Abstract: A light-emitting device display comprising a first light-emitting device and a second light emitting device is provided. The first light-emitting device and the second light-emitting device have a first forward voltage and a second forward voltage respectively, and the second forward voltage is higher than the first forward voltage. A first scan voltage and a second scan voltage is respectively provided to the first light-emitting device and the second light-emitting device. The first scan voltage is switched between a first scan-on voltage and a first scan-off voltage. The second scan voltage is switched between a second scan-on voltage and a second scan-off voltage. An absolute value of a difference between the second scan-on voltage and the second scan-off voltage is greater than an absolute value of a difference between the first scan-on voltage and the first scan-off voltage.

Abstract: A transistor array panel includes a transistor which includes a gate electrode, a semiconductor layer on the gate electrode, and a source electrode and a drain electrode on the semiconductor layer. The semiconductor layer includes a first portion overlapping the source electrode, a second portion overlapping the drain electrode, and a third portion between the first portion and the second portion. The first portion, the second portion, and the third portion have different minimum thicknesses.

Abstract: An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels or display pixels in a liquid crystal display. In an organic light-emitting diode display, hybrid thin-film transistor structures may be formed that include semiconducting oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. The capacitor structures may overlap the semiconducting oxide thin-film transistors. Organic light-emitting diode display pixels may have combinations of oxide and silicon transistors. In a liquid crystal display, display driver circuitry may include silicon thin-film transistor circuitry and display pixels may be based on oxide thin-film transistors. A single layer or two different layers of gate metal may be used in forming silicon transistor gates and oxide transistor gates. A silicon transistor may have a gate that overlaps a floating gate structure.

Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.

Abstract: A carbon allotrope and a display device including the same are disclosed. The thin-film transistor array substrate, comprising a substrate, a gate electrode on the substrate, an active layer comprising a first active layer, which opposes the gate electrode and is adjacent to the gate electrode thereby comprising a semiconductor material and a plurality of carbon allotropes, and a second active layer, which is in contact with the first active layer and comprises a semiconductor material, a gate insulating film between the gate electrode and the active layer, and a source electrode and a drain electrode respectively in contact with the active layer.

Abstract: A manufacturing method of a TFT substrate uses a top gate structure and the entire process can be completely done with seven masks. The number of masks used is reduced. The manufacturing process of a TFT substrate is simplified. Product yield can be increased to effectively improve productivity. Heavy and light ion doping can be simultaneously achieved with one single doping operation so that manufacturing cost can be reduced. By subjecting two ends of a semiconductor pattern to heavy ion doping to form a source electrode and a drain electrode, the manufacturing steps can be reduced and the source electrode and the drain electrode so formed do not need to extend through a via hole formed in an interlayer dielectric layer to contact the two ends of the active layer thereby effectively reducing contact resistance and improving product yield. Also provided is a TFT substrate manufactured with the method.

Abstract: A light-emitting device includes a substrate and a first light-emitting unit. The first light-emitting unit is disposed on the substrate, and includes a first semiconductor layer, a first light-emitting layer, and a second semiconductor layer. The first semiconductor layer is disposed on the substrate. The first light-emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The second semiconductor layer is disposed on the first light-emitting layer. The first semiconductor layer has a first sidewall and a second sidewall. A first angle is between the substrate and the first sidewall. A second angle is between the substrate and the second sidewall. The first angle is smaller than the second angle.

Abstract: Embodiments of the present invention relate to a thin-film transistor (TFT) and a manufacturing method thereof, an array substrate and a manufacturing method thereof, and a display device. The TFT includes an active layer, an amorphous silicon (a-Si) connecting layer and a source-drain electrode layer. The active layer includes a channel region, a source region and a drain region; forming materials of the channel region include polycrystalline silicon (poly-Si); the a-Si connecting layer is disposed on a side of the active layer and includes a first connecting part and a second connecting part which are spaced from each other; the source-drain electrode layer includes a source electrode and a drain electrode which are spaced to each other; the source electrode is electrically connected with the source region through the first connecting part; and the drain electrode is electrically connected with the drain electrode through the second connecting part.

Abstract: An evaporation mask is disclosed. The evaporation mask includes a mask frame, a set of first mask strips arranged on the mask frame along a first direction, and a set of second mask strips arranged on the set of first mask strips along a second direction different from the first direction. Each of the second mask strips has sections overlapping the first mask strips. The sections are embedded in respective ones of the first mask strips. Also disclosed is a method of patterning a substrate using the evaporation mask, as well as an organic light-emitting diode display substrate manufactured using the method.

