Abstract: The OA roller according to the present invention includes a roller body made of a metal and a coating layer formed on an outside surface of the roller body, while the coating layer is composed by applying a coating material containing binder resin having hardenability, a pigment, amino resin as a crosslinking agent for the binder resin, and attapulgite of not less than 1 part by mass and not more than 8 parts by mass with respect to 100 parts by mass of the binder resin to the outside surface of the roller body and hardening and crosslinking the binder resin.

Abstract: This invention relates to thermal spray composite coatings on a metal or non-metal substrate. The thermal spray composite coatings comprise a ceramic composite coating having at least two ceramic material phases randomly and uniformly dispersed and/or spatially oriented throughout the ceramic composite coating. At least a first ceramic material phase is present in an amount sufficient to provide corrosion resistance to the ceramic composite coating, and at least a second ceramic material phase is present in an amount sufficient to provide plasma erosion resistance to the ceramic composite coating. This invention also relates to methods of protecting metal and non-metal substrates by applying the thermal spray coatings. The composite coatings provide erosion and corrosion resistance at processing temperatures higher than conventional processing temperatures used in the semiconductor etch industry, e.g., greater than 100° C.

Abstract: A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of the metal substrate satisfies an equation as follows, ? f + 0.162 × ( 1 - v f ) E f ? ? s ? ? f + 0.889 × ( 1 - v f ) E f Ef representing Young's modulus of the buffer layer, vf representing Poisson's ratio of the buffer layer, ?f representing a coefficient of thermal expansion of the buffer layer, and ?s representing the predetermined coefficient of thermal expansion of the metal substrate.

Abstract: An coated article includes a substrate; and a coating deposited on the substrate, wherein the coating is a titanium layer mixed with a first element and a second element, M is at least one element selected from a group consisting of iron, cobalt, nickel, copper, niobium, hafnium and tantalum; R is at least one element selected from a group consisting of scandium, yttrium and lanthanide.

Abstract: An coated article includes a substrate; an chromium layer deposited on the substrate; and a silicon-nitride layer deposited on the chromium layer opposite to the substrate.

Abstract: A primer-less coating composition for facestock comprises: a binder being a water-dispersible polymer; an ethylenically unsaturated compound which is aqueous-dispersible and miscible with or bonded to said water-dispersible polymer, wherein said ethylenically unsaturated compound is able to form a covalent bond with an ink; and a crosslinker, wherein said crosslinker is suitable for binding the coating to the facestock. The coating composition may be applied to a substrate to form a printable film. A printed film in accordance with the invention may be used in a label, for example for use on a container such as a bottle.

Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

Abstract: A luminescent element is disclosed including: a luminescent substrate; and a metal layer with a metal microstructure formed on a surface of the luminescent substrate; wherein the luminescent substrate comprises a luminescent material with a chemical composition of Y2SiO5:Tb. A preparation method of a luminescent element and a luminescence method are also provided. The luminescent element has good luminescence homogeneity, high luminescence efficiency, good luminescence stability and simple structure, and can be used in luminescent devices with ultrahigh brightness.

Abstract: A coated article is described. The coated article includes a metal substrate and a hard coating formed on the substrate. The hard coating is a chromium nitride-silicon nitride compound layer. A method for applying the hard coating to the metal substrate is also described.

Abstract: Disclosed is a substrate for a display device that includes a composite material layer including an inorganic fiber material and a resin, and a metal layer disposed on the composite material layer, and a display device including the substrate.

Abstract: A novel, economical electrical insulation method for the production of ultra-thin insulation layers using a solution coating method. Thin hydrophobic self-assembled bi-functional layers of less than 10 nm thick were deposited by a simple solution method and demonstrated to electrically insulate micro-/nano-devices for in-water detection applications. The insulation layer includes a hydrophobic group which repels water and permits superb insulation properties of the ultra-thin layers. The insulation layer has the additional advantages that it binds to a metal or metal oxide surface and to sensing receptors by covalent bonding using standard silane chemistry.

Abstract: A method of preparing a substrate using a sol-gel derived coating incorporating a microorganism. The coating is configured to inhibit microbial induced corrosion (MIC) and/or biofouling at the substrate-coating interface. The coating is prepared by mixing a sol with a suspension comprising the microorganism, applying the mixture onto a substrate followed by curing such that the resultant coating is chemically bonded to the substrate.

