Abstract: A heat sink includes a body and a heat transmitting member coupled thereto. The body and member are arranged such they each contact a different section of an electronic component, e.g., a PCMCIA card. The heat sink can be integrated into an electronic component connector that enables the heat sink to move parallel with the component during insertion and extraction. The connector can also enable vertical movement of the heat sink during component insertion and extraction.

Abstract: The invention relates to an optical transceiver system for use in a host device including an optical transceiver receptacle or cage with a heat dissipating structure mounted thereon. The heat dissipating structure is electronically powered by an external source in the host device, which are electrically connected by insertion of a transceiver module into the transceiver receptacle. The present invention enables optical transceivers to support very high data rates, e.g. >8 Gb/s, while still supporting very high density applications, e.g. SFF/SFP. Actuating features on the transceiver module and cage enable the heat dissipating structure to be turned on when the transceiver module is fully inserted into the cage, and turned off when the transceiver module is removed or at least partially removed from the cage.

Abstract: A daughter card includes a number of circuit modules generating heat and a spring member transmitting the heat to a thermal bus extending along a circuit board adjacent to one side or to each side of a connector to which the daughter card is releasably attached. One or more contact surfaces of the spring member releasably contact one or more mating surfaces of a thermal bus at a side of the connector or at both sides of the connector. A heat pipe may additionally be used to direct heat from the thermal bus to a heat absorber.

Abstract: The present invention provides a card connector in which heat dissipation of a card can be performed by means of a heatsink without requiring any operation of the heatsink by the consumer. The card connector comprises a heatsink for contacting one surface of the card that is inserted into a connector part, and a push rod for ejecting the card. The push rod has a cam having a first cam surface which acts so that the heatsink moves away from the one surface of the card at the time of the insertion of the card, and a second cam surface which acts so that the heatsink moves away from the one surface of the card during the ejection of the card.

Abstract: An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board. The assembly also includes a spring formed of memory metal. The spring is operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board. The spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it is below said predetermined temperature.

Abstract: A system comprising a first board for electrical communication with a second board, at least one electrical communication connector positioned on one side of said first board, and slots constructed in said first board, said slots adapted for allowing at least one electrical communication connector positioned on said second board to mate through said slots with said first board electrical communication connector.

Abstract: A durable coaxial connector (100) for providing a reliable signal connection to a printed circuit board (PCB) (118) while isolating the PCB from mechanical loads that are applied to the connector, and an electrical system incorporating the same. The connector can include a connector body (102) having a connector interface member (106), at least one flange (104), and a ground interface member (304) having a first portion (306) configured to be fixedly attached to the PCB and a second portion (308) configured to slideably mate to a ground interface receptacle defined in the connector body. A connector interface can be defined on an inner surface (410) of the connector interface member. A fastener (124) can couple the connector body to a heat sink (112). A thermally conductive boss (116) can be provided to mount the connector body (102) and transfer thermal energy from the connector body to the heat sink.

Abstract: Various devices for mounting circuit devices and methods of making the same are provided. In aspect, a device is provided that includes a member for holding an integrated circuit. The member contains a first plurality of carbon nanotubes to enhance the thermal conductivity thereof. At least one conductor member projects from the member. In another aspect, a method of fabricating an interface for an electronic component is provided that includes forming a member containing a first plurality of carbon nanotubes and forming at least one conductor on the member.

Abstract: An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.

Abstract: In one embodiment the present invention is an MLB assembly 6 that is made up of two circular terminal conductor ends 2, 4. Multiple fins 10 radially extend from each of the two circular terminal conductor ends 2, 4, and each fin on each of the two circular terminal conductor ends has a matching fin on the other of the two circular terminal ends. Multiple flexible connectors 8 are attached to the fins 10 that electrically connects the terminal conductors 2, 4. The flexible connectors 8 also allow for a difference of movement between the two circular terminal ends. Current flowing through the MBL assembly 16 is evenly distributed 18 through the plurality of flexible connectors.

