Abstract: A method for forming semiconductor devices using damascene techniques provides self-aligned conductive lines that have an end-to-end spacing less than 60 nm without shorting. The method includes using at least one sacrificial hardmask layer to produce a mandrel and forming a void in the mandrel. The sacrificial hardmask layers are formed over a base material which is advantageously an insulating material. Another hardmask layer is also disposed over the base material and under the mandrel in some embodiments. Spacer material is formed alongside the mandrel and filling the void. The spacer material serves as a mask and at least one etching procedure is carried out to translate the pattern of the spacer material into the base material. The patterned base material includes trenches and raised portions. Conductive features are formed in the trenches using damascene techniques.

Abstract: A method for fabricating an image sensor includes at least one of: (1) Forming a gate on a semiconductor substrate; (2) Forming spacers on both side walls of the gate and forming a dummy pattern on an upper portion of the semiconductor substrate; and (3) Forming a metal pad for an electrical connection on an upper portion of the dummy pattern. The method may include at least one of: (1) Forming an interlayer dielectric layer covering the entire semiconductor substrate, (2) Etching portions of the interlayer dielectric layer and the semiconductor substrate to form a super-contact hole; and (3) forming an insulation film on the entire surface of the interlayer dielectric layer. The method may include forming normal contact holes such that a portion of an upper portion of the gate and a partial region of the metal pad for an electrical connection are exposed and filling up the normal contact holes with a conductive material to form normal contacts.

Abstract: A semiconductor manufacturing method includes: forming a seed film including a first metal over a bottom surface and a side wall of an opening portion formed over interlayer insulating films and a field portion located over the interlayer insulating film except the opening portion, forming a resist over the seed film and filling the opening portion with the resist, removing part of the resist, exposing the seed film formed over the upper portion of the side walls of the opening portion and the field portion, forming a cover film including a second metal, whose resistivity is higher than that of the first metal, over the seed film located over the upper portion of the side wall of the opening portion and the field portion, exposing the seed film by removing the resist, and forming a plating film including the first metal over the exposed seed film.

Abstract: A copper interconnect includes a copper layer formed in a dielectric layer, having a first portion and a second portion. A first barrier layer is formed between the first portion of the copper layer and the dielectric layer. A second barrier layer is formed at the boundary between the second portion of the copper layer and the dielectric layer. The first barrier layer is a dielectric layer, and the second barrier layer is a metal oxide layer.

Abstract: Ultra-low capacitance interconnect structures, preferably Through Silicon Via (TSV) interconnects and methods for fabricating said interconnects are disclosed. The fabrication method comprises the steps of providing a substrate having a first main surface, producing at least one hollow trench-like structure therein from the first main surface, said trench-like structure surrounding an inner pillar structure of substrate material, depositing a dielectric liner which pinches off said hollow trench-like structure at the first main surface such that an airgap is created in the center of hollow trench-like structure and further creating a TSV hole and filling it at least partly with conductive material.

Abstract: An apparatus involves a semiconductor wafer that has been back-end processed, the semiconductor wafer including a substrate, electronic devices and multiple metalization layers, a via extending from an outer surface of the substrate through the substrate to a metalization layer from among the multiple metalization layers, and an electrically conductive material within the via, the electrically conductive material forming an electrically conductive path from the metalization layer to the outer surface. A method of processing a semiconductor wafer that has been front-end and back-end processed involves forming a via in the semiconductor wafer extending from a surface of the wafer, into and through semiconductor material, to a metalization layer formed during the back-end processing by etching the semiconductor wafer; and making the via electrically conductive so as to form an electrical path within the via extending from the surface of the wafer to the metalization layer.

