And Monomeric Processing Ingredient Patents (Class 430/191)
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Patent number: 6887643Abstract: A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1): R1 represents an alkyl group having a carbon number in the range of 1 to 3. R2, R3, R4, and R5 each represent hydrogen or an alkyl group having a carbon number in the range of 1 to 3, and l represents an integer in the range of 0 to 3.Type: GrantFiled: July 22, 2003Date of Patent: May 3, 2005Assignee: Toray Industries, Inc.Inventors: Yoji Fujita, Mitsuhito Suwa, Masao Tomikawa
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Patent number: 6869742Abstract: A positive photoresist composition includes (A) an alkali-soluble novolak resin containing 1,2-naphthoquinonediazidosulfonyl groups substituting for part of hydrogen atoms of phenolic hydroxyl groups, (B) an ester of, for example, a compound represented by the following formula with a naphthoquinonediazidosulfonyl compound, and (C) a sensitizer:Type: GrantFiled: April 1, 2002Date of Patent: March 22, 2005Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Jyunichi Mizuta, Kouji Yonemura, Akira Katano, Satoshi Niikura, Kousuke Doi
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Patent number: 6852465Abstract: The present invention relates to a light-sensitive photoresist composition especially useful for imaging thick films, comprising a film-forming alkali-soluble resin, a photoactive compound, and a surfactant at a level ranging from about 2000 ppm to about 14,000 ppm by weight of total photoresist. Preferably the photoresist film has a thickness greater than 20 microns. The invention further provides for a process for coating and imaging the light-sensitive composition of this invention.Type: GrantFiled: March 21, 2003Date of Patent: February 8, 2005Assignee: Clariant International Ltd.Inventors: Ralph R. Dammel, Stephen Meyer, Mark A. Spak
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Patent number: 6849372Abstract: The present invention provides methods of forming and using thermally imageable composite elements which may be developed into lithographic printing plates. More specifically, the present invention provides a method of forming thermally imageable composite elements which provide substantial developer resistance in desired regions, while maintaining white light desensitivity and durability.Type: GrantFiled: July 30, 2002Date of Patent: February 1, 2005Assignee: Kodak Polychrome GraphicsInventors: Kevin Ray, Anthony Paul Kitson, Jian Bing Huang
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Patent number: 6841330Abstract: A positive planographic printing plate precursor comprising a recording layer containing a water-insoluble and alkali-soluble resin, an infrared absorbent and an organic quaternary ammonium salt. A positive planographic printing plate precursor comprising at least two recording layers containing the resin and the infrared absorbent with a coating amount of an upper positive recording layer being in the range of 0.05 to 0.45 g/m2.Type: GrantFiled: November 30, 2001Date of Patent: January 11, 2005Assignee: Fuji Photo Film Co., Ltd.Inventors: Hideo Miyake, Akio Oda, Tomoyoshi Mitsumoto, Kaoru Iwato
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Patent number: 6824947Abstract: Photosensitive compositions comprising a phenol resin having a urea bond in the main chain, planographic printing plate precursors containing the photosensitive compositions, and methods for preparing planographic printing plates using the planographic printing plate precursors are disclosed. Planographic printing plates that exhibit good durability, good exposure visual image property, and good solvent resistance; particularly superior resistance to washing oil used in UV ink printing; and superior baking property are produced.Type: GrantFiled: February 19, 2003Date of Patent: November 30, 2004Assignee: Kodak Polychrome Graphics, LLCInventors: Yasuhiro Ishizuka, Yasuhiko Kojima
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Patent number: 6821692Abstract: The present invention relates to novel thin layers for microsystem techniques and microstructuring. It is an object of the invention to provide thin layers which can be manufactured under less problems and more economically than the previous conventional layers, and which permit the use of existing technologies for microstructuring. The object is realized in that the thin layer is formed of an enzymatically degradable biopolymer in a range of layer thicknesses of from 30 nm to 3 &mgr;m. Biopolymeric thin layers manufactured according to the invention permit their application, after a respective structurizing, as test assays or in setting up substance libraries.Type: GrantFiled: February 4, 1999Date of Patent: November 23, 2004Assignee: Clondiag Chip Technologies GmbHInventors: Eugen Ermantraut, Johann Michael Köhler, Torsten Schulz, Klaus Wohlfart, Stefan Wölfl
