Shaped Configuration For Melting (e.g., Package, Etc.) Patents (Class 428/576)
  • Patent number: 7858204
    Abstract: A wire (10) for use in a brazing or soldering operation has an elongated body (12) of a metallic material. The elongated body (12) has an outer surface (18). A channel (14) is formed along a length of the body. The channel (14) has an opening (A1). A flux solution (22) is deposited within the channel (14) and along the length of the body. The flux solution (22) covers a portion of the outer surface (18). A portion of the flux solution (22) is exposed through the opening (A1) in the channel (14).
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: December 28, 2010
    Assignee: Bellman-Melcor Development, LLC
    Inventors: Steven Campbell, John Scott
  • Publication number: 20100304175
    Abstract: The present invention relates to aluminum brazing sheet with high levels of Magnesium in the core layer and having good Controlled Atmosphere Brazing (CAB) brazeability and suitable for use with any commercially available brazing flux, including brazing flux with or without Cesium.
    Type: Application
    Filed: May 29, 2009
    Publication date: December 2, 2010
    Applicant: ALCOA INC.
    Inventors: Raymond J. Kilmer, Michael P. Danz, John F. Butler, JR.
  • Publication number: 20100288823
    Abstract: A small solder rod with a stop-off at the end in order to prevent the solder from dripping from an opening is provided. A process for applying solder to a hole in a substrate, wherein the solder is used in the form of a wire or a small rod is also provided.
    Type: Application
    Filed: January 8, 2009
    Publication date: November 18, 2010
    Inventors: Francis-Jurjen Ladru, Gerhard Reich
  • Publication number: 20100291400
    Abstract: An aluminium alloy brazing sheet comprising: a core material made of an aluminium alloy consisting of ?0.1 wt % Si, most preferably ?0.06 wt % Si, ?0.35 wt % Mg, from 1.0 to 2.0 wt %, preferably 1.4 to 1.8 wt % Mn, from 0.2 to 1.0, preferably 0.6 to 1.0 wt % Cu, ?0.7 wt % Fe, ?0.3 wt % each of Zr, Ti, Ni, Hf, V, Cr, In, Sn and ?0.5 wt % total of Zr, Ti, Ni, Hf, V, Cr, In, Sn, the remainder being Al and unavoidable impurities; and a waterside cladding material clad on at least one side of the core material, said cladding material being made of an aluminium alloy having a potential lower than that of said core material and consisting essentially of 0.5-1.5 wt % of Si, 1.0 to 2.0 wt % preferably 1.4-1.8 wt % of Mn, ?0.15 wt % Mg, ?0.1% Cu, ?0.7 wt % Fe, ?1.4 wt %, preferably ?1.1 wt %, most preferably ?0.4 wt % Zn, ?0.3 wt % each of Zr, Ti, Ni, Hf, V, Cr, In, Sn and ?0.
    Type: Application
    Filed: May 14, 2010
    Publication date: November 18, 2010
    Applicant: SAPA HEAT TRANSFER AB
    Inventors: Linda AHL, Stefan Norgren, Anders Oskarsson
  • Publication number: 20100193801
    Abstract: A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.
    Type: Application
    Filed: November 19, 2008
    Publication date: August 5, 2010
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, TOHOKU UNIVERSITY
    Inventors: Yasushi Yamada, Yuji Yagi, Yoshikazu Takaku, Ikuo Ohnuma, Kiyohito Ishida, Takashi Atsumi, Ikuo Nakagawa, Mikio Shirai
  • Publication number: 20100151273
    Abstract: The invention relates to an aluminum alloy brazing sheet including: a thin covering material layer, a core material layer, and an Al—Si alloy brazing material layer as an intermediate material interposed between the thin covering material and the core material. The thin covering material and the core material being of aluminum alloys having a solidus temperature higher than a liquidus temperature of the brazing material so that the molten brazing material seeps onto a surface of the thin covering material when the brazing material is molten in a brazing operation. The Al—Si alloy brazing material contains from 0.01 to 0.09% mg, and the aluminum alloy brazing sheet has a total Mg-content of less than 0.06%.
