Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc. Patents (Class 439/55)
  • Patent number: 11934233
    Abstract: Disclosed is a control method for an audio device, the audio device includes a wireless charging module and a display screen, and the control method for the audio device includes the following steps: in response to detecting a mobile device is placed on the audio device, acquiring a screen placement state of the mobile device, the screen placement state includes at least one of a screen flat state, a screen horizontal state and a screen vertical state; and displaying display content of the display screen on a screen of the mobile device according to the screen placement state. This disclosure further provides an audio device and a computer-readable storage medium. The problem that the display effect of the display screen of the audio device will be affected when the audio device performs wireless charging for the mobile device has been solved.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: March 19, 2024
    Assignee: GOERTEK INC.
    Inventors: Haipeng Zhou, Li Ding, Shumin Zhou, Xiaochen Wang, Ke Dong
  • Patent number: 11936800
    Abstract: A case system includes first and second electrical connector assemblies coupled to an exterior side of a recess of a base of a rear assembly. The recess is couplable to a card reader so that the card reader when in a first position electrically couples to the first electrical connector assembly and when in a second position is oriented 180 degrees from the first position to electrically couple to the second electrical connector assembly. Other aspects are described in the claims, drawings, and text forming a part of the present disclosure.
    Type: Grant
    Filed: November 6, 2023
    Date of Patent: March 19, 2024
    Assignee: Pioneer Square Brands, Inc.
    Inventors: Vrushank Deepak Balutkar, Riley Edwin Lynch, Quentin Wade Forbes
  • Patent number: 11923634
    Abstract: A connector assembly includes a cage, a receptacle connector and a partitioning frame. The receptacle connector is positioned in a rear segment of the cage and has an upper card slot and a lower card slot. The partitioning frame includes a compartment bracket and an extension bracket, the compartment bracket is provided in the cage, and the compartment bracket and the cage together define an upper receiving space which corresponds to the upper card slot and a lower receiving space which corresponds to the lower card slot, a rear end of the compartment bracket is positioned in front of the upper card slot and the lower card slot. The extension bracket is assembled to a rear end of the compartment bracket and is capable of moving relative to the compartment bracket between a front position and a rear position.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: March 5, 2024
    Assignee: Molex. LLC
    Inventor: Ming-Huei Kao
  • Patent number: 11924960
    Abstract: Provided is a circuit board on which a circuit component is mounted on one side, and a recess is formed at a position corresponding to the circuit component on the other side, and the circuit board includes a first heat conductive member that is provided inside the recess and conducts heat generated by the circuit component.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: March 5, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Akira Haraguchi
  • Patent number: 11908635
    Abstract: To reduce the occurrence of capacitor mounting failure on a circuit board in the solder reflow process, the capacitor element is housed in the bottomed cylindrical outer case and sealed with a sealing member the open end of the outer case, the lead terminal derived from the capacitor element is formed through the sealing member a capacitor body, a base having a bottom surface portion and a side wall formed so as to surround the outer periphery of the capacitor body with a through hole through which the lead terminal penetrates, a capacitor having a convex portion protruding toward the capacitor body from the inner surface of the side wall, the caulking portion formed by caulking the side surface of the outer case the convex portion is disposed, providing a gap portion between the caulking portion and the convex portion.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: February 20, 2024
    Assignee: NIPPON CHEMI-CON CORPORATION
    Inventor: Kentaro Kobayashi
  • Patent number: 11901668
    Abstract: A modular device includes a polyhedral building element having a first type connector and a number of second type connectors; and a main control module comprising a plurality of second type connectors. The first type connector and the second type connectors are disposed on side surfaces of the building element. One of the second type connectors of the main control module is used to magnetically connect with the first type connector of the building element so as to detachably connect the building element to the main control module. The first type connector includes a first detection circuit, and each second type connector includes a second detection circuit.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: February 13, 2024
    Assignee: UBTECH ROBOTICS CORP LTD
    Inventors: Wei He, Youjun Xiong
  • Patent number: 11901667
    Abstract: Protective cover devices for associated electrical connectors include a one-piece molded polymeric body including at least one of: (i) at least one stud that is closely slidably received into a corresponding socket of the connector; (ii) a skirt that comprises a recess that receives at least part of the electrical connector therein. The protective cover device is adapted to be engaged with the associated electrical connector to inhibit contact between a surrounding corrosive atmosphere and at least one electrical contact of the associated electrical connector.