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Patent number: 6815140Abstract: A positive resist composition, having a superior resolution as well as good resist performances such as sensitivity, depth of focus and profile, is described and includes a novolac resin, a radiation-sensitive quinonediazide compound and a thioxanthone compound represented by the following formula (I): wherein R1, R2, R3, R4, R5, R6, R7 and R8 independently represent hydrogen, halogen, alkyl, alkoxy, aryl, carboxyl or alkoxycarbonyl.Type: GrantFiled: June 1, 1999Date of Patent: November 9, 2004Assignee: Sumitomo Chemical Company, LimitedInventors: Yasunori Uetani, Hiroshi Moriuma, Yoshiyuki Takata
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Patent number: 6806019Abstract: A radiation sensitive resin composition for i-line light exposure comprising an alkaline soluble resin and a quinonediazide group-containing photosensitizer where said alkaline soluble resin comprises a novolak resin and a mixture of one or two or more of resins selected from the group of (i) polyacrylate, (ii) polymethacrylate, (iii) a polystyrene derivative and (iv) a copolymer consisting of two or more of monomer units selected from the group of acrylic ester, methacrylic ester and styrene derivatives is applied on a substrate such as a substrate for a flat panel display and exposed preferably at the light-exposure quantity of 50 to 500 mJ/cm2 by an i-line light exposure source to form a pattern with high-resolution and a good pattern shape having no tailing.Type: GrantFiled: August 8, 2002Date of Patent: October 19, 2004Assignee: Clariant Finance (BVI) LimitedInventor: Shuichi Takahashi
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Publication number: 20040197696Abstract: The present invention relates to a composition and a process for preparing a composition that comprises: 1) a film-forming novolak resin wherein the hydrogen atom of a hydroxyl group in the novolak resin is substituted with a naphthoquinonediazidosulfonyl (DNQ) group in a proportion of less than 3.0 mol % per hydrogen atom to form a partially esterified novolak resin; 2) at least one photosensitive component present in an amount sufficient to photosensitize the photoresist composition; and 3) at least one solvent.Type: ApplicationFiled: April 1, 2003Publication date: October 7, 2004Inventor: J. Neville Eilbeck
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Patent number: 6797450Abstract: According to the present invention, there are provided an insulating film for an organic EL element, which has sufficiently low water permeability and a good sectional form and whose reactivity with a basic material and an electrode made from a metal having a low work function is suppressed, an insulating film for an organic EL element, which enables the formation of a through hole or U-shaped cavity therein and has excellent flattening performance, high transparency and high resistance to a resist stripper, and a radiation sensitive resin composition for forming the insulating film. An organic EL display element having this insulating film is free from an emission failure and has sufficiently long luminance half-life period and excellent reliability. The above composition comprises an alkali-soluble resin which may have an epoxy group and a 1,2-quinonediazide compound.Type: GrantFiled: March 27, 2002Date of Patent: September 28, 2004Assignee: JSR CorporationInventors: Masayoshi Suzuki, Hirofumi Sasaki, Isao Nishimura, Fumiko Yonezawa, Masayuki Endo, Kazuaki Niwa
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Publication number: 20040185368Abstract: The present invention relates to a light-sensitive photoresist composition especially useful for imaging thick films, comprising a film-forming alkali-soluble resin, a photoactive compound, and a surfactant at a level ranging from about 2000 ppm to about 14,000 ppm by weight of total photoresist. Preferably the photoresist film has a thickness greater than 20 microns. The invention further provides for a process for coating and imaging the light-sensitive composition of this invention.Type: ApplicationFiled: March 21, 2003Publication date: September 23, 2004Inventors: Ralph R. Dammel, Stephen Meyer, Mark A. Spak
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Patent number: 6790581Abstract: A phenolic resin/silicone resin hybrid compound is obtained by effecting hydrolytic condensation of an organooxysilane in the co-presence of a phenolic resin. The hybrid compound is used as the base polymer in a resist for endowing a resist film with excellent adhesion to a metal substrate.Type: GrantFiled: October 11, 2002Date of Patent: September 14, 2004Assignee: Shin-Etsu Chemical Company, LimitedInventors: Hideto Kato, Tomoyoshi Furihata
