Abstract: A magnetic recording medium comprises, on a substrate, a soft magnetic layer, a first seed layer, a second seed layer, and a recording layer having an artificial lattice structure. The first seed layer contains oxide of Fe. The second seed layer contains one of Pd and Pt, Si, and N. The magnetic exchange coupling force in the in-plane direction of the recording layer is weakened by the first seed layer and the second seed layer. Accordingly, minute recording magnetic domains can be formed in the recording layer, and the magnetization transition area is distinct as well. Even when information is recorded at a high density, the information can be reproduced with low noise. A magnetic storage apparatus, which is provided with such a magnetic recording medium, makes it possible to achieve an areal recording density of 150 gigabits/square inch.

Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece is a semi-solid braze that comprises a first component and a second component.

Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece comprises one of germanium and silicon, and one of chromium, titanium, gold, aluminum, palladium, platinum, and nickel. This abstract is submitted in compliance with 37 C.F.R. 1.72(b) with the understanding that it will not be used to interpret or limit the scope of or meaning of the claims.

Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined at a bonded region to the first piece by a diffusion bond. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite. The second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The diffusion bond is formed from a first metallic element disposed on a first surface of the first piece and a second metallic element disposed on at least one of the first surface and a second surface of the second piece, the second surface contacting the first surface, wherein the first and second metal form a composition having a melting temperature less than about 1400° C. This abstract is submitted in compliance with 37 C.F.R. 1.

Abstract: A brass coated metallic wire for use as a reinforcing component in an elastomeric article, such as a motor vehicle tire. The brass coating is formed by depositing alternate layers of copper and zinc on the wire and then drawing the wire under conditions of temperature and pressure suitable to alloy the copper and zinc to form a brass coating on the wire.

Abstract: A composite perpendicular magnetic recording disk has two distinct magnetic layers formed on the disk substrate, each with strong perpendicular magnetic anisotropy, that are strongly exchange coupled perpendicularly to each other across their interface. The first layer is a CoCr granular layer formed on a growth-enhancing sublayer, such as titanium, so as to have strong perpendicular magnetic anisotropy. The second layer is a continuous layer, preferably a continuous multilayer of Co/Pt or Co/Pd palladium formed on top of the granular layer. An interface layer, such as a layer of platinum or palladium, depending on whether the top multilayer is Co/Pt or Co/Pd, respectively, may be located between the two layers to enhance the growth of the continuous multilayer.

Abstract: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process.

Abstract: A support structure is provided for holding open lumina, the support structure having a stainless steel substrate and a platinum layer forming the surface of the structure. The structure has at least one gold layer arranged between the substrate and the platinum layer. The platinum layer is preferably applied with a pulsed current with current reversal, in order to avoid or reduce brittleness occurring by absorption of hydrogen during galvanic deposition of platinum. Such a support structure (stent) substantially withstands the high mechanical stresses, particularly bending and torsional forces that occur during application, without the formation of significant tears in the platinum layer.

Abstract: A circuit pattern 2a, made of copper foil, is arranged on a substrate 1. A nickel-containing barrier metal layer 2b is formed on the circuit pattern 2a. A gold layer 2c is formed on the barrier metal layer 2b by electroless substitution plating. Then, substrate 1 is heated up to impel nickel contained in the gold layer 2c to move toward a surface zone of the gold layer 2c to deposit nickel compound in the surface zone of the gold layer 2c, thereby enhancing the fineness of a remaining part of the gold layer 2c at at least an inside zone immediately below the surface zone. Then, the surface zone containing the crowded nickel compound is removed off the gold layer 2c so as to expose a purified surface of the inside zone of the gold layer 2c. Therefore, it becomes possible to form an excellent electrode having satisfactory bondability to the wire by using a less amount of gold at low costs.