Abstract: A method includes forming a connection between a first metal layer and a second metal layer. The second metal layer is over the first metal layer. A via location for a first via between the first metal layer and the second metal layer is identified. Additional locations for first additional vias are determined. The first additional vias are determined to be necessary for stress migration issues. Additional locations necessary for second additional vias are determined. The second additional vias are determined to be necessary for electromigration issues. The first via and the one of the group consisting of (i) the first additional vias and second additional vias (ii) the first additional vias plus a number of vias sufficient for electromigration issues taking into account that the first additional vias, after taking into account the stress migration issues, still have an effective via number greater than zero.

Abstract: To provide a method of manufacturing a through hole electrode substrate which comprises forming a plurality of through holes passing through the front and back of a wafer-shaped substrate, forming an insulation film on a surface of the substrate and the though hole, forming a seed layer from a metal on at least one side of the substrate and/or the through hole, forming a metal layer having a cap shape on a bottom part of the through hole on a surface on which the seed layer is formed by an electrolytic plating method supplying direct current to the seed layer for a first time period, and filling a metal material into the plurality of through holes by an electrolytic plating method supplying a pulse current to the seed layer and the metal layer.

Abstract: Semiconductor dice comprise at least one bond pad on an active surface of the semiconductor die. At least one blind hole extends from a back surface of the semiconductor die opposing the active surface, through a thickness of the semiconductor die, to an underside of the at least one bond pad. At least one quantity of passivation material covers at least a sidewall surface of the at least one blind hole. At least one conductive material is disposed in the at least one blind hole adjacent and in electrical communication with the at least one bond pad and adjacent the at least one quantity of passivation material.

Abstract: Semiconductor substrates with unitary vias and via terminals, and associated systems and methods are disclosed. A representative method in accordance with a particular embodiment includes forming a blind via in a semiconductor substrate, applying a protective layer to a sidewall surface of the via, and forming a terminal opening by selectively removing substrate material from an end surface of the via, while protecting from removal substrate material against which the protective coating is applied. The method can further include disposing a conductive material in both the via and the terminal opening to form an electrically conductive terminal that is unitary with conductive material in the via. Substrate material adjacent to the terminal can then be removed to expose the terminal, which can then be connected to a conductive structure external to the substrate.

Abstract: Some embodiments include methods of forming semiconductor constructions in which a semiconductor material sidewall is along an opening, a protective organic material is over at least one semiconductor material surface, and the semiconductor material sidewall and protective organic material are both exposed to an etch utilizing at least one fluorine-containing composition. The etch is selective for the semiconductor material relative to the organic material, and reduces sharpness of at least one projection along the semiconductor material sidewall. In some embodiments, the opening is a through wafer opening, and subsequent processing forms one or more materials within such through wafer opening to form a through wafer interconnect. In some embodiments, the opening extends to a sensor array, and the protective organic material is comprised by a microlens system over the sensor array. Subsequent processing may form a macrolens structure across the opening.

Abstract: A wiring method for a semiconductor integrated circuit has the steps of, separately from a first layer on which a first signal wiring pattern is mainly formed, laying out a first power-supply wiring pattern on a second layer so that a plurality of rows of the first power-supply wiring pattern are regularly arranged with vacant areas each interposed between the rows and making narrower a width of each vacant area than a narrowest width of a row among the rows of the first power-supply wiring pattern, and laying out a second signal wiring pattern electrically conductive to the first layer in two or more rows of the vacant areas on the second layer so that the second signal wiring pattern is not in contact with adjacent rows of the first power-supply wiring pattern on both sides.

Abstract: The present invention discloses a semiconductor structure and a method for manufacturing the same. The semiconductor structure comprises a semiconductor substrate, a local interconnect structure connected to the semiconductor substrate, and at least one via stack structure electrically connected to the local interconnect structure, wherein the at least one via stack structure comprises a via having an upper via and a lower via, the width of the upper via being greater than that of the lower via; a via spacer formed closely adjacent to the inner walls of the lower via; an insulation layer covering the surfaces of the via and the via spacer; a conductive plug formed within the space surrounded by the insulation layer, and electrically connected to the local interconnect structure. The present invention is applicable to manufacture of a via stack in the filed of manufacturing semiconductor.