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Patent number: 6790582Abstract: The present invention relates to a composition and a process for preparing a composition that comprises: a) a novolak resin partially esterified with from about 3 to about 7 weight percent of a naphthoquinonediazidosulfonyl group; b) one or more dilution resins; and c) at least one solvent.Type: GrantFiled: April 1, 2003Date of Patent: September 14, 2004Assignee: Clariant Finance BVI LimitedInventor: J. Neville Eilbeck
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Patent number: 6783914Abstract: The present invention describes encapsulated inorganic resists which are compatible with conventional resist processing such as spin casting from organic solvents and development with aqueous 2.38% TMAH developers. The resist includes encapsulated inorganic materials as resist components, a fact that significantly increases the plasma etch selectivity of the resists compared to conventional polymeric resists. In effect, these resist systems act as a photoimagable single layer hard mask, although use as the top layer in a bilayer resist scheme is contemplated.Type: GrantFiled: February 25, 2000Date of Patent: August 31, 2004Assignee: Massachusetts Institute of TechnologyInventor: Theodore H. Fedynyshyn
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Patent number: 6780561Abstract: Provided is a polybenzoxazole precursor having a high purity which does not contain ionic by-products. The above polybenzoxazole precursor comprises a repetitive unit represented by Formula (1): wherein A1 represents a tetravalent aromatic group; N and OH which are bonded to A1 are paired, and the respective pairs of N and OH are bonded to carbons which are adjacent to each other on the same aromatic ring; A2 represents a divalent organic group; and n represents a number of 2 to 300.Type: GrantFiled: November 26, 2002Date of Patent: August 24, 2004Assignee: Kansai Paint Co., Ltd.Inventors: Mitsuru Ueda, Kazuya Ebara, Kenji Miyagawa, Kazuo Yamanaka, Yoichi Yonehara
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Patent number: 6773858Abstract: A photoresist composition comprising a novolac resin in which 3-27 mol % of the hydroxyl group hydrogens are substituted with 1,2-naphthoquinonediazidosulfonyl groups and an alkali-soluble cellulose whose glucose ring substituent groups are substituted with organic groups at a specific rate is used in microprocessing as a positive photoresist and offers many advantages including uniformity, high sensitivity, high resolution, good pattern shape, heat resistance, film retention, substrate adhesion, shelf stability, and high throughput.Type: GrantFiled: August 6, 2003Date of Patent: August 10, 2004Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hideto Kato, Kyoko Soga, Tomoyoshi Furihata
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Publication number: 20040146801Abstract: The present invention provides a positive-working photosensitive resin composition with high sensitivity that gives a pattern having a high resolution and a high film thickness retention rate. In other words, the present invention provides a positive-working photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 50 parts by weight of a photosensitive material, that is, a 1,2-naphthoquinone-2-diazide-5-sulfonate ester compound or a 1,2-naphthoquinone-2-diazide-4-sulfonate ester compound of a phenol compound. In addition, the present invention provides a positive-working photosensitive resin composition comprising 100 parts by weight of a polyamide, 1 to 50 parts by weight of a photosensitive material, that is, a 1,2-naphthoquinone-2-diazide-5-sulfonate ester compound or a 1,2-naphthoquinone-2-diazide-4-sulfonate ester compound of a phenol compound and 1 to 30 parts by weight of a phenol compound.Type: ApplicationFiled: October 15, 2003Publication date: July 29, 2004Inventors: Toshio Banba, Hiroaki Makabe, Takashi Hirano
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Publication number: 20040137359Abstract: A composition includes (A) an alkali-soluble resin, (B) a quinonediazide ester of a compound represented by the following formula: 1Type: ApplicationFiled: December 23, 2003Publication date: July 15, 2004Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Masaki Kurihara, Takako Suzuki, Kenji Maruyama, Satoshi Niikura, Kousuke Doi