Abstract: In a magnetic storage apparatus having a magnetic recording medium, a drive unit for driving this medium in a prespecified recording direction, a magnetic head assembly including a recorder section and reproduction section, means for causing the magnetic head to move relatively with respect to the magnetic record medium, and a record/playback signal processor means for performing signal inputting to the magnetic head and for effecting reproduction of an output signal from the magnetic head, the reproduction section of said magnetic head is composed of a magnetic head of the magneto-resistance effect type, while said magnetic record medium is structured including a substrate and a magnetic layer formed thereover with one or several underlayers being sandwiched therebetween, wherein at least one of the underlayers is a specific layer that is made of amorphous or microcrystalline materials containing therein Ni as the principal or main component thereof and further containing at least one kind of element as sele

Abstract: A glazing covered ferrite core electrode terminal has a ferrite core, a glazing covered layer coated on a surface of the ferrite core, a silver paste layer disposed on the glazing covered layer, a nickel plated layer disposed on the silver paste layer, a solder plated layer disposed on the nickel plated layer, and a solder paste layer disposed on the solder plated layer.

Abstract: An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.

Abstract: An electrode substrate comprises a backing substrate carrying thereon a metal electrode layer and/or a recording layer, the layer or layers having a smooth surface area with a surface roughness of less than 1 nm by more than 1 &mgr;m2. The smooth surface of the metal electrode layer and/or the recording layer is formed by firstly forming the layer on another substrate having a corresponding smooth surface and then peeling another substrate off the layer after the layer is bonded to the surface of the backing substrate, whereby the smooth surface profile of another substrate is transferred to the surface of the layer formed on the backing substrate.

Abstract: Method and structure are disclosed for forming a protective and/or reflectivity enhanced over coating layer, or layers, on a noble metal. A metallic binder layer, capable of forming a metallic bond with the noble metal and exhibiting good adhesion to the over coating layer, is deposited on the noble metal, utilizing physical vapor deposition, and the over coating layer is thereafter deposited on the metallic binder layer, again utilizing physical vapor deposition. The noble metal is preferably gold, but may be silver or an alloy of gold or silver, and may be deposited on a substrate. Each metallic binder layer is a thin layer, such as a layer of chromium, titanium, tantalum, nickel, cobalt, or an alloy thereof, and over coating is formed as a single dielectric layer of material or as a stack of alternating low and high indices of refraction dielectric layers.

Abstract: Palladium-103 radiochemical of high radionuclidic purity can be produced in commercial scale quantities by irradiating enriched Palladium targets comprising a mixture of Pd isotopes with protons or deuterons in the 10-50 MeV energy range. Commercially viable batch sizes with acceptable specific activity of the product Pd-103 are achieved by adjusting the irradiation energy, irradiation time, irradiation current, current density, plated target mass, plated target shape, plated target size, target isotope enrichment levels, and incident angle of the target to the beam. The method for the production of Pd-103 comprises providing a target material enriched with Pd isotopes comprising atomic masses equal to or greater than Pd-103, applying the target material onto a target support; irradiating the target material with protons or deuterons of sufficient incident energy and time to convert at least some of the Pd isotopes within the target material to Pd-103; and purifying Pd from the non-Pd components.

Abstract: A compliant sleeve for attaching a ceramic member to a metal member is comprised of a superalloy substrate having a metal contacting side and a ceramic contacting side. The ceramic contacting side is plated with a layer of nickel followed by a layer of platinum. The substrate is then oxidized to form nickel oxide scale on the ceramic contacting side and a cobalt oxide scale on the metal contacting side. A lubricious coating of boron nitride is then applied over the metal contacting side, and a shear-stress limiting gold coating is applied over the ceramic contacting side.

Abstract: A magnetic tunnel junction (MTJ) device is usable as a magnetic field sensor in magnetic disk drives or as a memory cell in a magnetic random access (MRAM) array. The MTJ device has a "pinned" ferromagnetic layer whose magnetization is oriented in the plane of the layer but is fixed so as not to be able to rotate in the presence of an applied magnetic field in the range of interest, a "free" ferromagnetic layer whose magnetization is able to be rotated in the plane of the layer relative to the fixed magnetization of the pinned ferromagnetic layer, and an insulating tunnel barrier layer located between and in contact with both ferromagnetic layers. The pinned ferromagnetic layer is pinned by interfacial exchange coupling with an adjacent antiferromagnetic layer. A high spin polarization ferromagnetic layer (Ni.sub.40 --Fe.sub.60) is placed near the tunnel barrier layer in both the pinned and free layers to enhance the magnetoresistive effect. The undesirable positive magnetostriction coefficient of the Ni.sub.

