Abstract: A method for TEM/STEM sample preparation and analysis that can be used in a FIB-electron microscope system without a flip stage. The method allows a dual beam FIB electron microscope system with a typical tilt stage having a maximum tilt of approximately 60° to be used to extract a TEM/STEM sample to from a substrate, mount the sample onto a sample holder, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to a vertical electron beam column for TEM/STEM imaging.

Abstract: A multi charged particle beam writing apparatus according to an embodiment, includes a setting unit to set a second region such that more openings in remaining openings except for an opening through which the defective beam passes are included in the second region, a selection unit to select a mode from a first mode in which a pattern is written on a target object by using multiple beams having passed openings in the second region and a second mode in which multiple writing is performed while shifting a position by using at least one of remaining multiple beams in the state where the defective beam is controlled to be beam off and additional writing is performed for a position which was supposed to be written by the defective beam, and a writing processing control unit to control to write in the mode selected.

Abstract: A reticle manufacturing method of the present invention comprises the steps of holding a reference mask blank by a reference chuck to measure a surface shape of the reference mask blank as a first surface shape, holding the reference mask blank by a reticle chuck of the exposure apparatus to measure a surface shape of the reference mask blank as a second surface shape, holding the electron beam drawing mask blank by the reference chuck to measure a surface shape of the electron beam drawing mask blank as a third surface shape, calculating a difference between the measurement values of the first surface shape and the second surface shape as a first deference value, calculating, as a forth surface shape, a surface shape of the electron beam drawing mask blank held by the reticle chuck on the basis of the first deference value and the measurement value of the third surface shape, and drawing the pattern on the electron beam drawing mask blank on the basis of the forth surface shape.

Abstract: Provided are apparatuses for processing a surface of a substrate using direct and recycled radiation reflected from the substrate. The apparatus includes a radiation source positioned to direct a radiation beam toward a beam image forming system that forms a beam image on the substrate surface and a recycling system. The recycling system collects radiation reflected from the substrate surface and redirects it back toward the beam image on the substrate in a +1× manner. As a result, radiation incident on and reflected from the substrate is recycled through multiple cycles. This improves the uniformity of the radiation absorbed by the substrate in instances where the thin film patterns on the substrate would otherwise result in non-uniform absorption and uneven heating. Exemplary recycling systems suitable for use with the invention include Offner and Dyson relay systems as well as variants thereof.

Abstract: This invention provides methods and systems, e.g., to control the flow of photo-polymerizable resins. In the method, e.g., flow of a photo-polymerizable resin is restricted from illuminated resin exclusion regions on a substrate surface by precisely situated flow barriers. A system to control photo-polymerizable resin flow includes, e.g., a light source, a mask and a substrate.

Abstract: A method for producing highly purified fused aromatic ring compounds with high yield by a simpler method. A method for producing a fused aromatic ring compound comprising irradiating the bicyclo compound containing at least one bicyclo ring represented by formula (1) in a molecule with light to detach a leaving group X from a residual part to form an aromatic ring: wherein R1 and R3 each denotes a group to form an aromatic ring or a heteroaromatic ring which may be substituted, together with a group to which each thereof is bonded; R2 and R4 each denotes a hydrogen atom, an alkyl group, an alkoxy group, an ester group or a phenyl group; and X is a leaving group, which denotes a carbonyl group or —N?.

Abstract: A coating is applied to a work piece in a charged particle beam system without directing the beam to work piece. The coating is applied by sputtering, either within the charged particle beam vacuum chamber or outside the charged particle beam vacuum chamber. In one embodiment, the sputtering is performed by directing the charged particle beam to a sputter material source, such as a needle from a gas injection system. Material is sputtered from the sputter material source onto the work piece to form, for example, a protective or conductive coating, without requiring the beam to be directed to the work piece, thereby reducing or eliminating damage to the work piece.

Abstract: A process of providing a hydrophobic property to the surface of a plate, and a process of providing a hydrophilic property to the surface by irradiating energy light (radiation) on the surface of the plate, which is provided with the hydrophobic property are provided Variations in the accumulated illumination intensity of radiation on the surface of the plate are controlled to 20% or less.

Abstract: There is provided a method for producing highly purified fused aromatic ring compounds with high yield by a simpler method. A method for producing a fused aromatic ring compound comprising irradiating the bicyclo compound containing at least one bicyclo ring represented by formula (1) in a molecule with light to detach a leaving group X from a residual part to form an aromatic ring: wherein R1 and R3 each denotes a group to form an aromatic ring or a heteroaromatic ring which may be substituted, together with a group to which each thereof is bonded; R2 and R4 each denotes a hydrogen atom, an alkyl group, an alkoxy group, an ester group or a phenyl group; and X is a leaving group, which denotes a carbonyl group or —N?.

Abstract: An immersion lithographic apparatus provides an immersion liquid including photosensitive material(s) configured to form a patterned film on the surface of a substrate on exposure to a radiation beam. Irradiation through the immersion liquid onto a substrate leads to deposition of a film on the substrate. Film formation occurs only in the photoirradiated region, so that the film formed has a pattern corresponding to the pattern of the radiation.

