Abstract: A reflector/lamp assembly employs a heat-sink component that includes a rigid, elongate, relatively wide and thin conductor element which is disposed forwardly of the reflector rim and extends radially to a distal point lying substantially beyond the axial projection of the rim. The heat-sink component efficiently dissipates thermal energy without attenuating the reflected radiation and without imposing physical constraints or stresses.

Abstract: A heat exchange apparatus for a computing device. A heat dissipating cable connector for the computing device includes a heat dissipation mechanism. The heat dissipation mechanism in the heat dissipating cable connector is removably thermally coupled to a heat transfer element which is configured to transfer heat from an electronic component to the heat dissipation mechanism.

Abstract: Socket apparatus (10) particularly adapted for use of burn-in tests of IC components having a large number of contact points on the bottom surface thereof has a cover frame (16) and adapter plate (22) movably mounted on a base (16). A latch assembly (30) is pivotably mounted on the base (12) at each side thereof and is linked to the cover frame so that when the cover frame is moved downwardly toward the base against the bias of spring members (20) each latch member (30a) is pivoted away from the seating surface allowing an IC component to be inserted into the socket or removed from the socket.

Abstract: An electric junction box in which electric power is distributed to electric parts or devices, mounted on an upper side of a part-mounting floor portion of an upper case, through bus bars mounted on a lower side of the part-mounting floor portion. In the electric junction box, a peripheral wall of an upper case has a heat-radiating wall portion which projects upwardly beyond the position of mounting of the electric parts on the part-mounting floor portion of the upper case. The heat-radiating wall portion has a bus bar installation space of a slit-like cross-section which is open to the lower surface of the part-mounting floor portion, and receives the connecting plate of the bus bar.

Abstract: An IC socket (FIGS. 2, 14) is provided with a core block (9) for supporting a multitude of contact pins (13, 14). A TAB package including a chip (T) and a film (PCB) having lead terminals arranged at a fine pitch is to be placed into the socket for engagement with upper ends of the contacts (13, 14) and is to be pressed downwardly by a cover (2). Inner and outer floating and vertically displaceable members (10, 11) are spring biased upwardly against the TAB package and separating members (12) are located along each side of the socket and are floatably supported by upper ends of the contact pins (13, 14). The separating members (12) include series of ribs (12e, 12f) on opposite sides for maintaining alignment of the upper ends of the contact pins. The socket also includes heat transfer pins (8). The core plate (9) includes ribs (9f, 9g, 9h, 9i, 9j) for positioning central sections of the contact pins (13, 14). In another embodiment (FIGS.

Abstract: A computer system having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate mounted in the computer system enclosure, along with a power supply, a bus system, and connectors for communicating with units external to the enclosure. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.

Abstract: A socket assembly for mechanically and electrically coupling an integrated component with an interfacing carrier comprises a socket body for receiving the integrated component, a retaining spring hingedly connected to the socket body for retaining the integrated component within the socket body, and at least one post element. The socket body includes at least one generally cylindrical receiving member having at least a portion protruding through an aperture in the interfacing carrier which is deformable to engage the socket body with the carrier when the post element is received within the receiving element. The socket body also includes a first mounting surface having plurality of holes for receiving wadded button contacts and a heat transfer element in contacting relation with the mounting side of the integrated component.

Abstract: A connector position assurance system is provided for an electrical connector adapted to mate with another mateable connecting device. The connector includes a housing, and a primary locking arm is mounted on the housing for movement between a first position when the connector is fully mated with the mateable connecting device and second position of incomplete mating of the connector with the device. The primary locking arm includes a latch for mechanically interlocking with a cooperating latch of the mateable connecting device. A locking slider is mounted in a recessed area of the housing so as to be shrouded by the housing. The slider is slidable between a first position allowing movement of the locking arm and mating of the connector and the device, and a second position blocking movement of the locking arm from its first position with the connector and the device fully mated.

Abstract: The present invention is to provide a CPU heat dissipator hook-up structure having a metal pressing board and a metal hook-up board. The two sides of the metal pressing board stretch upward and formed an elastic tilt angle. There, on one side of the metal pressing board is bent downward and form an open, while the other side of the metal pressing board is formed two separate recesses. The top end of the metal hook-up board formed a flat surface as the force applied to when hooking up downward with the ZIF socket. Also on the two sides of the metal hook-up board formed a recess separately to be inserted by the protrusion formed because of the recess of the metal pressing board while being assembled. On the bottom of the metal hook-up board there is an open formed to be hooked by the hook formed on the side of the ZIF socket. Thus, using the upward elasticity of the metal pressing board, the dissipator board and he CPU can be fixed together tightly and achieve the purpose of ventilation.

