Abstract: A hair iron according to one example embodiment includes a first arm and a second arm movable relative to each other between an open position and a closed position. A contact surface is positioned on an exterior of the first arm for contacting hair during use. The hair iron includes a heater having a ceramic substrate and an electrical resistor material thick film printed on a surface of the ceramic substrate. The heater generates heat by applying an electric current to the electrical resistor material. The heater is positioned to supply heat to the contact surface.

Abstract: A build chamber for a 3D printer includes a heated build space in an interior of the build chamber and a thermal isolator configured to insulate 3D printer components from the heated build space. The thermal isolator includes a first baffle section and a second baffle section. Each of the first baffle section and the second baffle section includes an accordion-pleated panel having a length, a width, a first end and a second end, wherein the panel comprises a parallel alternating top folds and bottom folds along the width forming a series of pleats, and each pleat within the series being configured to expand and contract, and wherein the panel is constructed of a heat-resistant material. Each baffle section also includes support rods affixed to the accordion-pleated panel in parallel to the pleats and at intervals along the length of the panel, the support rods substantially spanning the width of the panel.

Abstract: A supporting unit is provided to support a substrate. The supporting unit includes a supporting plate including a pressure reducing fluid passage formed inside the supporting plate, and a flanger provided in a groove formed in a top surface of the supporting plate. A lower area of the flanger is connected to the pressure reducing fluid passage in the groove, and the flanger moves up and down by reduced pressure applied through the pressure reducing fluid passage.

Abstract: Disclosed is a ceramic heater, which includes: a disc-shaped ceramic substrate with top and bottom surfaces; and a planar electrode and first and second heating resistors embedded in the ceramic substrate in this order from top to bottom. In top view, the first heating resistor has: a planer first resistive portion arranged inside a first imaginary circle defined by an outermost circumferential contour of the planer electrode; a linear or strip-shaped second resistive portion arranged outward of the first resistive portion in a radial direction of the ceramic substrate and extending along a circumferential direction of the ceramic substrate; and a connecting portion connecting the first and second resistive portions to each other; and the second heating resistor is arranged inside a second imaginary circle defined by an innermost circumferential contour of the second resistive portion.

Abstract: A workpiece processing system and method comprises transferring a workpiece to a vacuum chamber. A heated chuck is configured to selectively clamp a workpiece to a clamping surface thereof, wherein the heated chuck is configured to selectively heat the clamping surface. A workpiece transfer apparatus has an end effector configured to transfer the workpiece to the heated chuck, wherein the workpiece rests on the end effector. A controller selectively position the workpiece with respect to the heated chuck via a control of the workpiece transfer apparatus, wherein the controller is configured to position the workpiece at a predetermined distance from the clamping surface, wherein the predetermined distance generally determines an amount of radiation received by the workpiece from the heated chuck, and wherein the controller is further configured to place the workpiece on the surface of the heated chuck via a control of the workpiece transfer apparatus.

Abstract: A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.

Abstract: An embodiment of the present invention suggests a method in which an access point (AP) obtains channel quality information in a wireless LAN system. The AP transmits, to at least one station (STA), a null data packet announcement (NDP-A) frame including information on transmission of a subsequent null data packet (NDP) frame, and transmits an NDP frame to the at least one station on the basis of information on the NDP-A frame. Further, the AP receives, from the at least one STA, a feedback frame including downlink channel quality information. At this time, the NDP frame includes an L-part for a legacy STA and a high efficiency (HE)-part for a HE STA, wherein the HE-part consists of a HE-signaling A (HE-SIG A) field, a HE-short training field (HE-STF), and a HE-long training field (HE-LTF).

Abstract: A method and apparatus for annealing semiconductor substrates is disclosed. The apparatus has an annealing energy source and a substrate support, with a shield member disposed between the annealing energy source and the substrate support. The shield member is a substantially flat member having a dimension larger than a substrate processed on the substrate support, with a window covering a central opening in the substantially flat member. The central opening has a gas inlet portal and a gas outlet portal, each in fluid communication with a gas inlet plenum and gas outlet plenum, respectively. A connection member is disposed around the central opening and holds the window over the central opening. Connection openings in the connection member are in fluid communication with the gas inlet plenum and gas outlet plenum, respectively, through a gas inlet conduit and a gas outlet conduit formed through the connection member.