    Type: Grant
    Filed: February 13, 2023
    Date of Patent: February 13, 2024
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Garron Morris, Garrett Wolff, Craig Devroy, James Carter, Christopher Genthe, Nicholas De Leo
  • Patent number: 11895797
    Abstract: An electrical device includes a connection part and a cover part connected to the connection part. A mounting part is accommodated and situated in the connection part, and a first circuit board is connected to the mounting part in a coded manner. A second circuit board is situated in the cover part, which is connected to a frame part in a coded manner. The first circuit board is connected to a plug connector part, and the second circuit board is connected to a mating plug connector part. A leading guide for a plug connection is provided on the mounting part, which becomes active when the cover part is connected to the connection part. The frame part being able to be connected to the mounting part in a coded manner.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: February 6, 2024
    Assignee: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Franz Daminger, Ralph Mayer
  • Patent number: 11719639
    Abstract: Some aspects relate to an integrated circuit, comprising at least one photodetection region configured to generate charge carriers responsive to incident photons emitted from a sample, at least one charge storage region configured to receive the charge carriers from the photodetection region, and at least one controller configured to obtain information about the incident photons, the information comprising at least one member selected from the group comprising pulse duration and interpulse duration and at least one member selected from the group comprising wavelength information, luminescence lifetime information, and intensity information. In some embodiments, the information comprises at least three, four, and/or five members selected from the group comprising wavelength information, luminescence lifetime information, intensity information, pulse duration information, and interpulse duration information. In some embodiments, the information obtained may be used to identify the sample.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: August 8, 2023
    Assignee: Quantum-Si Incorporated
    Inventors: Gerard Schmid, Dajiang Yang, Eric A. G. Webster, Xin Wang, Todd Rearick, Changhoon Choi, Ali Kabiri, Kyle Preston, Brian Reed
  • Patent number: 11717194
    Abstract: A regional oximetry pod drives optical emitters on regional oximetry sensors and receives the corresponding detector signals in response. The sensor pod has a dual sensor connector configured to physically attach and electrically connect one or two regional oximetry sensors. The pod housing has a first housing end and a second housing end. The dual sensor connector is disposed proximate the first housing end. The housing at least partially encloses the dual sensor connector. A monitor connector is disposed proximate a second housing end. An analog board is disposed within the pod housing and is in communications with the dual sensor connector. A digital board is disposed within the pod housing in communications with the monitor connector.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 8, 2023
    Assignee: MASIMO CORPORATION
    Inventors: Ammar Al-Ali, Kevin Forrest, David Dalke, Walter M. Weber
  • Patent number: 11700701
    Abstract: The present disclosure relates to the field of display technologies, and provides a display apparatus, including: a support and a display module, wherein the support includes a support part and a rotation part; a frame is disposed at a periphery of the display module, and includes two first frame segments which are oppositely arranged and two second frame segments which are oppositely arranged; one end of the rotation part is pivoted to the support part; a rotation axis of the rotation part is a center line of the rotation part; the other end of the rotation part is fixedly connected to any one of the first frame segments or the second frame segments; the axis of the rotation part is at a first included angle with the frame; and the first included angle is used for switching of the display module between a landscape-screen mode and a portrait-screen mode.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: July 11, 2023
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Yao Zhang, Guoshuai Zhu, Jinghua Yang
  • Patent number: 11678433
    Abstract: Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: June 13, 2023
    Assignee: D-WAVE SYSTEMS INC.