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Patent number: 6762005Abstract: A composition includes (A) an alkali-soluble resin having Mw of 1500 to 10000, (B) a quinonediazide ester of, for example, the following formula, and (C) a phenolic compound containing an acid-decomposable group. When a resin film 1 &mgr;m thick is prepared from the alkali-soluble resin (A), the resin film is completely dissolved in 2.38% by weight tetramethylammonium hydroxide aqueous solution at 23° C. within ten seconds.Type: GrantFiled: November 15, 2002Date of Patent: July 13, 2004Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akira Katano, Yusuke Nakagawa, Shinichi Kono, Kousuke Doi
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Publication number: 20040126693Abstract: A positive photosensitive composition and method of pattern formation using the same. The composition comprises a precursor of poly(imide-benzoxazole) (PIBO) copolymer prepared by the reaction of trimellitic anhydride halide monomer with bis(o-diaminophenol) monomer; a photosensitizer; and a solvent.Type: ApplicationFiled: July 23, 2003Publication date: July 1, 2004Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE.Inventors: Shih-Fan Wang, Shing-Tza Liou, Shih-Jung Tsai, Steve Lien-Chung Hsu, Po-I Lee
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Patent number: 6756178Abstract: A composition includes (A) a novolak resin containing at least 20% by mole of a m-cresol repeating unit and having a 1-ethoxyethyl group substituting for part of hydrogen atoms of phenolic hydroxyl groups, (B) a quinonediazide ester of, for example, the following formula, and (C) 1,1-bis(4-hydroxyphenyl)cyclohexane.Type: GrantFiled: November 15, 2002Date of Patent: June 29, 2004Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akira Katano, Yusuke Nakagawa, Shinichi Kono, Kousuke Doi
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Patent number: 6746812Abstract: A photosensitive resin composition containing a high molecular compound having at least a) a fluoro aliphatic group, and b) a group represented by formula —L—P (wherein L represents a divalent organic group connected to the skeleton of the high molecular compound, and P represents an aromatic group having a carboxyl group at the ortho-position).Type: GrantFiled: May 23, 2001Date of Patent: June 8, 2004Assignee: Fuji Photo Film Co., Ltd.Inventors: Noriaki Watanabe, Koichi Kawamura, Kazuo Fujita, Takeshi Serikawa, Akira Nagashima
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Patent number: 6737212Abstract: A radiation sensitive composition useful as a photoresist containing a resin composition and a radiation sensitive material, wherein the resin composition comprises a mixture of two or more resins different from each other by at least 0.03 in refractive index or comprises a resin component of an alkali-soluble resin and a resin additive of a resin working as a dissolution inhibitor for the radiation sensitive composition, such as an acrylic polymer, a methacrylic polymer or a styrenic polymer. A dissolution rate in a 2.38 weight-% aqueous tetramethylammonium hydroxide solution of the radiation sensitive composition is preferably 5000 Å/min or less. Use of these resin compositions enable one to reduce the amount of the quinonediazide radiation sensitive agents to be used and obtain a radiation sensitive composition which has both high sensitivity and highly normalized film remaining characteristics.Type: GrantFiled: June 5, 2001Date of Patent: May 18, 2004Assignee: Clariant Finance (BVI) LimitedInventor: Shuichi Takahashi
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Patent number: 6733949Abstract: Disclosed is an alkali-soluble, film-forming novolak resin mixture containing at least two novolak resins, each novolak resin containing the addition-condensation reaction product of at least one phenolic compound with at least one aldehyde source, wherein the phenolic compound for first novolak resin contains 90-100 mole % of meta-cresol, and the phenolic compound for the second novolak resin contains less than 50 mole % of meta-cresol. Also disclosed is a photosensitive composition, containing an admixture of: a) the above-mentioned novolak resin mixture; b) at least one o-quinone photoactive compound; and c) at least one photoresist solvent.Type: GrantFiled: April 11, 2002Date of Patent: May 11, 2004Assignee: Clariant Finance (BVI) LimitedInventors: J. Neville Eilbeck, Alberto D. Dioses
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Patent number: 6730769Abstract: (i) As a primary reaction, m-cresol is allowed to react with propionaldehyde in the presence of an acid catalyst and thereby yields a polymer having a weight average molecular weight Mw of 200 to 500 and a molecular weight distribution Mw/Mn of 1.7 or less, and (ii) as a secondary reaction, the polymer is allowed to react with 3,4-xylenol and formaldehyde and thereby yields a novolak resin having an Mw of 1000 to 20000. By adding a specific photosensitizer, the novolak resin yields a positive photoresist composition.Type: GrantFiled: May 1, 2002Date of Patent: May 4, 2004Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akira Katano, Mitsuo Hagihara, Ken Miyagi, Toshiaki Tachi