Abstract: There are provided a sheet having a silicon/plastic bi-layer structure capable of easily transferring a paste even when a hard roll is used, the hard roll having excellent durability but having disadvantages that the paste is poorly transferred when the paste is printed on a plastic base, and a method for producing the same. The bi-layer structured sheet having excellent printability when printed by hard roll includes a flexible substrate and a silicon resin formed on the substrate.

Abstract: An insulation sheet made from silicon nitride comprising: a sheet-shaped silicon-nitride substrate which contains ?-silicon-nitride crystal grains as a main phase; and a surface layer which is formed on one face or both front and back faces of surfaces of the silicon-nitride substrate and is formed from a resin or a metal which includes at least one element selected from among In, Sn, Al, Ag, Au, Cu, Ni, Pb, Pd, Sr, Ce, Fe, Nb, Ta, V and Ti. A semiconductor module structure using the insulation sheet made from silicon nitride.

Abstract: Novel articles and methods to fabricate the same resulting in flexible, {100}<100> or 45°-rotated {100}<100> oriented, semiconductor-based, electronic devices are disclosed. Potential applications of resulting articles are in areas of photovoltaic devices, flat-panel displays, thermophotovoltaic devices, ferroelectric devices, light emitting diode devices, computer hard disc drive devices, magnetoresistance based devices, photoluminescence based devices, non-volatile memory devices, dielectric devices, thermoelectric devices and quantum dot laser devices.

Abstract: The present invention provides a ceramic green sheet with a thin flat plate shape obtained by molding and solidifying a ceramic slurry, which contains a ceramic powder, dispersion medium, and gelling agent, into a thin flat plate. The ceramic green sheet partially includes a body that is obtained by molding and solidifying a conductor paste, which becomes a conductor later, and the body is exposed on a part of each of the both surfaces of the sheet. Plural ceramic green sheets described above are produced. The plural ceramic green sheets are successively stacked and press-bonded in the thickness direction in such a manner that the bodies included in the respective sheets are connected to each other for all combinations of the adjacent two sheets. As a result, a ceramic green sheet laminate is formed, which includes one body that is obtained by connecting the bodies included in the respective sheets.

Abstract: A thermal processing and consolidation system is provided that includes an upper chamber assembly lower chamber assembly, layup and demolding station, transfer assembly, automatic or permanent coupling system, and controller. The upper and lower chamber assemblies are coupled to form an enclosed plenum operable to maintain a pressurized environment about a tool. The layup and demolding station receives the tool and facilitates the layup, bagging and sealing of unprocessed components at the tool. A transfer assembly accurately positions the tool on the lower chamber assembly in alignment with the upper chamber assembly. An automatic or permanent coupling system provides services to the tool and the enclosed plenum. A controller directs services to be supplied to the enclosed plenum and tool in accordance with a set of process parameters. This set of process parameters allows an individual set of unprocessed components to be thermally processed and consolidated.

Abstract: A heat treatable coated article (e.g., vehicle windshield, IG unit, etc.) is provided with a dual-silver low-E coating. Before and/or after heat treatment (HT), the coating and/or coated article has a visible transmittance of at least 70%, more preferably at least 75%. Moreover, the coating and/or coated article is designed so as to have approximately the same color when viewed over a wide range of viewing angles. In certain embodiments, at least one contact layer (e.g., of or including NiCrOx) that contacts an infrared (IR) reflecting layer (e.g., Ag) is oxidation graded so that it progressively becomes less oxidized through its thickness as it nears the IR reflecting layer. In still other embodiments, a Si-rich silicon nitride layer(s) may be utilized to reduce haze.

Abstract: A method for producing a metal-ceramic composite coating with increased hardness on a substrate includes adding a sol of a ceramic phase to the plating solution or electrolyte. The sol may be added prior to and/or during the plating or coating and at a rate of sol addition controlled to be sufficiently low that nanoparticles of the ceramic phase form directly onto or at the substrate and/or that the metal-ceramic coating forms on the substrate with a predominantly crystalline structure and/or to substantially avoid formation of nanoparticles of the ceramic phase, and/or agglomeration of particles of the ceramic phase, in the plating solution or electrolyte. The ceramic phase may be a single or mixed oxide, carbide, nitride, silicate, boride of Ti, W, Si, Zr, Al, Y, Cr, Fe, Pb, Co, or a rare earth element. The coating, other than the ceramic phase may comprise Ni, Ni—P, Ni—W—P, Ni—Cu—P, Ni—B, Cu, Ag, Au, Pd.

