Next To Metal Patents (Class 428/418)
  • Patent number: 11359117
    Abstract: The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: June 14, 2022
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Hirokazu Iizuka, Kunihiro Takei, Yuiko Maruyama, Yuki Sato
  • Patent number: 11214693
    Abstract: An electrically conductive and corrosion resistant graphene-based coating composition, including a binder, a graphene-filler; and a dispersing agent, wherein the graphene filler comprises a plurality of graphene stacks.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: January 4, 2022
    Assignee: THE BOEING COMPANY
    Inventors: Vijaykumar S. Ijeri, Stephen P. Gaydos, Patrick J. Kinlen, Priyanka G. Dhirde, Anand Khanna
  • Patent number: 11153976
    Abstract: A method and structure are provided for implementing manufacture of a printed circuit board (PCB) with one of an infrared (IR) reflective mask or a novel solder mask to minimize coefficient of thermal expansion (CTE) mismatch between PCB laminate and plated through hole (PTH) copper. At least one of an IR-reflective mask and a solder mask composition for use in IR reflow processes is created such that radiant heat is reflected away from the major portion of the PCB yet permitted to impinge upon the PTHs. The copper within the PTH expands due to radiant heating while the bulk laminate expansion is significantly reduced due to the reflected IR radiation. Consequently, the CTE mismatch is minimized and tensile strain of the copper in the PTH is reduced, providing enhanced reliability.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: October 19, 2021
    Assignee: International Business Machines Corporation
    Inventors: Kevin O'Connell, Mark Plucinski, Timothy Tofil, Joseph Kuczynski
  • Patent number: 11072766
    Abstract: The present invention relates to a one-shell aminoplast core-shell microcapsule stabilized by a polyisocyanate. It also provides a method for stabilizing aminoplast microcapsules in liquid aqueous surfactant-rich consumer products.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: July 27, 2021
    Assignee: Firmenich SA
    Inventors: Nicolas Pichon, Sonia Godefroy, Arnaud Struillou
  • Patent number: 10947408
    Abstract: The present invention is directed to a phosphated epoxy resin comprising at least one terminal group comprising a phosphorous atom covalently bonded to the resin by a carbon-phosphorous bond or by a phosphoester linkage; and at least one carbamate functional group. The present invention is also directed towards aqueous resinous dispersions comprising the phosphated epoxy resin, methods of coating a substrate, coated substrates, and methods of making a phosphated epoxy resin.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: March 16, 2021
    Assignee: PRC-DeSoto International, Inc.
    Inventors: Christopher A. Dacko, Michael A. Mayo, Gregory J. McCollum, Robin M. Peffer, Se Ryeon Lee
  • Patent number: 10865304
    Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 15, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoyuki Kushihara, Yuki Kudo, Kazuaki Sumita, Yoshihiro Tsutsumi, Yoshihira Hamamoto
  • Patent number: 10669377
    Abstract: The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance. A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: June 2, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Natsuko Chayama, Masao Tomikawa, Tomoyuki Yuba
  • Patent number: 10642324
    Abstract: Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: May 5, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Ai-Tsung Li, Ya-Ting Yeh, Kevin Voss, Michael Delpier
  • Patent number: 10611910
    Abstract: The present invention discloses a halogen-free epoxy resin composition having low dielectric loss, comprises: (A) 100 parts by weight of an epoxy resin; (B) 10-30 parts by weight of a DOPO modified curing agent; (C) 1-10 parts by weight of benzoxazine resin; (D) 60-90 parts by weight of an active ester compound; (E) 20-50 parts by weight of a flame retardant; and (F) 0.5-10 parts by weight of a curing accelerator. The halogen-free epoxy resin composition uses active ester as a curing agent of the epoxy resin to ensure that the hardening product has characteristics such as low dielectric constant (Dk), low dielectric loss (Df), high heat resistance, low water absorption, flame retardant and halogen-free. The halogen-free epoxy resin composition of the present invention is used for manufacturing semi-cured prepregs or resin-coated films, and is applied toward manufacturing metal clad laminates and printed circuit boards.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: April 7, 2020