Abstract: A layered structure suitable as a support for an organic light emitting device (OLED), includes a light-transmissive glass substrate, a diffusive internal extraction layer (IEL) with an outer layer made of a glass containing at least 30 weight % of Bi2O3, formed on one side of the light-transmissive glass substrate, and an acid-resistant barrier layer formed on the IEL. The acid-resistant barrier layer has a bilayer structure made of an ALD-deposited metal oxide layer, the metal oxide being selected from the group consisting of aluminum oxide (Al2O3), titanium oxide (TiO2), zirconium oxide (ZrO2) and hafnium oxide (HfO2), in contact with the IEL, and a sputter-deposited SiOxNy layer in contact with the ALD-deposited metal oxide layer.

Abstract: A thin film transistor array panel device comprises: a base substrate; a barrier layer disposed over the base substrate and comprising a plurality of transparent material layers; and an array of thin film transistors disposed over the barrier layer. A difference between a refractive index of the barrier layer and a refractive index of the base substrate may be within about 6%. The transparent material layers may be arranged such that the transparent material layers having compressive residual stress and the transparent material layers having tensile residual stress are alternately stacked. Each of the transparent material layers may comprise silicon oxynitride (SiON).

Abstract: An organic light emitting display device includes a pixel electrode, an auxiliary electrode, a pixel defining layer, a spacer, a light emitting layer, and an opposite electrode. The pixel electrode and auxiliary electrode on a same layer and are separated and electrically isolated from each other. The pixel defining layer is on the pixel and auxiliary electrodes and exposes at least portions of the pixel and auxiliary electrodes. The spacer corresponds to portions of the auxiliary electrode and pixel defining layer and exposes at least a portion of the auxiliary electrode. The light emitting layer is on the pixel electrode. The opposite electrode is on the light emitting layer and the spacer and is in contact with the auxiliary electrode.

Abstract: The invention relates in at least one embodiment to the production of optoelectronic semiconductor components and comprises the steps: A) providing an intermediate carrier (2) having a plurality of fixing points (23), B) providing optoelectronic semiconductor chips (3) each having a chip upper side (30) and a mounting side (32) located opposite thereto, wherein electric contact points (34) of the semiconductor chips (3) are each located on the mounting sides (32), C) attaching connecting means (4), D) fixing the contact points (34) to the fixing points (23) by means of the connecting means (4), E) producing a potting layer (5), such that the semiconductor chips (3) and the contact points (34) and the connecting means (4) are directly surrounded all round by the potting layer (5), F) detaching the semiconductor chips (3), such that the connecting means (4) are removed from the semiconductor chips (3) and recesses (44) are each provided at the contact points (34) as a negative form in relation to the connecting

Abstract: The invention discloses a temperature regulation mask and an alignment layer pre-curing device, and is related to the field of manufacturing a liquid crystal display panel. Said temperature regulation mask is suitable for the alignment layer pre-curing device for pre-curing an alignment layer, and includes a base and a pattern arranged on the base. A pattern region of said temperature regulation mask has a different thermal conductivity from a thermal conductivity of a non-pattern region of said temperature regulation mask. A position of the one having a lower thermal conductivity among the pattern region and the non-pattern region of said temperature regulation mask corresponds to a position of said alignment layer corresponding to a metallic wiring region. The present invention can obtain an alignment layer with even thickness and improve a display quality.

Abstract: A novel display device or the like in which a transistor connected to a scan line has small gate capacitance is provided. A novel display device or the like in which a scan line has low resistance is provided. A novel display device or the like in which pixels can be arranged with high density is provided. A novel display device or the like that can be manufactured without an increase in cost is provided. In a transistor including a first gate electrode and a second gate electrode, the first gate electrode is formed using a metal material with low resistance and the second gate electrode is formed using a metal oxide material that can reduce oxygen vacancies in an oxide semiconductor layer. The first gate electrode is connected to the scan line, and the second gate electrode is connected to a wiring to which a constant potential is supplied.

