Abstract: A semiconductor device includes: an active fin disposed on a substrate; a gate structure overlapping the active fin; source/drain regions disposed on both sides of the gate structure and on the active fin; and contact structures respectively connected to the source/drain regions, wherein the gate structure includes: a pair of gate spacers spaced apart from each other to provide a trench; a first gate electrode disposed in the trench and extending along an upper surface and a lateral surface of the active fin; a second gate electrode disposed on the first gate electrode in the trench, wherein the first gate electrode is not disposed between the second gate electrode and the pair of gate spacers; and a gate insulating film disposed between the pair of gate spacers and interposed between the first gate electrode and the active fin.

Abstract: A semiconductor device includes: an active fin disposed on a substrate; a gate structure overlapping the active fin; source/drain regions disposed on both sides of the gate structure and on the active fin; and contact structures respectively connected to the source/drain regions, wherein the gate structure includes: a pair of gate spacers spaced apart from each other to provide a trench; a first gate electrode disposed in the trench and extending along an upper surface and a lateral surface of the active fin; a second gate electrode disposed on the first gate electrode in the trench, wherein the first gate electrode is not disposed between the second gate electrode and the pair of gate spacers; and a gate insulating film disposed between the pair of gate spacers and interposed between the first gate electrode and the active fin.

Abstract: A method of forming a fin field effect transistor (FinFET) includes etching a substrate to define a fin comprising a first material. The fin includes a first portion comprising first sidewalls tapered at a first angle and having a first height; and a second portion comprising second sidewalls tapered at a second angle different from the first angle and having a second height. A ratio of the second height to the first height ranges from about 0.2 to about 0.5. The method includes depositing an insulating material over the substrate, wherein the insulating material covers the fin. The method includes recessing the insulating material to expose at least the second portion of the fin. The method further includes forming a gate structure over the fin. The gate structure includes a gate dielectric over the fin and the recessed insulating material; and a conductive material over the gate dielectric.

Abstract: One example of an apparatus includes a conducting channel region. The conducting channel region includes a plurality of epitaxially grown, in situ doped conducting channels arranged in a spaced apart relation relative to each other. A source positioned at a first end of the conducting channel region, and a drain positioned at a second end of the conducting channel region. A gate surrounds all sides of the conducting channel region and fills in spaces between the plurality of epitaxially grown, in situ doped conducting channels.

Abstract: A method of manufacturing a semiconductor device including following steps is provided. A substrate is provided. An ion implantation process is performed on the substrate to form doped material layers at different depth positions of the substrate and to define at least one nanowire layer. The at least one nanowire layer and the doped material layers are alternately stacked. A patterning process is performed on the at least one nanowire layer and the doped material layers to form at least one nanowire and doped layers. The at least one nanowire and the doped layers are alternately stacked to form a stack structure. A dummy gate structure spanning over the stack structure is formed. Spacers located on sidewalls of the dummy gate structure is formed. The dummy gate structure is removed to expose the at least one nanowire and the doped layers. The exposed doped layers are removed to form openings.

Abstract: Methods, systems, and computer programs are presented for selective deposition of etch-stop layers for enhanced patterning during semiconductor manufacturing. One method includes an operation for adding a photo-resist material (M2) on top of a base material (M1) of a substrate, M2 defining a pattern for etching M1 in areas where M2 is not present above M1. The method further includes operations for conformally capping the substrate with an oxide material (M3) after adding M2, and for gap filling the substrate with filling material M4 after the conformally capping. Further, a stop-etch material (M5) is selectively grown on exposed surfaces of M3 and not on surfaces of M4 after the gap filling. Additionally, the method includes operations for removing M4 from the substrate after selectively growing M5, and for etching the substrate after removing M4 to transfer the pattern into M1. M5 adds etching protection to enable deeper etching into M1.

Abstract: A sub-word line driver circuit includes a substrate, a plurality of gate lines, at least one gate tab, and a variable-thickness gate dielectric. The substrate includes an isolation area and an active area. The gate lines are arranged in a first direction and extend in a second direction perpendicular to the first direction. The gate tab extends in the first direction to cover the isolation area, in which the gate lines and the gate tab form at least one gate region on the substrate. The variable-thickness gate dielectric includes a thick gate dielectric region disposed over a first portion of the active area, and a thin gate dielectric region disposed over a second portion of the active area.