    Assignee: ITEQ CORPORATION
    Inventors: Kai-Yang Chen, Chun-Hao Chang, Yu-Chieh Hsu
  • Patent number: 10611876
    Abstract: Provided is an epoxy-amine adduct. The epoxy-amine adduct is a compound that may be a compound I containing two or more amino groups per molecule, a compound corresponding to the compound I, except being modified with a compound II-1 containing two or more (meth)acryloyl groups per molecule, a compound corresponding to the compound I, except being modified with a lactone II-2, or a salt of the compound I. The compound I is an adduct between an epoxide (A) containing two or more cycloaliphatic epoxy groups per molecule and an amine (B) containing two or more amino groups per molecule. The compound I includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) and contains amino groups at both ends.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: April 7, 2020
    Assignee: DAICEL CORPORATION
    Inventors: Hiroko Inoue, Hiroto Tanigawa, Masanori Sakane, Toshihiko Nijukken, Tomio Ozaki, Tomoyuki Ono, Hiroshi Sakurai, Hiroshi Kimura, Takeshi Naito
  • Patent number: 10608249
    Abstract: A negative lithium-containing electrode for an electrochemical cell is provided, along with methods of making such a negative lithium-containing electrode. The method includes depositing a first precursor and a second precursor in a vapor deposition process onto one or more surface regions of a negative electrode material comprising lithium. The first precursor and the second precursor react to form an inorganic-organic composite surface coating on the one or more surface regions. The first precursor comprises an organic mercapto-containing silane and the second precursor comprises an inorganic silane.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: March 31, 2020
    Assignees: GM GLOBAL TECHNOLOGY OPERATIONS LLC, THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Fang Liu, Duo Xu, Yunfeng Lu, Qiangfeng Xiao, Mei Cai
  • Patent number: 10563029
    Abstract: A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: wherein Ra represents a group represented by the following general formula (c),
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: February 18, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoichi Takano, Katsuya Tomizawa, Takashi Kubo, Tomo Chiba, Eisuke Shiga
  • Patent number: 10556985
    Abstract: Amine-epoxy curing agents are disclosed including at least one saturated heterocyclic compound having two nitrogen heteroatoms according to formula (I) and at least one saturated fused bicyclic heterocyclic compound having three nitrogen heteroatoms according to formula (II): wherein X is independently selected from a hydrogen atom, a linear or branched C1 to C4 alkyl group and a substituted or un-substituted phenyl group, Y1 is a direct bond or a divalent polyethylene polyamine group having 1 to 8 nitrogen atoms or a divalent polyethylene polyamine derivative having 1 to 8 nitrogen atoms, Y2 is a direct bond or a divalent polyethylene polyamine group having 1 to 7 nitrogen atoms and R is independently a hydrogen atom or a group selected from C1-C8 linear, cyclic, and branched alkyl, alkenyl, and alkaryl groups.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: February 11, 2020
    Assignee: Evonik Operations GmbH
    Inventors: Shiying Zheng, Sudhir Ananthachar, Shafiq Nisarali Fazel, Michael Ian Cook, Robert Marjo Theodoor Rasing, Wei Cao, Edze Jan Tijsma
  • Patent number: 10526109
    Abstract: Provided is a container-use surface treated steel sheet which is manufactured without using chromium and exhibits excellent working adhesion with a coated organic resin, a method of manufacturing the container-use surface treated steel sheet, an organic resin coated surface treated steel sheet. The container-use surface treated steel sheet is a surface treated steel sheet where nickel plating is applied to at least one-side surface of surfaces of a steel sheet by coating, wherein nickel plating has a fine particle shape formed by fine particles which has particle density of 2 to 500 pieces/?m2 and having an average particle size of 0.05 to 0.7 ?m. The container-use surface treated steel sheet is also characterized in that a coating weight of the nickel plating of the container-use surface treated steel sheet is 0.1 to 12 g/m2, metal tin is contained in coating of the nickel plating, and an amount of metal tin is 0.05 to 0.1 g/m2.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: January 7, 2020
    Assignee: TOYO KOHAN CO., LTD.