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Publication number: 20040081909Abstract: There is provided a method of producing a resist composition which yields a resist composition with good storage stability, and no fluctuation in characteristics between production lots. There are provided: a novolak resin solution formed by adding benzoquinone to a novolak resin solution produced by dissolving a novolak resin in an organic solvent; a positive photoresist composition comprising the novolak resin solution and a photosensitive component; a positive photoresist composition comprising the novolak resin solution, a photosensitive component, and hydroquinone; and a method of producing a positive photoresist composition involving mixing the novolak resin solution described above and a photosensitive component.Type: ApplicationFiled: April 15, 2003Publication date: April 29, 2004Inventors: Hiroyuki Ohnishi, Yusuke Nakagawa, Kousuke Doi
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Patent number: 6723484Abstract: The present invention relates to a positive-working photosensitive resin precursor composition which is characterized in that it contains (a) polymer in which the chief component comprises structural units of the kind where the bonding between structural units is represented by general formula (1) and (b) photoacid generator, and it can form a pattern by light irradiation and subsequent developing, and the total carboxyl groups contained in said polymer is from 0.02 to 2.0 mmol/g, and it provides a photosensitive resin composition of high sensitivity which can be developed by alkali. (R1 is an organic group of valency from 3 to 8 having at least 2 carbon atoms, R2 is an organic group of valency from 2 to 6 having at least 2 carbon atoms, R3 is hydrogen or an organic group with from 1 to 10 carbons. n is an integer of value from 3 to 100,000, m is 1 or 2, p and q are integers of value from 0 to 4 and p+q>0).Type: GrantFiled: May 8, 2000Date of Patent: April 20, 2004Assignee: Toray Industries, Inc.Inventors: Masao Tomikawa, Naoyo Okamoto, Satoshi Yoshida, Ryoji Okuda
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Patent number: 6713225Abstract: The invention provides a 1,2-naphthoquinone-2-diazidesulfonate ester photosensitive agent which is useful as a photosensitive agent employed in a photoresist for producing semiconductor integrated circuits, liquid crystal displays, EL displays, etc., a method for producing the photosensitive agent, and a photoresist composition containing the photosensitive agent.Type: GrantFiled: March 11, 2003Date of Patent: March 30, 2004Assignee: Toyo Gosei Kogyo Co., Ltd.Inventors: Hirotada Iida, Miharu Suwa, Yuichi Hagiwara, Katsumi Tada, Suehiro Katori, Tsuneaki Miyazaki
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Publication number: 20040053156Abstract: A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1): 1Type: ApplicationFiled: July 22, 2003Publication date: March 18, 2004Applicant: Toray Industries, Inc.Inventors: Yoji Fujita, Mitsuhito Suwa, Masao Tomikawa
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Patent number: 6706454Abstract: A coating solution useful in the preparation of printing plate precursors comprises: a) a radiation sensitive composition C comprising a phenolic resin; b) at least one thermoplastic polymer P which has a solubility in aqueous alkaline media ranging from sparingly soluble to insoluble; c) a first solvent component A which is capable of solubilizing both composition C and thermoplastic polymer P; d) a second solvent component B having a volatility less than component A, wherein component B is capable of volatilizing composition C but not thermoplastic polymer P, and composition C and thermoplastic P are homogeneously dissolved in a mixture of components A and B; and e) at least one further polymer AP having a higher molecular weight than the phenolic resin of composition C, wherein polymer AB is miscible with the phenolic resin and immiscible with thermoplastic polymer P.Type: GrantFiled: July 5, 2001Date of Patent: March 16, 2004Assignee: Kodak Polychrome Graphics LLCInventor: Mathias Jarek
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Patent number: 6689531Abstract: A resist composition showing excellent close adherence at the interface of a substrate and a resist, improving problems in wet etching, having excellent sensitivity and resolution, and also showing excellent resist performances, and comprising a compound of the general formula (I): wherein, R1 and R2 represent each independently a hydrogen atom or an alkyl group, R3 represents a hydrogen atom, alkyl group, aryl group, aralkyl group, alkenyl group, alkylcarbonyl group, arylcarbonyl group or aralkylcarbonyl group, n represents an integer of 1 to 40, m represents an integer of 1 to 5, and l represents an integer of 1 to 5, is provided.Type: GrantFiled: August 27, 2002Date of Patent: February 10, 2004Assignees: Sumitomo Chemical Company, Limited, Dongwoo Fine-Chem Co., Ltd.Inventors: Sang Tae Kim, Seung Jin Kang, Shi Jin Sung, Masumi Suetsugu, Airi Yamada