Abstract: Processes for preparing color stable red-emitting phosphors include contacting a complex fluoride phosphor of formula I with a first fluorine-containing oxidizing agent in gaseous form at a first temperature ranging from 200° C. to 700° C. to form a first product phosphor, contacting the first product phosphor in particulate form with a solution of a compound of formula II in aqueous hydrofluoric acid to form a treated phosphor, and contacting the treated phosphor with a second fluorine-containing oxidizing agent in gaseous form at a second temperature <225° C., AxMFy:MN4+??I AxMFy??II wherein A is independently at each occurrence Li, Na, K, Rb, Cs or a combination thereof, M is independently at each occurrence Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or a combination thereof, x is absolute value of the charge of the MFy ion; and y is 5, 6 or 7.

Abstract: By controlling the luminance of light emitting element not by means of a voltage to be impressed to the TFT but by means of controlling a current that flows to the TFT in a signal line drive circuit, the current that flows to the light emitting element is held to a desired value without depending on the characteristics of the TFT. Further, a voltage of inverted bias is impressed to the light emitting element every predetermined period. Since a multiplier effect is given by the two configurations described above, it is possible to prevent the luminance from deteriorating due to a deterioration of the organic luminescent layer, and further, it is possible to maintain the current that flows to the light emitting element to a desired value without depending on the characteristics of the TFT.

Abstract: A thin film transistor comprises a substrate, a gate electrode formed on the substrate, an electrically insulating layer covering the gate electrode, a channel layer made of a semiconductor material and formed on the electrically insulating layer, a source electrode formed on a first lateral side of the electrically insulating layer, and a drain electrode formed on an opposite second lateral side of the electrically insulating layer. The source electrode has an inner end covering a first outer end of the channel layer and electrically connecting therewith. The drain electrode has an inner end covering an opposite second outer end of the channel layer and electrically connecting therewith. An area of the channel layer adjacent to and not covered by one of the source electrode and the drain electrode has an electrical conductivity lower than the electrical conductivity of other area of the channel layer.

Abstract: A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure includes a processed semiconductor substrate. The processed semiconductor substrate includes active electronic components. The semiconductor structure also includes a dielectric layer that covers, at least partially, the processed semiconductor substrate. An interface layer that is suitable for growing optically active material on the interface layer is bonded to the dielectric layer. An optical gain layer and the processed semiconductor substrate are connected through the dielectric layer by electric and/or optical contacts.

Abstract: The invention describes an OLED device (1) comprising an organic layer (3) which emits light (L1) in operation and which is positioned between an essentially transparent anode layer (5) and an essentially opaque cathode layer (7). The cathode layer (7) is deliberately structured along a main extension plane (EP) of the OLED device to comprise at least one cathode region (11, 11a, 11b) in which the cathode layer (7) is 10 present and a plurality of cathode-free regions (13, 13a, 13b) and/or at least one cathode-free region (13, 13a, 13b) of a larger extension, through which cathode-free regions and/or region (13, 13a, 13b) visible light (L2) can pass in the direction of a cross extension (CE) of the OLED device. The invention also describes a production method of such OLED device (1).

Abstract: The present specification relates to an organic light emitting device.

Abstract: An organic layer depositing apparatus includes a deposition unit which includes one or more deposition assemblies spaced a predetermined distance apart from a substrate to deposit a deposition material on the substrate, wherein the one or more deposition assemblies include: a deposition source; a deposition source nozzle unit; a first pattern sheet which includes a first patterning unit and a first overlap unit; and a second pattern sheet which includes a second patterning unit and a second overlap unit, wherein the first and second pattern sheets are arranged such that the first and second overlap units overlap each other.

Abstract: An embodiment of present disclosure provides a method for manufacturing an array substrate, an array substrate manufactured by the method, and a mask. The method for manufacturing the array substrate includes: providing a mask including a transparent substrate, a light semi-transmission region, a light non-transmission region, and a light transmission region excluding the light semi-transmission region and the light non-transmission region being formed on the transparent substrate; forming a first mask pattern on a base substrate by means of the light non-transmission region of the mask; and forming a second mask pattern on the base substrate having the first mask pattern by means of the light semi-transmission region and the light non-transmission region of the mask.

Abstract: To suppress change in electric characteristics and improve reliability of a semiconductor device including a transistor formed using an oxide semiconductor. A semiconductor device includes a transistor including a gate electrode, a first insulating film, an oxide semiconductor film, a second insulating film, and a pair of electrodes. The gate electrode and the oxide semiconductor film overlap with each other. The oxide semiconductor film is located between the first insulating film and the second insulating film and in contact with the pair of electrodes. The first insulating film is located between the gate electrode and the oxide semiconductor film. An etching rate of a region of at least one of the first insulating film and the second insulating film is higher than 8 nm/min when etching is performed using a hydrofluoric acid.