    Type: Application
    Filed: June 12, 2008
    Publication date: June 17, 2010
    Applicant: ALERIS ALUMINUM KOBLENZ GMBH
    Inventor: Adrianus Jacobus Wittebrood
  • Publication number: 20100136361
    Abstract: A welding material, to be used for welding a base metal made of an austenitic alloy comprising C?2.0%, Si?4.0%, Mn: 0.01 to 3.0%, P: more than 0.03% to not more 0.3%, S?0.03%, Cr: 12 to 35%, Ni: 6 to 80%, sol. Al: 0.001 to 1% and N?0.3%, with the balance being Fe and impurities to a base metal made of another austenitic alloy, which comprises C: more than 0.3% to 3.0%, Si?4.0%, Mn?3.0%, P?0.03%, S?0.03%, Cr: more than 22% to 55%, Ni: more than 30% to not more than 70%, sol. Al: 0.001 to 1% and N?0.3%, with the balance being Fe and impurities can suppress the weld solidification cracking which occurs in an austenitic alloy having a high P content and showing fully austenitic solidification. Therefore, the said welding material can be widely used in such fields where a welding fabrication is required. The said welding material may contain a specific amount or amounts of one or more elements selected from Cu, Mo, W, V, Nb, Ti, Ta, Zr, Hf, Co, B, Ca, Mg and REM.
    Type: Application
    Filed: January 22, 2010
    Publication date: June 3, 2010
    Inventors: Takahiro Osuki, Kazuhiro Ogawa, Hirokazu Okada
  • Patent number: 7718274
    Abstract: The invention relates to a method for welding two welding parts (1, 3) by means of a fillet weld (11), wherein a first welding part (1), with a bearing surface at least in an edge area of an edge that is to be welded by means of a fillet weld, is brought into contact with a bearing surface of a welding part (3) and the welding energy (5) is supplied in an energy supply area during the welding process, exclusive of a surface (7) of the first welding part facing away from the bearing surface, said energy supply area being located at a predetermined distance from the edge of the first welding part. The welding energy is supplied in a direction, whereby the direction component thereof points perpendicular to the course of the fillet weld that is to be produced in the direction of an inner area of the first welding part, forming a welding angle of less than 90° with the contact plane of the bearing surfaces of the first and second welding parts.
    Type: Grant
    Filed: November 15, 2005
    Date of Patent: May 18, 2010
    Assignee: TRW Automotive Electronics & Components GmbH & Co. KG
    Inventors: Thomas Ertl, Hardy Wilkendorf
  • Publication number: 20100119859
    Abstract: A component and a solder are provided. The solder is used to repair the component including a base material with a directional microstructure. The solder used includes two constituents, a first constituent and a second constituent, including different grain size distributions. The first constituent of the solder includes a composition that corresponds to or is similar to the base material.
    Type: Application
    Filed: February 15, 2008
    Publication date: May 13, 2010
    Inventors: Karl-Heinz Manier, Michael Ott
  • Publication number: 20100112370
    Abstract: Disclosed is an aluminum alloy brazing sheet for heat exchangers, which has high strength after brazing, high corrosion resistance and excellent brazability. Specifically disclosed is an aluminum alloy brazing sheet (1a) for heat exchangers comprising a core member (2), a sacrificial member (3) formed on one side of the core member (2), and a brazing filler metal (4) formed on the other side of the core member (2) and composed of an Al—Si alloy. The sacrificial member (3) contains 0.03-0.30% by mass of Fe, 0.01-0.40% by mass of Mn, 0.4-1.4% by mass of Si, 2.0-5.5% by mass of Zn, not more than 0.05% by mass of Mg and the balance of Al and unavoidable impurities. In addition, the sacrificial member (3) has a crystal grain size of 100-400 & mgr;m after 5-minute heat treatment at 600 & ring;C during the brazing.
    Type: Application
    Filed: December 18, 2007
    Publication date: May 6, 2010
    Applicants: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), DENSO CORPORATION
    Inventors: Toshiki Ueda, Akihiro Tsuruno, Fumihiro Koshigoe, Keiichi Okazaki, Takahiko Nagaya, Kenji Negura
  • Publication number: 20100104887
    Abstract: Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap (10) is used for an electronic component storing package (100) which includes an electronic component storing member (20) for storing an electronic component (40). The airtightly sealing cap is provided with a base material (1); a base layer (2) which is formed on the surface of the base material and contains Ni; and a soldering material layer (6), which is formed on the base layer, has a thickness of 10 ?m or less and composed of Au and Sn. The content percentage of Au in the soldering material layer is 43 mass % or more but not more than 64 mass %.