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Publication number: 20040023147Abstract: A positive photosensitive resin composition having high sensitivity is provided which can form patterns with high resolution and high film thickness retention and can give by curing film excellent in mechanical characteristics, adhesion, and water absorption. This composition comprises 100 parts by weight of an alkali-soluble resin, 1 to 100 parts by weight of a photosensitive diazoquinone compound (B) and a filler (C), the content (F) of the filler(C) as defined by the following formula ranging from 2 to 70 wt %.Type: ApplicationFiled: April 25, 2003Publication date: February 5, 2004Inventors: Takashi Hirano, Shusaku Okaaki
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Patent number: 6686120Abstract: Disclosed is a photoresist composition including a thermal acid generator and a method of forming a pattern using the same. The photoresist composition includes about 100 parts by weight of an alkali-soluble acryl copolymer, about 5-100 parts by weight of 1,2-quinonediazide compound, about 2-35 parts by weight of nitrogen-containing cross-linking agent and about 0.1-10 parts by weight of a thermal acid generator which produces an acid by heat. The photoresist composition is coated on a substrate and dried to form a photoresist layer. The photoresist layer is exposed by using a mask having a predetermined shape. Thus obtained exposed photoresist layer is developed by using an aqueous alkaline solution to form a photoresist pattern. Thus obtained photoresist pattern is heated to be cured without generating thermal reflow.Type: GrantFiled: August 15, 2002Date of Patent: February 3, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: You-Kyoung Lee, Sung-Chul Kang, Jin-Ho Ju, Dong-Ki Lee
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Patent number: 6680155Abstract: A composition includes (A) an alkali-soluble resin; and (B) (b-1) a compound of Formula (I): wherein Ds are each a hydrogen atom or a naphthoquinonediazidosulfonyl group; and (b2) a quinonediazide ester of, for example, bis(2-methyl-4-hydroxy-5-cyclohexylphenyl)-3,4-dihydroxyphenylmethane.Type: GrantFiled: December 26, 2002Date of Patent: January 20, 2004Assignee: Tokyo, Ohka Kogyo Co., Ltd.Inventors: Mitsuo Hagihara, Toshiaki Tachi, Kenji Maruyama
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Patent number: 6677099Abstract: A positive type photosensitive resin composition which can be developed by an aqueous alkaline solution and which is excellent in the developability and the adhesion to a substrate, is presented.Type: GrantFiled: May 30, 2002Date of Patent: January 13, 2004Assignee: Nissan Chemical Industries, Ltd.Inventors: Kazuhisa Ishii, Tomonari Nakayama, Takayasu Nihira, Hiroyoshi Fukuro
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Patent number: 6670090Abstract: The present invention relates to a positive-working photosensitive composition comprising a partially diazonaphthoquinone (DNQ) capped polyamic ester with a capping level of about 5-80 molar %; a photosensitive agent and a solvent. The composition shows a high photosensitivity and leaves a relief pattern with high resolution and low dark film loss.Type: GrantFiled: September 3, 2002Date of Patent: December 30, 2003Assignee: Industrial Technology Research InstituteInventors: Steve Lien-Chung Hsu, Jinn-Shing King, Po-I Lee, Jhy-Long Jeng
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Patent number: 6660445Abstract: The present invention relates to a photosensitive compound comprising a vinyl polymer compound which is insoluble in water and soluble in an aqueous alkaline solution and o-naphthoquinonediazide compound, wherein said vinyl polymer compound is a copolymer comprising at least one monomer unit derived from monomer compound (A): a compound having an alkaline-soluble group represented by general formula (I), (II) or (III) as defined in the specification, and at least one monomer unit derived from monomer compound (B): (meth)acrylate having poly(oxyalkylene) chain. A lithographic printing plate prepared from a presensitized plate having a photosensitive layer of said photosensitive compound of the present invention shows improvement of abrasion resistance, printing durability, chemical resistance, development latitude, and contamination property.Type: GrantFiled: October 5, 2001Date of Patent: December 9, 2003Assignee: Fuji Photo Film Co., Ltd.Inventors: Kazuo Fujita, Shiro Tan