    Inventors: Shinichi Taya, Hiroshi Doi, Etsuro Tsutsumi, Kota Sadaki, Masahiro Kai
  • Patent number: 10487233
    Abstract: Solvent-containing clearcoat coating composition comprising (A) an OH-functional (meth)acrylate (co)polymer comprising (A1) 30%-99% by weight, based on the mass of the nonvolatile fraction of (A), of at least one OH-functional (meth)acrylate (co)polymer having an OH number of 60-200 mg KOH/g and glass transition temperature Tg of 15° C. to 100° C., and (A2) 1%-70% by weight, based on the mass of the nonvolatile fraction of (A), of at least one OH-functional (meth)acrylate (co)polymer having an OH number of 60-200 mg KOH/g and a glass transition temperature Tg of ?100° C. to ?20° C., (B) a crosslinker component comprising functional groups reactive toward OH, (C) 0.02%-1.2% by weight, based on the mass of the nonvolatile fraction of (A), of at least one polyamide and (D) 0.04%-2.9% by weight, based on the mass of the nonvolatile fraction of (A), of at least one urea adduct of a polyisocyanate and benzylamine.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: November 26, 2019
    Assignee: BASF Coatings GmbH
    Inventors: Egon Wegner, Peter Mayenfels
  • Patent number: 10472537
    Abstract: There is provided a coating composition with excellent storage stability, and with excellent mar resistance for obtained coating films. The coating composition comprises a hydroxyl group-containing resin (A), a curing agent (B) and a dispersion of acrylic resin-coated silica particles (C), the dispersion of acrylic resin-coated silica particles (C) being an acrylic resin-coated silica particle dispersion obtained by reacting silica particles with a polymerizable unsaturated group (c1) and a polymerizable unsaturated monomer (c2) in a mass ratio of (c1):(c2)=20:80 to 90:10, the polymerizable unsaturated monomer (c2) including a specific polymerizable unsaturated monomer (c2-1) as at least a portion of its components, and the molecular weight of the resin covering the silica particles being 400 to 6000.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: November 12, 2019
    Assignee: KANSAI PAINT CO. LTD.
    Inventors: Kazuya Watanabe, Akinori Nagai
  • Patent number: 10351967
    Abstract: The present invention provides a method for forming a sensitive film for neutron detection, wherein the sensitive film is formed by electrophoresis coating, the liquid used for electrophoresis coating includes neutron sensitive material, electrophoresis paint and deionized water, and the neutron sensitive material is 10B single substance, 10B compound or mixture containing 10B. The sensitive film for neutron detection has the high detection efficiency because of the high content of 10B. The sensitive film for neutron detection has the uniform and stable film thickness, and excellent consistency. The production efficiency and the cost of the sensitive film are improved.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: July 16, 2019
    Assignee: NUCTECH COMPANY LIMITED
    Inventors: Yongqiang Wang, Qingjun Zhang, Yuanjing Li, Ziran Zhao, Jianping Chang, Yanchun Wang, Lifeng Sun, Nan Bai, Xingliang Zhai
  • Patent number: 10307787
    Abstract: The present invention is directed to a method for manufacturing a corrosion resistant wheel adapted for securement to a vehicle and/or trailer, including the steps of: providing a wheel body, applying a primary anticorrosion composition, forming a primary anticorrosion layer, applying a secondary anticorrosion composition, and forming a secondary anticorrosion layer.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: June 4, 2019
    Assignee: PRP Industries, Inc.
    Inventor: Phil Pierce
  • Patent number: 10273390
    Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: April 30, 2019
    Assignees: Evonik Degussa GmbH, SI-Coatings GmbH
    Inventors: Willi Henkenjohann, Karl Kuhmann, Maximilian Gruhn, Andreas Pawlik, Martin Risthaus, Klaus Welsch, Sven Mang
  • Patent number: 10266719
    Abstract: The present disclosure relates to coatings and coating compositions that are substantially free of bisphenol A (BPA) and similar compounds, which help reduce or minimize flavor loss associated with foods or beverages stored in contact with the coating compositions. In one aspect, the composition can include the reaction products of an intimate mixture of cyclic ether resins and acrylate resins, which provides a unique cross-linked and interpenetrating network of polymers.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: April 23, 2019
    Assignee: The Coca-Cola Company
    Inventors: Xiaorong You, Yu Shi, Linda Hsiao-hua Liu
  • Patent number: 10208213
    Abstract: The present invention relates to an aqueous coating composition comprising at least one aqueous dispersion or solution (A) of at least one electrophoretically depositable binder and optionally of at least one crosslinking agent, and also at least one aqueous sol-gel composition (B), for at least partly coating an electrically conductive substrate with an electrocoat material, where the aqueous sol-gel composition (B) is obtainable by reaction of at least one starting compound suitable for preparing the sol-gel composition (B) with water, with hydrolysis and condensation of the at least one starting compound, to a method for producing the coating composition, to the use thereof for at least partly coating an electrically conductive substrate with an electrocoat material, to a method for at least partly coating an electrically conductive substrate with an electrocoat material by at least partial electrophoretic deposition of the coating composition on the substrate surface, to an electrically conductive substra