    Inventor: Richard D. Neufeld
  • Patent number: 11664615
    Abstract: A circuit board includes a terminal area projecting from an end face of the circuit board. The terminal area is flush with a front side and a back side of the circuit board and has a thickness equal to the circuit board. The terminal area has a plurality of sides covered with an electrically conductive material, the sides including a first surface flush with a front side of the circuit board, a second surface flush with a back side of the circuit board, and a pair of side surfaces that intersect the first surface and the second surface.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: May 30, 2023
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Yohei Sakurai, Daisuke Dobashi
  • Patent number: 11647585
    Abstract: A flexible printed circuit for bridging is provided. The flexible printed circuit has at least one via, at least one overflow groove is provided at a first distance from an edge of the via, and the overflow groove is provided in a cover layer on a side of a soldering surface of the flexible printed circuit.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 9, 2023
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xiaolong Zhu, Hengzhen Liang
  • Patent number: 11640860
    Abstract: A circuit module includes an interposer, and the interposer includes an element body including a first surface, a first interposer terminal provided on the first surface of the element body, and connected to a first external element, a second interposer terminal provided on the first surface of the element body, and connected to a second external element, a first wiring provided in the element body, and electrically connecting the first interposer terminal and the circuit board with each other, a second wiring provided in the element body, and electrically connecting the second interposer terminal and the circuit board with each other, and a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the second interposer terminal with each other.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: May 2, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Keito Yonemori, Hirokazu Yazaki, Takanori Tsuchiya
  • Patent number: 11628779
    Abstract: A head-up display for a vehicle in which an assembly structure of a screen and a picture generation unit (PGU) is reinforced. The head-up display for a vehicle according to one embodiment includes a lower case embedded with a board assembly, and a screen connected to the lower case in a plurality of directions and snap-fit-coupled to the lower case by passing through the board assembly in at least one direction.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: April 18, 2023
    Assignee: Hyundai Mobis Co., Ltd.
    Inventors: Byung Ki Kim, Chan Seo Goo
  • Patent number: 11616313
    Abstract: A compute system is provided that includes cables that are terminated to a grid array connector that is mounted on a substrate that has an integrated circuit packaged mounted thereon. The cables include conductors that are electrically connected to the integrated circuit via terminals supposed by the substrate.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: March 28, 2023
    Assignee: Molex, LLC
    Inventors: Brian Keith Lloyd, Gregory Walz, Colby Waggener, Karen Hille, Bruce Reed, Sagar Dalvi, Chitaou Tsai
  • Patent number: 11606869
    Abstract: An engine control system includes an integrated engine control module assembly having an engine control module and an adapter module. The integrated engine control module assembly further includes a first connector, a second connector, and a hermetic enclosure. The first connector includes a connection circuit configured to connect the integrated engine control module assembly to engine hardware. The second connector is configured to connect the adapter module to engine hardware. The hermetic enclosure houses the engine control module and is configured to protect the engine control module from environmental conditions.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: March 14, 2023
    Assignee: Cummins Inc.