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Publication number: 20030224281Abstract: Photosensitive compositions comprising a phenol resin having a urea bond in the main chain, planographic printing plate precursors containing the photosensitive compositions, and methods for preparing planographic printing plates using the planographic printing plate precursors are disclosed. Planographic printing plates that exhibit good durability, good exposure visual image property, and good solvent resistance; particularly superior resistance to washing oil used in UV ink printing; and superior baking property are produced.Type: ApplicationFiled: February 19, 2003Publication date: December 4, 2003Inventors: Yasuhiro Ishizuka, Yasuhiko Kojima
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Patent number: 6645689Abstract: A radiation-sensitive composition for use in printing plates is described. The composition comprises: (a) at least one novolak; (b) at least one naphthoquinone diazide derivative; and (c) a copolymer comprising units A, B, and a unit C comprising a cyclic terminal urea group, wherein unit A is present in an amount of about 5 to about 50 mol % and has the formula wherein R1 is selected such that the homopolymer of A is alkali-soluble, unit B is present in an amount of about 20 to about 70 mol % and has the following formula wherein R2 is selected such that the homopolymer of B has a glass transition temperature greater than 100° C., preferably a glass transition temperature in the range from about 100 to about 380° C.Type: GrantFiled: March 13, 2002Date of Patent: November 11, 2003Assignee: Kodak Polychrome Graphics LLCInventor: Mathias Jarek
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Publication number: 20030207195Abstract: Disclosed is an alkali-soluble, film-forming novolak resin mixture containing at least two novolak resins, each novolak resin containing the addition-condensation reaction product of at least one phenolic compound with at least one aldehyde source, wherein the phenolic compound for first novolak resin contains 90-100 mole % of meta-cresol, and the phenolic compound for the second novolak resin contains less than 50 mole % of meta-cresol. Also disclosed is a photosensitive composition, containing an admixture of: a) the above-mentioned novolak resin mixture; b) at least one o-quinone photoactive compound; and c) at least one photoresist solvent.Type: ApplicationFiled: April 11, 2002Publication date: November 6, 2003Inventors: J. Neville Eilbeck, Alberto D. Dioses
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Patent number: 6635400Abstract: A resist composition comprising (A) an alkali-insoluble or substantially insoluble polymer having acidic functional groups protected with acid labile groups, which polymer becomes alkali-soluble upon elimination of the acid labile groups, (B) a photoacid generator, and (C) a 1,2-naphthoquinonediazidosulfonyl group-bearing compound has a high resolution and sensitivity, and provides resist patterns of excellent plating resistance when used in UV lithography at an exposure light wavelength of at least 300 nm.Type: GrantFiled: April 17, 2001Date of Patent: October 21, 2003Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hideto Kato, Kazuhiro Nishikawa, Yoshinori Hirano, Katsuya Takemura
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Publication number: 20030194636Abstract: Disclosed is a photoresist composition comprising: a) at least one film forming resin selected from the group consisting of novolak resins, and polyhydroxystyrenes; b) at least one photoactive compound or photoacid generator; and c) a solvent composition comprising at least one solvent selected from the group consisting of acetals and ketals. Also disclosed is a photoresist composition comprising a polycarbonate resin and a solvent composition comprising at least one solvent selected from the group consisting of acetals and ketals. Also disclosed is a process for imaging a photoresist composition, comprising the steps of: a) coating a suitable substrate with any of the aforementioned photoresist compositions; b) baking the substrate to substantially remove the solvent; c) imagewise irradiating the photoresist film; and d) removing the imagewise exposed or, alternatively, the unexposed areas of the coated substrate with a suitable developer.Type: ApplicationFiled: April 11, 2002Publication date: October 16, 2003Inventors: Stanley F. Wanat, Joseph E. Oberlander, Robert R. Plass, Douglas McKenzie