Abstract: Methods for fabricating integrated circuits having substrate contacts and integrated circuits having substrate contacts are provided. One method includes forming a first trench in a SOI substrate extending through a buried insulating layer to a silicon substrate. A metal silicide region is formed in the silicon substrate exposed by the first trench. A first stress-inducing layer is formed overlying the metal silicide region. A second stress-inducing layer is formed overlying the first stress-inducing layer. An ILD layer of dielectric material is formed overlying the second stress-inducing layer. A second trench is formed extending through the ILD layer and the first and second stress-inducing layers to the metal silicide region. The second trench is filled with a conductive material.

Abstract: A high programming efficiency electrical fuse is provided utilizing a dual damascene structure located atop a metal layer. The dual damascene structure includes a patterned dielectric material having a line opening located above and connected to an underlying via opening. The via opening is located atop and is connected to the metal layer. The dual damascene structure also includes a conductive feature within the line opening and the via opening. Dielectric spacers are also present within the line opening and the via opening. The dielectric spacers are present on vertical sidewalls of the patterned dielectric material and separate the conductive feature from the patterned dielectric material. The presence of the dielectric spacers within the line opening and the via opening reduces the area in which the conductive feature is formed. As such, a high programming efficiency electrical fuse is provided in which space is saved.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece having a buried layer disposed beneath a top portion thereof. A trench is disposed in the workpiece extending at least through the buried layer. At least one sinker contact is disposed in the top portion of the workpiece. The at least one sinker contact is proximate sidewalls of at least a portion of the trench and is adjacent the buried layer. An insulating material is disposed on the sidewalls of the trench. A conductive material is disposed within the trench and is coupled to a lower portion of the workpiece.

Abstract: A method of manufacturing is disclosed. An exemplary method includes providing a substrate and forming one or more layers over the substrate. The method further includes forming a surface layer over the one or more layers. The method further includes performing a patterning process on the surface layer thereby forming a pattern on the surface layer. The method further includes performing a cleaning process using a cleaning solution to clean a top surface of the substrate. The cleaning solution includes tetra methyl ammonium hydroxide (TMAH), hydrogen peroxide (H2O2) and water (H2O).

Abstract: A method for forming a semiconductor device is disclosed. A method for forming a semiconductor device includes forming a first bit line contact over a semiconductor substrate, forming a second bit line contact that is coupled to the first bit line contact and has a larger width than the first bit line contact, and forming a bit line over the second bit line contact. When using the semiconductor device having a buried gate, although the bit line is formed to have a small width and the bit line pattern is misaligned, the method prevents incorrect coupling between a bit line and a bit line contact, so that it basically deteriorates unique characteristics of the semiconductor device.

Abstract: There is provided a method for forming a metal interlayer via, comprising: forming a seed layer on a first dielectric layer and a first metal layer embedded in the first dielectric layer; forming a mask pattern on the seed layer to expose a portion of the seed layer covering some of the first metal layer; growing a second metal layer on the exposed portion of the seed layer; removing the mask pattern and a portion of the seed layer carrying the mask pattern to expose side walls of the second metal layer, a portion of the first metal layer and the first dielectric layer; forming an insulating barrier layer on the side walls, the portion of the first metal layer and the first dielectric layer. There is also provided a method for forming a metal interconnection line. Both of them can suppress the occurrence of voids.

Abstract: A method of forming stacked die devices includes attaching first semiconductor die onto a wafer to form a reconstituted wafer, and then bonding second semiconductor die onto the first semiconductor die to form a plurality of singulated stacked die devices on the wafer. A support tape is attached to a bottomside of the second semiconductor die. A dicing tape is attached to the wafer. The wafer is laser irradiated before or after attachment of the dicing tape at intended dicing lanes that align with gaps between the first semiconductor die to mechanically weaken the wafer at the intended dicing lanes, but not cut through the wafer. The dicing tape is pulled to cleave the wafer into a plurality of singulated portions to form a plurality of singulated stacked die devices attached to the singulated wafer portions by the dicing tape. The support tape is removed prior to cleaving.

Abstract: Vertical contact structures, such as contact elements connected to semiconductor-based contact regions in device areas comprising densely-spaced gate electrode structures, are formed for given lithography and patterning capabilities by incorporating at least one additional dielectric layer of superior tapering behavior into the dielectric material system.

Abstract: Disclosed is a backside illuminated image sensor including a light receiving element formed in a first substrate, an interlayer insulation layer formed on the first substrate including the light receiving element, a via hole formed through the interlayer insulation layer and the first substrate while being spaced apart from the light receiving element, a spacer formed on an inner sidewall of the via hole, an alignment key to fill the via hole, interconnection layers formed on the interlayer insulation layer in a multilayer structure in which a backside of a lowermost layer of the interconnection layers is connected to the alignment key, a passivation layer covering the interconnection layers, a pad locally formed on a backside of the first substrate and connected to a backside of the alignment key, and a color filter and a microlens formed on the backside of the first substrate corresponding to the light receiving element.

Abstract: A semiconductor device manufacture method includes: forming a first film above a semiconductor substrate; forming a first mask film above the first film; patterning the first mask film; executing a plasma process for a side wall of the patterned first mask film to transform the side wall into a transformed layer; after the plasma process, forming a second mask film covering the first mask film; etching the second mask film to remove the second mask film above the first mask film and leave the second mask film formed on the side wall; after the etching the second mask film, removing the transformed layer; and after the removing the transformed layer, etching the first film by using the first mask film and the second mask film as mask.

Abstract: A method for forming a device is disclosed. The method includes providing a substrate prepared with first and second contact regions and a dielectric layer over the contact region. First and second vias are formed in the dielectric layer. The first via is in communication with the first contact region and the second via is in communication with the second contact region. A buried void provides a communication path between the first and second vias. The vias and buried void are at least partially filled with a dielectric filler. The partially filled buried void blocks the communication path between the first and second vias created by the buried void. The dielectric filler in the vias is removed, leaving remaining dielectric filler in the buried void to block the communication path between the first and second vias and contact plugs are formed in the vias.

Abstract: The invention includes semiconductor assemblies having two or more dies. An exemplary assembly has circuitry associated with a first die front side electrically connected to circuitry associated with a second die front side. The front side of the second die is adjacent a back side of the first die, and a through wafer interconnect extends through the first die. The through wafer interconnect includes a conductive liner within a via extending through the first die. The conductive liner narrows the via, and the narrowed via is filled with insulative material. The invention also includes methods of forming semiconductor assemblies having two or more dies; and includes electronic systems containing assemblies with two or more dies.

Abstract: A method of forming an interconnect structure that may reduce or eliminate stress induced voids is provided. In an embodiment, a via is formed below a conductive line to provide an electrical connection to an underlying conductive region. The conductive line includes a widened region above the via. The widened region serves to reduce or eliminate stress induced voids between the via and the underlying conductive region. In another embodiment, one or more redundant lines are formed extending from a conductive region, such as a contact pad, such that the redundant line does not electrically couple the conductive region to an underlying conductive region. In a preferred embodiment, the redundant lines extend from a conductive region on a side adjacent to a side having a conductive line coupled to a via.

Abstract: A combination, composition and associated method for chemical mechanical planarization of a tungsten-containing substrate are described herein which afford tunability of tungsten/dielectric selectivity and low selectivity for tungsten removal in relation to dielectric material. Removal rates for both tungsten and dielectric are high and stability of the slurry (e.g., with respect to pH drift over time) is high.

Abstract: A multiwavelength optical device includes a substrate; a first mirror section including a plurality of first mirror layers stacked on the substrate; an active layer stacked on the first mirror section, the active layer including a light emission portion; a second mirror section including a plurality of second mirror layers stacked on the active layer; a first electrode disposed between the active layer and the second mirror section; and a second electrode disposed between the first mirror section and the active layer.

Abstract: An object of the invention is to fully fill a wiring material in via holes formed in a low-hardness interlayer insulating film and a high-hardness interlayer insulating film, respectively, upon forming a Cu wiring in interlayer insulating films by using the dual damascene process. According to the invention, a second interlayer insulating film has therein both a wiring trench and a via hole. The via hole has, at the opening portion thereof, a recess portion having a tapered cross-sectional shape. It is formed by causing the second interlayer insulating film to retreat obliquely downward. The diameter of the opening portion of the via hole therefore becomes greater than the diameter of a region below the opening portion and it becomes possible to fully fill a wiring material in the via hole even if the via hole has a fine diameter.

Abstract: In MRAM, a write wiring clad in a ferromagnetic film has been used to reduce a write current or avoid disturbances. Besides, a CuAl wiring obtained by adding a trace of Al to a Cu wiring has been used widely to secure reliability of a high reliability product. There is a high possibility of MRAM being mounted in high reliability products so that reliability is important. Clad wiring however increases the resistance of the CuAl wiring, which is originally high, so that using both may fail to satisfy the specification of the wiring resistance. In the semiconductor device of the invention having plural copper-embedded wiring layers, copper wiring films of plural copper-embedded clad wirings configuring a memory cell matrix region of MRAM are made of relatively pure copper, while a CuAl wiring film is used as copper wiring films of copper-embedded non-clad wirings below these wiring layers.

Abstract: A method for forming passivated through wafer vias, passivated through wafer via structures, and passivated through wafer via design structures. The method includes: forming a through wafer via in a semiconductor substrate, the through wafer via comprising an electrical conductor extending from a top of the semiconductor substrate to a bottom surface of the semiconductor substrate; and forming a doped layer abutting all sidewalls of the electrical conductor, the doped layer of a same dopant type as the semiconductor substrate, the concentration of dopant in the doped layer greater than the concentration of dopant in the semiconductor substrate, the doped layer intervening between the electrical conductor and the semiconductor substrate.

Abstract: A semiconductor wafer has an integrated, through substrate, via (TSV). The semiconductor wafer includes a substrate. A dielectric layer may be formed on a first side of the substrate. A through substrate via may extend through the dielectric layer and the substrate. The through substrate via may include a conductive material and an isolation layer. The isolation layer may at least partially surround the conductive material. The isolation layer may have a tapered portion.

Abstract: A semiconductor structure which includes a plurality of stacked semiconductor chips in a three dimensional configuration. There is a first semiconductor chip in contact with a second semiconductor chip. The first semiconductor chip includes a through silicon via (TSV) extending through the first semiconductor chip; an electrically conducting pad at a surface of the first semiconductor chip, the TSV terminating in contact at a first side of the electrically conducting pad; a passivation layer covering the electrically conducting pad, the passivation layer having a plurality of openings; and a plurality of electrically conducting structures formed in the plurality of openings and in contact with a second side of the electrically conducting pad, the contact of the plurality of electrically conducting structures with the electrically conducting pad being offset with respect to the contact of the TSV with the electrically conducting pad.

Abstract: A semiconductor device includes an inorganic insulating layer on a semiconductor substrate, a contact plug that extends through the inorganic insulating layer to contact the semiconductor substrate and a stress buffer spacer disposed between the node contact plug and the inorganic insulating layer. The device further includes a thin-film transistor (TFT) disposed on the inorganic insulating layer and having a source/drain region extending along the inorganic insulating layer to contact the contact plug. The device may further include an etch stop layer interposed between the inorganic insulating layer and the semiconductor substrate.

Abstract: A method and apparatus for providing a conductive structure adjacent to a damascene conductive structure in a semiconductor device structure. The semiconductor device structure includes an insulation layer with at least one damascene conductive structure formed therein, wherein the at least one damascene conductive structure includes an insulative, protective layer disposed thereon. The insulative material of the protective layer is able to resist removal by at least some suitable etchants for the insulative material of the insulation layer adjacent to the at least one damascene conductive structure. A self-aligned opening is formed by removing a portion of an insulation layer adjacent the at least one damascene conductive structure. The self-aligned opening is then filled with a conductive material to thereby provide another conductive structure adjacent to the at least one damascene conductive structure.

Abstract: A method of plating via hole in a substrate includes providing a substrate having a first side and a second side and a plurality of through substrate via holes; depositing a first seed layer on the first side of the substrate; applying a foil on the first seed layer of the substrate closing the first ends of the plurality of via holes; electro-chemical plating of the second side of the substrate; and removing the foil.

Abstract: A semiconductor device includes a first die having top, bottom, and peripheral surfaces. A bond pad is formed over the top surface. An organic material is connected to the first die and disposed around the peripheral surface. A via hole is formed in the organic material. A metal trace connects the via hole to the bond pad. A conductive material is deposited in the via hole. A redistribution layer (RDL) has an interconnection pad disposed over the top surface of the first die.

Abstract: The present invention generally relates to the use of glass as the interposer material with the surface of the interposer and/or the walls of through vias in being coated by a stress relief barrier that provides thermal expansion and contraction stress relief and better metallization capabilities. The present invention discloses ways in that a stress relief barrier can be used to reduce the effects of stress caused by the different CTEs while also, in some applications, acting as an adhesion promoter between the metallization and the interposer. The stress relief barrier acts to absorb some of the stress caused by the different CTEs and promotes better adhesion for the conductive metal layer, thus helping to increase reliability while also providing for smaller designs.

Abstract: A method of forming openings to a layer of a semiconductor device comprises forming a dielectric layer over the layer of the semiconductor device, and forming a mask over the dielectric layer. The mask comprises a plurality of mask openings arranged in a regular pattern extending over the dielectric layer and the plurality of mask openings include a plurality of first mask openings and a plurality of second mask openings, each of the plurality of first mask openings being greater in size than each of the plurality of second mask openings. The method further comprises reducing the size of the plurality of second mask openings such that each of the second mask openings is substantially closed and removing portions of the dielectric layer through the plurality of first mask openings to provide openings extending through the dielectric layer to the layer.

Abstract: A method for forming a plug structure includes the following steps. A substrate is provided. The substrate includes a MOS device with a source/drain region, a dielectric layer disposed on the MOS device, an opening defined in the dielectric layer, and a first glue layer disposed on a sidewall and a bottom of the opening. A portion of the first glue layer disposed at the bottom of the opening is punched through to expose the source/drain region. A barrier layer is formed over the substrate after the first glue layer is punched through. The opening is filled with a conductive structure, wherein the barrier layer disposed at the bottom of the opening is remained when the conductive structure is filled into the opening.

Abstract: A method of forming through silicon vias (TSVs) includes forming a primary via hole in a semiconductor substrate, depositing low-k dielectric material in the primary via hole, forming a secondary via hole by etching the low-k dielectric in the primary via hole, in such a manner that a via insulating layer and an inter metal dielectric layer of the low-k dielectric layer are simultaneously formed. The via insulating layer is formed of the low-k dielectric material on sidewalls and a bottom surface of the substrate which delimit the primary via hole and the inter metal dielectric layer is formed on an upper surface of the substrate. Then a metal layer is formed on the substrate including in the secondary via hole, and the metal layer is selectively removed from an upper surface of the semiconductor substrate.

Abstract: A method for producing an electrical component (1) is proposed, in which a ceramic base body (5) that contains a through-hole contact (10) and at least one metallization surface (20C) electroconductively connected to the through-hole contact is provided in a method step A). On the surface of the base body, an electrically insulating first material is arranged in layer form at least above the through-hole contact in method step B), and thereafter an electrically conductive second material is applied above through-hole contact (10) in method step C). Then a solder contact (30B) that electroconductively connects through-hole contact (10) through passivation layer (25B), which is formed from the first material by sintering, is formed by hardening in method step D).

Abstract: Methods of forming integrated circuit devices include forming first and second gate electrodes at side-by-side locations on a substrate and forming first and second sidewall spacers on sidewalls of the first gate electrode and the second gate electrode, respectively. The first and second gate electrodes are covered with a first electrically insulating layer of a first material. A second electrically insulating layer of a second material is deposited on the first electrically insulating layer. The second electrically insulating layer is patterned to define a first opening therein that exposes an underlying first portion of the first electrically insulating layer.

Abstract: A semiconductor device includes a first substrate and a second substrate being bonded to each other, a posterior interconnect layer interposed between the first and second substrates, a weld pad disposed in the posterior interconnect layer, and a first annular opening disposed in the first substrate. The device further includes a dielectric layer formed in the first opening, a via surrounded by the first annular opening, and an interconnect layer disposed in the via. The device also includes a conductive bump disposed on the interconnect layer and electrically connected to the weld pad through the interconnect layer.

Abstract: When forming contact levels of sophisticated semiconductor devices, a superior bottom to top fill behavior may be accomplished by applying an activation material selectively in the lower part of the contact openings and using a selective deposition technique. Consequently, deposition-related irregularities, such as voids, may be efficiently suppressed even for high aspect ratio contact openings.

Abstract: Methods and associated structures of forming a microelectronic device are described. Those methods may include forming a first block on a nanodot material, forming a first spacer on the first block, removing the first block to form a free standing spacer, removing exposed portions of the nanodot material and then the free standing spacer to form nanowires, forming a second block at an angle to a length of the nanowires, forming a second spacer on the second block, forming a second free standing spacer on the nanowires by removing the second block, and removing exposed portions of the nanowires and then the second free standing spacer to form an ordered array of nanodots.

Abstract: A patterned adhesive layer including holes is employed to attach a coreless substrate layer to a stiffner. The patterned adhesive layer is confined to kerf regions, which are subsequently removed during singulation. Each hole in the patterned adhesive layer has an area that is greater than the area of a bottomside interconnect footprint of the coreless substrate. The patterned adhesive layer may include a permanent adhesive that is thermally curable or ultraviolet-curable. The composition of the stiffner can be tailored so that the thermal coefficient of expansion of the stiffner provides tensile stress to the coreless substrate layer at room temperature and at the bonding temperature. The tensile stress applied to the coreless substrate layer prevents or reduces warpage of the coreless substrate layer during bonding. Upon dicing, bonded stacks of a semiconductor chip and a coreless substrate can be provided without adhesive thereupon.

Abstract: The interlayer connection of the substrate is formed by a contact-hole filling (4) of a semiconductor layer (11) and metallization (17) of a recess (16) in a reverse-side semiconductor layer (13), wherein the semiconductor layers are separated from each other by a buried insulation layer (12), at whose layer position the contact-hole filling or the metallization ends.

Abstract: In a “via first/trench last” approach for forming metal lines and vias in a metallization system of a semiconductor device, a combination of two hard masks may be used, wherein the desired lateral size of the via openings may be defined on the basis of spacer elements, thereby resulting in significantly less demanding lithography conditions compared to conventional approaches.

Abstract: Structures and methods are provided for forming pre-fabricated deep trench capacitors for SOI substrates. The method includes forming a trench in a substrate and forming a dielectric material in the trench. The method further includes depositing a conductive material over the dielectric material in the trench and forming an insulator layer over the conductive material and the substrate.