Abstract: The present invention discloses an exhaust gas catalyst for reducing the pollutant release containing in the exhaust gas. The catalyst includes a primary-core support carrier composed of gamma-phase aluminum oxide. The core-carrier is coated with Y.sub.2 O.sub.3 and ZrO.sub.2 such that the heat resistance is greatly improved. A two-layer active catalytic structure is formed over the core-carrier. An inner catalytic layer is formed with composition active catalytic elements with approximate weight ratios of La:Ce:Mn:Co:Pd:=10-15:10-15:6-10:6-10:0.1-0.3. An outer catalytic layer is then coated over the inner catalytic layer. The outer catalytic layer comprises catalytic active elements. The weight ratio of the active catalytic elements are Y:La:Zr:Cu:Cr:V:Pd:=1-3:2-6:2-6:6-10:10-15:2-6:0.1-0.3.

Abstract: A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g.

Abstract: A thermal barrier coating and a method for forming the coating on an article designed for use in a hostile thermal environment, such as turbine, combustor and augmentor components of a gas turbine engine. The method is particularly directed to increasing the spallation resistance of a thermal barrier coating system that includes a thermal insulating ceramic layer. The coating system of this invention generally includes a nickel aluminide alloy on which an aluminum oxide layer is formed, over which a ceramic layer is deposited so as to overlie and contact the aluminum oxide layer. The coating system does not include a bond coat, such as a diffusion aluminide or MCrAlY coating known in the prior art. The nickel aluminide alloy may be a binary NiAl alloy consisting essentially of nickel and aluminum in stoichiometric amounts, or may contain one or more oxygen-active elements.

Abstract: This invention describes the infiltration methods used to incorporate ceramic additives in carbon/carbon brake disc preforms. Aqueous vacuum infiltration techniques were employed. Both methods were effective in achieving homogeneous dispersion of ceramic additives throughout brake disc thickness. Heat treatment processes were developed to convert oxide additives to more refractory phases. Both temperature and N.sub.2 overpressure were precisely controlled during conversion. By using the additives, infiltration routes, and heat treatment schedules, brake disc friction material performance properties such as friction coefficient, friction coefficient stability, and brake disc wear rate are improved. The disclosed carbon/carbon brake discs can be used in aerospace, automotive and other friction material applications.

Abstract: A leadframe and method of fabrication of the leadframe. A leadframe is formed from one of copper or copper-based material and a coating of palladium is formed over the leadframe. Optionally, a layer of from about 10 to about 95 percent copper by weight and the remainder palladium is deposited between the leadframe and the coating of palladium. The coating of palladium is from about 3 to about 10 microinches and preferably about 3 microinches. The palladium/copper layer is from about 5 to about 40 microinches and preferably about 10 microinches. A semiconductor device is fabricated by providing a copper or copper-based lead frame and forming a layer of palladium over the leadframe. Optionally, a layer of palladium and copper is formed between the leadframe and the layer of palladium.

Abstract: A cold-rolled steel sheet or a zinc or zinc alloy layer coated steel sheet containing 0.0010 to 0.01 wt % of C and having a steel composition containing one or two kinds of 0.005 to 0.08 wt % of Nb and 0.01 to 0.07 wt % of Ti in the ranges given by {(12/93)Nb+(12/48)Ti*} .gtoreq.0.0005, 0.ltoreq.C-{(12/93)Nb+(12/48)Ti*}.ltoreq.0.0015, and Ti*=Ti-{(48/32)S+(48/14)N } , in which a bake hardenability BH f the steel sheet at 170.degree. C..times.20 min after 2% tensile prestrain is 10 to 35 MPa and the BH (MPa) and a yield strength YP (MPa) of the steel sheet satisfy the ranges given by BH.gtoreq.exp(-0.115.multidot.YP+23.0) and 0.67.multidot.BH+160.ltoreq.YP.ltoreq.-0.8.multidot.BH+280.