Abstract: Apparatus for housing circuit cards that comprises a cylindrical housing having an internal wall having a single diameter. First and second cylindrical heat sinks are provided that each comprise a sloped outer surface. The heat sinks are disposed such that the sloped outer surfaces face each other. First and second circuit cards are secured to distal edges of respective heat sinks, or pairs of circuit cards are secured to both edges of respective heat sinks. Each circuit card comprises at least one internal interface connector that is designed to mate with an internal interface connector of an adjacent circuit card. A cylindrical card lock is provided that has an outer surface that is designed to contact the internal wall of the housing and an inner surface that has a V-shaped cross section having oppositely sloped surfaces. The respective sloped surfaces of the card lock are designed to mate with the sloped outer surfaces of the respective heat sinks.

Abstract: A mounting assembly for a multiple chip module or other circuit module, which includes a board having a surface including an array of board contacts, such as a printed wiring board in a computer system. A circuit module, such as a multiple chip module, having a first surface and a second surface is included. The circuit module includes an array of circuit contacts on the first surface of the circuit module. An interposer between the board and the first surface of the circuit module, includes conductors between the circuit contacts in the array of circuit contacts on the circuit module and board contacts in the array of board contacts on the board. A thermal bridge member contacts the second surface of the circuit module. A heat spreader contacts the thermal bridge member to dissipate the heat over a large region.

Abstract: An electrical receptacle assembly with an enhanced heat dissipation arrangement includes a housing having a front side with plug contact receiving openings and a rear side spaced from the front side, a circuitboard mounted in the housing between the front and rear sides thereof and spaced from the rear side, a plurality of varistors mounted to the circuitboard and disposed between the circuitboard and the rear side of the housing, and a mounting bridge fitted over the exteriors of the rear side and top and bottom ends of the housing for mounting the housing to an outlet box and providing a heat sink for dissipating from the housing heat generated by the varistors. The varistors are mounted to the circuitboard in the housing on the front side thereof opposite to the rear side where the electrical components are mounted to the circuitboard.

Abstract: A circuit card having module strain relief and heat sink support is provided. The circuit card comprises a printed circuit board having a front and a back, a module mounted to the front of the printed circuit board, and a stiffening structure mounted to the back of the printed circuit card directly opposite from the module to provide rigidity to the printed circuit board. The module has a plurality of electrical leads making electrical connection with the printed circuit board and anchoring the module to the printed circuit board. The stiffening structure is coextensive with the plurality of electrical leads along the printed circuit board, and is of sufficient thickness and strength to resist flexure of an area of the printed circuit board in contact with the stiffening structure in response to shock and vibration applied to the module.

Abstract: A socket for receiving an IC chip having ball-shaped pins is disclosed. The socket includes a base having a plurality of through holes defined therein, a sliding cover housing the base and having a central opening for permitting the IC chip to be inserted therethrough, and an actuating rod located between the base and the cover for causing a sliding movement of the cover relative to the base. Each of said through holes has a contacting leg disposed therein and said leg has a first end extending beyond an upper face of the base and a second end extending through a bottom of the base. Said first end has an arcuate surface which is perpendicular to the sliding movement of the IC chip and has a curvature equal to that of the ball-shaped pin of the IC chip so as to make an electrical surface contact with the ball-shaped pin when the IC chip is moved to be fastened on the base.

Abstract: Light socket improvements include a thermal conductor which removes heat by inducing a flow of air within the socket and/or which acts as heat sink that more efficiently transfers heat to the socket support thereby enabling use of higher wattage light bulbs. The conductor may, if desired, also function as a control signal input. Other improvements simplify wiring procedures and assure safety by providing a lockable internal chamber for power terminals within the socket housing. Some embodiments of the invention include electronic control circuits and enable selection of any of a variety of modes of controlling the light sockets by touch or by other forms of signal input including remote control and optional joint or independent control of individual sockets in a light fixture which has a plurality of sockets.

Abstract: A control device, in particular for motor vehicles has a metal housing, a printed board provided with a circuit and surrounded at least partially by the metal housing, a plug connection having a plug insert with at least one plug contact connected with the printed board, and a metal casing which at least partially surrounds the plug insert. The casing extending substantially inside the housing close to the printed board.