    Type: Application
    Filed: February 19, 2008
    Publication date: April 29, 2010
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Masaharu Yamamoto, Takayuki Furujo
  • Publication number: 20100086802
    Abstract: A brazing product for fluxless brazing comprises a substrate and a filler metal-forming composition applied to the substrate. The substrate preferably comprises aluminum, an aluminum alloy or another metal and may include at least one layer of a ceramic, carbide or nitride. The filler metal-forming composition comprises a liquid-forming layer comprising silicon and a braze-promoting layer comprising one or more metals selected from the group comprising nickel, cobalt, palladium and iron. The liquid-forming layer comprises one or more material layers. Where the liquid-forming layer comprises a plurality of layers, it may include at least one layer consisting essentially of silicon.
    Type: Application
    Filed: December 2, 2009
    Publication date: April 8, 2010
    Inventors: Michael E. Graham, Richard A. Hoffman, Margaret Anna Hoffman, Brian E. Cheadle, Kostas F. Dockus, Stefanija Kisielius, Robert H. Krueger
  • Publication number: 20100055489
    Abstract: A coupling apparatus that may have a first component having a first sealing surface and a second component having a second sealing surface. The first and second sealing surfaces are in facing relationship with one another when the first and second components are coupled together. One of the first and second sealing surfaces has a metallic film layer that transforms into a liquefied metal layer when the metallic film layer is exposed to a temperature that exceeds a melting temperature of a metal from which the metallic film layer is formed. The liquefied metal layer forms a seal between the sealing surfaces.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 4, 2010
    Applicant: The Boeing Company
    Inventors: Lawrence J. Pionke, Michael H. Curry
  • Publication number: 20090324985
    Abstract: The present invention provides an aluminum alloy material which is used as a core material for an aluminum alloy brazing sheet and has superior strength at a high temperature. The aluminum alloy material of the present invention is used as a core material C1 for an aluminum alloy brazing sheet B31 (or B32) which has a filler alloy F formed on at least one side of the core material C1. The aluminum alloy material contains more than 2.5% by mass and 3.5% by mass or less of Cu, and the balance being made of aluminum and unavoidable impurities.
    Type: Application
    Filed: September 2, 2009
    Publication date: December 31, 2009
    Applicants: KABUSHIKI KAISHA KOBE SEIKO SHO, T.RAD CO., LTD.
    Inventors: Akihiro TSURUNO, Katsuhiro MATSUKADO, Yoshinori KATO
  • Publication number: 20090212091
    Abstract: Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present.
    Type: Application
    Filed: February 27, 2008
    Publication date: August 27, 2009
    Inventors: Siuyoung Yao, Brian Taggart
  • Publication number: 20090173626
    Abstract: A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.
    Type: Application
    Filed: April 14, 2008
    Publication date: July 9, 2009
    Inventors: Alan Duckham, Jesse E. Newson, Michael V. Brown, Timothy Ryan Rude, Omar M. Knio, Ellen M. Heian, Jai S. Subramanian, Timothy P. Weihs, Yuping Lin, Jonathan Levin, Gary Catig
  • Publication number: 20090162686
    Abstract: A brazing sheet of aluminum alloy composed of a core material and a first brazing filler metal covering one surface of the core material. The core material contains as an essential component 0.2-1.0 mass % of Cu and as optional components at least one species of no more than 1.5 mass % of Si, no more than 1.8 mass % of Mn, no more than 0.35 mass % of Ti, and no more than 0.5 mass % of Mg, with the remainder being Al and inevitable impurities. The first brazing filler metal has a liquid phase ratio (X %) at 600° C. and a thickness (Y ?m) such that X and Y satisfy the following relationship: (1) 30?X?80, (2) Y?25, and (3) 1000?X×Y?24000. The brazing sheet provides good brazeability and maintains high corrosion resistance after brazing on the surface cladded with the brazing filler metal.