Abstract: Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.

Abstract: A ceramic lid assembly includes an integral metallized layer provided around the periphery of a ceramic lid substrate to serve as a foundation for a solder layer. A portion of the metallized layer for contact with the ceramic lid substrate is formed from a metallized paste containing glass frits so that the metallized layer is baked to adhere to the ceramic lid by reflowed glass frits. A portion of the metallized layer for contact with the solder layer is formed from a metallized paste containing no glass frits so that substantially no void is formed in the solder layer.

Abstract: A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable.

Abstract: A magneto-optical recording medium in which direct overwriting can be done by only modifying the power level and/or the pulse width of applied optical pulses, and without changing the direction of the bias magnetic field. The recording layer comprises first and second magnetic recording layers. The first magnetic layer is a rare-earth transition metal-amorphous alloy and has a perpendicular easy magnetization axis, a thickness of 10 to 200 nm, and a compensation temperature above room temperature. The second magnetic layer comprises an alloy of a first component of Co and/or Fe and a second component of a rare earth metal and/or a noble metal or an alloy of Co and at least one metal selected from Ti, Cr, Mn, Cu, Zn, Ga and Ge. The second magnetic layer is a material having an in-plane easy magnetization axis such that it has a magnetization axis parallel to the second magnetic layer if formed independently on a dielectric layer, the second magnetic layer having a thickness of not more than 3 nm.

Abstract: A [(Pt/Co/Pt)/Pd] multilayer thin film (40) provides improved perpendicular anisotropy and magnetic coercivity relative to Pt/Co multilayer thin films (10) without reducing the Kerr rotations provided by the component Pt/Co layers (44, 48, 46). [(Pt/Co/Pt)/Pd] multilayer thin films (40) comprise a substrate (26), an optional underlayer (110) including a crystallographically textured layer (114) of Pt and a crystallographically textured layer (116) of Pd, and several quadlayers (42) of Pt, Co, and Pd forming a periodic array (43) in the direction of the normal to the substrate (26). Each quadlayer (42) of the periodic array (43) typically comprises a first layer (44) of Pt atoms approximately one to two atomic monolayers thick, a layer (46) of Co between one and three atomic monolayers thick, a second layer (48) of Pt of substantially the same thickness as the first layer (44) of Pt, and a layer (50) of Pd that is at least as thick as the Pt layers.

Abstract: A magneto-optical recording medium including a base; a readout layer formed on the base; a recording layer formed on the readout layer; and an auxiliary recording layer formed on the recording layer, each of the readout layer, recording layer and auxiliary recording layer being made of an alloy of rare-earth metal and transition metal showing ferrimagnetism.

Abstract: Printed circuit board having excellent peel strength and conductance resistance is provided with a substrate, a resin insulating layer formed thereon and roughened at its surface, and a conductor formed thereon, in which at least a portion of the conductor is composed of an eutectic metal layer.

Abstract: A thermal barrier coating for superalloy turbine engine vanes and blades that are exposed to high temperature gas is disclosed. The coating includes a ceramic layer applied to an Aluminide or MCrAlY bond coat by electron beam physical vapor deposition. The ceramic layer has a first portion having unstabilized porosity, a second portion, overlying the first portion, with stabilized porosity, and an outer portion wherein the pores are coated with a noble metal. The stabilized porosity portion along with the noble metal coating reduce the thermal conductivity of the ceramic layer. Stabilizing the porosity renders it more resistant to sintering densification at high temperatures.

Abstract: Thin film media characterized by the utilization of a substantially peritectic seed alloy layer which is sputter deposited so as to provide dispersed, substantially peritectic and homogenous globules underlying subsequently deposited media layers. These media layers may include a metal layer such as chrome and a magnetic layer such as an alloy of cobalt, chromium, and platinum and possibly other ingredients.