Abstract: A process for joining a stainless steel part and a silicon carbide ceramic part comprising: providing a SUS part, a SiC ceramic part, a Mo foil and a Ti foil; placing the SiC ceramic part, the Mo foil, the Ti foil, and the SUS part into a mold, the Mo foil and the Ti foil located between the SiC ceramic part and the SUS part, the Mo foil abutting the SiC ceramic part, the Ti foil abutting the SUS part and the Mo foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part, the SiC ceramic part, the Mo foil, and the Ti foil at least until the SUS part, the SiC ceramic part, the Mo foil and the Ti foil form a integral composite article.

Abstract: Provided is a technology capable of improving the reliability of a semiconductor device using a SiOC film as an interlayer film. In the invention, by forming an interlayer film from a SiOC film having a Si—CH3 bond/Si—O bond ratio less than 2.50% or having a strength ratio determined by the FT-IR of a Si—OH bond to a SiO—O bond exceeding 0.0007, a strength ratio of a SiH bond to a SiO—O bond at a wavelength of 2230 cm?1 exceeding 0.0050 and a strength ratio of a Si—H bond to a SiO—O bond at a wavelength of 2170 cm?1 exceeding 0.0067, the interlayer film has a relative dielectric constant of to 3 or less, and owing to suppression of lowering in hardness or elastic modulus, has improved mechanical strength.

Abstract: A method of forming an easy-to-clean metal or metallized substrate, the method comprising forming a layer comprising silicon, oxygen, and hydrogen on at least a portion of a surface of the substrate by plasma deposition; and applying an at least partially fluorinated composition comprising at least one silane group to at least a portion of a surface of the layer comprising the silicon, oxygen, and hydrogen; and an easy-to-clean article made by the method are disclosed.

Abstract: A compound comprising at least one alkoxy silane moiety; and at least one moiety selected from a nitrosobenzene or a nitrosobenzene precursor and combinations thereof are provided and used in polymer to metal in particular rubber to metal bonding. The nitrosobenzene precursor may be at least one of a quinone dioxime or a quinone oxime.

Abstract: A process for joining a brass part and a silicon carbide ceramic part comprising: providing a brass part, a SiC ceramic part, a Al foil and a Ni foil; placing the SiC ceramic part, the Al foil, the Ni foil, and the brass part into a mold, the Al foil and the Ni foil located between the SiC ceramic part and the brass part, the Al foil abutting against the SiC ceramic part, the Ni foil abutting against the brass part and the Al foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the brass part, the SiC ceramic part, the Al foil, and the Ni foil at least until the brass part, the SiC ceramic part, the Al foil and the Ni foil form a integral composite article.

Abstract: A method for making a composite structure or a portion of a composite structure of a braking band of a brake disc, unusually capable of obtaining a structure with an especially long life, comprising at least the following steps: making a composite ceramic structure, comprising carbon fibre filaments, silicon and silicon carbides, obtaining a body of a braking band comprising at least one braking surface; processing said braking surface removing a surface layer so as to have carbon not bonded with the silicon on surface; removing at least partly the carbon not bonded with silicon from the surface; depositing an anchoring substrate on said braking surface; and depositing a protective coating on said anchoring substrate.

Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, a silicone compound, and a Fluoropolymer. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.

Abstract: A ceramic sintered member is used as an insulating substrate for mounting of an electronic part and bonded to a copper plate or aluminum plate on at least part of a front face or backside face of the insulating substrate. A powder material to form the ceramic sintered member includes alumina as a main ingredient and further includes as subsidiary ingredients partially stabilized zirconia and magnesia. Content of the partially stabilized zirconia is 1 to 30 percent by weight relative to the entire powder material. Content of the magnesia relative to the entire powder material is within a range 0.05 to 0.50 percent by weight. Mole fraction of yttria in the partially stabilized zirconia being is a range of 0.015 to 0.035. 80 to 100 percent of the zirconia crystals included in the ceramic sintered member is in the tetragonal crystal phase.

Abstract: A housing includes a substrate and a nano-composite layer deposited on the substrate. The nano-composite layer includes a number of metal oxide nitride layers and a number of Ce layers. Each metal oxide nitride layer alternates with a Ce layer, and the outermost nano-composite layer is a metal oxide nitride layer. The metal in the metal oxide nitride layer aluminum, titanium, silicon, chromium, or zirconium.