Abstract: A device includes first and second fins defined in a semiconductor substrate and a raised isolation post structure positioned between the first and second fins, wherein an upper surface of the raised isolation post structure is at a level that is approximately equal to or greater than a level corresponding to an upper surface of each of the first and second fins. A first space is defined by a sidewall of the first fin and a first sidewall of the raised isolation post structure, a second space is defined by a sidewall of the second fin and a second sidewall of the raised isolation post structure, and a gate structure is positioned around a portion of each of the first and second fins and around a portion of the raised isolation post structure, wherein at least portions of the gate structure are positioned in the first and second spaces.

Abstract: A method includes probing at least one semiconductor fin using a four-point probe head, with four probe pins of the four-point probe head contacting the at least one semiconductor fin. A resistance of the at least one semiconductor fin is calculated. A carrier concentration of the semiconductor fin is calculated from the resistance.

Abstract: A nanowire transistor structure is fabricated by using auxiliary epitaxial nucleation source/drain fin structures. The fin structures include semiconductor layers integral with nanowires that extend between the fin structures. Gate structures are formed between the fin structures such that the nanowires extend through the gate conductors. Following spacer formation and nanowire chop, source/drain regions are grown epitaxially between the gate structures.

Abstract: Integrated circuits and methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes providing a semiconductor substrate and forming fins over the semiconductor substrate. Each fin is formed with sidewalls. The method further includes conformally depositing a metal film stack on the sidewalls of each fin. In the method, the metal film stack is annealed to form a metal silicide film over the sidewalls of each fin.

Abstract: A method includes probing at least one semiconductor fin using a four-point probe head, with four probe pins of the four-point probe head contacting the at least one semiconductor fin. A resistance of the at least one semiconductor fin is calculated. A carrier concentration of the semiconductor fin is calculated from the resistance.

Abstract: The present disclosure discloses a method of fabricating a semiconductor device. A first layer is formed over a substrate. A patterned second layer is then formed over the first layer. The patterned second layer includes an opening. A spacer material is then deposited in the opening, thereby reducing the opening in a plurality of directions. A direction-specific trimming process is performed to the spacer material and the second layer. Thereafter, the first layer is patterned with the second layer.

Abstract: To prevent contact plugs formed to sandwich an abutting portion between gate electrodes, from being short-circuited via a void formed inside an insulating film of the abutting portion. Over sidewalls SW facing each other in the abutting portion between gate electrodes G2 and G5, a liner insulating film 6 and an interlayer insulating film 7 are formed. Between the sidewalls SW, the liner insulating film 6 formed on each of the side walls of the sidewalls SW are brought in contact with each other to close a space between the sidewalls SW to prevent a void from being generated inside the interlayer insulating film 7 and the liner insulating film 6.

Abstract: A semiconductor device is provided that includes a fin having a first gate and a second gate formed on a first sidewall of the fin in a first trench, wherein the first gate is formed above the second gate. The device includes a third gate and a fourth gate formed on a second sidewall of the fin in a second trench, wherein the third gate is formed above the fourth gate. Methods of manufacturing and operating the device are also included. A method of operation may include biasing the first gate and the fourth gate to create a current path across the fin.

Abstract: A device includes a wafer substrate including an isolation feature, at least two fin structures embedded in the isolation feature, and at least two gate stacks disposed around the two fin structures respectively. A first inter-layer dielectric (ILD) layer is disposed between the two gate stacks, with a dish-shaped recess formed therebetween, such that a bottom surface of the recess is below the top surface of the adjacent two gate stacks. A second ILD layer is disposed over the first ILD layer, including in the dish-shaped recess. The second ILD includes nitride material; the first ILD includes oxide material.

Abstract: A FinFET structure which includes a bulk semiconductor substrate; semiconductor fins extending from the bulk semiconductor substrate, each of the semiconductor fins having a top portion and a bottom portion such that the bottom portion of the semiconductor fins is doped and the top portion of the semiconductor fins is undoped; a portion of the bulk semiconductor substrate directly underneath the plurality of semiconductor fins being doped to form an n+ or p+ well; and an oxide formed between the bottom portions of the fins. Also disclosed is a method for forming a FinFET device.