Abstract: In a card connector having an eject mechanism for removing a card inserted at a predetermined position, the card connector has a heat radiation member which is brought into contact with the card to promote heat radiation. The heat radiation member is held by holding members to be movable with respect to the card. The card connector further has cam mechanisms acting between the holding members and eject mechanisms for removing the card. When the card is removed from the predetermined position, the card is removed after the heat radiation member is separated from the card.

Abstract: A processor actuation system for engaging electrical contacts of a processor with mating elements of a socket. The processor actuation system comprises a socket, a processor, a heat sink and a cam actuator. The socket includes a base, an actuator-receiving member and a sliding cover. The processor includes electrical contacts extending from a surface of the processor. The processor is mounted on a processor-interface surface of the sliding cover. The heat sink mounts on at least one of the processor and the socket. The cam actuator connects to the actuator-receiving member. The cam actuator moves the sliding cover in a longitudinal direction with respect to the base, such that movement of the sliding cover along the longitudinal direction moves the processor and the heat sink along the longitudinal direction to lock the processor.

Abstract: A socket for electrical parts, which detachably holds an electrical part such as an IC package on a mounting portion thereof and connects the electrical part electrically to external circuit, capable of improving the heat dissipation capability of a heat sink which dissipates the heat generated from the electrical part, in a state of being in contact with the electrical part mounted on the mounting portion, and also capable of preventing damage to the electrical part.

Abstract: A socket structure for grid array (GA) Packages, mainly comprises the flexible chassis assembly, the frame, the first hinge cover lid and the second hinge cover lid. The flexible chassis assembly comprises the silicon rubber pad, the inner base plate, the flex-board, two solder mask layers, bumps and solder balls. The flex-board, encompassing the silicon rubber pad and the inner base plate, is used for electrical contacts. Also, the first hinge cover lid is situated and pivoting on the frame by a first hinge pin and a second hinge pin; the second hinge cover lid is situated and pivoting on the frame by a third hinge pin and a fourth hinge pin. By pressing the first hinge cover lid and the second hinge cover lid downward, the hinge pads thereon contact with the substrate of the package and snap the package firm in place. In this invention, the package with pre-attached heat sink can be easily placed into the socket.

Abstract: An automotive control module includes a plastic housing with a snap-fit metal cover. A printed circuit board is positioned within a cavity formed in the housing, and is attached to the housing with a plurality of fasteners. Resilient tabs are formed on side walls of the housing and grip a cover plate surface to define a snap-fit attachment. Once the cover is attached to the plastic housing, the printed circuit board is enclosed within the cavity between the cover and the housing. The cover includes a plurality of heat transfer fins and/or stamped indentations that form surfaces that are positioned in close proximity to the printed circuit board. The cover utilizes these fins and surfaces to form a heat sink for cooling electronics mounted to the printed circuit board.

Abstract: An electronic module having a configuration for promoting efficient heat dissipation and a circuit board assembly are provided such that when the electronic module is inserted within the circuit board assembly a portion of the electronic module overlaps an EMI shield, with the portion of the electronic module having a configuration for promoting efficient heat dissipation and being external of the EMI shield.

Abstract: An electrical cable and connector assembly having an electrical cable comprising a 12 Volt supply conductor and a 5 Volt supply conductor; and an electrical connector connected to the electrical cable. The electrical connector includes a 12 Volt supply contact connected to the 12 Volt supply conductor, a 5 Volt supply contact connected to the 5 Volt supply conductor, and a 3.3 Volt supply contact connected to the 5 Volt supply conductor by a voltage step down system located inside a housing of the electrical connector. With this embodiment, the connector can be connected to a device, such as a disc drive, requiring 12 and 5 Volt inputs or alternatively can be connected to a device requiring 12 and 3.3 Volt inputs.