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: February 19, 2019
    Assignees: BASF COATINGS GmbH, HENKEL AG & CO. KGAA
    Inventors: Sebastian Sinnwell, Natalja Ott, Christian Hammer
  • Patent number: 9981776
    Abstract: Food and beverage containers and methods of coating are provided. The food and beverage containers include a metal substrate that is at least partially coated with a coating composition that includes a water-dispersible resin system and an aqueous carrier. The resin system includes an epoxy component and an acrylic component. In a preferred embodiment, the coating composition is at least minimally retortable when cured.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: May 29, 2018
    Assignee: SWIMC, LLC
    Inventors: Sebastien Gibanel, Robert Lespinasse, Georges Sion, Benoit Prouvost, Paul Stenson
  • Patent number: 9818498
    Abstract: Disclosed is a paste composition for printing including conductive powders, a binder, a dispersing agent, and a solvent. The dispersing agent includes a block copolymer of polyethylene oxide (PEO)-polypropylene oxide (PPO)-polyethylene oxide (PEO), or a block copolymer of polypropylene oxide (PPO)-polyethylene oxide (PEO)-polypropylene oxide (PPO).
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: November 14, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Bong Jun Park, Sun Hong Yoon, Yong Jin Lee, Kwang Yong Jin, Kyoung Hoon Chai
  • Patent number: 9798233
    Abstract: A radiation-sensitive resin composition containing an alicyclic olefin polymer which has an acidic group (A), a sulfonium salt-based photoacid generator (B) which is represented by the following general formula (1), and a cross-linking agent (C) is provided. (In the above general formula (1), R1, R2, and R3 respectively independently are a C6 to C30 aryl group, C4 to C30 heterocyclic group, C1 to C30 alkyl group, C2 to C30 alkenyl group, or C2 to C30 alkynyl group, the groups being optionally substituted, and “a” is an integer of 1 to 5.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: October 24, 2017
    Assignee: ZEON CORPORATION
    Inventor: Satoshi Abe
  • Patent number: 9783894
    Abstract: A metal composite, a method of preparing the metal composite, a metal-resin composite, and a method of preparing the metal-resin composite are provided. The metal composite comprises: a metal substrate comprising a first layer formed on a surface of the metal substrate and an anodic oxidation layer formed on the first layer. The first layer comprises a first pore having an average diameter of about 10 nanometers to about 1 millimeter, and the metal composite comprises aluminum alloy or aluminum. The anodic oxidation layer comprises a second layer contacted with the first layer of the metal substrate and a third layer formed on an outer surface of the second layer, and the second layer comprises a second pore having an average diameter of about 10 nanometers to about 800 microns, and the third layer comprises a third pore having an average diameter of about 10 nanometers to about 800 microns.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: October 10, 2017
    Assignee: BYD COMPANY LIMITED
    Inventors: Xiao Zhang, Lili Tang, Yun Cheng, Qiang Guo, Liang Chen
  • Patent number: 9745411
    Abstract: A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 ?m and less than 1 ?m, not less than 1 ?m and less than 10 ?m, from 10 ?m to 50 ?m, and from 20 ?m to 100 ?m, and in which a peak present in a range of from 10 ?m to 50 ?m includes an aluminum oxide particle, and a peak present in a range of from 20 ?m to 100 ?m includes a boron nitride particle. In Formula (I) each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: August 29, 2017
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tomoo Nishiyama, Shigemitsu Yoshie, Naoki Hara, Kazumasa Fukuda, Atsushi Kuwano, Yasuo Miyazaki
  • Patent number: 9716409
    Abstract: There are disclosed a motor comprising a stator and a rotor rotary with respect to the stator, the stator comprising a stator core comprising a back yoke and a plurality of teeth projected from the back yoke 311 in a radial direction; an insulator provided in a predetermined portion in a radial direction with respect to the stator core to insulate the stator core from outside; and an insulation film formed from the other portion in the radial direction with respect to the stator core to the plurality of the teeth, to insulate stator core from the coil and the teeth, so as to reduce the manufacture price, with an easy manufacture process and an improved product reliability.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: July 25, 2017
    Assignee: LG ELECTRONICS INC.
