer of possibly peelable adhesive (g), a layer of aluminium (h) and a layer of heat sealing lacquer (i). The invention is characterized in that the printing primer layer (d) is an aluminium layer.

Abstract: A process for producing a sandwich structure, includes laminating a reinforced fiber material which is substantially free from a matrix resin; a glycol modified copolymerized polyester resin film; a thermosetting resin composition film which is hardened at room temperature; a core material selected from an open cell foam and a honeycomb; a thermosetting resin composition film which is hardened at room temperature; a glycol modified copolymerized polyester resin film; and a reinforced fiber material which is substantially free from a matrix resin, in this order in a molding tool to form a sandwich, hardening the thermosetting resin composition film which is hardened at room temperature under a condition that the molding tool is closed, infusing a matrix resin into the molding tool, and adjusting a temperature in the molding tool at room temperature or a hardening temperature of the matrix resin to harden the matrix resin.

Abstract: A film, for use in a label and a related method, including a print skin layer, a base layer, and an adhesive skin layer having at least one heat-activated thermoplastic polymer. The film is stretched biaxially in both a machine direction and a transverse direction. The stretch ratio in a first direction is greater than 2:1 to 10:1, the stretch ratio in a second direction ranges in value from 1.02:1 to 1.8:1, the film has an ASTM D1204 shrinkage at 100° C. of at least 0.5% in both the machine and transverse directions, and the film has an ASTM D882 2% secant modulus of at least 679,134 kPa (98,500 psi) in the first direction.

Abstract: A heat transfer label comprising a support portion and a transfer portion for transfer of the transfer portion from the support portion to an article. The article may be untreated polyethylene, polypropylene, PET, or acrylonitrile. Heat is applied to the support portion while the transfer portion is placed into contact with the untreated polyethylene, polypropylene, or acrylonitrile article. The transfer portion comprises an adhesive layer comprising a vinyl acetate resin, a tackifying petroleum hydrocarbon resin, and a microcrystalline wax.

Abstract: Films containing a sealant layer composition comprising: (1) polyethylene homopolymer, and ethylene/alpha-olefin copolymer, ethylene vinyl acetate copolymer, and ethylene/acrylate copolymer; and (2) elastomer, plastomer, ionomer, and carboxyl-modified polyethylene; when sealed to another outer film layer comprising at least one member selected from the group consisting of ionomer, ethylene/acid copolymer, ethylene/vinyl acetate copolymer and ethylene/acrylate copolymer, have been discovered to provide a seal strength comparable to an ionomer to ionomer seal.

Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.

Abstract: Disclosed is a thermoplastic polyimide which has excellent heat resistance and can adhere to a metal foil by thermocompression bonding for a short-time. The thermoplastic polyimide comprising a tetracarboxylic dianhydride residue and a diamine residue wherein the biphenyl tetracarboxylic dianhydride residues account for 80 mol % or more of the total tetracarboxylic dianhydride residues, the 4,4?-diaminodiphenyl ether residues for 65 mol % or more and 85 mol % or less of the total diamine residues, and the paraphenylene diamine residues for 15 mol % or more and 35 mol % or less of the total diamine residues.

Abstract: The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness. The adhesive composition of the present invention comprises: (A) an acrylic polymer; (B) an epoxy resin; (C) a thermosetting agent; and (D) a silicone compound having a specific side chain.

Abstract: The present invention concerns a sealed package formed from a polymer film comprising a block copolymeric substrate and a heat sealable coating and/or skin layer on the substrate, the package being formed by wrapping the film around an article to be packaged in a manner to obtain at least one region of film overlap, and heat sealing the resulting overlapped film sections to each other to provide at least one sealed region of the package, the sealed region being subsequently openable by manually separating the overlapped film sections, effective without substantial tearing of the film at or around the sealed region.

Abstract: The present invention provides a display strip easy for automating the process of bonding product-enclosed bags and capable of bonding the product-enclosed bags once removed again.

Abstract: The invention provides a method for imparting topographical or protective features to a substrate by contacting a sheet material comprising a thermosettable layer with a substrate and heating the sheet material to an elevated temperature.

Abstract: There is disclosed a plurality of embodiments of composite webs of labels wherein there are labels on a pressure sensitive pressure-coated carrier web and wherein adhesive deadener coats the adhesive underlying the labels to enable the labels to be releasably adhered to the carrier web while leaving the carrier outside the peripheries of the labels non-tacky.

Abstract: High frequency-weldable articles, such as sheets or yarns, include at least one high frequency-weldable part that is made from a modified polyethylene terephthalate (PET) material and that has a melting point ranging from 100° C. to 250° C. The modified PET material is prepared from a composition that includes terephthalic acid, ethylene glycol and a diol modifier. The diol modifier is selected from the group consisting of neopentanediol, 1,3-dihydroxy-2-methylpropane, 1,3-dihydroxy-2-methylpropane alkoxylate, 2,5-dimethyl-2,5-hexanediol, polyethylene glycol, and combinations thereof.

Abstract: A wiring circuit board at least contains an electric insulator layer and an electric conductor formed on the electric insulator layer so as to form a predetermined circuit pattern, which further comprises an adhesive layer formed by thermal hardening of the thermosetting adhesive and pressure-sensitive adhesive composition as described in the specification.

