Abstract: A laminated polyester film stretched in at least one direction, comprising:a polyester support, andat least one enhanced adhesion layer laminated on the polyester support, comprising a composition comprising:(1) an aromatic copolyester (A1) having a water-dispersible functional group, a polyvinyl alcohol resin (B1), and a vinylpyrrolidone copolymer resin (C1); or(2) an aromatic copolyester (A1) having a water-dispersible functional group, a polyvinyl alcohol resin (B1), and a polyglycerol polyglycidyl ether (C2); or(3) an aqueous-type polyurethane (A3), a polyvinyl alcohol resin (B3), and inert particles wherein the thickness (L) of the adhesion layer and the average particle diameter (d) of said inert particles satisfies the equation1/3.ltoreq.d/L.ltoreq.3.

Abstract: This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.

Abstract: An adhesive composition comprising a thermosetting powder adhesive adhered to a thermoplastic non-woven web adhesive, and processes for making the same. The thermosetting powder adhesive component is preferably a polyester, a polyester-polyurethane, an epoxy or an epoxy-polyester hybrid. The thermoplastic non-woven web adhesive component is preferably an ethylene-vinyl acetate copolymer, a polyester, a polyolefin, or a polyamide. The adhesive composition provides superior bonding between vinyl and/or cloth coverings and a variety of surfaces including metal, plastic, rubber and wood. There is also disclosed herein a composite article that comprises an adhesive layer made from the aforementioned adhesive composition and a substrate layer, and processes for making the same.

Abstract: An adhesive-applied tape prepared by coating a support film with a solution obtained by dissolving in an organic solvent a mixture of an epoxy resin and an amorphous polyimidosiloxane produced from an aromatic tetracarboxylic dianhydride or its derivative and a diamine comprising an aromatic diamine which comprises an aromatic diamine having a functional group which can react with an epoxy group and a diaminopolysiloxane, and then drying it at a temperature at which the epoxy resin is not cured to provide a tack-free adhesive layer with no surface tackiness. The tape is both flexible and heat resistant, and does not require high-temperature, high-pressure contact bonding conditions upon contact bonding.

Abstract: The invention provides a method for imparting topographical or protective features to a substrate by contacting a sheet material comprising a thermosettable layer with a substrate and heating the sheet material to an elevated temperature.

Abstract: A multilayer anisotropic electroconductive adhesive, comprises an anisotropic electroconductive adhesive layer and laminated to at least one side thereof an insulating adhesive layer. The anisotropic electroconductive adhesive layer comprises a film-forming resin and electroconductive particles and has a melt viscosity at 150.degree. C. of 100 poise or higher, and the insulating adhesive layer comprises a latent curing agent and a resin having a functional group and has a melt viscosity at 150.degree. C. of less than 100 poise.

Abstract: A printing sheet having a high gloss and an enhanced ink-setting property has an outermost surface coating layer formed on a substrate sheet from an electron beam-cured resin produced from at least one electron beam-curable unsaturated organic compound having a dimer acid structure derived from unsaturated higher fatty acid.

Abstract: A composite reinforced roof is formed by applying to a roof deck a preformed membrane which has a tacky lower layer formed from rubberized asphalt. The second layer of the preformed membrane is a reinforcing mesh material embedded in the surface of the rubberized asphalt. This is applied to a roof deck and subsequently overcoated with a molten coating of rubberized asphalt. The self-adherent rubberized asphalt membrane prevents formation of bubbles and pinholes in the molten rubberized asphalt layer. This is particularly beneficial when the roof deck surface is lightweight structural concrete which releases gas when heated.

Abstract: Two-component curable adhesive for blocking automotive wiring bundles, the respective components preferably amine-terminated polyamide Part A, and acrylate, anhydride or epoxy Part B, being contained in separate sheets which are inter-leaved with one another. The concentration of the reactive components in the sheets is chosen to cause the adhesive to flow on initial heating and then to cure to resist further flow at elevated temperatures in service. Apparatus, kits and method for blocking cables or wire bundles using the adhesive are also claimed.