Abstract: The improved connector box assembly of the present invention includes mating male and female connectors, each of which is insulated in a novel manner to prevent manual touching, especially of the male probe during electrical connection, and also to prevent manual touching of the electrically live female conductor when not engaged with the male connector element. The female electrical receptacle is recessed within elongated neck-like electrical insulation means for disposition over one end of the female electrical receptacle and to permit relatively snug entry thereinto of the male electrical probe. The female electrical receptacle is a substantial distance front the orifice of the elongated neck means of such insulation.

Abstract: A socket assembly for mechanically and electrically coupling an integrated component with an interfacing carrier includes a socket body for receiving the integrated component, a retaining spring hingedly connected to the socket body for retaining the integrated component within the socket body, and at least one post element. The socket body includes at least one generally cylindrical receiving member having at least a portion protruding through an aperture in the interfacing carrier which is deformable to engage the socket body with the carrier when the post element is received within the receiving element. The socket body also includes a first mounting surface having plurality of holes for receiving wadded button contacts and a heat transfer element in contacting relation with the mounting side of the integrated component.

Abstract: In a header assembly, for interconnecting an electronic module to a mother board, including an insulating strip and at least one row of spaced-apart pins inserted through holes between an upper face and a lower face of the strip, each of the pins having an upper portion projecting from the upper face and being shaped and dimensioned to interconnect with the module, and a lower portion projecting from the lower face and being shaped and dimensioned to interconnect with the mother board, any adjacent two of the pins being separated by a length of the strip, the improvement which includes a plurality of collars of heat-dissipating material, one of the collars mounted around and in intimate contact with each of the pins, the collars having a peripheral outline shaped and dimensioned to avoid electrical contact with an adjacent pin.

Abstract: A connector for attaching a heat sink or other device to a circuit board comprising an attachment portion for connecting to the device, the attachment portion having a pair of legs, each with a projection on its end, the legs being spring-biased so that once the projections pass through the hole, the projections expand and engage the surface of the board or edges of the holes opposite the device.

Abstract: A phased array radar, solid state, module retention apparatus having a tool operated tubular assembly at an antenna radiator end of a dual channel T/R module and a wedge structure at the module's connector end. A single rotational motion of the tubular assembly by the tool is translated into linear motion in two orthogonal directions. During installation of the module into a subassembly tray, the tubular assembly translates the module into the connector and wedge structure while simultaneously locking the module in place and applying compressive forces that press the module base at the antenna radiator end of the module against a cold plate of the tray. The wedge structure forces the module base at the connector end of the module the cold plate of the tray as the module translates into the tray connector. The tubular assembly has a helical cam that translates the module toward the connector as it is rotated.

Abstract: An integral shell (150) for connectors (102,132) mounted to an edge of a circuit card (100,130). The connectors are secured in cavities (152) of the shell, and the cavities are precisely referenced to a single datum defined by an alignment or datum post (160). A corresponding alignment hole (162) of the circuit card is precisely positioned with reference to the arrays of termini of the circuits, and upon mounting of the shell to the card with the datum post (160) received in the alignment hole (162), the contact sections of the terminals of the several connectors (102,132) remain precisely aligned with the termini and their terminations protected against stress during handling, mating and unmating.

Abstract: An electrical plug-receiving receptacle includes a housing enclosure with an opening and a cover for closing the opening. The housing enclosure has walls defining at least a portion of the periphery of the opening, including an outside wall and a generally flexible inside wall spaced from the outside wall. The inside wall has an aperture spaced from the opening. The cover includes a generally rigid inner arm for positioning inside the flexible inside wall of the housing enclosure and a generally rigid outer arm for positioning between the inside and the outside walls of the enclosure. The inner and outer arms define a tortuous passage therebetween for insertion thereinto of the inside wall of the housing enclosure. The inner arm has a latching nib for latching engagement in the aperture in the inside wall of the enclosure. The inside wall must bend when inserted into the tortuous passage. The cover may include a heat sink.

Abstract: A presser cover 2 is open- and closably connected to a socket body 1 through a pivotal hinge. A metal frame 13 is embedded in a synthetic resin frame 12 forming a heat discharging opening portion 10 in the presser cover 2. This metal frame 13 can be used as a bearing portion of the pivotal hinge, etc. and also as a static electricity discharging means.