Abstract: A solder bonding metal layer which is formed on a circuit board comprises a metal layer having a mixture of first metal which is easily wetted with metals constituting the solder and which easily forms alloy or intermetallic compounds and of second metal which is not wetted easily with the above solder and not melted. In this case, a concentration gradient that the concentration of the first metal is high on the bonding surface may be formed in the metal layer. A circuit board having a solder bonding metal layer which keeps good bonding even after many times of repairs and improves the reliability is realized.

Abstract: The present invention is designed to improve a method of deposition of coatings upon a metal or alloy substrate. The coating comprises aluminum or aluminide material interdiffused with a transition metal deposited by chemical vapor deposition which utilizes organometallic precursors to facilitate the deposition of the transition metal. The improvement permits better control of the process and permits coating of complex substrates including those with internal passages or holes. In the embodiment involving a first deposition of aluminum or aluminide coating, applicants have achieved deposition thereon of the transition metal. Platinum is the preferred transition metal to be used in the subject method. A product is taught. This product can be a component from a gas turbine engine.

Abstract: The invention consists of a process for electroplating electroactive polymer substrates at potentials sufficient to cause reduction of the substrates. The inventive process can be used to make polymer-metal composites having one or more metal films. More specifically, it can be used to electroplate polyimide substrates with gold, or to electroplate gold over a copper plated polyimide substrate. These inventive composites exhibit improved polymer-metal adhesion when they are exposed to elevated temperatures and humidities, i.e., 85.degree. C. and 85% R.H.

Abstract: The invention consists of a process for pulse electroplating electroactive polymer substrates at potentials sufficient to cause reduction of the substrates. The inventive process can be used to make polymer-metal composites having one or more metal films. More specifically, it can be used to electroplate polyimide substrates with gold, or to electroplate gold over a copper plated polyimide substrate. These inventive composites exhibit improved polymer-metal adhesion when they are exposed to elevated temperatures and humidities, i.e., 85.degree. C. and 85% R.H.

Abstract: The invention discloses a coated substrate product comprised of a titanium of titanium alloy substrate, at least one thin interlayer composed of a non-reactive noble metal and a hard outer coating selected from the group comprised of a ceramic, a hard metal, a hard metal compound and a diamond-like carbon, wherein at least the non-reactive noble metal interlayer which is immediately adjacent to the titanium or titanium alloy substrate is deposited onto the substrate by means of an electroless plating procedure, and the hard outer coating is deposited onto the non-reactive interlayer(s) by means of known chemical and physical vapor deposition techniques. The invention also discloses a method for making these coated substrate products.

Abstract: Device comprising a substrate and a metallized sensor/heater element having a temperature coefficient of resistance of at least 2000 parts per million. Methods of fabricating the devices are also disclosed.

Abstract: A direct (metal-metal compound eutectic) bond process is improved by disposing a eutectic/substrate-wetting enhancement layer on the substrate prior to performing the direct bond process to bond a metal foil to the substrate. Where the metal is copper, the direct bond process is rendered more effective than prior art direct bond processes on alumina and beryllia and makes the direct bond process effective on tungsten, molybdenum and aluminum nitride, all of which were unusable with the prior art direct bond copper process. A variety of new, useful structures may be produced using this process. The eutectic/substrate-wetting enhancement layer is preferably a noble-like metal or includes a noble-like metal such as platinum, palladium and gold.

Abstract: A dental crown restoration which comprises a metal coping and a relatively thick outer coating of a ceramic dental veneer. The metal coping is composed of a lamination of a low fusing temperature precious metal component substantially or entirely of gold and a high-fusing temperature precious metal component. The high fusing component is formed from three layers with one layer composed of from 90 to 100% palladium bounded on both sides by a gold based layer.

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.

Abstract: A multiple-layered metallic article useful for example, as costume jewelry having an intermediate "brightening layer" of bronze. A barrier layer selected from the group comprising palladium, tin, tin/zinc, rhodium, or platinum is disposed between the bronze "brightening layer" and a "top coat" layer to avoid migration of the copper component in the bronze layer to the outer surface of the article which, if left unimpeded eventually would result in a tarnishing effect to the article. As a result of the bronze intermediate layer, the article is hypo-allergenic with respect to those people having a skin sensitivity to nickel-plated or nickel-underplated metallic articles.