    Type: Application
    Filed: December 1, 2008
    Publication date: June 25, 2009
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Katsuhiro Matsukado, Akihiro Tsuruno, Yoshinori Kato
  • Publication number: 20090107658
    Abstract: A brazing method is provided for brazing a metallic material for brazing to another metallic material. The metallic material for brazing includes a base material portion made of copper or a copper alloy containing chrome by a predetermined amount, and a metallic film portion made of a material having a melting point lower than a heating temperature in brazing, and provided on the surface of the base material portion. The brazing method includes a step of assembling the metallic material for brazing and the another metallic material to form an assembly, a step of heating and brazing the assembly, in which the metallic film portion is melted to diffuse chrome into a surface of the metallic material for brazing, and a step of forming a chrome oxide film by using the chrome diffused into the surface of the metallic material for brazing in atmosphere after the brazing step.
    Type: Application
    Filed: October 29, 2008
    Publication date: April 30, 2009
    Applicants: DENSO CORPORATION, Luvata Sweden AB
    Inventors: Shin Takewaka, Sumio Susa, Tooru Ikeda, Shoei Teshima, Anders Falkeno, Ulrik Palmqvist, Leif Tapper
  • Publication number: 20090068489
    Abstract: The present invention is, in a hermetic seal cover including a seal cover main body and an Au—Sn brazing material fused to a surface of the seal cover main body, a hermetic seal cover characterized in that surface roughness defined by JIS B0601 of the surface of the aforesaid seal cover main body to which the Au—Sn brazing material is fused is 0.005 to 0.25 ?m. Here, the Au—Sn brazing material is preferably fused after Au plating is applied to the seal cover main body, and by making the thickness of the Au plating 0.003 to 0.05 ?m, a seal cover without inflow of the brazing material to the inside of the package at the time of sealing can be provided.
    Type: Application
    Filed: February 1, 2006
    Publication date: March 12, 2009
    Inventors: Kenichi Miyazaki, Shinsuke Mano
  • Publication number: 20090004501
    Abstract: A pad for soldering a contact of a surface mounted component is provided herein. The pad includes a central portion and a plurality of separate extending portions extending from the central portion. All of the plurality of separate extending portions includes a free end and a connected end connected to the central portion. A width of the free end is larger than a width of the connected end. A circuit board and an electronic device are also provided.
    Type: Application
    Filed: December 29, 2007
    Publication date: January 1, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHU-JEN TSAI, LONG-FONG CHEN, WEN-HAW TSENG, SHIH-FANG WONG
  • Publication number: 20090004500
    Abstract: In some embodiments, a multilayer preform for fast transient liquid phase bonding is presented. In this regard, a method is introduced consisting of forming a plurality of first alloy layers, forming a plurality of second alloy layers, wherein the second alloy has a melting temperature that is higher than the melting temperature of the first alloy, and placing the first and second alloy layers together in an alternating sequence such that there is one more layer of the first alloy than of the second alloy and that the top and bottom layers of the formation are of the first alloy. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 26, 2007
    Publication date: January 1, 2009
    Inventors: Daewoong Suh, Jessica Weninger
  • Publication number: 20080305354
    Abstract: A filler composition for welding onto a substrate is composed of 82.5˜96.5 wt %, aluminum, 3.0˜10.0 wt % copper, 0.2˜1.5 wt % magnesium, 0.1˜1.5 wt % silver, 0.1˜2.0 wt % scandium, 0˜1.5 wt % zirconium, and 0˜1.0 wt % titanium, and can be welded with a high success rate to a substrate (such as an aluminum-copper alloy substrate) and avoiding a hot cracking phenomenon and a low welding strength, so as to achieve the effects of enhancing the yield rate and lowering the cost of a product.
    Type: Application
    Filed: August 16, 2007
    Publication date: December 11, 2008
    Inventors: Sheng-Long Lee, Chih-Horng Chang, Jing-Chie Lin, Chin-Kui Lin, Meng-Syuan Doong, Kent-Yi Lee, Yu-Chou Tsai, Yu-Te Chen
  • Publication number: 20080187772
    Abstract: This invention is related to an electronic board comprising an area forming a BGA type electronic component backing, an electric heating resistor at right angle to said area, said resistor being able to supply an amount of heat for soldering the component onto the plate, characterized in that the board comprises a plurality of conductive layers alternating with electrically insulating layers, said resistor forming one of the conductive layers immediately underlying the surface layer. The board comprises, if need be, a thermal drain. This invention is also related to a facility for implementing the method. It also allows for an electronic board to be repaired through replacing defective members without risking to unsolder or to damage adjacent members.