Abstract: A unitary strip of thermally and electrically conductive spring material is formed with two rows of spring fingers formed at one end which have frictionally engaged therebetween the bus bar or plate of a solid-state device such as an FET having leads soldered to a printed circuit board. The opposite end of the strip is fastened mechanically to a conductive heat sink block on the circuit board. The strip provides electrical power, support for, and heat sinking of the solid-state device.

Abstract: A test socket for testing of semiconductor devices. The socket includes a plurality of electrical contacts mounted within a housing, a cover, and a pressure applicator which serve to prolong test life of the contacts. The pressure applicator is mounted to the cover by use of an elastomeric element which compliantly holds the applicator to the cover. The socket construction, thereby, serves to prevent damage to leads of an integrated circuit device held by the socket.

Abstract: A unitary heat sink and connector housing (10, 10', 10", 10"') is disposed between a pair of electrical members, such as printed circuit boards (11, 12, 31) and/or flexible etched circuits (32) in an overall assembly used in a variety of high-performance miniaturized electronic products. One or more flexible electrical connectors (21, 25, 26, 29, 30) are mounted within the unitary heat sink and connector housing (10, 10', 10", 10"') and provide a circuit interface between respective circuit elements or pads (13, 14) on the printed circuit boards (11, 12, 31) and/or flexible etched circuits (32), respectively. The unitary heat sink and connector housing (10, 10', 10", 10"'), which preferably has heat-radiating fins (20), is made from a material which is thermally conductive but electrically non-conductive. Examples of such a material are anodized aluminum, silicon dioxide and beryllium oxide. Any suitable ceramic material could be used.

Abstract: It is an object of the invention to provide an electronic circuit device in which semiconductor elements, resistors, capacitors and the like are packaged onto an insulating substrate such as a ceramic substrate or the like, wherein high-density packaging is realized. A circuit module comprises a terminal section having an annular insulating frame body and a plurality of terminals provided on respective portions of the frame body to extend outwardly therefrom, and a circuit substrate having wiring patterns each adapted for connection with the respective terminals of the terminal section and packaging to one surface of the circuit substrate surface packaging parts, the circuit substrate being connected to the terminals with the surface packaging parts directed toward the inside of the terminal section. One circuit module is stacked on the other circuit module to be connected to the latter by the terminals. Thus high-density packaging can be readily realized.

Abstract: A socket for receiving an electric part has a presser cover openably and closably connected to a socket body through a pivotal hinge. Metal frames are embedded in a synthetic resin frame defining an opening in the presser cover at the position of the electric part. The metal frames can be used as bearing portions of the pivotal hinge. Holes in the presser frame through which the metal frames are exposed permit the metal frames to act as a static electricity discharging device.

Abstract: A radiating device for radiating heat of an electronic component to the atmosphere, includes a container body, a cap for tight-sealing the inner space of the container body, and a working fluid serving as a heat carrier kept in the container body. The bottom wall of the container body is flat and serves as a heat receiving portion. The working fluid repeats evaporation and condensation in the container body. In a corner where the inner surface of the bottom wall of the container body meets the inner surface of a vertical cylindrical wall, a loop groove is formed running all along the corner. A plurality of horizontal grooves intersecting the loop groove are formed on the inner surface of the bottom wall. A plurality of second grooves intersecting the loop grooves are formed on the inner surface of the cylindrical wall. The working fluid condensed at the heat radiating portion returns to the bottom wall through the vertical grooves and through the loop groove.

Abstract: A thermal transfer plate for removing heat to a heat sink or cooling fins positioned between an electrical component and a mounting surface. The plate comprises a heat conductive material which is in thermal communication with the electrical component and extends beyond the electrical component to establish thermal communication with a heat sink or cooling fins. In one specific embodiment, the thermal transfer plate has a base portion with upright side walls which form a socket to receive the electrical component. Horizontal cooling fins are located at the top of the sidewalls. The cooling fins can be of any shape which will perform the cooling or heat sink function and can be made with openings which permit air to circulate through the cooling fins. Moreover, due to its efficient heat transfer capabilities, the thermal transfer plate could be thermally connected to a separate heat sink device.