    Inventors: Hyunho Ha, Sungjung Kim, Hyunwoo Jung
  • Patent number: 9708484
    Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of not higher than 0.006 at 1 GHz, and the filler is selected from the following group: strontium titanate, calcium titanate, barium titanate, magnesium titanate, combinations thereof and the sintered material of any of the combinations. The filler is doped or not doped with one or more elements selected from silicon, cobalt, nickel, manganese, and rare earth elements. The average particle size (D50) of the filler ranges from about 2 ?m to about 10 ?m. The amount of the filler is about 10 parts by weight to about 600 parts by weight per 100 parts by weight of the thermosetting resin component.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: July 18, 2017
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Shur-Fen Liu, Meng-Huei Chen, Hsin-Ho Wu
  • Patent number: 9441091
    Abstract: A transparentization agent composition is a mixture containing 100 parts by mass of a dibenzylidene sorbitol compound represented by a general formula (I) having a particle diameter such that d97 is from 30 ?m to 200 ?m and 5 to 200 parts by mass of tetrakis[3(3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxymethyl]methane, wherein the total for the two components is 50% by mass or more of the mixture. Also disclosed is a method for producing a polypropylene resin composition, including obtaining a polypropylene resin composition in which a dibenzylidene sorbitol compound represented by a general formula (I) having a particle diameter such that d97 is from 30 ?m to 200 ?m is incorporated in a polypropylene resin, by kneading a mixture containing 100 parts by mass of the polypropylene resin and 0.05 to 2 parts by mass of the dibenzylidene sorbitol compound by using a biaxial extruder at an extrusion temperature of from 220 to 250° C.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: September 13, 2016
    Assignee: ADEKA CORPORATION
    Inventors: Toru Haruna, Naoko Tanji, Daniel Yataro Martin
  • Patent number: 9328058
    Abstract: The present invention provides a mixture comprising at least three hardener components a1), a2), and b), the ratio of hardener component a1) to a2) being in the range from 0.1 to 10:1, and hardener component b) being present at 5% to 55% by weight, based on the mixture, a process for preparing this mixture, the use of the mixture of the invention for curing epoxy resins, the use of the mixture of the invention with epoxy resins as adhesives, and an epoxy resin cured with the mixture of the invention.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: May 3, 2016
    Assignee: BASF SE
    Inventors: Lars Wittenbecher, Michael Henningsen, Gregor Daun, Dieter Flick, Joerg-Peter Geisler, Juergen Schillgalies, Erhard Jacobi
  • Patent number: 9321946
    Abstract: Disclosed herein is a primer composition for metal materials, capable of forming a primer layer excellent in adhesion properties and film-forming properties on the surfaces of various metal materials such as common steel, stainless steel, aluminum, aluminum alloy, copper, and zinc plating to impart high bond strength and high bond durability when the metal materials are bonded with an epoxy-based adhesive. The primer composition is intended to be applied onto the surface of a metal material to be bonded with an epoxy-based adhesive and includes an epoxy resin containing both a bifunctional epoxy resin containing at least a bisphenol A-type epoxy resin and a multifunctional epoxy resin containing at least a phenol novolac-type epoxy resin, a curing agent composed of cyandiamide, a curing catalyst composed of imidazole, and an inorganic oxide filler composed of silica and titanium oxide.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: April 26, 2016
    Assignee: SUMITOMO METAL MINING CO., LTD.
    Inventors: Yuka Takita, Kyouko Miyauchi, Hidetoshi Yamabe
  • Patent number: 9290670
    Abstract: Provided is a highly versatile conductive metallic coating material which is free from the limitation related to a facility without handling complication, and which can maintain its anticorrosive action for a long period. Specifically provided is a conductive metallic coating material which has an organic resin component and a metal component containing aluminum and magnesium and which exhibits a sacrificial anticorrosive reaction on iron. A content ratio of the metal component and the organic resin component is desirably 98:2 to 80:20 in terms of weight ratio. The conductive metallic coating material according to the present invention is usable for preventing corrosion of a building structure or a civil engineering structure and for repairing a corrosion proof treated surface of an existing building structure or a civil engineering structure.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: March 22, 2016
    Assignees: ALPHA KOGYO K.K., OILES CORPORATION
    Inventors: Fabinia H. Romero, Yoshiko Nishijima, Haruo Hamaki, Shinji Sato, Taro Niki, Yasunori Motegi
  • Patent number: 9240263
    Abstract: A cable includes a flexible jacket extending along a length and first and second lateral axes perpendicular to the length. The jacket also defines flat major surfaces that are parallel to each other and spaced apart on opposite sides of the first lateral axis. First and second inner wire assemblies extend within the jacket. The jacket maintains the first and second inner wire assembles in predetermined positions along the first lateral axis within 0.05 mm of each other and disposed on opposing sides of the second lateral axis. First and second outer wire assemblies also extend within the jacket. The outer wire assemblies include a wire of conductive filaments and an insulating layer of an enamel material surrounding the wire. The jacket maintains the first and second outer wire assemblies in positions along the first lateral axis and spaced apart from the first and second inner wire assemblies.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: January 19, 2016
    Assignee: Google Inc.