Abstract: In one example, the method disclosed herein includes forming a shared sacrificial gate structure above at least one first fin for a first type of FinFET device and at least one second fin for a second type of FinFET device, wherein the second type is opposite to the first type, and forming a first sidewall spacer around an entire perimeter of the sacrificial gate structure in a single process operation.

Abstract: According to various embodiments, a distributed heating transistor includes: a plurality of active regions where transistor action occurs including a heat source; and at least one inactive region where transistor action does not occur and no heat source is present, wherein adjacent active regions are separated by the at least one inactive region. The distributed heating transistor may be configured as field effect transistors (FETs), and bipolar junction transistors (BJTs). Methods for forming the distributed heating transistors are also provided.

Abstract: Non-planar semiconductor devices including at least one semiconductor nanowire having a tapered profile which widens from the source side of the device towards the drain side of the device are provided which have reduced gate to drain coupling and therefore reduced gate induced drain tunneling currents.

Abstract: One illustrative method disclosed herein includes, among other things, forming a plurality of fin-formation trenches that define a fin, forming a first stressed layer within the trenches and above the fin and performing at least one etching process on the first stressed layer so as to define spaced-apart portions of the first stressed layer positioned at least partially within the trenches on opposite sides of the fin. The method also includes forming spaced-apart portions of a second stressed layer above the spaced-apart portions of the first layer, forming a third stressed layer above the fin between the spaced-apart portions of the second layer and, after forming the third layer, forming a conductive layer above the second and third layers.

Abstract: A nanotubular MOSFET device and a method of fabricating the same are used to extend device scaling roadmap while maintaining good short channel effects and providing competitive drive current. The nanotubular MOSFET device includes a concentric tubular inner and outer gate separated from each other by a tubular shaped epitaxially grown silicon layer, and a source and drain respectively separated by spacers surrounding the tubular inner and outer gates.

Abstract: A semiconductor device includes a gate electrode buried in a semiconductor portion. The gate electrode includes a first gate portion on a first side of a longitudinal center axis of the gate electrode parallel to the main surface and a second gate portion on an opposite, second side of the longitudinal center axis. At least one first gate contact extends from a main side defined by a main surface into the first gate portion.

Abstract: According to one embodiment, a method includes forming a first SiGe layer having a first profile of a concentration of Ge on a semiconductor substrate, forming a second SiGe layer having a second profile of a concentration of Ge on the first SiGe layer, the second profile lower than a first peak of the first profile, forming a mask layer on the second SiGe layer, etching the first and second SiGe layers by anisotropic etching using the mask layer as a mask to form trenches, selectively removing the first SiGe layer exposed into the trenches to form a cavity under the second SiGe layer, and oxidizing side and lower surfaces of the second SiGe layer exposed in the trenches and the cavity to increase the concentration of Ge in the second SiGe layer.

Abstract: The present disclosure provides a TFET, which comprises: a substrate; a channel region formed in the substrate, and a source region and a drain region formed on two sides of the channel region; a gate stack formed on the channel region, wherein the gate stack comprises: a gate dielectric layer, and at least a first gate electrode and a second gate electrode distributed in a direction from the source region to the drain region and formed on the gate dielectric layer, and the first gate electrode and the second gate electrode have different work functions; and a first side wall and a second side wall formed on a side of the first gate electrode and on a side of the second gate electrode respectively.

Abstract: A method for manufacturing a semiconductor device having multi-channels is provided. The method includes etching an active region of a gate region and a device isolation layer of the gate to form a gate recess, forming a first gate buried in a lower portion of the gate recess, forming an active bridge on the first gate for connecting portions of the active region at both sides of the first gate, and forming a second gate on the first gate to cover the active bridge. Therefore, a multi-channel region can be formed.

Abstract: Embodiments of transistors comprise a gate stack overlying a semiconductor material. The gate stack comprises a deposited oxide layer overlying the semiconductor material, an oxygen-diffusion barrier layer overlying the deposited oxide layer, a high-k dielectric layer overlying the oxygen-diffusion barrier layer, and a conductive material (e.g., an oxygen-gettering conductive material) overlying the high-k dielectric layer. When the conductive material is an oxygen-gettering conductive material, the oxygen-diffusion barrier layer prevents diffusion of oxygen from the deposited oxide layer to the oxygen-gettering conductive material.