Abstract: Processes for preparing color stable Mn4+ doped phosphors include contacting a phosphor of formula I with a fluorine-containing oxidizing agent in gaseous form at temperature ?225° C. to form the color stable Mn4+ doped phosphor A x ? MF y ? : ? Mn 4 + I wherein A is independently at each occurrence Li, Na, K, Rb, Cs, or a combination thereof; M is independently at each occurrence Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or a combination thereof; x is the absolute value of the charge of the MFy ion; and y is 5, 6 or 7. In another aspect, the processes include contacting a phosphor of formula I at an elevated temperature with an oxidizing agent comprising a C1-C4 fluorocarbon, to form the color stable Mn4+ doped phosphor.

Abstract: Techniques and mechanisms for providing efficient direction of light to a photodetector with a tapered waveguide structure. In an embodiment, a taper structure of a semiconductor device comprises a substantially single crystalline silicon. A buried oxide underlies and adjoins the monocrystalline silicon of the taper structure, and a polycrystalline Si is disposed under the buried oxide. During operation of the semiconductor device light is redirected in the taper structure and received via a first side of a Germanium photodetector. In another embodiment, one or more mirror structures positioned on a far side of the Germanium photodetector may provide for a portion of the light to be reflected back to the Germanium photodetector.

Abstract: The present disclosure provides a method for producing a thin film transistor. The method includes the steps of: forming a protective layer on an active layer of the thin film transistor and patterning the protective layer along with the active layer when the active layer is deposited; depositing a source and drain electrode layer and patterning it by a dry etching to form a source electrode and a drain electrode; and etching or passivating the protective layer located in a back channel region of the source electrode and the drain electrode. In addition, the present disclosure also discloses a thin film transistor produced by the above method, and an array substrate.

Abstract: An organic light emitting diode display panel is provided. The organic light emitting diode display panel comprises a glass substrate, a conductive layer, an anode, a hole inject layer, a hole transport layer, an organic light-emitting layer, an electron inject layer and a cathode. The present invention further provides an organic light emitting diode display device. The organic light emitting diode display panel and the organic light emitting diode display device can effectively reduce a horizontal resistance of the organic light emitting diode display panel through setting the conductive layer, thereby improving the luminous uniformity of the organic light emitting diode display panel.

Abstract: A deposition apparatus for manufacturing a display device is disclosed. In one aspect, the apparatus includes a substrate fixing portion configured to fix a deposition substrate to a lower portion thereof and a first mask transfer portion placed on one side of the substrate fixing portion and configured to move the deposition mask upwardly such that the deposition mask is formed spaced apart from the deposition substrate by a predetermined distance. The apparatus also includes a substrate transfer portion configured to move the deposition substrate such that the deposition substrate passes over the deposition mask. The apparatus further includes a mask spacing portion positioned on the substrate fixing portion and configured to maintain a substantially uniform distance between the deposition substrate and the deposition mask when the deposition substrate is moved and a deposition source configured to deposit a deposition material on the deposition substrate through the deposition mask.

Abstract: A pixel array includes a plurality of scan lines, a plurality of data lines, a first active device, a second active device, a first pixel electrode and a second pixel electrode. The first active device and the second active device are electrically connected to the corresponding scan line and data line respectively. The first pixel electrode is electrically connected to the first active device through a contact hole. The second pixel electrode is electrically connected to the second active device through the contact hole.

Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes the following operations: (i) forming a transistor having a source, a drain and a gate on a semiconductor substrate; (ii) forming a conductive contact located on and in contact with at least one of the source and the drain; and (iii) forming a capacitor having a first electrode and a second electrode on the semiconductor substrate, in which at least one of the first and second electrodes is formed using front-end-of line (FEOL) processes or middle-end-of line (MEOL) processes.

Abstract: A device for delivery of material or stimulus to targets within a body to produce a desired response, the targets being at least one of cells of interest, cell organelles of interest and cell nuclei of interest. The device includes a number of projections for penetrating a body surface, with the number of projections being selected to produce a desired response, and the number being at least 500. A spacing between projections is also at least partially determined based on an arrangement of the targets within the body.