Abstract: In one exemplary embodiment, a method includes: forming at least one first monolayer of first material on a surface of a substrate by performing a first plurality of cycles of atomic layer deposition; thereafter, annealing the formed at least one first monolayer of first material under a first inert atmosphere at a first temperature between about 650° C. and about 900° C.; thereafter, forming at least one second monolayer of second material by performing a second plurality of cycles of atomic layer deposition, where the formed at least one second monolayer of second material at least partially overlies the annealed at least one first monolayer of first material; and thereafter, annealing the formed at least one second monolayer of second material under a second inert atmosphere at a second temperature between about 650° C. and about 900° C.

Abstract: Provide an oven and optional cooking accessories having a high emissivity thermal protective layer on a substrate surface which comprises a metal or ceramic. The layer comprises from about 5% to 30% of an inorganic adhesive, from about 45% to 92% of at least one filler, and from about 1% to 25% of one or more emissivity agents; or from about 5% to 35% of colloidal silica, colloidal alumina, or combinations thereof, from about 23% to 79% of at least one filler, and from about 1% to 25% of one or more emissivity agents.

Abstract: A structure and method of forming the structure. At least one copper wire is formed within a first dielectric layer of a substrate. The top surface of each copper wire and of the first dielectric layer are essentially coplanar. A recess is formed in the first dielectric layer from the top surface of each copper wire to a recess depth less than a thickness of each copper wire within the first dielectric layer such that the recess surrounds a perimeter surface of each copper wire. A capping layer, which is a copper diffusion barrier, is formed in the recess and on the top surface of each copper wire and on the first dielectric layer. A second dielectric layer is formed on the capping layer. The recess depth has a magnitude sufficient to prevent a lateral fail of the capping layer during packaging and/or operation of the substrate.

Abstract: A sound-absorbing heat shield includes at least three layers which are connected to one another. The heat shield is produced from a composite foil which includes two metal foils which are connected to one another via a damping layer. A method for producing a sound-absorbing heat shield introduces a damping layer between two metal foils, subsequently applies pressure to them over their full area, and afterward forms the foil into the desired shape of the heat shield.

Abstract: A low emissivity and EMI shielding transparent composite film typically for use in association with window glazing and comprising a transparent film substrate having on one side thereof an underlayer of abrasion resistant hardcoat material with at least one infrared reflective layer covering the underlayer, typically a metallic layer which may be encased in metal oxide layers, which is then covered with a thin external protective top coat of a cured fluorinated resin.

Abstract: A coating composition is provided, the starting materials of which comprise nano SiO2, film-forming substance, film-forming aid, accelerator, acid, and water. The composition has pH of 3-9. A passivated zinc-plated material is also provided. The zinc-plated material comprises zinc-plated substrate and passivated coat adhered to the surface of the zinc-plated substrate, wherein the passivated coat is formed by curing the coating composition. The coating composition can impart to the zinc-plated material excellent corrosion resistance, water resistance, high temperature resistance, surface conductivity, and adhesion to the zinc-plated substrate. Additionally, the coating composition contains no Cr6+, and satisfies the requirement of EU RoHS Directive.

Abstract: The subject of the present invention is the use of at least one element chosen from among yttrium, zirconium, lanthanum, cerium, praseodymium and neodymium, in the form of oxides or salts, as reinforcing agent for the anticorrosion properties of an anticorrosion coating composition containing a particulate metal, in aqueous or organic phase, for metal parts.

Abstract: A coating includes a titanium aluminum silicon carbon-nitride layer including a first surface and an opposite second surface. The atomic carbon content and/or the atomic nitrogen content in the titanium aluminum silicon carbon-nitride layer gradually increases from the first surface to the second surface.

Abstract: A sanitary object having a decorative surface, which comprises substantially a body, formed of plastic or metal and an at least partial outer coating, that at least one metal layer has a combination of at least two elements selected from the following group: aluminum, chromium, zinc, silver, titanium, and/or zirconium, and is arranged as a coating.

Abstract: The silica film forming material of the present invention comprises a silicone polymer which comprises, as part of its structure, CHx, an Si—O—Si bond, an Si—CH3 bond and an Si—CHx- bond, where x represents an integer of 0 to 2.

Abstract: A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of the metal substrate satisfies an equation as follows, ? f + 0.162 × ( 1 - v f ) E f ? ? s ? ? f + 0.889 × ( 1 - v f ) E f Ef representing Young's modulus of the buffer layer, vf representing Poisson's ratio of the buffer layer, ?f representing a coefficient of thermal expansion of the buffer layer, and ?s representing the predetermined coefficient of thermal expansion of the metal substrate.