Abstract: A process for adjusting the energy of an imaging laser for imaging of a thermally imageable element including the steps of: (a) providing an imaging unit having a non-imaging laser and an imaging laser, the non-imaging laser having a light detector which is in communication with the imaging laser, (b) contacting a receiver element with the thermally imageable element in the imaging unit, wherein the receiver element comprises a light attenuating layer having a front surface and a back surface; (c) actuating the non-imaging laser to expose the thermally imageable element and the receiver element to an amount of light energy sufficient for the light detector to detect the amount of light reflected from the thermally imageable element and light attenuating layer of the receiver element; and (d) actuating the imaging laser to focus the imaging laser in order to expose the thermally imageable element to an amount of light energy sufficient for imaging the thermally imageable element

Abstract: The present invention relates to maskless photolithography using a patterned light generator for creating 2-D and 3-D patterns on objects using etching and deposition techniques. In an embodiment, the patterned light generator uses a micromirror array to direct pattern light on a target object. In an alternate embodiment, the patterned light generator uses a plasma display device to generate and direct patterned light onto a target object. Specifically, the invention provides a maskless photolithography system and method for photo stimulated etching of objects in a liquid solution, patterning glass, and photoselective metal deposition. For photo stimulated etching of objects in a liquid solution, the invention provides a system and method for immersing a substrate in an etchant solution, exposing the immersed substrate to patterned light, and etching the substrate according to the pattern of incident light.

Abstract: A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy is present. The heat associated with the laser beam causes the laser reactive material to fuse to the surface of the chip creating a visibly distinct mark in contrast to the rest of the surface of the chip. Only reactive material contacted by the laser fuses to the chip surface, and the remaining residue on the non-irradiated portion can be readily removed.

Abstract: Substrates are patterned with antibodies attached thereto at discrete locations from which absorption resistant coating is removed by selectively controlled mechanical scribing contact to avoid chemical removal so as to decrease fabrication costs and increase fabrication speed.

Abstract: A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy is present. The heat associated with the laser beam causes the laser reactive material to fuse to the surface of the chip creating a visibly distinct mark in contrast to the rest of the surface of the chip. Only reactive material contacted by the laser fuses to the chip surface, and the remaining residue on the non-irradiated portion can be readily removed.

Abstract: An improved method and apparatus for forming a plasma-polymerized methylsilane (PPMS) photo-sensitive resist material includes the steps of pressurizing the chamber to between about 1 to about 2 Torr, heating the substrate to between about 50.degree. C. and about 200.degree. C., and plasma-polymerizing the precursor methylsilane gas to deposit a stable film having high-photosensitivity at high deposition rates.

Abstract: An improved method and apparatus for forming a plasma-polymerized methylsilane (PPMS) photo-sensitive resist material includes the steps of pressurizing the chamber to between about 1 to about 2 Torr, heating the substrate to between about 50.degree. C. and about 200.degree. C., and plasma-polymerizing the precursor methylsilane gas to deposit a stable film having high-photosensitivity at high deposition rates.

Abstract: A patterned multiple antibody substrate for use in biosensors or immunosensors is produced by (1) coating an antibody-adsorbent substrate with a material that resists antibody adsorption, (2) using ion beam sputtering, laser ablation, or mechanical scribing to remove the coating at specific sites on the substrate, and then (3) adsorbing specific antibodies at the sites. The substrate is capable of detecting multiple chemical species simultaneously.

Abstract: Silver halide photographic material is disclosed, which has provided on a support at least one silver halide emulsion layer which comprises silver halide grains containing a silver chloride of 50 mol % or more and at least one emulsion layer and other hydrophilic colloid layers contain at least one hydrazine derivative and at least one phosphonium salt compound.

Abstract: Disclosed is a silver halide photographic light-sensitive material for plate making which has an excellent rapid processing performance and a high processing stability. The silver halide photographic light-sensitive material comprises a support having provided thereon at least one silver halide light-sensitive emulsion layer, wherein at least one of (i) the at least one emulsion layer and (ii) another hydrophilic colloid layers(s) contains a compound represented by Formula (I).

Abstract: Structured polymer layers having nonlinear optical properties are produced by a process wherein either organic compounds containing ethylenically unsaturated groups are subjected to free radical copolymerization (A) with stilbene, azo or azomethine compounds containing ethylenically unsaturated groups and donor and acceptor groups, or organic compounds containing ethylenically unsaturated groups are subjected to free radical polymerization and are mixed (B) with stilbene, azo or azomethine compounds containing ethylenically unsaturated groups and donor and acceptor groups, the copolymers (A) or mixtures (B) thus obtained are exposed imagewise to high-energy radiation, the unexposed parts are removed and the structured polymer layers thus obtained are polarized in an electric field for orientation of the chromophoric structural units in the region of the glass transition temperature of the polymer and crosslinked in an applied electric field.