Abstract: One method disclosed herein includes forming a layer of silicon/germanium having a germanium concentration of at least 30% on a semiconducting substrate, forming a plurality of spaced-apart trenches that extend through the layer of silicon/germanium and at least partially into the semiconducting substrate, wherein the trenches define a fin structure for the device comprised of a portion of the substrate and a portion of the layer of silicon/germanium, the portion of the layer of silicon/germanium having a first cross-sectional configuration, forming a layer of insulating material in the trenches and above the fin structure, performing an anneal process on the device so as to cause the first cross-sectional configuration of the layer of silicon/germanium to change to a second cross-sectional configuration that is different from the first cross-sectional configuration, and forming a final gate structure around at least a portion of the layer of silicon/germanium having the second cross-sectional configuration.

Abstract: The present invention discloses a transistor having the saddle fin structure. The saddle fin transistor of the present invention has a structure in which a landing plug contact region, particularly, a landing plug contact region on an isolation layer is elevated such that the landing plug contact SAC (Self Aligned Contact) fail can be prevented.

Abstract: The present invention provides a method of forming a transistor. The method includes forming a first layer of a first semiconductor material above an insulation layer. The first semiconductor material is selected to provide high mobility to a first carrier type. The method also includes forming a second layer of a second semiconductor material above the first layer of semiconductor material. The second semiconductor material is selected to provide high mobility to a second carrier type opposite the first carrier type. The method further includes forming a first masking layer adjacent the second layer and etching the second layer through the first masking layer to form at least one feature in the second layer. Each feature in the second layer forms an inverted-T shape with a portion of the second layer.

Abstract: The present disclosure provides a tunneling device, which comprises: a substrate; a channel region formed in the substrate, and a source region and a drain region formed on two sides of the channel region; and a gate stack formed on the channel region and a first side wall and a second side wall formed on two sides of the gate stack, wherein the gate stack comprises: a first gate dielectric layer; at least a first gate electrode and a second gate electrode formed on the first gate dielectric layer; a second gate dielectric layer formed between the first gate electrode and the first side wall; and a third gate dielectric layer formed between the second gate electrode and the second side wall.

Abstract: Gate structures with different gate lengths and methods of manufacture are disclosed. The method includes forming a first gate structure with a first critical dimension, using a pattern of a mask. The method further includes forming a second gate structure with a second critical dimension, different than the first critical dimension of the first gate structure, using the pattern of the mask.

Abstract: A fin-type field effect transistor including at least one fin-type semiconductor structure, a gate strip and a gate insulating layer is provided. The fin-type semiconductor structure is doped with a first type dopant and has a block region with a first doping concentration and a channel region with a second doping concentration. The first doping concentration is larger than the second doping concentration. The blocking region has a height. The channel region is configured above the blocking region. The gate strip is substantially perpendicular to the fin-type semiconductor structure and covers above the channel region. The gate insulating layer is disposed between the gate strip and the fin-type semiconductor structure.

Abstract: A Multi-Gate Field-Effect Transistor includes a fin-shaped structure, a gate structure, at least an epitaxial structure and a gradient cap layer. The fin-shaped structure is located on a substrate. The gate structure is disposed across a part of the fin-shaped structure and the substrate. The epitaxial structure is located on the fin-shaped structure beside the gate structure. The gradient cap layer is located on each of the epitaxial structures. The gradient cap layer is a compound semiconductor, and the concentration of one of the ingredients of the compound semiconductor has a gradient distribution decreasing from bottom to top. Moreover, the present invention also provides a Multi-Gate Field-Effect Transistor process forming said Multi-Gate Field-Effect Transistor.

Abstract: A method for manufacturing a semiconductor device includes forming a source electrode and a drain electrode on a front face of a semiconductor substrate which is transparent to visible light, forming a front-side gate electrode between the source electrode and the drain electrode on the front face of the semiconductor substrate; forming an aligning mark on a region of the front face of the semiconductor substrate other than a region between the source electrode and the drain electrode, aligning the semiconductor substrate based on the aligning mark that is seen through the semiconductor substrate, and forming a back-side gate electrode on a back face of the semiconductor substrate in a location opposite the front-side gate electrode.