    Type: Application
    Filed: January 30, 2008
    Publication date: August 7, 2008
    Applicant: HISPANO SUIZA
    Inventors: Bernard Glever, Daniel Goux, Robert Poirier
  • Patent number: 6638638
    Abstract: A solder structure comprising a radially-curved exterior surface enclosing a predetermined-sized cavity used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an annular conductive pad and the other planar element having either a corresponding annular or circular conductive pad, separated by a spherical solder compound comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.
    Type: Grant
    Filed: September 18, 2001
    Date of Patent: October 28, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Young Kim, Ho-Jeong Moon, Dong-Kil Shin, Seung-Kon Mok
  • Patent number: 6558763
    Abstract: Disclosed is a container, made by folding, with fold-in flaps, for packaging food. The container can be recycled economically, i.e. with a profit. The material consists of a metal sheet coated with a plastics skin which, when the metal is recovered, produces no residual matter or pollutants. The edges of the containers are welded to each other by the plastics coating. After bending open the flaps, the container can be easily laid flat by hand (thus reducing its volume) without it springing back and used containers can be collected in compact form in a recycling container and transported in the recycling container to the recycling facility where the metal is recovered by melting.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: May 6, 2003
    Assignee: Tettra Laval Holdings & Finance S.A.
    Inventor: Hans-Werner Meixner
  • Patent number: 6511759
    Abstract: The instant invention provides a means and method for producing multi-laminar elements, said elements being suitable for operation in high temperature, atmospheric or vacuum environments such as those which may be required when processing materials such as substrates for semiconductors or for chemical vapor deposition.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: January 28, 2003
    Inventor: Carl Schalansky
  • Publication number: 20020168538
    Abstract: A metal alloy composite comprising a phase of a highly-conductive base metal in the from of a matrix and a phase of another metal positioned within the matrix, the base metal being present in a major amount and the other metal being present in a minor amount, the metal alloy composite being capable of being formed into a very thin wire for use in a semiconductor application which includes a terminal assembly comprising an electrically conductive terminal in conductive contact with a conductive member and another electrically conductive terminal in conductive contact with a semiconductor, said terminals being joined by said alloy composite wire, examples of the base metal being gold, copper, and aluminum.
    Type: Application
    Filed: April 23, 2002
    Publication date: November 14, 2002
    Inventor: Timothy W. Ellis
  • Patent number: 6391085
    Abstract: A metal feedstock from wasted metal products is disclosed. The feedstock is formed by crushing the metal products into pieces; magnetically separating sheet-shaped ferrous scraps and ferrous cast blocks from the crushed pieces; placing the cast blocks between the sheet-shaped scraps to make a sandwich structure; and pressing the sandwich structure to form a metal feedstock.
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: May 21, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Takano, Tetsushi Yonekawa, Yoshihiro Ogawa, Takashi Okada
  • Patent number: 6357099
    Abstract: A method of forming a metal feedstock from wasted metal products is disclosed. The method includes the steps of crushing the metal products into pieces; magnetically separating sheet-shaped ferrous scraps and ferrous cast blocks from the crushed pieces; placing the cast blocks between the sheet-shaped scraps to make a sandwich structure; and pressing the sandwich structure to form a metal feedstock.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: March 19, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Takano, Tetsushi Yonekawa, Yoshihiro Ogawa, Takashi Okada
  • Publication number: 20010039709
    Abstract: A method of forming a metal feedstock from wasted metal products is disclosed. The method includes the steps of crushing the metal products into pieces; magnetically separating sheet-shaped ferrous scraps and ferrous cast blocks from the crushed pieces; placing the cast blocks between the sheet-shaped scraps to make a sandwich structure; and pressing the sandwich structure to form a metal feedstock.
    Type: Application
    Filed: May 23, 2001
    Publication date: November 15, 2001
    Inventors: Hiroshi Takano, Tetsushi Yonekawa, Yoshihiro Ogawa, Takashi Okada
  • Patent number: 6306526
    Abstract: A metal lid for use in hermetic sealing of a semiconductor package comprises a lid body comprising a metal plate having a solder layer secured to the entire surface of the metal lid by cladding. The lid is placed in position on a substrate and can seal the resulting package by heating to melt the solder layer. The lid can be readily mass-produced and can seal the package with high seal reliability and without deposition of solder balls on the inner wall of the package.