Abstract: A resin composition suitable for marking with a laser and a method for laser marking said resin are provided. The resin composition comprises a thermoplastic resin, one or more compounds selected from the group consisting essentially of (i) tetrazole compounds, and (ii) sulfonylhydrazide, nitroso and azo compounds having a decomposition temperature of at least 210.degree. C., and carbon black.

Abstract: The present invention provides photopolymerizable coating compositions comprising (a) a photosensitive compound selected from the group consisting of photoinitiators and negative-working photosensitive substances which are present in an amount effective to render the compositions sensitive to radiant energy, and (b) an ethylenically unsaturated, urethane-containing, self-crosslinkable grafted cellulose ester polymer; imaging elements for use in offset printing processes prepared therefrom; and processes employing said imaging elements.

Abstract: In a method of forming a solid article of predetermined shape from a liquid which can be cured by exposure to radiation, a surface upon which the article is to be formed is provided. A predetermined region of the surface is exposed to a beam of radiation. Liquid is then supplied to an unexposed region of the surface such that a solid barrier, defining a surface of the solid article, is created at the interface of the liquid and the beam. The solid barrier is effective as a mold to contain the liquid which has been supplied but not yet cured until this liquid is cured. Such a method can be used to encapsulate a microelectronic device.

Abstract: A resist is formed by sorption of an inorganic-containing gas into an organic material. The development of the resist occurs by exposure to a plasma (e.g., oxygen reactive ion etching) that forms a protective compound (e.g., a metal oxide) selectively in the resist. The selected regions can be defined by patterning radiation of various types, including visible, ultraviolet, electron beam, and ion beam. In an alternate embodiment, the selected regions are defined by an overlying resist, with the gas sorption protecting the underlying layer in a bilevel resist. The protective compound can protect the organic resist layer during etching of an underlying inorganic layer, such as metal, silicide, oxide, nitride, etc.

Abstract: A novel information recording medium comprising a substrate and a recording layer for writing information by means of laser beam which is provided on the substrate is disclosed. The recording layer contains an organic metal complex compound and a sensitizing agent for laser beam. Alternatively, the recording layer contains an organic metal complex compound and this recording layer is arranged in contact with a layer of a sensitizing agent for laser beam.

Abstract: A silylation method wherein a resist coating applied on a substrate is reacted with an organic silane compound under the irradiation of a deep ultraviolet ray to render regions of the resist coating durable to oxidative ion etching, whereby a fine pattern is formed. The resist coating includes a layer of an active polymer which is reactive with an organic silane compound under the irradiation of a deep ultraviolet ray to be combined with silyl groups, and a layer of an inert polymer which is not reactive with an organic silicone compound under the irradiation of a deep ultraviolet ray. A desired pattern is formed with the resist coating by ordinary lithographic technique, and then the active polymer layer of the pattern is allowed to contact with an organic silane compound while being irradiated with a deep ultraviolet ray to introduce silyl groups into the active polymer layer of the pattern so as to form masking regions durable to oxidative ion etching.

Abstract: The novel thioxanthones of the formula I ##STR1## in which R.sub.1, R.sub.2, X and W are as defined in patent claim 1, are suitable, for example, for the preparation of photosensitive, compositions of matter which are capable of undergoing condensation or addition reactions and may or may not be crosslinkable, and which in turn are used for image formation, in particular by means of electroless deposition of metals. Such compositions of matter contain, for example, a thioxanthone of the formula I, an oligomer or polymer with terminal glycidyl groups and, where relevant, a crosslinking agent and/or a salt of a metal or group Ib or VIII of the Periodic Table.

Abstract: A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.

Abstract: A thin film of material such as metal is deposited on the surface of a substrate by placing a substrate (22) into a chamber (10) containing holder (12) cooled by heat exchanger 18. A beam (56) of U.V. light from the illumination source (42) is projected through monochromator (43), mask (46) and lens (16) onto a selected area (58) of the substrate at an energy level exceeding the photoemission threshold of the surface. A slow electron (60) is ejected from the surface into the capture zone (62). A compound AB such as iron pentacarbonyl from supply (30) is leaked into the chamber (10), enters the capture zone (60) to form a highly reactive deposition fragment A.sup.- which attaches to the surface and a dissociation fragment which is evacuated through outlet (14). The deposited fragment may further dissociate to form metal deposit.

Abstract: Sub-100A line width patterns are formed on a member by electron beam conversion and fixing of a resist that arrives at the reaction zone point by surface migration into a resist pattern of a precise thickness and width while the member rests on an electron backscattering control support.

Abstract: A process for forming a delineated vapor deposition film of a deposition material on a substrate. The delineation is accomplished by exposing selected areas of the substrate to an electron beam before depositing the deposition material whereby the sticking coefficients of the selected areas are sufficiently reduced so as to prevent any significant deposition in those areas. Furthermore, irradiated areas of the substrate can be restored to their original surface characteristics by exposure to a second electron beam while the substrate is at an elevated temperature. Thus, areas of the substrate can be negatively delineated to prevent deposition, and such negatively delineated surfaces can then be positively delineated to permit deposition.