Group Ib Metal-base Component Alternative To Platinum Group Metal-base Component (e.g., Precious Metal, Etc.) Patents (Class 428/669)
  • Patent number: 4559279
    Abstract: This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.
    Type: Grant
    Filed: February 1, 1985
    Date of Patent: December 17, 1985
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Katsuhiko Honjo, Hiromitsu Taki, Noriya Sato
  • Patent number: 4529667
    Abstract: A silver-coated electric material wherein a partial or total surface of an electroconductive or non-electroconductive substrate is provided with a coating of silver or silver alloy, having the first intermediate coating layer made of Ni, Co, Cr, Pd or their alloys and the second intermediate coating layer made of Sn, Cd, Pd, Ru or their alloys between the silver coating and the surface of the substrate, and the method of preparing the same.
    Type: Grant
    Filed: April 6, 1983
    Date of Patent: July 16, 1985
    Assignee: The Furukawa Electric Company, Ltd.
    Inventors: Shoji Shiga, Satoshi Suzuki, Nariyoshi Kiso
  • Patent number: 4511451
    Abstract: To coat a substrate with a thin layer of pure platinum oxide, an insulating and transparent substance, recourse is had to a cylindrical magnetron comprising means for generating an axial magnetic field in an enclosure containing rarefied oxygen, an axial cathode at least coated with platinum and a cylindrical grid forming an anode and coaxially surrounding the cathode so as to reserve an annular zone outside the grid. The substrate is placed in the said zone so that its surface to be coated by the thin layer is shielded from the impact of electrons. This shielding can be obtained by a particular shape given to the bars constituting the grid or by the positioning of obstacles in the said zone. It then suffices to heat the thin layer, whether or not locally, to above 250.degree. C., to convert it into conducting and opaque platinum.
    Type: Grant
    Filed: September 9, 1983
    Date of Patent: April 16, 1985
    Assignee: Centre National de la Recherche Scientifique
    Inventors: Claude Sella, Vien Tran-Khanh, Jean-Claude Martin
  • Patent number: 4495255
    Abstract: A very thin gold coating (e.g., 270 to 3,500 Angstroms) is vapor deposited on the surface of a nickel substrate. A short radiant energy pulse from a laser having a pulse length of about 130 nanoseconds is directed at the coated surface to melt portions of the gold coating and the nickel substrate therebelow. The energy pulse is removed to permit the melted material to resolidify as an alloy with a high concentration of gold at the surface thereof.
    Type: Grant
    Filed: October 30, 1980
    Date of Patent: January 22, 1985
    Assignee: AT&T Technologies, Inc.
    Inventors: Clifton W. Draper, John M. Poate
  • Patent number: 4463060
    Abstract: A permanently solderable palladium-nickel electroplated coating is formed on electrically conductive surfaces. The coating has a first alloy layer of 46 to 82 atomic percent palladium and 18 to 54 atomic percent nickel. This first layer is covered by a continuous second layer of 96 to 100 atomic percent metallic palladium and 0-4 atomic percent nickel. The second layer has a thickness of up to twenty angstroms. The second layer is formed by dipping the first layer in a solution of sulfuric or hydrochloric acid.
    Type: Grant
    Filed: November 15, 1983
    Date of Patent: July 31, 1984
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Stephen W. Updegraff
  • Patent number: 4246322
    Abstract: This invention relates to fabricating wire and particularly wire at least the surface of which consists of platinum or a platinum-based alloy for use in the jewellery industry. The wire according to the invention comprises a first portion at least the outer surface of which consists essentially of platinum or a platinum-based alloy and a second portion in the form of a coating or layer on the outer surface of the first portion, the second portion consisting essentially of a metal or alloy which is soft relative to the platinum or platinum-based alloy. Preferably, the second portion consists essentially of copper.
    Type: Grant
    Filed: February 8, 1979
    Date of Patent: January 20, 1981
    Assignee: Johnson, Matthey & Co., Limited
    Inventors: John E. Wall, Ernest E. Lloyd