    Type: Grant
    Filed: September 10, 1999
    Date of Patent: October 23, 2001
    Assignees: Sumitomo Metal (SMI) Electronics Devices Inc., Senju Metal Industry Co. Ltd.
    Inventors: Tetsuya Yamamoto, Shigeki Kawamura, Sanae Taniguchi
  • Patent number: 6077615
    Abstract: A Co-base alloy including, by weight, 0.03-0.10% C, not more than 1.0% Si, not more than 1.0% Mn, 20-30% Cr, 15-23% Ni, 3-10% W, 5-10% Ta and 0.05-0.7% Zr, is used as a welding material. A gas turbine nozzle has a crack repaired with a multi-layer weld using the Co-base alloy and a gas turbine for power generation employs the nozzle.
    Type: Grant
    Filed: December 16, 1997
    Date of Patent: June 20, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Masami Yada, Takao Funamoto, Takamitsu Nakazaki, Kei Kobayashi, Norio Yokoba, Nobuyuki Iizuka, Kazuhiko Kumata
  • Patent number: 6037048
    Abstract: Fibers having increased strength and small diameters can be produced from compositions comprising long chain branched syndiotactic vinyl aromatic polymers. Due to the increased fiber strength, less strand breakage occurs during processing which increases process productivity and yield.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: March 14, 2000
    Assignee: The Dow Chemical Company
    Inventors: Curtis E. Peterson, Roel H. Vossen, Yi-Bin Huang, Paul J. Moses, Jr.
  • Patent number: 5968670
    Abstract: A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.
    Type: Grant
    Filed: August 12, 1997
    Date of Patent: October 19, 1999
    Assignee: International Business Machines Corporation
    Inventors: Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, James H. Covell, II, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson, David C. Linnell, Gregory B. Martin, Frank L. Pompeo, Kathleen A. Stalter, Hilton T. Toy
  • Patent number: 5846287
    Abstract: A method for forming a wrought product from a starting metal such as tantalum, niobium, and alloys thereof. A consumable electrode is coated with at least a first alloy layer by means which provide for uniform thickness. Sufficient power is applied to the electrode body to induce arcing to cause the starting metal and alloy layers to melt and pool in a crucible. The uniform layer on the electrode body provides a means for delivering minute quantities of alloy into a larger quantity of starting metal and facilitates a uniform and consistent arc which promotes mixing of the alloy and starting material in the crucible. The electrode body is consumed at an improved rate without an associated decrease in the final ingot yield weight. The pooled metal is allowed to solidify into an ingot. The ingot is then formed into a wrought product.
    Type: Grant
    Filed: January 27, 1997
    Date of Patent: December 8, 1998
    Assignee: Cabot Corporation
    Inventors: Prabhat Kumar, Louis Huber, Robert Engleman, Charles Heatley
  • Patent number: 5589118
    Abstract: Iron-rich-material waste products, such as electric arc furnace dust, are formed with an organic binder into discrete shapes, such as briquettes. The shapes can then be used in iron and steel making processes and the iron and heavy metal values in the waste product recovered.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: December 31, 1996
    Assignee: Covol Technologies, Inc.
    Inventors: George W. Ford, Jr., Richard C. Lambert, Russell G. Madsen
  • Patent number: 5400946
    Abstract: When hard-substance parts are soldered onto steel bases, thermal stresses are produced between the hard substance and the steel. These stresses can be reduced by means of using a multilayer solder in which the middle layer consists of a precipitation-hardenable copper alloy or nickel alloy provided on both sides with a layer of a hard-solder alloy whose working temperature is at least 50.degree. C. below the melting point of the precipitation-hardenable copper alloy or nickel alloy. A tempering treatment at 250.degree. to 550.degree. C. is carried out after the soldering in order to achieve a precipitation hardening of the middle layer.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: March 28, 1995
    Assignee: Degussa Aktiengesellschaft
    Inventors: Wolfgang Weise, Harald Krappitz, Willi Malikowski
  • Patent number: 4871622
    Abstract: A flexible multilayered brazing material is disclosed comprising at least one layer of ductile brazing foil defining a core body having two major surfaces and at least one minor surface, and at least one layer of ductile brazing foil substantially covering said two major surfaces and at least one minor surface. In particular, the layer(s) and the covering foil are each at least about 50% amorphous, with the covering foil being, most preferably, helically wrapped around the layers. The multilayered brazing materials enable brazing of large gaps and wide gaps formed by juxtaposed parts to be brazed. Processes for producing the flexible multilayered brazing material are also disclosed.