Abstract: A gate electrode is formed so as to embed an electrode material in a recess for an electrode, which has been formed in a structure of stacked compound semiconductors, through a gate insulation film, and also a field plate electrode that comes in Schottky contact with the structure of the stacked compound semiconductors is formed by embedding an electrode material in a recess for an electrode, which has been formed in the structure of the stacked compound semiconductors so that the field plate electrode directly comes in contact with the structure of the stacked compound semiconductors at least on the bottom face of the recess for the electrode.

Abstract: A method of fabricating a gate includes sequentially forming an insulation layer and a conductive layer on substantially an entire surface of a substrate. The substrate has a device isolation layer therein and a top surface of the device isolation layer is higher than a top surface of the substrate. The method includes planarizing a top surface of the conductive layer and forming a gate electrode by patterning the insulation layer and the conductive layer.

Abstract: A dual-gate transistor including: a first insulating layer provided to cover a first conductive layer; a first semiconductor layer over the first insulating layer; second semiconductor layers over the first semiconductor layer, the second semiconductor layers are spaced from each other to expose the first semiconductor layer; impurity semiconductor layers over the second semiconductor layers; second conductive layers over the impurity semiconductor layers; second insulating layers over the second conductive layers; a third insulating layer to cover the first semiconductor layer, the second semiconductor layers, the impurity semiconductor layers, the second conductive layers, and the second insulating layers; and a third conductive layer at least over the third insulating layer, and in the dual-gate transistor including the first to third insulating layers with openings, the first insulating layer is substantially equal in thickness to the second insulating layer.

Abstract: One method herein includes forming a plurality of spaced-apart trenches that extend at least partially into a semiconducting substrate, wherein the trenches define a fin structure comprised of first and second layers of semiconducting material, wherein the first layer of semiconducting material is selectively etchable relative to the substrate and the second layer of semiconducting material, forming a sacrificial gate structure above the fin, wherein the gate structure includes a gate insulation layer and a gate electrode, forming a sidewall spacer adjacent the gate structure, performing an etching process to remove the sacrificial gate structure, thereby defining a gate cavity, performing at least one selective etching process to selectively remove the first layer of semiconducting material relative to the second layer of semiconducting material within the gate cavity, thereby defining a space between the second semiconducting material and the substrate, and forming a final gate structure in the gate cavity.

Abstract: A first conductive layer and an underlying charge storage layer are patterned to form a control gate in an NVM region. A first dielectric layer and barrier layer are formed over the control gate. A sacrificial layer is formed over the barrier layer and planarized. A first patterned masking layer is formed over the sacrificial layer and control gate in the NVM region which defines a select gate location laterally adjacent the control gate in the NVM region. A second masking layer is formed in the logic region which defines a logic gate location. Exposed portions of the sacrificial layer are removed such that a first portion remains at the select gate location. A second dielectric layer is formed over the first portion and planarized to expose the first portion. The first portion is removed to result in an opening at the select gate location which exposes the barrier layer.

Abstract: Disclosed are a semiconductor device including a stepped gate electrode and a method of fabricating the semiconductor device. The semiconductor device according to an exemplary embodiment of the present disclosure includes: a semiconductor substrate having a structure including a plurality of epitaxial layers and including an under-cut region formed in a part of a Schottky layer in an upper most part thereof; a cap layer, a first nitride layer and a second nitride layer sequentially formed on the semiconductor substrate to form a stepped gate insulating layer pattern; and a stepped gate electrode formed by depositing a heat-resistant metal through the gate insulating layer pattern, wherein the under-cut region includes an air-cavity formed between the gate electrode and the Schottky layer.

Abstract: An integrated circuit device includes a gate region extending above a semiconductor substrate and extending in a first longitudinal direction. A first fin has a first sidewall that extends in a second longitudinal direction above the semiconductor substrate such that the first fin intersects the gate region. A second fin has a second sidewall extending in the second direction above the semiconductor substrate such that the second fin intersects the gate region. A shallow trench isolation (STI) region is formed in the semiconductor substrate between the first and second sidewalls of the first and second fins. A conductive layer disposed over the first insulating layer and over top surfaces of the first and second fins. A first insulating layer is disposed between an upper surface of the STI region and a lower surface of the conductive layer to separate the STI region from the conductive layer.