Abstract: Modified alkoxylation products of the formula (I), their use and processes for preparing them

Abstract: A coating and a method of forming the same on a substrate is provided. The coating is provided with at least one ceramic material layer and at least one metal material layer. At least one of the materials used is a shape memory alloy so as to provide elasticity in the coating so as to allow any deformation of the same to be substantially recovered.

Abstract: A composite article includes a substrate and a protective coating on at least a portion of the substrate. The protective coating includes reinforcement particles dispersed within an elastomeric matrix that is modified with a silicon-containing modifier selected from polysilsesquioxane, polyhedral oligomeric silicate and polyhedral oligomeric silsesquioxane (POSS).

Abstract: Disclosed is a refrigeration circuit-forming member which has a metal surface and is used for a refrigeration circuit in which HFO-1234yf that is a refrigerant configured of molecules having a double bond is used. The metal surface, which comes into contact with the HFO-1234yf, is covered with a coating layer that is not reactive with the HFO-1234yf within the range of temperature at which the HFO-1234yf is used. The coating layer is formed of any of a coating film that is firmly fixed to the metal surface, a coating layer that is formed by adhesion of a specific component added into the lubricant oil, and a coating layer that is formed by modification of the metal surface layer itself that forms the metal surface. Consequently, the chemical instability that is caused when the refrigerant HFO-1234yf comes into contact with the metal can be eliminated.

Abstract: The invention relates to solvent-containing two-component polyurethane moisture cured hybrid sol-gel coating formulation comprising 1) an epoxy-functional binder with carbamate functionality and 2) a blended curing component comprising at least one sol gel precursor and an amine crosslinker.

Abstract: The invention relates to a rollable tile structure, to a process for the production of the tile structure, and to the use of the tile structure in the production of a tiled covering. The invention relates further to the use of organic polysilazanes in the production of a rollable tile structure. The tile structure has a first carrier layer (1) and a surface layer (2), the surface layer (2) comprising a network of organic polysilazanes and the tile structure as a whole being in rollable form.

Abstract: A heat sink substrate has a composite structure including a three-dimensional network structure of SiC ceramic having pores infiltrated with Si, and has a thermal conductivity of not less than 150 W/m·K and an oxygen content of not greater than 7 ppm. The heat sink substrate is easily allowed to have an increased surface area. Further, the heat sink substrate has a higher thermal conductivity and a coefficient thermal expansion close to that of the SiC. Therefore, the heat sink substrate is superior in the efficiency of heat conduction from a semiconductor device. The heat sink substrate is produced by infiltrating a thermally melted Si into the pores of the three-dimensional network structure in a non-oxidative atmosphere in the presence of an oxygen absorber.

Abstract: A cermet has a hard phase which contains W and nitrogen, and includes at least one selected from a carbide, nitride and carbonitride of a metal having Ti as a main component, and a binder phase having an iron group metal as a main component. A W amount contained in the whole cermet is 5 to 40% by weight, an interfacial phase including a complex carbonitride with a larger W amount than a W amount of the hard phase being present between grains of the hard phase, and when a W amount contained in the interfacial phase based on the whole metal element is represented by Wb (atomic %), and a W amount contained in the hard phase based on the whole metal element is represented by Wh (atomic %), then, an atomic ratio of Wb to Wh (Wb/Wh) is 1.7 or more. The cermet is excellent in fracture resistance and wear resistance.

Abstract: A substrate of the present invention for producing aligned carbon nanotube aggregates on a surface thereof is a substrate for producing aligned carbon nanotube aggregates on a surface thereof, the substrate for producing aligned carbon nanotube aggregates including: a metal base substrate; and carburizing prevention layers formed on both front and back surfaces of the metal base substrate, respectively.

Abstract: Nanoscopic metallized and nonmetallized nanoscopic silicon containing agents including polyhedral oligomeric silsesquioxane and polyhedral oligomeric silicate provide radiation absorption and in situ formation of nanoscopic glass layers on material surfaces. These property improvements are useful in space-survivable materials, microelectronic packaging, and radiation absorptive paints, coatings and molded articles.

Abstract: The present invention relates to a rust-preventive metallic component part in which a steel wire to which wire-drawing processing is performed is adapted into a substrate and which comprises a rust-preventive coating film being free from chromium on a surface of the substrate, and to a manufacturing method for the same; and its object is to provide a rust-preventive metallic component part whose rust-preventive coating film exhibits such good adhesiveness to substrate that it is not come off by elastic deformations in service, by sliding contacts at the time of transportation, and the like, and to provide a manufacturing method for the same.