    Inventors: Eliot Kim, Russell Norman Mirov
  • Patent number: 9120293
    Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: September 1, 2015
    Assignee: SEIKU CHEMICAL CO., LTD.
    Inventors: Reona Yokota, Koichi Shibayama, Akihiro Uenishi, Hidenobu Deguchi, Tomoki Kunikawa, Tatsushi Hayashi
  • Publication number: 20150147542
    Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.
    Type: Application
    Filed: July 18, 2014
    Publication date: May 28, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Seok MOON, Dae Hui Jo, Seong Hyun Yoo, Hyun Jun Lee, Jin Young Kim, Geum Hee Yun
  • Publication number: 20150147505
    Abstract: Food and beverage containers and methods of coating are provided. The food and beverage containers include a metal substrate that is at least partially coated with a coating composition that includes a water-dispersible resin system and an aqueous carrier. The resin system includes an epoxy component and an acrylic component. In a preferred embodiment, the coating composition is at least minimally retortable when cured.
    Type: Application
    Filed: November 25, 2014
    Publication date: May 28, 2015
    Inventors: Sebastien Gibanel, Robert Lespinasse, Georges Sion, Benoit Prouvost, Paul Stenson
  • Publication number: 20150118499
    Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.
    Type: Application
    Filed: March 19, 2013
    Publication date: April 30, 2015
    Inventors: Etsuko Suzuki, Kazuo Arita
  • Publication number: 20150111044
    Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.
    Type: Application
    Filed: December 23, 2014
    Publication date: April 23, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takaaki OGASHIWA, Hiroshi TAKAHASHI, Tetsuro MIYAHIRA, Yoshihiro KATO
  • Publication number: 20150104651
    Abstract: The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.
    Type: Application
    Filed: March 19, 2013
    Publication date: April 16, 2015
    Inventors: Kazuo Arita, Hajime Watanabe
  • Patent number: 9006377
    Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; and a hardener, which is a stable solution obtainable from the following steps: (a) adding a N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification; (b) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and (c) cooling the polymer solution to obtain the stable solution, wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amounts of the DOPO-based compound and the hardener are as defined in the specification.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: April 14, 2015
    Assignee: Taiwan Union Technology Corporation
    Inventor: Hsin-Ho Wu
  • Patent number: 9005761
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 14, 2015
    Assignee: Elite Material Co., Ltd.
    Inventor: Yu-Te Lin
  • Publication number: 20150096680
    Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
    Type: Application
    Filed: August 15, 2014
    Publication date: April 9, 2015
    Applicant: Cytec Industries Inc.
    Inventors: Yiqiang Zhao, Dalip K. Kohli, Gaurang Kunal Shah
  • Publication number: 20150082747
    Abstract: Provided is e.g., an epoxy resin curing agent, epoxy resin composition and a gas-barrier adhesive containing the epoxy resin composition which can express high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester, and a gas-barrier laminate having high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester. The epoxy resin curing agent of the present invention is a reaction product of the following (A) and (B). Furthermore, the epoxy resin curing agent contains at least an epoxy resin and the epoxy resin curing agent of the present invention. (A) metaxylylenediamine or paraxylylenediamine; (B) an unsaturated carboxylic acid represented by the following formula (1) and/or derivatives thereof: wherein R1 represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group.