Abstract: An adhesive tape for TAB having an organic insulating film, an adhesive layer formed on the organic insulating film and a protection layer formed on the adhesive layer, the adhesive layer being any one of a layer containing a polyamide resin having an amine value of at least 3 and an epoxy resin, a layer containing a polyamide resin and a powdery inorganic filler, a layer containing an epoxy resin having a siloxane structure in its main chain, and a layer containing at least one maleimide compound.

Abstract: A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.

Abstract: A can-covering polyester film which is bonded under heat to a metal surface of a can through a thermosetting resin adhesive to form a protective coat, wherein the adhesive layer is formed of a resin comprising an epoxy resin having a number average molecular weight of 5,000-20,000 and a trimellitic acid anhydride hardener at a weight ratio of 70/30 to 99/1.

Abstract: An adhesive tape for TAB having an organic insulating film, an adhesive layer formed on the organic insulating film and a protection layer formed on the adhesive layer, the adhesive layer being any one of a layer containing a polyamide resin having an amine value of at least 3 and an epoxy resin, a layer containing a polyamide resin and a powdery inorganic filler, a layer containing an epoxy resin having a siloxane structure in its main chain, and a layer containing at least one maleimide compound.

Abstract: A selectively filled thermally curable adhesive film (10) contains a fluxing agent for reflow soldering an electronic device to a substrate. The adhesive film has a central, region (12) and a boundary region (14) surrounding the central region. The central region consists of an adhesive that is filled with an inert filler to reduce the co-efficient of thermal expansion of the adhesive. The boundary region consists of an unfilled adhesive and a fluxing agent. The film may be used to adhesively bond a flip chip semiconductor die (20) to a substrate (21). When solder bumps (22) on the die are reflowed, the fluxing agent acts to remove any oxides present on the solderable surfaces of the substrate or the die.

Abstract: An adhesive composition and foils coated with the adhesive, wherein the adhesive consisting essentially of: (I) a fist amount of a non-modified epoxy resin and a second amount of a rubber-modified epoxy resin in a total amount of 60-100 parts by weight, wherein the amount of rubber-modified epoxy resin is 0.5 to 20 parts by weight; (II) 5-30 parts by weight of a polyvinyl acetal resin; and optionally contains (III) at least one resin selected rom the group consisting of blocked isocyanate resins, polyester resins, polyester resins, melamine resins and urethane resins. The adhesive coating can optionally contain inorganic fillers, fire retardants, and curing agents.

Abstract: An adhesive for bonding a reinforcing sheet to a lead-formed surface of a tape carrier package used for forming a semiconductor device, the adhesive being a resin composition which constitutes an interlayer between the lead-formed surface and the reinforcing sheet, comprises a polyamide resin having an amine value of 3.0 to 50 and an epoxy resin, is free from peeling and foaming, undergoes sufficient softening and curing at a temperature lower than about 150.degree. C., has high insulation reliability after cured, and has heat resistance against a temperature up to 260.degree. C.

Abstract: An improved tackifier for making tackified substrates contains: (a) at least one epoxy resin, and (b) at least one curing agent for the epoxy resin, but (c) no catalytic amount of catalyst for the reaction between the epoxy resin and the curing agent. The tackified substrates are used to make composites by: (1) placing one or more of the tackified substrates in a mold; (2) injecting into the mold a matrix resin formulation which is chemically-similar to the tackifier, except that it contains a catalytic amount of catalyst for the reaction between the epoxy resin and the curing agent; and (3) curing the matrix resin formulation. The tackifiers are more storage-stable than similar tackifiers which contain catalyst, and the resulting composites have and/or retain physical properties better than composites made using tackifiers without curing agent.

Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Abstract: Electrically conductive sheet material preforms useful in bonding of electronic components as well as in the formation of electronic circuits are disclosed. The preforms, which comprise a multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive, are particularly useful in the assembly of multi-chip modules and other electronic devices.

Abstract: A stabilized heat curable adhesive prepared from a formulation comprised of (1) at least one free radically polymerizable monomer; (2) at least one epoxy function monomer; (3) at least one free radical polymerization photoinitiator; (4) a thermally-initiated cationic catalyst system comprising (a) at least one salt of an organometallic cation, (b) at least one stabilizing additive; (5) optionally, at least one alcohol-containing material; and (6) optionally, adjuvants.