Abstract: An electrical connector assembly includes a pair of spaced receptacle modules mounted to a first printed circuit board which is electrically coupled to a second printed circuit board spaced from and generally parallel to the first printed circuit board. A conductive ground plate is electrically coupled between the printed circuit boards and mechanically supports the circuit boards in their spaced generally parallel relationship. The ground plate is disposed perpendicular to the first and second printed circuit boards forming two separate compartments between the first and second printed circuit boards to provide electromagnetic interference isolation between the compartments. An electrical component such as transformer may be mounted on one side of the ground plate between the spaced generally parallel printed circuit boards, and the ground plate provides a heat sink for the transformer.

Abstract: A multi-chip module electrical and thermal conducting apparatus is provided. The apparatus is disposed between layers or boards of the module and includes electrical conducting traces. Electrical conductors are deposited on the faces of the layers and the traces electrically interconnect the electrical conductors of the two layers. The traces are joined to an elastomeric body and insulating material that are essentially non-conductive of electrical and thermal energy. The apparatus includes a thermal conduction unit that acts as a thermal shunt around the body and insulating material. The thermal conduction unit is electrically isolated from the traces. Thermal energy is received by the thermal conduction unit when heat is generated by the activation of electronic components mounted on the module layers. The thermal energy received by the thermal conduction unit is carried away by thermal vias formed in the module layers.

Abstract: A thermally controlled bi-pin lamp socket includes a pair of female, electrically-conductive receptacles, laterally spaced apart in a parallel relationship in a common plane, each female receptacle is an elongated tube with an internal surface at a first end mechanically and electrically engageable with the pins of a bi-pin lamp. The second end of each receptacle has a means for connection to a source of electrical power. The receptacles are retained in a ceramic housing having a generally flat configuration. The housing has upper and lower walls having internal surfaces in contact with external surfaces of the female receptacles. Heat-conductive metal radiators are held against the external walls of the ceramic housing by screws with nuts and spring washers.

Abstract: An electrical socket (1) comprises, a lever (21) pivotally attached to a base housing (4), a cam (25) rotatable by pivoting the lever (21), the cam (25) having a lobe (26) for urging a cover (7) slidable along the housing (4) to urge electrical leads (3) of an electronic package (2) into engagement with electrical contact elements (6) in the housing (4), and the lever (21) being constructed as a bail for opening the socket (1) to permit low insertion force insertion of the electrical leads (3).

Abstract: A substrate heater for the production of superconducting films utilizing a nickel alloy block uniformly heated with a resistance heating element fully immersed in a brazing material that fills a recess in the block. Massive electric power connectors surround the heating element leads outside the braze material so as to provide a protective heat sink therefor and also to mechanically strengthen the block against warpage.

Abstract: Disclosed is a burn-in test socket which serves as a temporary package for integrated circuit die, multichip hybrid or a complete wafer without damaging the bonding pads or insulating passivation on the die during test and burn-in.

Abstract: A socket comprises a housing member having a recess for receiving an electronic package therein, the housing member supporting a plurality of contact members for making contact with respective leads of the electronic package. A cover is pivotally mounted on the housing member for covering the electronic package received in the recess and for holding the electronic package therein under pressure. An adapter is provided for receipt in the housing member, the adapter having means for receiving and aligning the leads of the electronic package in a preferred pattern. The adapter has an opening therein arranged to communicate with the electronic package in assembly. The cover is made of aluminum or other good thermally conductive material and includes a recessed portion projecting inwardly through the adapter opening for making contact with the electronic package. As such, in assembly, heat generated by the electronic package is effectively released through the cover.

Abstract: An isothermal block has a multi-layer thermal conductor interleaves with different layers of a printed circuit board to provide improved thermal coupling of input terminals and a local temperature sensor mounted on the isothermal block. Each of the layers of the thermal conductor is substantially thinner than substrate layers of the printed circuit board. The layers of the thermal conductor are spaced apart from the terminals so as to be electrically isolated from the terminals. Embedded layers of the thermal conductor are spaced closer to the terminals than are external layers of the thermal conductor.

Abstract: The present invention relates to an active plug-in function unit, intended for plugging into a multipolar plug contact device on a circuit board or back plane, and comprises a base plate, a connector, an electronic circuit and a cover. According to the invention, the connector is a module-type multipolar sleeve connector (3) mounted on one end of the base plate (2), the base plate extending in the direction of the sleeve connectors. The electronic circuit (4) is mounted on the base plate (2) and connected to the sleeve connectors. The cover (5) is preferably made of metal and is placed over the electronic circuit (4) and, together with the base plate (2) and the sleeve connector (3), forms an EMC-casing around the circuit. The dimensions of the function unit are such that its projection, when plugged into the circuit board (A) or the back plane (B), falls within the dimensions of the plug contact device (C).