Abstract: A method of manufacturing a silicon carbide semiconductor device includes a step of preparing a silicon carbide substrate having a first main surface and a second main surface located opposite to the first main surface, a step of forming a doped region in the silicon carbide substrate by doping the first main surface with an impurity, a step of forming a first protecting film on the first main surface, and a step of forming a second protecting film on the second main surface, the step of forming a first protecting film being performed after the step of forming a doped region, the method further including a step of activating the impurity included in the doped region by annealing with at least a portion of the first main surface covered with the first protecting film and at least a portion of the second main surface covered with the second protecting film.

Abstract: A wafer handling station includes a housing defining a chamber, and a wafer cassette assembly positionable in the chamber. The wafer cassette assembly includes a vertical support, and cassette members carried by the vertical support in spaced relation. Each cassette member includes a base coupled to the vertical support, wafer contact pads on an upper surface of the base and configured to support a wafer thereon, and a pair of wafer brackets carried by the base and configured to engage respective edges of the wafer to laterally confine the wafer.

Abstract: Embodiments of edge rings for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, an edge ring for a semiconductor process chamber may include an annular body having a central opening, an inner edge, an outer edge, an upper surface, and a lower surface, an inner lip disposed proximate the inner edge and extending downward from the upper surface, and a plurality of protrusions extending upward from the inner lip and disposed along the inner edge of the annular body, wherein the plurality of protrusions are arranged to support a substrate above the inner lip and over the central opening, wherein the inner lip is configured to substantially prevent light radiation from travelling between a first volume disposed above the edge ring and a second volume disposed below the edge ring when a substrate is disposed on the plurality of protrusions.

Abstract: An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer holder including a first portion and a second portion. The first and second portions are formed of the same continuous material. The first portion includes a first upper surface and a first lower surface, and the second portion including a second upper surface and a second lower surface. The apparatus further includes an interface between the first and second portions. The interface provides for a transition such that the first upper surface of the first portion tends toward the second upper surface of the second portion. The apparatus further includes a tapered region formed in the first portion. The tapered region starts at a radial distance from a center line of the wafer holder and terminates at the interface. The tapered region has an initial thickness that gradually decreases to a final thickness.

Abstract: A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support.

Abstract: A heating apparatus including: a first heating part and a second heating part between which a substrate having a coating film is disposed at a substrate position in the film thickness direction; and a distance control part which controls at least one of a first distance between the substrate position and the first heating part and a second distance between the substrate position and the second heating part.

Abstract: A retaining bar to be used in combination with a heat furnace supporting assembly for supporting at least one receptacle. The retaining bar comprises at least one single piece elongated body having a finite length and at least one receptacle receiving cavity defined therein and extending along a section of the length of the body. Each one of the at least one receptacle receiving cavity is configured to receive therein one of a bottom section and an upper section of one of the at least one receptacle. A heat furnace receptacle supporting assembly comprising such a retaining bar and a heat furnace provided with the heat furnace receptacle supporting assembly are further provided.

Abstract: A multi-operation wafer baking system includes a chassis; a wafer loading device mounted on the chassis for laterally moving a wafer; a cruciform transportation device mounted on the chassis for receiving a wafer from the wafer loading device and including a base, an elevation platform, and a rotation platform mounted on the elevation platform and having four carrier arms for carrying wafers; an annular baking device mounted on the chassis to oppose the cruciform transportation device and including a central turn table, a plurality of wafer racks, and a plurality of baking tray assemblies functioning to receive wafers from corresponding wafer racks for performing a baking operation on the wafer; and an unloading device mounted on the chassis for receiving baked wafers. This system allows for baking wafers in a multi-operation manner to thereby improve throughput.

Abstract: A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.

Abstract: Methods and apparatuses that decouple wafer temperature from pre-heat station residence time, thereby improving wafer-to-wafer temperature uniformity, are provided. The methods involve maintaining a desired temperature by varying the distance between the wafer and a heater. In certain embodiments, the methods involve rapidly approaching a predetermined initial distance and then obtaining and maintaining a desired final temperature using closed loop temperature control. In certain embodiments, a heated pedestal supplies the heat. The wafer-pedestal gap may be modulated may be varied by moving the heated pedestal and/or moving the wafer, e.g., via a movable wafer support. Also in certain embodiments, the closed loop control system includes a real time wafer temperature sensor and a servo controlled linear motor for moving the pedestal or wafer support.

Abstract: In a method for heat treating a metal tube or pipe for a nuclear power plant, the tube or pipe being accommodated in a batch-type vacuum heat treatment furnace, when the tube or pipe is laid down on and is subjected to heat treatment on a plurality of metal cross beams arranged along a longitudinal direction of the tube or pipe, it is possible to suppress scratches to be formed on the outer surface of the tube or pipe and attributable to heat treatment, and to reduce the discoloration on the outer surface of the tube or pipe by holding the tube or pipe and the metal cross beams in indirect contact with each other by virtue of a heat resistant fabric having a thickness of 0.1 to 1.2 mm interposed in between.

Abstract: A boat according to this disclosure includes side walls and a base that are arranged to define a container with an interior. A bottom of the boat may have a convex configuration. In a specific embodiment, the base may have a convex configuration, such as the shape of a portion of the curved surface of a cylinder, with end walls located at opposite ends of the base. Such a boat may have a crescent configuration. Each boat may be configured to be positioned against another boat, enabling the assembly of groups of boats. Multi-celled structures that receive and effectively increase the surface area of precursor material are also disclosed. A multi-celled structure may be configured for use within the interior of a boat, or individually, without a separate boat.

Abstract: An enhanced bead rack has a pair of supports. Each support has a front face, a back face, a top edge and a base. The front faces and back faces have a plurality of ports extending therethrough, and each port can receive therein one end of a wire. Beads, pendants, and other works can be threaded onto one or more wires and the wires can then be placed so that each end of each wire is supported by a port in each support. The plurality of ports can be arranged in various patterns or randomly and the number of ports can vary. Different sizes, shapes and styles of ports can be employed including: a grid of round ports, a series of long slots with notches, a series of long shelf spaces with notches, etc.

Abstract: A system for ashing carbon includes a vertically oriented burner column having a first end and an opposing end with an interior chamber therebetween. The burner column has an aperture at the first end and a suction port proximal to the second end, the aperture and the suction port in communication with the interior chamber. The system also comprises a porous media screen located in the interior chamber and positioned between the first end and the second end of the burner column. The media screen is adapted to hold ignited carbon containing a precious metal therein. The system also contains a pump that is coupled to the suction port. The pump is configured to apply a negative pressure to the interior chamber of the burner column to draw air into the interior chamber via the aperture. The drawn air passes through the ignited carbon at a desired flow rate to achieve a temperature of the carbon suitable for ashing the carbon.

Abstract: An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.

Abstract: A sintering apparatus comprising a furnace core tube having an opening in a top end through which the soot deposition body is inserted, and having atmospheric gas introduced therein from below and expelled upward; a shaft from which the soot deposition body hangs; a lid that has the shaft inserted therethrough and can cover the opening; a heating furnace that heats the soot deposition body; an internal lid in a top portion of the furnace core tube that divides the top portion of the furnace core tube into an upper region and a lower region; and a gas flow path that connects the two regions to each other and has the atmospheric gas flow therethrough. Total cross-sectional area, relative to movement direction of the atmospheric gas, of the gas flow path is less than cross-sectional area, relative to movement direction of the atmospheric gas, of the furnace core tube.

Abstract: In a method for heat treating a metal tube or pipe for a nuclear power plant, the tube or pipe being accommodated in a batch-type vacuum heat treatment furnace, when the tube or pipe is laid down on and is subjected to heat treatment on a plurality of metal cross beams arranged along a longitudinal direction of the tube or pipe, it is possible to suppress scratches to be formed on the outer surface of the tube or pipe and attributable to heat treatment, and to reduce the discoloration on the outer surface of the tube or pipe by holding the tube or pipe and the metal cross beams in indirect contact with each other by virtue of a heat resistant fabric having a thickness of 0.1 to 1.2 mm interposed in between.

Abstract: A medium heating device includes a heater that heats a medium, and a medium support member that supports a target heating portion, which is a portion that is heated by the heater in the medium, in which the medium support member has a first component portion that is formed so that a space is provided between the medium and the first component portion when the medium is supported, and a second component portion that is in contact with the medium when the medium is supported.

Abstract: A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.

Abstract: A method of supporting a plurality of planar substrates in a tube shaped furnace for conducting a thermal treatment process is disclosed. The method uses a boat fixture having a base frame including two length portions and a first width portion, a second width portion, and one or more middle members connected between the two length portions. Additionally, the method includes mounting a removable first grooved rod respectively on the first width portion, the second width portion, and each of the one or more middle members, each first grooved rod having a first plurality of grooves characterized by a first spatial configuration. The method further includes inserting one or two substrates of a plurality of planar substrates into each groove in the boat fixture separated by a distance.

Abstract: An apparatus and method for small scale heating of an asphalt material suitable for repair and/or resurfacing of paved surfaces, most preferably where the material is placed in a small microwavable container.

Abstract: A heating storage structure includes a plurality of mounting parts each including a mounting face on which articles to be heated are mounted, which is a part of the surface of the mounting part; and a fixing part to which the plurality of mounting parts are detachably fixed so that the plurality of mounting parts are stacked while each of spaces S1 to S4 is left between the mounting face of one of the mounting parts and the mounting part disposed adjacent to the one mounting part, and the plurality of mounting parts include a mounting part provided with the mounting face having a thermal emissivity which is different from that of the mounting face of another mounting part.

Abstract: Improved workpiece-carrier in the form of a high-temperature-grating 10 assembled from mutually engaging elements consisting of carbon-fiber-reinforced carbon-composite-board-strips comprising comb-shaped elements, having a frame surrounding a horizontal grating as well as at least one workpiece-support (40) which is inert in relation to the supported workpiece and provides a workpiece-support-area (50) at a distance above the grating (3O)7 said work-piece-support (40) being arranged within at least one enclosing cut-out-section of at least one element wherein furthermore said elements comprise at least one element having interlocking cut-out-sections in alternating arrangement, at least one auxiliary element, said workpiece-support (40) is a single-piece part of high temperature ceramic of rod-shaped elongation being arranged parallel to the plane of said grating (30) and being an integral part of the grating by being enclosed beneath the workpiece-support-area (50) by cut-out-sections of a multitude of cros

Abstract: A heat-collecting kiln device includes a housing assembly including a single housing or a plurality of housings having a same height or different heights, with the housings stackable one upon another. A top lid is mounted on a top of the housing assembly to seal the housing assembly and includes an observation hole. A base is mounted to a bottom of the housing assembly to seal the housing assembly. A cover is mounted to the top lid to seal the observation hole. The cover is removable to reveal the observation hole. The heat-collecting kiln device further includes a net and at least one leg. Each housing is comprised of four modular elements each having a mortise engaged with a tenon of another modular element. One of the modular elements includes a temperature detection hole.

Abstract: A firing tray for a furnace for dental ceramics having a plate for the placement on it of the firing material, wherein the plate is made as a base for the improvement of the application possibilities and the firing tray has additional wall elements which are designed for the placement on them of a further firing tray for the forming of a stack.

Abstract: According to one aspect of the present disclosure, provided is a heat treatment apparatus configured to heat treat a plurality of objects to be treated which are held and supported by a holding and supporting unit while an inert gas is allowed to flow in a vertical type processing chamber from a bottom to a top thereof, wherein the processing chamber has a heating unit installed therearound. The heat treatment apparatus includes a gas supply system configured to supply the inert gas, wherein the gas supply system includes a gas supply header portion located in a lower end of the processing chamber to allow the inert gas to flow along a circumferential direction of the lower end; and a gas introduction portion in communication with the gas supply header portion to introduce the inert gas into the processing chamber.

Abstract: A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.

Abstract: A sintering chamber structure adapted to store multiple articles to be sintered in a sintering furnace, includes a first wall, a second wall, two side walls interconnecting the first and second walls, at least two supporting walls, and holding boards for holding the multiple articles. The two side walls and the first and second walls together define a storage space communicating outside. The two supporting walls correspondingly form a plurality of guiding grooves, wherein the first and second walls correspondingly form a pair of positioning slots communicating with the storage space, the at least two supporting walls are detachably inserted in the pairs of positioning slots, respectively, and the holding boards are inserted in corresponding guiding grooves. In this manner, the at least two supporting walls can adjust the inner space according to the sizes of the articles, whereby achieving the best yield of sintering.

Abstract: A susceptor supports a crucible in a furnace and includes a first wall having a vertical edge and a second wall having a vertical edge. A first interlocking member is on the vertical edge of the first wall and a second interlocking member is on the vertical edge of the second wall. The first interlocking member is interlocked with the second interlocking member when the first wall and second wall are in an assembled configuration. Openings are disposed through the first interlocking member and the second interlocking member. Each of the openings through the first interlocking member is coaxial with each of the openings through the second interlocking member.

Abstract: A self-contained heated wax treatment apparatus includes an outer shell and a rack disposed inside the outer shell. The rack includes a receptacle holder and at least one heater holder. At least a first receptacle is mounted to the receptacle holder of the rack. The first receptacle contains a heat activated substance. A heater is mounted to the heater holder of the rack in thermal conductive contact with the first receptacle. Activation of the heater causes heat to flow to the first receptacle and activate the heat activated substance inside the receptacle.

Abstract: Firing containers for firing an electrode active material include one or more through openings, and protrusions protruding from an outer surface of sidewalls of each of the firing containers. The protrusions allow adjacent firing containers to be spaced apart from each other and guide the adjacent firing containers during alignment.

Abstract: In a sample heating method which uses a microchip, using the microchip which includes a vessel portion (70e) in which at least a portion is configured of an elastic member and a flow channel (61b) which leads a liquid sample to the vessel portion (70e), after a liquid sample is put in the vessel portion (70e), the liquid sample is heated while pressure is applied with respect to an inner portion of the vessel portion (70e).

Abstract: Provided are a conveying jig, a method of manufacturing the conveying jig, and a method of heat-treating metal rings using the conveying jig. The conveying jig is provided with a base and ten holding shafts raised from the base. Ridges and grooves are alternatively provided in the side wall of each holding shaft. The metal rings are held in position by being engaged in the grooves in the holding shafts. The space enclosed within the holding shafts is communicated with the atmosphere, and this allows, when the metal rings held by the conveying jig are subjected to heat treatment in a heat treatment furnace, an atmospheric gas to circulate in the space enclosed within the holding shafts.

Abstract: An apparatus, a system and a method are disclosed. An exemplary apparatus includes a first portion configured to hold an overlying wafer. The first portion includes a central region and an edge region circumscribing the central region. The first portion further including an upper surface and a lower surface. The apparatus further includes a second portion extending beyond an outer radius of the wafer. The second portion including an upper surface and a lower surface. The lower surface of the first portion in the central region has a first reflective characteristic. The lower surface of the first portion in the edge region and the second portion have a second reflective characteristic.

Abstract: A support tooling for supporting at least one metal part that is to be subjected to heat treatment or shaped while hot, the tooling including: a stationary support structure presenting a determined shape that corresponds to the general shape of each metal part that is to be supported; first holder elements arranged on one side of each part; second holder elements arranged on the other side of each part; and at least one spring type resilient element placed between the support structure and each first or second holder element so as to hold the part throughout the duration of heat treatment. The support structure, the first and second holder elements and the resilient element(s) are made of thermostructural composite material.

Abstract: A substrate carrier is used for carrying a plurality of back electrode substrates into a furnace. Each back electrode substrate has a precursor layer formed thereon. The furnace is used for providing a process gas to react with the precursor layer, so as to form a photoelectric transducing layer on each back electrode substrate. The substrate carrier includes a heat-resistant metal frame and a first protective layer. The heat-resistant metal frame has a plurality of slots for supporting the plurality of back electrode substrates. The first protective layer is formed on the heat-resistant metal frame for preventing a chemical reaction of the heat-resistant metal frame with the process gas.

Abstract: A substrate supporting assembly in a reaction space includes a heater, a substrate support member, and a shim positioned between the heater and the substrate support member. The shim may be removably secured between the heater and the substrate support member. The shim may further include an inner surface defining a perimeter of a gap. The gap may be further defined by a bottom surface of the substrate support member and a top surface of the heater. The substrate support member may further include a shoulder positioned radially outside of a substrate support position and wherein the shim inner surface is radially aligned with the substrate support member shoulder.

Abstract: An electrostatic chuck device includes a surface to support a substrate, an electrode to generate electrostatic force for the substrate, and a plurality of heaters to heat different regions of the surface. The plurality of heaters include a first heater to heat a first region to a first temperature, a second heater to heat a second region to a second temperature, and a third heater to heat a third region to a third temperature between the first and second temperatures. The second region is closer to a peripheral area of the surface than the first region, and the third region between the first and second regions.

Abstract: The invention relates to an oven for heat treatment of a multiplicity of objects. The oven comprises a support stand, which is realized as a three-dimensional frame, an elongate heating chamber, which is arranged vertically or horizontally in a central region of the support stand, and a plurality of elongate combustion chambers, which are arranged vertically or horizontally inside the support stand. The oven additionally comprises a heating element, which is assigned to the heating chamber, and at least one fan for generating an air stream from the heating chamber to the combustion chambers. The combustion chambers are provided to receive the objects to be treated. The support stand is provided to support the heating chamber and the combustion chambers. The invention additionally relates to an oven installation having a multiplicity of such ovens.

Abstract: The present invention provides a wafer support jig having at least a support surface on which a treatment target wafer is mounted and supported when performing a heat treatment, wherein skewness Rsk on the support surface that supports the treatment target wafer is 0<Rsk<10, and 100 to 105 protruding objects each having a height of 2 ?m or above and less than 30 ?m are present within arbitrary 1 mm2 without protruding objects each having a height of 30 ?m or above on the entire support surface.

Abstract: A vertical boat for heat treatment includes a plurality of supporting columns, a pair of plate members coupled to both ends of each supporting column. In each of the supporting columns a plurality of supporting parts for horizontally supporting substrates to be treated are formed and an auxiliary supporting member to place each of the substrates to be treated is removably attached to each of the plurality of supporting parts. The auxiliary supporting member is adjusted for each supporting part with respect to the inclination of a surface for placing the substrates to be treated depending on the shape of each supporting part by processing a surface for attaching to the supporting part, or by interposing a spacer between the supporting part and the auxiliary supporting member is provided.

Abstract: A method of supporting a plurality of planar substrates in a tube shaped furnace for conducting a thermal treatment process is disclosed. The method uses a boat fixture having a base frame including two length portions and a first width portion, a second width portion, and one or more middle members connected between the two length portions. Additionally, the method includes mounting a removable first grooved rod respectively on the first width portion, the second width portion, and each of the one or more middle members, each first grooved rod having a first plurality of grooves characterized by a first spatial configuration. The method further includes inserting one or two substrates of a plurality of planar substrates into each groove in the boat fixture separated by a distance.