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Publication number: 20030194635Abstract: The present invention provides a positive working imageable composition, which includes a hydroxyfunctional resin comprising a covalently bound radiation sensitive group capable of increasing the solubility of the imageable composition in an alkaline developer upon exposure to radiation; and an isocyanate crosslinking agent. The present invention further provides an imageable element, which includes a substrate and an imageable composition according to the present invention coated on a surface of the substrate and a method of producing an imaged element according to the present invention. Also provided is a radiation sensitive hydroxyfunctional resin including a covalently bound radiation sensitive group capable of increasing solubility in an alkaline developer of an imageable composition derived therefrom upon exposure of the imageable composition to radiation.Type: ApplicationFiled: January 24, 2002Publication date: October 16, 2003Applicant: KODAK POLYCHROME GRAPHICS, L.L.C.Inventor: James Mulligan
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Publication number: 20030193624Abstract: The invention provides a radiation-sensitive resin composition, by which a patterned insulation film whose water repellency varies is easily formed with high precision, a process for forming a patterned insulation film using this composition, a display element and an flat-panel disply device using the composition, and a process for producing the flat-panel disply device.Type: ApplicationFiled: April 10, 2003Publication date: October 16, 2003Applicants: SHARP KABUSHIKI KAISHA, JSR CORPORATIONInventors: Kazuki Kobayashi, Ikuo Sakono, Shinji Shiraki, Hirofumi Sasaki, Kazuaki Niwa
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Publication number: 20030194633Abstract: A radiation-sensitive composition for use in printing plates is described.Type: ApplicationFiled: March 13, 2002Publication date: October 16, 2003Inventor: Mathias Jarek
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Publication number: 20030190554Abstract: A plate-making method of a printing plate comprising exposing a printing plate precursor having a photosensitive layer comprising a photopolymerizable composition containing (i) a crosslinking agent having two ethylenic polymerizable groups and (ii) a crosslinking agent having three or more ethylenic polymerizable groups, and development processing the exposed printing plate precursor with an alkali developer having a pH of not more than 12.5.Type: ApplicationFiled: August 29, 2002Publication date: October 9, 2003Inventor: Kazuto Kunita
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Patent number: 6630279Abstract: A composition includes (A) an alkali-soluble resin; and (B) (b-1) a compound of Formula (I): wherein Ds are each a hydrogen atom or a naphthoquinonediazidosulfonyl group; and (b2) a quinonediazide ester of, for example, methyl gallate.Type: GrantFiled: December 26, 2002Date of Patent: October 7, 2003Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Mitsuo Hagihara, Toshiaki Tachi, Kenji Maruyama
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Publication number: 20030175617Abstract: A resist composition comprising (A) a substantially alkali-insoluble polymer having acidic functional groups protected with acid labile groups, which becomes alkali soluble upon elimination of the acid labile groups, (B) a photoacid generator, and (C) a nonionic fluorinated organosiloxane compound consisting of perfluoroalkyl-containing siloxane bonds and polyoxyethylene type polyether bonds is exposed to UV having a wavelength of at least 150 nm and developed with an alkaline solution to form a pattern without leaving scum.Type: ApplicationFiled: December 27, 2002Publication date: September 18, 2003Inventors: Hideto Kato, Yoshinori Hirano, Toshihiko Fujii, Hiromasa Yamaguchi
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Patent number: RE38256Abstract: Disclosed are a safe slurry photosensitive composition superior in image formation capabilities such as resolution and sensitivity and containing no harmful compound, and a safe water-soluble photosensitive composition capable of being dissolved in water without using any organic solvent while maintaining a sufficient sensitivity as a resist and containing no harmful substance. The slurry photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, at least one type of a resin with acid-crosslinkability or acid-decomposability, and a powder. Various devices can be manufactured by forming a layer of this photosensitive composition on a substrate, exposing the layer to light in accordance with a desired pattern, and heating the layer. The water-soluble photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, and an acetal resin.Type: GrantFiled: November 24, 1999Date of Patent: September 23, 2003Assignee: Kabushiki Kaisha ToshibaInventors: Toru Ushirogouchi, Naomi Shida, Takuya Naito, Koji Asakawa, Akinori Hongu, Makoto Nakase, Hirokazu Niki