    Type: Grant
    Filed: April 15, 1988
    Date of Patent: October 3, 1989
    Assignee: Allied SIgnal Inc.
    Inventor: Anatol Rabinkin
  • Patent number: 4839236
    Abstract: An ingot formed as an elongate structure characterized by a rectangular center body and reduced section handle structures on the ends of the body each provided with recesses for receipt of manipulative tools. The rectangular center body moreover, includes performations proximate each handle structure which are useful in storage and for the control of heat transfer for partial melting.
    Type: Grant
    Filed: May 11, 1987
    Date of Patent: June 13, 1989
    Inventor: Lucelio Sulprizio
  • Patent number: 4737417
    Abstract: A cast metallic fixture for workpieces including twin turbine blades has two spaced-apart walls which surround portions of the exterior of a workpiece and several webs which connect the walls to each other. The fixture is made in a casting mold which has one or more inserts extending into the interior of a workpiece which is placed into the cavity of the mold preparatory to pouring of a molten alloy which is then caused to harden and to thus form the fixture. When the fixture has served its purpose of holding the workpiece in a grinding machine, it is broken up by subjecting its walls to bending and tensional stresses to destroy the webs, whereupon the walls are moved apart to afford access to the workpiece. The webs can be destroyed by melting simultaneously with or in lieu of the application of mechanical stresses to the walls of the fixture.
    Type: Grant
    Filed: April 20, 1987
    Date of Patent: April 12, 1988
    Assignee: Korber AG
    Inventors: Heinrich Mushardt, Uwe Uhlig, Ralf Bleich
  • Patent number: 4654255
    Abstract: Adhesive resins obtained by reacting 100 parts by weight of an epoxy-containing olefin polymer with 0.01-10 parts by weight of at least one ethylenically unsaturated fatty acid or derivative thereof, are described. The adhesive resins or olefin polymer compositions comprising the adhesive resins are particularly useful in lamination with other types of resins. Such laminates are also described.
    Type: Grant
    Filed: July 12, 1985
    Date of Patent: March 31, 1987
    Assignee: Nippon Petrochemicals
    Inventors: Shinji Kojima, Hirokazu Suzuki, Yuichi Orikasa
  • Patent number: 4639398
    Abstract: Compound film containing polyolefin. Such a compound film comprises at least one polyolefin layer having good adhesiveness to polymers containing polar radicals. In order to make the adhesive polyolefin layer such that the adhesive layer contains no substances detrimental to health, the adhesive layer in the compound film of the invention consists of polyolefin which has been modified by grafting 0.01 to 10% of unsaturated alkoxysilane.
    Type: Grant
    Filed: September 13, 1984
    Date of Patent: January 27, 1987
    Assignee: Neste Oy
    Inventor: Christer Bergstrom
  • Patent number: 4588643
    Abstract: Coated internal surfaces of molding apparatus and a process for reducing the amount of sticking of material on the internal surface of a molding apparatus are disclosed. The coated substrate and the process both employ release compositions having very low surface tensions comprising (1) a linear or branched polymer containing ionic functional moieties and (2) a perfluorocarbon compound having a counterionic character. Such compositions dissolve in volatile acidic or basic solutions and result in salt precipitates which adhere to substrates upon the evaporation of the volatile acidic or basic solution.
    Type: Grant
    Filed: March 18, 1983
    Date of Patent: May 13, 1986
    Assignee: The Dow Chemical Company
    Inventors: Donald L. Schmidt, Louis W. Meyer, Demetrius Urchick
  • Patent number: 4537810
    Abstract: A metallic endless press band with an embossed engraving thereon for use in double band presses for the manufacture of laminates, such as panels, foils, films and the like having textured surfaces wherein a lengthwise and crosswise welding of rolled or electrodeposited surfaces is utilized, consisting essentially of a material which is a metal alloy which may be precipitation hardened or altered in its crystal structure by heat or radiation treatment, the metal structure at the welding seam being identical with the unwelded base material after hardening or after treatment to the extent that no hardness or crystal structure differences which impair the depth of the embossing pattern result when texturing the surface by knurling, etching or mechanical engraving.