Abstract: Provided are a transistor of a semiconductor device and a method of fabricating the same.

Abstract: A finFET is formed having a fin with a source region, a drain region, and a channel region between the source and drain regions. The fin is etched on a semiconductor wafer. A gate stack is formed having an insulating layer in direct contact with the channel region and a conductive gate material in direct contact with the insulating layer. The source and drain regions are etched leaving the channel region of the fin. Epitaxial semiconductor is grown on the sides of the channel region that were adjacent the source and drain regions to form a source epitaxy region and a drain epitaxy region. The source and drain epitaxy regions are doped in-situ while growing the epitaxial semiconductor.

Abstract: The present disclosure provides a semiconductor device which includes a semiconductor substrate, a first gate structure disposed over the substrate, the first gate structure including a first gate electrode of a first conductivity type, a second gate structure disposed over the substrate and proximate the first gate structure, the second gate structure including a second gate electrode of a second conductivity type different from the first conductivity type, a first doped region of the first conductivity type disposed in the substrate, the first doped region including a first lightly doped region aligned with a side of the first gate structure, and a second doped region of the second conductivity type disposed in the substrate, the second doped region including a second lightly doped region aligned with a side of the second gate structure.

Abstract: A multi-gate semiconductor device and method for forming the same. A multi-gate semiconductor device is formed including a first fin of a first transistor formed on a semiconductor substrate having a first dopant type. The first transistor has a doped channel region of the first dopant type. The device also includes a second fin of a second transistor formed on the first dopant type semiconductor substrate. The second transistor has a doped channel region of a second dopant type. The device further includes a gate electrode layer of the second dopant type formed over the channel region of the first fin and a gate electrode layer of the first dopant type formed over the channel region of the second fin.

Abstract: The gate electrode of a metal oxide semiconductor field effect transistor (MOSFET) comprises a source side gate electrode and a drain side gate electrode that abut each other near the middle of the channel. In one embodiment, the source side gate electrode comprises a silicon oxide based gate dielectric and the drain side gate electrode comprises a high-k gate dielectric. The source side gate electrode provides high carrier mobility, while the drain side gate electrode provides good short channel effect and reduced gate leakage. In another embodiment, the source gate electrode and drain gate electrode comprises different high-k gate dielectric stacks and different gate conductor materials, wherein the source side gate electrode has a first work function a quarter band gap away from a band gap edge and the drain side gate electrode has a second work function near the band gap edge.

Abstract: A method for manufacturing a MOS transistor is provided. A substrate has a high-k dielectric layer and a barrier in each of a first opening and a second opening formed by removing a dummy gate and located in a first transistor region and a second transistor region. A dielectric barrier layer is formed on the substrate and filled into the first opening and the second opening to cover the barrier layers. A portion of the dielectric barrier in the first transistor region is removed. A first work function metal layer is formed. The first work function metal layer and a portion of the dielectric barrier layer in the second transistor region are removed. A second work function metal layer is formed. The method can avoid a loss of the high-k dielectric layer to maintain the reliability of a gate structure, thereby improving the performance of the MOS transistor.

Abstract: Semiconductor devices and related fabrication methods are provided. An exemplary fabrication method involves forming a pair of gate structures having a dielectric region disposed between a first gate structure of the pair and a second gate structure of the pair, and forming a voided region in the dielectric region between the first gate structure and the second gate structure. The first and second gate structures each include a first gate electrode material, wherein the method continues by removing the first gate electrode material to provide second and third voided regions corresponding to the gate structures and forming a second gate electrode material in the first voided region, the second voided region, and the third voided region.

Abstract: Fabricating a semiconductor device includes: forming a gate trench in an epitaxial layer overlaying a semiconductor substrate; depositing gate material in the gate trench; forming a body in the epitaxial layer, having a body top surface and a body bottom surface; forming a source; forming an active region contact trench that extends through the source and the body into the drain, wherein bottom surface of the active region contact trench is formed to include at least a portion that is shallower than the body bottom surface; and disposing a contact electrode within the active region contact trench.