Abstract: An integrated circuit (IC) socket assembly (1) includes an IC socket (4) mounted on a burn-in board (3) and receiving an IC (2) therein, a supporting member (5) assembled on the burn-in board and covering the IC socket, a heat sink (6) assembled on the supporting member, and an actuation member (7) assembled on the supporting member. The heat sink includes a jacket (61) attached on the IC. The jacket defines a U-shaped channel for containing cooling liquid therein. The actuation member is capable of being operated from an open position to a closed position, in which the jacket abuts against a top surface of the IC and the IC is reliably electrically connected with the burn-in board. During burning in, the jacket can quickly efficiently dissipate heat from the IC and associated components the protect the IC from instability and damage.

Abstract: Contact pin temperature of a semiconductor package is reduced by forcing air into a region between a circuit board and a socket body. A sealant around the perimeter of the socket body at least in part seals the socket body with the circuit board, allowing the forced gas to flow through cavities containing the contacts, thereby cooling the contacts and the package pins. The contact-pin temperature may be reduced, allowing power pins to carry more current. Accordingly, microprocessors and processing systems may be operated at higher data rates without reducing reliability or increasing contact-pin oxidation.

Abstract: In an electric connection box containing a bus bar board in a case, heat radiation member-side bus bars are connected to a heat radiation member, and switching devices, such as FETs, are mounted on the bus bars. The heat radiation member-side bus bars may project beyond an end surface of the heat radiation member, and form heat radiation member-side electrical component connection terminals. Electrical component connection bus bars project from a bus bar board to form bus bar board-side electrical component connection terminals. Electrical components are bridged between the heat radiation member-side electrical component connection terminals and the bus bar board-side electrical component connector terminals.

Abstract: A waterproof and heat-dissipating structure of an electronic apparatus including a circuit board, an input element and an output element is disclosed. The structure includes an aluminum-wrapped housing having at least four adjoining surfaces for defining a space, a first opening end and a second opening end, wherein the space is used for accommodating the circuit board, a first lateral plate fixed to the aluminum-wrapped housing, covering the first opening end and having a first hole for fixing the input element therein, and a second lateral plate fixed to the aluminum-wrapped housing, covering the second opening end and having a second hole for fixing the output element therein.

Abstract: A combined fuse holder and shunt has a shunt integrated into a one-piece assembly between a fuse holder and a circuit connector. The housing for the connectors is made in two halves that are heat staked together after the connectors are inserted therein. Slots and ribs in the housing retain the connectors therein without requiring supplemental fasteners.

Abstract: A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.

Abstract: An electrical coupler comprises an inner connector having upper and lower ends, an insulative outer connector element circumscribing the inner connector, and a thermally conductive flange disposed over the upper end of the inner connector and the outer connector for conducting heat from the electrical conductor. The electrical conductor may be utilized in a substrate support for semiconductor wafer processing. The substrate support comprises a chuck body having an electrode embedded therein, and an upper male connector coupled to the electrode and protruding from said chuck body. A cooling plate having the electrical coupler is positioned proximate to the chuck body. The upper male connector is inserted in the electrical coupler, and a power source coupled to the lower portion of the electrical coupler chucks and biases a wafer to an upper surface of said chuck. The thermally conductive flange conducts and transfers heat generated from the upper male connector and electrical coupler to the cooling plate.

Abstract: A socket structure for grid array (GA) packages, mainly comprises the flexible chassis assembly, the frame, the first hinge cover lid and the second hinge cover lid. The flexible chassis assembly comprises the silicon rubber pad, the inner base plate, the flex-board, two solder mask layers, bumps and solder balls. The flex-board, encompassing the silicon rubber pad and the inner base plate, is used for electrical contacts. By pressing the first hinge cover lid and the second hinge cover lid downward, the hinge pads thereon contact with the substrate of the package and snap the package firm in place. In this invention, the package with pre-attached heat sink can be easily placed into the socket.

Abstract: A coupling mechanism for radiator aims to fasten a radiator to a heat generating element of a socket on a main board for absorbing the thermal energy generated by the heat generating element. The coupling mechanism includes a first anchor dock, a second anchor dock and a latch element. The first anchor dock and the second anchor dock are located on two opposite ends of the socket. The latch element passes through the gap of the radiation fins of the radiator and straddles the radiator. It has one end pivotally engaging with the first anchor dock and another end selectively engaging with the second anchor dock. The latch element further has an elastic section formed in the middle portion to put the radiator in close contact with the heat generating element. The coupling mechanism thus constructed can increase the surface area of the radiation fins of the radiator to achieve the maximum radiation effect.

Abstract: The invention relates to a power electronics unit with a sheet-like carrier element, on which interconnects 5 are arranged for the electrical connection of electrical power components 6 and control components 7 of a circuit, likewise located on the carrier element. The carrier element is a heat sink 1, on which the interconnects 5 have been applied by means of a heat-conducting adhesive 3, and a minimum thickness of the heat-conducting adhesive 3 to allow the heat-conducting adhesive 3 to be an electrical insulating layer is ensured by spacers 4 in the heat-conducting adhesive 3.

Abstract: A socket (10) has a cover (14) pivotably mounted to a base (12). The base is formed with a seat (12a) for mounting a semiconductor device on a contact mounting plate (18). A locking mechanism (20) for locking the cover in the closed position includes an over center linkage mechanism interacting with a locking pin (20a). In a modified embodiment, the locking mechanism is provided with a pivotable locking member (27) to provide either manual or automated operation. The cover (14) of socket (10) also comprises an integrally formed heat sink. In another embodiment (10′), a separate heat sink (30) is independently mounted on the cover (28) provided with an aperture through the cover in which the heat sink is slidably mounted.

Abstract: A heat sink assembly for use with edge connectors, e.g., card edge connectors, of cards or printed circuit boards. The heat sink assembly provides a relatively large heat transfer capacity to control temperatures in contacts of the edge connectors which increases the current rating of the connector by allowing more current to pass through the connector. The heat sink assembly includes fins attached to the edge connector power and ground leads by direct thermal connection, such as soldering, to traces in the board. The fins are connected to the power and ground leads in an alternating or interweaved fashion. The fins are fabricated from thermal conducting material and heat is conducted to the fins where it is removed by the relatively large surface area of the fins. Adjacent fins are electrically isolated such that power and ground fins do not contact.

Abstract: A twin-Thermoelectric cooler design including two independent thermoelectric coolers sharing the same base (hot side ceramic plate). People familiar with the art understand that the number of independent TEC sharing the same base is not limited to two. Depending on application needs any number of TECs can be constructed on the same base and be controlled independently.

Abstract: A device having heat sinks for dissipating heat from the object under test, which is held by the heat sink holding members provided rotational movably about the object under test accommodation portion.

Abstract: A flip-chip module is interconnected to a PCB or circuit card through a peripheral LGA interposer connector. The flip-chip is mounted on the same surface of the module substrate as the peripheral array of LGA interconnection pads and projects into a central opening of the interposer. An opening in the upper stiffener of the PCB or circuit card permits the peripheral array of LGA interconnection pads to make contact with corresponding LGA PCB or circuit card pads. A first heat sink is arranged to thermally contact the entire surface of the substrate opposing the surface upon which the flip-chip is mounted. An opening in the PCB or circuit card and lower stiffener allows a second heat sink to make thermal contact with the surface of the flip-chip.

Abstract: A heat sink dissipater includes a retaining device and a heat dissipater. A plurality of fins and a plurality of pads or recesses are integrally formed on the top surface of the heat dissipater. A plurality of resilient legs extend inward from the sides of the retaining device. Retaining edges are also formed on two sides of the retaining device. The resilient legs fall into the gaps between the fins when the retaining device is positioned on the heat dissipater to secure a CPU assembly. In an orientation, the legs are placed on the pads or recesses of the heat dissipater and in an orthogonal orientation, the legs are placed directly on the top surface of the heat dissipater. Therefore, CPU assemblies of different thickness can be accommodated by rotating the retaining device or the heat dissipater 90 degrees.

Abstract: An apparatus for cooling circuit components includes a heat sink and circuit components mounted on a base. The heat sink includes a heat receiving portion for receiving heat from the circuit components. The heat sink includes a heat-transfer member provided between the heat sink and the circuit component. A spacer is provided between the circuit components and the heat sink to support the heat sink.

Abstract: A socket for an electrical part includes a socket body to which an electrical part having terminals are mounted, a number of contact pins arranged to the socket body so as to be contacted to or separated from the terminals of the electrical part, an operation member mounted to the socket body to be reciprocally movable with respect to the socket body, an open/close unit mounted to the socket body to be opened or closed in accordance with the reciprocal motion of the operation member and to press the electrical part when closed, and a closing speed reduction feature arranged for the open/close unit so as to reduce a closing speed thereof when the open/close unit is rotated in a closing direction thereof.

Abstract: A computer processor socket has a base with grounding and signal holes. Each hole contains a pin for electrical interconnection with a circuit board. The socket also contains a grounding device around its perimeter. The grounding device has a continuous ring of wiping members on its upper end. When a processor is mounted to the top of the socket, the wiping members extend slightly above the processor. The heatsink mounted on top of the processor engages the wiping members which are spring-biased against its lower surface. Since the wiping members extend completely around the perimeter of the socket, a continuous electrical ground interface is formed between the heatsink and the socket. The lower ends of the grounding device are electrically interconnected with the socket grounding pins which are grounded to the board.

Abstract: A CPU and heat sink mounting arrangement, which includes a locating plate having downward hooks inserted through respective through holes at a CPU connector and a heat sink, and two retainer strips attached to respective transverse grooves at the heat sink and having retaining holes fastened to the downward hooks of the locating plate to secure the CPU connector and the heat sink together, wherein the retainer plates each have a finger strip for operation by hand to disengage the respective retaining holes from the downward hooks, and the locating plate has two transverse spring leaves at two opposite ends, which push the locating plate away from the CPU connector after disengagement of the retainer plates from the downward hooks of the locating plate.

Abstract: A power diode and heat sink arrangement includes two power diodes fastened to a heat sink, a copper plate soldered to the power diodes at the top to hold a terminal holder, and a ceramic pad connected between the heat sink and the copper plate and spaced between the chips and adapted to support the copper plate against deformation and to transmit heat from the copper plate to the heat sink for quick dissipation.

Abstract: A socket attaches to a first component and includes a receptive area to couple a second component to the first component. A low profile voltage regulator is integrated into the socket and proximately disposed adjacent to the receptive area. The low profile voltage regulator converts a first power signal from the first component to a second power signal for the second component. A chassis encloses the socket and the low profile voltage regulator and serves as a base for a heat sink to be attached to the second component.

Abstract: A clip for mounting a heat sink to an electronic element includes a pressing body and a pair of latching arms extending from opposite ends of the pressing body. A sloped portion connects the pressing body with each latching arm. Each latching arm defines a latching opening for engaging with a corresponding latching projection of the electronic element. A handling tab is integrally extends outward from one of the latching arms. A slot is defined in the handling tab. Thus, when disassembling the clip from the electronic element, a tooling, such as a screwdriver, is partially inserted into the slot of the clip and then ensures an easy disengagement the latching opening of the clip from the latching projection of the electronic element.

Abstract: A power diode terminal holder mounting arrangement includes a copper plate connected between two chips on a heat sink above a ceramic plate, and a terminal holder soldered to the copper plate, the copper plate having a circular hole through a flat base thereof; the terminal holder having a conical bottom end fitted into the circular hole of the copper plate and disposed in contact with a top sidewall of the ceramic plate.

Abstract: An intercoupling component (e.g., socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array positioned within the intercoupling component, while maintaining a relatively low profile. The intercoupling component includes a heat sink positioned within the package support member configured to contact both a lower surface of the integrated circuit package disposed within the package support member and a substrate such as a printed circuit board. The package support member includes contact terminals disposed within associated openings of the package for electrically connecting the contacting areas of the integrated circuit package to the corresponding connection regions of the substrate. The openings extend from an upper surface to an opposite lower surface of the support member and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink may be configured to be removable and replaceable.

Abstract: An electrical power supply connector assembly having a plurality of terminal modules mounted side by side in the connector housing. Each terminal module includes a lead frame having a main plate and a plurality of contacts and terminal legs integrally connected to the main plate and coplanar therewith. The main plate of the lead frame is embedded in an insulation resin mold, and has a heat dissipating plate projecting from the insulation resin mold.

Abstract: A heat sink assembly includes a socket secured on a printed circuit board, an integrated circuit secured on the socket, a heat sink disposed on the integrated circuit, and a resilient retainer clip biasing the heat sink to engage with the socket. An anti-electromagnetic wave device includes a leg engaged with the printed circuit board and a head engaged through a lug of the socket and engaged with one arm of the resilient retainer clip for dissipating the electromagnetic wave that may be transmitted to the integrated circuit.

Abstract: A structure for mounting a heat sink onto an integrated circuit package mounted on a printed circuit board is constructed such that a guide member having a frame portion and support post portions is fixed to the printed circuit board, and the heat sink is seated on an inner periphery of the guide member such that the heat sink may be closely contacted with the integrated circuit package, and then a cover is fixed to the guide member such that it covers over outer peripheral edge portions of an upper face of the heat sink. This structure is high in cooling efficiency and is easy to mount.

Abstract: An advanced zero-insertion force (ZIF) socket for coupling an electronic package having a plurality of electrical pins and a heat sink having a heat sink alignment and retention means onto a printed circuit board (PCB) of a computer system.

Abstract: The locking member of a ZIF socket, which is movable between a locked position, in which high contact forces are present between contact springs within the socket and pins extending from an electronic module into the socket, and an unlocked position, in which the pins are released from the contact springs, is held in the locked position by means of a portion of a clamping spring inserted into a gap between the locking member and a portion of the housing of the ZIF socket. The clamping spring also holds a heat sink in place on the electronic module.

Abstract: A retention device for mounting a heat sink to a CPU socket comprises a pair of supporting members and a pair of pressing members. Each supporting member is pivotably assembled with one pressing member to form a subassembly. The subassemblies straddle opposite ends of the CPU socket, respectively. Each supporting member comprises a supporting portion defining a supporting face thereon and a pair of side portions. The side portions define a pair of through holes therethrough and a pair of side supporting face thereon. The supporting faces together with the side supporting faces support opposite sides of a heat sink having a pair of retention plates extending therefrom thereon. Each pressing member comprises an operating portion and a pressing portion defining an abutting portion to engage with a corresponding retention plate of the heat sink. Each pressing portion forms a pair of axles extending from two opposite outer surfaces thereof to engage with the through holes of the supporting member.

Abstract: A socket for establishing a releasable connection between terminals of electronic modules and a circuit board includes a base having a module support surface for supporting the module in test position. A contact holder cooperates with the base for supporting contact elements for each terminal of the module. Each of the contact modules include a projecting portion projecting from the socket and before engagement with the circuit board, a support section which is supported on the contact holder in grooves defined between ribs and oriented with respect thereto by tabs on the contact elements engaging gaps in the grooves, and a deflecting section which extends over slots in the contact holder. When a module to be tested, the module is placed on the test surface and a lid pivotally mounted on the socket is closed to thereby push the terminals into engagement with the contact elements and thereafter downward force being accommodated by deflection of the deflectable portion of the contact elements into the grooves.

Abstract: In a control device for a motor vehicle having a cooling plate between an upper component of the housing and a lower component of the housing wherein a first printed circuit board which is fitted with an electrical circuit is mounted on the cooling plate. Arranged underneath the cooling plate is a plug component on the lower component of the housing. Plug pins of the plug component are fitted into a second printed circuit board which is also arranged underneath the cooling plate. The plug pins are electrically connected to the first printed circuit board via conductor tracks of the second printed circuit board and connecting elements between the second printed circuit board and the first printed circuit board.