Abstract: The invention is directed to an electric plug connector having a cooled connector component on a consumer where an intense heat is generated. The plug connector includes a movable connector component having a flexible supply line and both connector components are configured with heat-contact surfaces which define a low heat resistance when in contact with each other. In the movable connector component, at least one electrical line part is connected to a part made of a good insulating and heat-conductive material. The flow of heat to the heat-contact surface of the movable connector component takes place through this part made of insulating and good heat-conductive material.

Abstract: An I/O relay interface module for mounting a plurality of relays which are adapted to be connected to individual external I/O devices to be controlled or monitored by a central controller. The I/O module comprises a plurality of relay sockets for detachably receiving the relays, respectively, and a terminal section including wire terminals internally connected to the relays through the sockets for connection between the relays and the external devices. An I/O connector is provided on the I/O module for connection with the central controller to receive therefrom control signals for energizing the relays for control of the associated devices or transmit to the central controller monitor signals from the relays as indicative of the operation of the associated devices.

Abstract: Described is an improvement for thermal enhancement technology for high power dissipating plastic packaged electronic circuit chips derived from providing structural features in the plastic package adapted to snap fit with complementarily formed edges of heat sink members.

Abstract: A heat sink assembly to dissipate heat from electrical components to a housing is made in which the housing is formed from a suitable heat sinking material including a body with integral continuous walls extending from the perimeter of the body. A carrier mechanism which retains a plurality of electrical components is positioned within the housing. The electrical components have heat sink tabs which are positioned in the housing such that the tabs are coupled with the housing to dissipate heat from the electrical components to the housing. A resilient biasing member including a plurality of resilient fingers is coupled with the carrier mechanism to retain the carrier and electrical components in position on the housing.

Abstract: A multiple-plate hybrid device with integrated heat dissipation for thick-film hybrid substrates containing hybrid circuits in which the thick-film hybrid substrates are inserted in metal frames of a metal housing and at least partially coupled with portions of the metal frames for dissipating the occurring heat.

Abstract: A heat dissipating connector assembly is provided for use in retrofit applications to replace the electrical connector within the housing of an existing light fixture. In one embodiment thereof, the connector assembly includes a hollow, externally finned cooling body having a graphite foil-lined socket opening formed through a forward end portion thereof. The socket opening communicates with an enlarged cavity within a rear portion of the body which captively retains a connector formed from two stacked metal block pairs encapsulated within and separated by silicon insulating material. Pin openings are formed through the block pairs along the junctures between their individual blocks. Entry of the pins into the block openings slightly separates the blocks in each pair thereof, against the resilient force of the insulation material, to create an automatic "pin-wiping" action.

Abstract: A photoelectric control unit for street lighting comprises control means including a photoelectric sensor mounted on a printed circuit board for switching on a street lamp when the intensity of light falling on the sensor falls below a preset value. Electrical connection means between the P.C.B. and the lamp is provided by three connector pins which are led through a cooling chamber or stem. The pins are cranked to closely follow the contour of the chamber to dissipate heat through the chamber walls. The chamber is also filled with a high thermal conductivity potting compound for heat transfer to the walls of the chamber.One controller for such a photoelectric control unit includes a switching means provided by a relay and a triac connected in parallel. The triac operates to prevent the relay being subjected to high voltages during switching and hence prevents pitting of the relay contacts.

Abstract: A structure for mounting an electronic apparatus comprises a pair of opposed side members each having front and rear ends for guiding the apparatus between the front and rear ends of the structure. A rear member has a coupling element for establishing an electrical connection with the electronic apparatus. To make the apparatus retractable with a minimum of effort, the rear member is arranged to movably engage the side members so that when the apparatus is removed from the structure, the rear member is also moved with it, over a predetermined distance, allowing the apparatus to be more firmly gripped for further removal with a greater force that is sufficient to disengage the coupling elements from each other.

Abstract: Dissipation of heat from a socketed leadless electronic chip-carrier package is promoted by a heat-conducting metal socket cap distinctively overlying and guiding heat away from the socketed package fully along a broad planar surface area, the socket cap being of a unitary construction which both mechanically holds the package securely mated with a multi-pin socket and also cools the package by way of an integrated array of heat-radiating elements; edge clasping of the cap with a chip-carrying socket avoids interference with needed conduction of heat away from central areas of the package and cap.