    Type: Application
    Filed: March 25, 2013
    Publication date: March 26, 2015
    Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., Henkel AG & Co. KGaA
    Inventors: Eiichi Honda, Kazuki Kouno
  • Patent number: 8986799
    Abstract: The invention relates to compositions that can be used as coatings for the inner lining of cargo tanks. The compositions comprise a mixture of epoxy resins, a curing agent, an accelerator or mixture of accelerator(s), and one or more filler(s) or pigment(s), wherein the mixture of epoxy resins comprises 60-80 wt. % of an RDGE epoxy resin and 20-40 wt. % of an epoxy novolac resin, wherein the wt. % is based upon the total weight of the mixture of epoxy resins.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: March 24, 2015
    Assignee: Akzo Nobel Coatings International B.V.
    Inventors: Paul Anthony Jackson, Peter Robert Jones
  • Publication number: 20150079402
    Abstract: A waterborne dispersion containing a high molecular weight cycloaliphatic epoxy resin based on a diglycidyl ether of a cycloaliphatic diol polymerized with, for example, a diphenolic or diacid compound.
    Type: Application
    Filed: April 1, 2013
    Publication date: March 19, 2015
    Inventors: Houxiang Tang, Manesh Nadupparambil Sekharan, Ray E. Drumright, Yinzhong Guo
  • Publication number: 20150059295
    Abstract: An epoxy resin curing agent includes at least the following component (I) and component (II) in a mass ratio of 50/50 to 92/8: Component (I): a reaction product obtained by reacting at least (A) metaxylylenediamine or paraxylylenediamine and at least one selected from (B1) acrylic acid and acrylic acid derivatives; Component (II): a reaction product obtained by reacting at least (A) metaxylylenediamine or paraxylylenediamine and at least one selected from (B2) unsaturated carboxylic acids represented by the following formula (1) and derivatives thereof: wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group; so that at least one of R1 and R2 is an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group.
    Type: Application
    Filed: March 25, 2013
    Publication date: March 5, 2015
    Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., HENKEL AG & CO. KGAA
    Inventors: Eiichi Honda, Kazuki Kouno
  • Publication number: 20150056454
    Abstract: Provided are a resin composition that can realize a prepreg, a metal foil-clad laminate and the like high in light reflectance in an ultraviolet region and in a visible light region, small in the reduction in light reflectance due to a heating treatment and a light irradiation treatment, good in peel strength of metal foil, also excellent in heat resistance after moisture absorption, also good in outer appearance, and also excellent in preservation stability, and a prepreg, a metal foil-clad laminate and the like using the same. The resin composition of the present invention contains at least an epoxy-modified silicone compound (A), a branched imide resin (B) having an isocyanurate group and a carboxyl group, a phosphorus curing accelerator (C), titanium dioxide (D) and a dispersant (E). The branched imide resin (B) is preferably at least one selected from the group consisting of an epoxy-modified branched imide resin, an alcohol-modified branched imide resin and an amine-modified branched imide resin.
    Type: Application
    Filed: March 12, 2013
    Publication date: February 26, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Keisuke Takada, Syunsuke Hirano, Koji Morishita, Hidetoshi Kawai, Yuichi Koga, Yoshihiro Kato
  • Publication number: 20150044476
    Abstract: Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.
    Type: Application
    Filed: October 23, 2014
    Publication date: February 12, 2015
    Applicant: VALSPAR SOURCING, INC.
    Inventors: Owen H. Decker, Thomas E. Reno, Robert D. Breitzman, Carlos A Concha, Jeffrey D. Rogozinski, Keith M. Kirkwood
  • Publication number: 20150044475
    Abstract: The present invention includes an electrical steel sheet with an insulation coating having a large interlaminar insulation resistance when laminated; a coating material for forming the insulation coating that is used for the electrical steel sheet and the coating material for forming the insulation coating, which includes apart from a solvent an aqueous carboxy group-containing resin as component (A), an aluminum-containing oxide as component (B), and at least one crosslinking agent as component (C) selected from the group consisting of melamine, isocyanate and oxazoline. There are component (A); 100 parts by mass; 40 parts by mass<component (B)<150 parts by mass; 20 parts by mass<component (C)<100 parts by mass.
    Type: Application
    Filed: February 25, 2013
    Publication date: February 12, 2015
    Applicants: JFE STEEL CORPORATION, DAI NIPPON TORYO CO., LTD.
    Inventors: Nobuko Nakagawa, Tomofumi Shigekuni, Takahiro Kubota, Osamu Tanida
  • Publication number: 20150037589
    Abstract: The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 ?m/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
    Type: Application
    Filed: July 30, 2014
    Publication date: February 5, 2015
    Inventors: Hiroharu INOUE, Shingo YOSHIOKA