Abstract: To simplify manufacture of plated metal parts with high corrosion resistance especially suitable for use as sealing lids or cover elements for semiconductor packages, a substrate of Kovar, or Alloy 42, which are nickel-containing iron alloys, are electroplated with a base layer of a metal having an electromotive potential high with respect to that of the substrate, over which an intermediate layer is electroplated, which intermediate layer (16) has an electromotive potential which is low with respect to the base layer, and over that a cover layer (18) is plated which has an electromotive potential similar to that of the base layer. Suitable metals are gold-nickel-gold combinations, in which the gold layers should be over 10 microinches thick, preferably and in order to meet MIL-STD 883C, about 25 microinches thick. The intermediate layer (16), if of nickel, has an electromotive potential which is at the negative side of the electromotive series.

Abstract: Disclosed is a thin film magnetic recording medium which comprises a substrate and a magnetic layer formed on the substrate, the magnetic layer including a lamination composed of at least a grain size suppression film and a magnetic film formed on each of opposite sides of the grain size suppression film, the grain size suppression film being made of at least a grain size suppressing metal, the magnetic film being made of a cobalt magnetic material, and further disclosed is a method of producing a thin film magnetic recording medium which comprises the step of: dipping a substrate in an electroless plating solution for depositing a crystal of a cobalt magnetic material on the substate to form a first crystal film thereon; adding a metallic salt solution for suppressing growth of a grain size of a crystal structure into the electroless plating solution at least once after a predetermined period of time has passed from the dipping of the substrate under the condition that the substrate is dipped in the electrol

Abstract: The article is provided with a coating resisting wear and corrosion, such coating being for the most part made of a precious metal or alloy of a precious metal, for example gold or an alloy containing gold.The coating is made up of a first layer of such precious metal or alloy thereof comprising discrete inclusions of a metallic compound such as titanium nitride. These inclusions are deposited along with the precious metal in vapor phase and distributed in a substantially homogeneous manner through the entire thickness of the layer, said thickness being equal to or greater than 0.4 .mu.m. A second layer of precious metal or alloy thereof is located between the article and said first layer.The article may be a watch case, a bracelet link or a piece of jewelry.

Abstract: A metal dental coping foil for dental restoration, having a high fusing temperature layer composed of a precious metal palladium-gold alloy and at least two precious metal gold layers symmetrically disposed about the palladium-gold layer.

Abstract: A magnetic recording member with a thin metallic antifriction protection overcoat formed over a magnetic layer. The overcoat is soft ductile and low stress and includes a metal selected from the group consisting of palladium, platinum, silver, gold, cadmium, indium, tin and lead or an alloy of one or more of these metals, and may include less than 20 percent by weight of antimony, bismuth, thallium or copper to improve wear resistance or impede corrosion. In one preferred embodiment the antifriction overcoat is an alloy of silver, lead and antimony formed with N layers where 10.ltoreq.N.ltoreq.40. The even layers are richer in a selected metal of the alloy than the odd layers in order to produce adjacent layers with different lattice or microstructural and associated mechanical properties so that there tends to be parallel shear between adjacent layers under shearing stress of head impact or friction.

Abstract: A dental crown restoration which comprises a metal coping and a relatively thick outer coating of a ceramic dental veneer. The metal coping is composed of a lamination of a low fusing temperature precious metal component substantially or entirely of gold and a high fusing temperature precious metal component. The high fusing component is formed from three layers with one layer composed of from 90 to 100% palladium bounded on both sides by a gold based layer.

Abstract: Methods for increasing the ductility and reducing the porosity and cracking tendency of a palladium or palladium-silver electrodeposit which comprises providing an underlayer of a palladium/nickel or palladium/cobalt alloy electrodeposit. Also dual layer composite electroplated deposits and their use in electrical contacts or connectors.

Abstract: A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass.