Abstract: The invention relates to a dental furnace (1) comprising a hood-shaped combustion chamber (3) with a heating element (12) that is placed therein and an opening (13), and a closing plate (4) which is arranged so as to be movable relative to the combustion chamber (3) and is used for accommodating a material (5) that is to be baked, particularly a tooth replacement object. Said dental furnace (1) further comprises a sensor (31) for determining the combustion chamber temperature. In order to optimize the drying time and closing time, a measuring instrument (7b) is provided for recording the actual value of the position of the closing plate relative to the combustion chamber (3) while an arithmetic unit (51) is provided for determining the deviation from the comparison between the determined actual value and a defined required value so as to derive a control variable for triggering the relative position between the closing plate (4) and the combustion chamber (5).

Abstract: A controller and method for operating an HVAC system including an air conditioning unit, such as a gas furnace, having three stages of heat output and responsive to signals from a single stage or two stage thermostat. The W1, W2, and W3 inputs to the controller may be configured for receipt of a single stage control signal simultaneously or paired as W1, W2 or W2, W3. The system controller is configured to determine which input connection arrangement is in existence and operates the system in mock one stage or mock two stage modes depending on the signals received from a single or two stage thermostat, respectively.

Abstract: A thermal oxidizer assembly for abatement of process emissions uses an abatement chamber where process emissions are abated generating heated gases. A converter is in fluid communication with the abatement chamber for receiving the heated gases from the abatement chamber. The converter includes a heat engine for converting thermal energy disposed in the heated gases to useable mechanical energy.

Abstract: Provided herein is a wafer carrier comprising a disk and a pocket, wherein the pocket is centered in the disk and holds a wafer. Also provided is a method of processing or testing a wafer for a semiconductor device, comprising the steps of placing the wafer in the wafer carrier disclosed herein; loading the wafer carrier in a loadlock chamber; and transferring the wafer carrier from the loadlock chamber to a process chamber for processing or testing.

Abstract: A heat flux measuring device for transporting through a heated chamber, the device having an array of sensors, each sensor comprising first and second surfaces bounding a region, a thermally insulating layer substantially occupying said region, and means for providing a signal which is a measure of the temperature difference across the layer. The said first surface of each sensor is in thermal contact with a heat sink and the said second surface of each sensor is exposed.

Abstract: A heat treatment system is fabricated from a loading section, a heat treatment section and a outlet section integrated with one another, and the heat treatment section comprises a transfer mechanism provided between the loading section and the outlet section for successively transferring silicon wafers, a heating unit provided along the transfer mechanism for heating the silicon wafers, and a cooling unit provided along the transfer mechanism and closer to the outlet section than the heating section for cooling the silicon wafers so that the silicon wafers are continuously treated with heat for annihilating thermal donors produced from oxygen during the growth of a silicon crystal without any handling by operators.

Abstract: For use in the fabrication of electronic circuit modules, there is provided a heating furnace which can be arbitrarily set in a desired temperature profile. The furnace includes a plural number of independently controllable heaters located in spaced positions to provide a plural number of heating zones in the furnace, and a plural number of cooling panels provided in the heating zones of the respective heaters. Each heater is independently controlled according to a specified type of substrate to establish a temperature profile for the specified substrate type in the furnace to carry out the curing of a sealing synthetic resin material of a semiconductor device and the reflow soldering of surface mounting devices in one and single furnace.

Abstract: A thermal cycling apparatus having an upper heat chamber and a lower cold chamber positioned vertically beneath the upper heat chamber and vertically coaxial therewith whereby a material to the thermal cycle tested can be transferred between the upper heat chamber and the lower cold chamber. An externally operated flapper door within the thermal cycling apparatus separates the two chambers. The material to be thermally tested is placed in a basket constructed of suitable material which can be translated between the two chambers from a location externally of the chambers. The temperature in the upper chamber is elevated by gaseous nitrogen to a temperature up to about 1000 degrees F. and the lower cold chamber is cooled by a cryogenic liquid. Cycle testing is preformed by alternately transferring the material, i.e. 40 or more specimens at a time, between the upper and lower chambers the number of times desired.

Abstract: A multi stage heater heats items on a conveyor so that they follow a predetermined temperature profile. The heater is used for printed circuit boards or the like when heated for soldering and avoids thermal gradients that can occur with heating different materials. The heater has a first heater for applying a first quantity of heat to items on the conveyor, a temperature sensing device for determining temperature of items leaving the first heater, a second heater downstream of the first heater and a control system which compares signals from the temperature sensing device with a predetermined temperataure profile to produce a first control output to control the first heater and a second control output to control the second heater so that items passing through the heater follow the predetermined temperature profile.

Abstract: An apparatus controls the temperature of a multi-zone furnace based on a given temperature distribution pattern, which pattern is automatically modified zone by zone as the work being heat-treated is changed by using a memory storing a series of such patterns for different kinds of works.

Abstract: A method of and system for controlling the temperature of a continuous furnace through which steel bodies are transported at a constant speed, in which the temperature is controlled so as to keep the distance from the entry port of the furnace to a position in the furnace where the furnace temperature is substantially equal to the desired delivery temperature of a steel body to be heated at a predetermined value which is determined in accordance with the dwell time, shape and size of the steel body.