Abstract: A light-emitting device is disclosed. The light-emitting device comprises a supportive substrate; a first light-emitting element and a second light-emitting element on the supportive substrate, wherein the first light-emitting element comprises a transparent layer on the supportive substrate, a first light-emitting stacked layer on the transparent layer, and a plurality of contact parts between the transparent layer and the first light-emitting stacked layer; and the second light-emitting element comprises an electrode and a second light-emitting stacked layer between the electrode and the supportive substrate; and a metal line on the supportive substrate and electrically connecting the electrode and one of the contact parts.

Abstract: A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first carrier; dicing the semiconductor workpiece and the carrier so as to form at least one individual semiconductor chip; mounting the at least one semiconductor chip with a side facing away from the carrier, to an additional carrier.

Abstract: Provided are a reliable high performance thin film transistor and a reliable high performance display device. The display device has: a gate electrode which is formed on a substrate; a gate insulating film which is formed to cover the substrate and the gate electrode; an oxide semiconductor layer which is formed on the gate electrode through the gate insulating film; a channel protective layer which is in contact with the oxide semiconductor layer and formed on the oxide semiconductor layer; and source/drain electrodes which are electrically connected to the oxide semiconductor layer and formed to cover the oxide semiconductor layer. A metal oxide layer is formed on an upper part of the channel protective layer. The source/drain electrodes are formed to be divided apart on the channel protective layer and the metal oxide layer.

Abstract: A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first carrier; dicing the semiconductor workpiece and the carrier so as to form at least one individual semiconductor chip; mounting the at least one semiconductor chip with a side facing away from the carrier, to an additional carrier.

Abstract: An organic layer deposition apparatus, a method of manufacturing an organic light-emitting display apparatus by using the same, and an organic light-emitting display apparatus manufactured using the method. The organic layer deposition apparatus includes a conveyer unit including first and second conveyer units, loading and unloading units, and a deposition unit. A transfer unit moves between the first and second conveyer units, and the substrate attached to the transfer unit is spaced from a plurality of organic layer deposition assemblies of the deposition unit while being transferred by the first conveyer unit. The organic layer deposition assemblies include common layer deposition assemblies and pattern layer deposition assemblies.

Abstract: A display device using a semiconductor light emitting device and a method of fabricating the semiconductor light emitting device are disclosed. The display device includes a substrate, a plurality of first electrodes disposed on the substrate, an anisotropic conductive film disposed on the substrate provided with the first electrodes, a plurality of semiconductor light emitting devices disposed on the anisotropic conductive film layer, electrically connected to the first electrodes, and constituting individual pixels, and a plurality of second electrodes disposed between the semiconductor light emitting devices and electrically connected to the semiconductor light emitting devices. Thus, alignment of the semiconductor light emitting device array may be simplified by use of an anisotropic conductive film Due to excellent brightness, the semiconductor light emitting devices, which are small in size, may form individual sub-pixels.

Abstract: A thin film transistor (TFT) array substrate includes a substrate, a gate electrode, a gate line, a first data line, and a second data line on the substrate, a gate insulating layer that covers the gate electrode and the gate line and includes a first opening that exposes a portion of the first data line and a second opening that exposes a portion of the second data line, an active layer disposed on the gate insulating layer so that at least one portion of the active layer overlaps the gate electrode, a drain electrode and a source electrode that extend from opposite sides of the active layer, a pixel electrode that extends from the drain electrode, and a connection wiring that extends from the source electrode, and connects the first data line to the second data line through the first and second openings of the gate insulating layer.

Abstract: A method of manufacturing an organic light-emitting display device is provided. A plurality of anodes and an auxiliary electrode are formed on a substrate. The auxiliary electrode is separated from the plurality of the anodes. An organic layer is formed on the plurality of the anodes and the auxiliary electrode. An opening is formed in the organic layer by applying a voltage to the auxiliary electrode. The opening exposes the auxiliary electrode. A cathode is formed on the organic layer and the exposed auxiliary electrode. The cathode is electrically connected to the exposed auxiliary electrode.

Abstract: An optoelectric device including microwires or nanowires on a support, each microwire or nanowire including at least one portion mainly containing a III-V compound in contact with the support, wherein the III-V compound is based on a first group-V element and on a second group-III element, wherein a surface of the support includes first areas of a first material promoting the growth of the III-V compound according to the polarity of the first element distributed in a second area of a second material promoting the growth of the compound according to the polarity of the second element, the microwires or nanowires being located on the first areas.