Abstract: The object of the present invention is to provide an adhesive composition which can form a thinner adhesive layer, which has good storage stability and which can actualize high package reliability even when exposed to severe reflow conditions in a semiconductor package in which a semiconductor chip being reduced in a thickness is mounted, and an adhesive sheet having an adhesive layer comprising the adhesive composition. The adhesive composition of the present invention comprises an epoxy thermosetting resin (A), a thermosetting agent (B) and a thermosetting accelerating agent (C); the thermosetting accelerating agent (C) being soluble in methyl ethyl ketone and inactive as a thermosetting accelerating agent at room temperature.

Abstract: In-mold labelled, blow-molded articles formed from high density polyethylene, the labels being formed from biaxially oriented polypropylene based films having a shrinkage of at least 4% in both the machine and transverse directions as measured by the OPMA shrink test in which the film is suspended in an oven at 130° C. for a period of 10 minutes. The use of films with the specified shrinkage enables blistering and “orange peel” effects to be avoided when the blow-molding is carried out.

Abstract: The present invention provides a multilayer sealable film having a sealable outer layer, a first heat resistant layer, a core layer, and a second heat resistant layer. In a preferred embodiment of the present invention, the core layer is positioned between the two heat resistant layers. The sealable layer is positioned such that one of the heat resistant layers is located between the seal layer and the core layers.

Abstract: Ultrahigh molecular weight polyethylene compositions of highly beneficial sintering characteristics are disclosed and methods for making and processing same. Additionally, products comprising these compositions are described.

Abstract: The present invention provides a heat-sensitive adhesive containing at least a thermoplastic resin, a solid plasticizer, and an adhesion-imparting agent, wherein the adhesion-imparting agent is an adhesion-imparting agent emulsion which is prepared by emulsifying in the presence of a polymeric emulsifier.

Abstract: Multi-layer films that are suitable for packaging and having improved sealing properties are disclosed. Some embodiments may also provide a lower minimum sealing temperature. A soft polymer is blended in a core layer and a tie layer comprising the soft polymer and, optionally, another polymer. A sealable layer is provided on the side of the tie layer opposite the core layer. The multi-layer films may be transparent, contain a cavitating agent, or are pigmented to form an opaque film. Also, the multi-layer film may be metallized or coated with a barrier coating.

Abstract: The present invention is to provide a heat-sensitive adhesive material containing a support;,and an adhesive under layer, an intermediate layer and a heat-sensitive adhesive layer formed over one surface of the support in this order, wherein the intermediate layer contains at least a thermoplastic resin and hollow particles, the heat-sensitive adhesive layer contains at least a thermoplastic resin, an adhesion imparting agent and a thermofusible material, and the adhesive under layer contains at least a thermoplastic resin, the thermoplastic resin has a glass transition temperature (Tg) of ?70° C. to ?10° C. and a mass average molecular mass of 100,000 to 1,500,000.

Abstract: Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a. an acid- or acid anhydride-modified acrylonitrile-butadiene copolymer, and b. an epoxy resin, the weight ratio of the two components a/b being greater than 1.5 and no additional nonpolymer hardener being used.

Abstract: The invention relates to a biaxially oriented polyester film having a base layer (B) which comprises at least 80% by weight of a polyester comprised of from 55 to 90 mol % of units deriving from at least two aromatic dicarboxylic acids and of from 5 to 45 mol % of units deriving from at least one aliphatic dicarboxylic acid, where the total of the dicarboxylic-acid-derived molar percentages is 100. The film features ultimate tensile strength of ?100 N/mm2 and modulus of elasticity of ?3000 N/mm2.

Abstract: An in-mold label includes a thermoplastic resin film substrate layer and a heat-seal resin layer. The label has a label body and a separable part. Tearable perforations are provided between the label body and the separable part. The adhesion strength between the separable part and a thermoplastic resin container is from 80 to 270 gf/10 mm, when the label is stuck to the container during in-mold production of the container. A lubricant is applied to from 55 to 80% of the surface area of the heat-seal resin layer of the separable part. The wettability index of both the thermoplastic resin film substrate layer surface and the heat-seal resin layer surface is from 34 to 73 mN/m.

Abstract: A laminate film including a first polyolefin heat sealable resin layer and a second core layer including of a blend of 5-15 wt % of a metallocene-catalyzed butene-propylene or ethylene-propylene thermoplastic elastomer or ethylene-propylene plastomer or blends thereof which exhibit an isothermal crystallization temperature of 60° C. or less and 95-85 wt % of a crystalline propylene homopolymer is disclosed. The laminate film may include additional layers such as a third polyolefin resin-containing layer disposed on the side of the core layer opposite the heat sealable layer, a metal layer, or combinations thereof.

Abstract: A method of triggering a film containing an oxygen scavenger includes providing composition including a peroxide; and packaging the composition in a film including an oxygen scavenger; whereby the oxygen scavenger is triggered in the absence of ultraviolet light, visible light, and electron beam radiation by exposure to the peroxide or an associated enriched oxygen environment.

Abstract: Film laminates for packaging applications having at least two polymer layers which are formed together as a coextruded blown film such that the first polymer layer is a surface layer relative to the film and comprises a heat-sealable material having a melt index of at least 20 g/10 min. The present invention further provides food packages formed from these film laminates.

Abstract: Disclosed is A gas barrier film comprising a substrate film and a barrier layer containing an organic region and an inorganic region on the substrate film, in which, when the organic region is provided on one surface of the gas barrier film, the outermost layer on the side with the organic region is an adhesive layer, or when the organic regions are provided on both surfaces of the gas barrier film, at least one outermost layer of the gas barrier film is an adhesive layer. The gas barrier film is capable of simplifying the working process with it and keeping its good gas-barrier property.

Abstract: A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.