    Type: Grant
    Filed: December 15, 1983
    Date of Patent: August 27, 1985
    Inventor: Kurt Held
  • Patent number: 4473621
    Abstract: This invention relates to brazing alloys for use primarily in jewellery manufacture having compositions consisting of 30 to 80 weight % gold, 0 to 20 weight % silver, 20 to 60 weight % copper, 5 to 20 weight % zinc, 0 to 5.0.% of a group VIII metal as a grain refiner for gold, and 0.5 to 3.0 weight % indium. These alloys have desirable properties, particularly in the 14 karat gold range, without the health hazards associated with the use of cadmium.
    Type: Grant
    Filed: July 19, 1983
    Date of Patent: September 25, 1984
    Assignee: Johnson Matthey Limited
    Inventor: Vernon K. Drylie
  • Patent number: 4402743
    Abstract: A method of preparing a charge of super alloy material for use in metal casting is disclosed. Thin wall tubes consisting of one of the metallic elements of the alloy material, or an alloy of such element are provided. If an alloy tube is selected, all elements in the tube alloy must also be materials included in the overall formulation of the alloy material. The type and quantity of the materials contained in the tubes is deducted from the quantities set forth in the overall formula and the balance of the formula is melted and poured under vacuum as a core in the tube using the tube as a mold. The resulting master charge is cut into unit charges each of a predetermined weight. These unit charges are then used in a subsequent casting operation by melting the entire unit charge under vacuum to cast precision products of an alloy which consists of the mixed and alloyed materials of both the tube and the core.
    Type: Grant
    Filed: May 15, 1981
    Date of Patent: September 6, 1983
    Assignee: Cannon-Muskegon Corportion
    Inventor: Steve F. Morykwas
  • Patent number: 4315972
    Abstract: A casting consisting of a dehydrated agglomerate of particulate material and shaped such that one of its right angle projections is in the form of a trapezoid whose sides include angles greater than 90.degree., the sides being joined by means of curved surfaces.
    Type: Grant
    Filed: July 18, 1977
    Date of Patent: February 16, 1982
    Assignee: Klockner-Humboldt-Deutz AG
    Inventors: Chatty Rao, Hans Bender
  • Patent number: 4297416
    Abstract: Gold alloy wire for the production of jewelry, especially jewelry chains, is made of a gold solder containing nucleus and a jacket of a gold alloy wherein the solder containing nucleus has a core of fine gold which is surrounded by a layer of a ductile, lower melting gold solder alloy.
    Type: Grant
    Filed: June 13, 1979
    Date of Patent: October 27, 1981
    Assignee: Ferd. Wagner
    Inventors: Hans Krug, Kurt Heilmann
  • Patent number: 4280840
    Abstract: Sponge iron produced at a direct reduction plant is placed into containers and transported to a smelting furnace whereupon the container and contents are dumped into the furnace for charging the same.
    Type: Grant
    Filed: November 8, 1979
    Date of Patent: July 28, 1981
    Assignee: Pullman Incorporated
    Inventor: Z. Alexander Swiecicki
  • Patent number: 4276353
    Abstract: A self-bonding flame spray wire capable of forming a readily grindable coating formed of a sheath of aluminum and a compacted powder core containing a major portion of nickel and stainless steel and a minor portion of aluminum and metal oxide. The core may contain from about 10 to 90 percent, and preferably about 61 percent, by weight nickel, about 10 to 90, and preferably 30, percent by weight stainless steel, from 1 to 10 percent by weight, and preferably 5 percent by weight, aluminum, from 1/4 to 10 percent by weight, and preferably 4 percent by weight, of the metal oxide which may, for example, be cobalt oxide or zirconium oxide, and is most preferably zirconium oxide.
    Type: Grant
    Filed: August 23, 1978
    Date of Patent: June 30, 1981
    Assignee: Metco, Inc.
    Inventors: Edward R. Novinski, John H. Harrington