Abstract: A vapor deposition device includes a vapor deposition source (60) having a plurality of vapor deposition source openings (61) that discharge vapor deposition particles (91), a limiting unit (80) having a plurality of limiting openings (82), and a vapor deposition mask (70) in which a plurality of mask openings (71) are formed only in a plurality of vapor deposition regions (72) where the vapor deposition particles that have passed through a plurality of limiting openings reach. The plurality of vapor deposition regions are arranged along a second direction that is orthogonal to the normal line direction of the substrate (10) and the movement direction of the substrate, with non-vapor deposition regions (73) where the vapor deposition particles do not reach being sandwiched therebetween.

Abstract: The present invention provides a light emitting diode, which comprises a first LED die, a second LED die, and a dummy LED die, wherein the second LED die is disposed between the first LED die and the dummy LED die, and each die comprises a first semi-conductive layer, a second semi-conductive layer, and a multiple quantum well layer disposed between the first and the second semi-conductive layers. The first semi-conductive layer of the first LED die is coupled to the second semi-conductive layer of the second LED die, and the first semi-conductive layer of the second LED die is coupled to the first and second semi-conductive layers of the dummy LED die.

Abstract: The present invention provides a light emitting diode, which comprises a first LED die and a second LED die, each die comprising a first semi-conductive layer, a second semi-conductive layer, and a multiple quantum well layer disposed between the first and the second semi-conductive layers, wherein the first semi-conductive layer of the first LED die is coupled to the second semi-conductive layer of the second LED die so as to form a serially connected structure whereby the consuming current and heat generation of the light emitting diode are lowered so that the size of heat dissipating device for the light emitting diode can be reduced and illumination of the light emitting diode can be enhanced.

Abstract: Embodiment of the present invention disclose an array substrate and a manufacturing method thereof, and the manufacturing method of an array substrate comprises the following steps: Step S1: a gate electrode metal layer, an insulating layer and an active layer are deposited successively on a substrate, and gate electrodes, gate lines and an active layer pattern are formed through a first mask process; Step S2: a protective layer is deposited on the substrate after completion of the step S1, and via-holes are formed in the protective layer through a second mask process; and Step S3: a pixel electrode layer and a source/drain electrode metal layer are deposited sequentially on the substrate after completion of the step S2, and source/drain electrodes, pixel electrodes and data lines are formed through a third mask process.

Abstract: A deposition mask for forming an organic layer pattern of an organic light emitting diode (OLED) display includes a base member having a first surface facing a substrate of the OLED display, and a second surface facing a side opposite to the first surface, and including a plurality of openings passing through the first surface and the second surface for forming the organic layer pattern. The opening has a pair of first side walls and a pair of second side walls. Each side wall of the openings has an inclination surface inclined with respect to a thickness direction of the base member, and when measuring an inclination angle of the inclination surface with reference to the first surface of the base member, the inclination angle of the first side wall and the inclination angle of the second side wall are different from each other.

Abstract: In a light-emitting element 1, a light-emitting layer 4, a second conductivity type semiconductor layer 5, a transparent electrode layer 6, a reflecting electrode layer 7 and an insulating layer 8 are stacked in this order on a first conductivity type semiconductor layer 3, while a first electrode layer 10 and a second electrode layer 12 are stacked on the insulating layer 8 in an isolated state.

Abstract: A LED structure includes a support and a plurality of nanowires located on the support, where each nanowire includes a tip and a sidewall. A method of making the LED structure includes reducing or eliminating the conductivity of the tips of the nanowires compared to the conductivity of the sidewalls during or after creation of the nanowires.

Abstract: A display device using a semiconductor light emitting device and a method of fabricating the semiconductor light emitting device are disclosed. The display device includes a substrate, a plurality of first electrodes disposed on the substrate, an anisotropic conductive film disposed on the substrate provided with the first electrodes, a plurality of semiconductor light emitting devices disposed on the anisotropic conductive film layer, electrically connected to the first electrodes, and constituting individual pixels, and a plurality of second electrodes disposed between the semiconductor light emitting devices and electrically connected to the semiconductor light emitting devices. Thus, alignment of the semiconductor light emitting device array may be simplified by use of an anisotropic conductive film Due to excellent brightness, the semiconductor light emitting devices, which are small in size, may form individual sub-pixels.