    Inventors: Nikhil Pandey, Daniel R. Harshbarger, William D. Meyer, Mark Swain
  • Patent number: 11564737
    Abstract: Medical devices and methods for making and using medical devices are disclosed. An example medical device may include a catheter shaft. An expandable member may be coupled to the catheter shaft. The expandable member may be capable of shifting between a folded configuration and an expanded configuration. A plurality of flexible elements may be attached to the expandable member, with a plurality of electrode assemblies disposed on the flexible elements. The flexible elements may have a grooved substrate.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: January 31, 2023
    Assignee: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: Jeffrey S. Lindquist, Cass A. Hanson, Patrick A. Haverkost, Daniel J. Horn, Martin R. Willard, Derek C. Sutermeister
  • Patent number: 11567533
    Abstract: An electronic device is disclosed, including a housing including a first surface forming a front surface of the electronic device, a second surface facing away from the first surface, and a side surface surrounding an interior space defined between the first surface and the second surface, a key structure forming part of the side surface and extending into the interior space, the key structure including an electrode member partially exposed to an exterior environment, wherein the electrode member partially extends into the interior space, a display disposed in the housing so as to be visible through the first surface from the exterior environment, an internal structure disposed between the display and the second surface, wherein the internal structure includes a printed circuit board, and a conductive structure protruding from the internal structure, wherein the conductive structure is electrically connected with the electrode member of the key structure.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: January 31, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kijung Kim, Youngjae Ko, Junghyun Kang, Taegyun Kim, Jaejong Ryu
  • Patent number: 11522320
    Abstract: A circuit board includes two first insertion holes, a second insertion hole located on one side of the two first insertion holes, a third insertion hole located on the other side of the two first insertion holes, and a number of grounding points. The grounding points are distributed on a periphery of the first insertion holes. The grounding points, the second insertion hole and the third insertion hole together form a shielding layer surrounding the periphery of the first insertion holes. The present disclosure also relates to a backplane connector assembly having a backplane connector and the circuit board. Compared with the prior art, the circuit board disclosed in the present disclosure improves the shielding effect of differential signal terminals, reduces crosstalk and improves the quality of signal transmission.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: December 6, 2022
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Tao Song, Kun Liu, Rongzhe Guo, Chuanqi Gong, Xiaogang Liu, Ming Li
  • Patent number: 11493944
    Abstract: An electronic device system includes a first electronic device and a power delivery device. The first electronic device is arranged to selectively provide multiple power signals. The power delivery device is arranged to deliver one or more of the power signals. The power signals at least include a first power signal and a second power signal. When the first electronic device detects that the power delivery device is connected to the first electronic device and before a hot plug notification signal is received, the first electronic device provides only the first power signal to the power delivery device. After the first electronic device has received the hot plug notification signal, the first electronic device provides both the first power signal and the second power signal to the power delivery device.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: November 8, 2022
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yueh-Hsing Huang, Sen-Huang Tang, Wu-Chih Lin
  • Patent number: 11375636
    Abstract: Systems, methods, and devices are provided in which cord storage cartridges are removably connected to a power distribution unit (PDU). The cord storage cartridge may include a cartridge housing having at least one aperture, a PDU interface associated with the cartridge housing and configured to removably connect the cord storage device to a mateable interface of the PDU, and a power output cord having a proximal end in electrical communication with the PDU interface and a distal end coupled with an output connector that is configured to connect to electronic equipment. The power output cord may be stowed at least partially within the cartridge housing in a retracted state and moveable through the at least one aperture to an extended state at least partially external to the cartridge housing.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: June 28, 2022
    Assignee: Server Technology, Inc.
    Inventors: Travis Irons, Vimal Bhakta, Jeff Macedo
  • Patent number: 11322429
    Abstract: A circuit module includes a circuit board including an insulating layer, first and second signal conductors, a ground conductor, and a ground conductor layer; and an electronic component including first and second signal terminals and a first ground terminal. The ground conductor includes a first strip portion parallel to the first and second signal conductors. When a portion of the first signal conductor parallel to the second signal conductor and the first signal terminal are set as a first signal wiring line and a portion of the second signal conductor parallel to the first signal conductor and the second signal terminal are set as a second signal wiring line, the circuit board includes a first strip portion connection via conductor that connects the first strip portion and the ground conductor layer in a region where the first and second signal wiring lines are parallel to each other.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: May 3, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yoshiro Maeda
  • Patent number: 11283204
    Abstract: Systems and methods for simultaneously coupling a plurality of high speed electrical connectors to a Printed Wiring Board (“PWB”). The methods comprise: obtaining a composite electrical connector comprising the plurality of high speed electrical connectors which are serially arranged in a side-by-side manner and coupled to each other; automatedly engaging a smooth surface of the composite electrical connector; placing the composite electrical connector on the PWB so that pins of the plurality of high speed electrical connectors are concurrently inserted into vias formed in the PWB; and coupling the composite electrical connector to the PWB by soldering the pins in the vias.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: March 22, 2022
    Assignee: Eagle Technology, LLC
    Inventors: Dale Loch, Michael T. DeRoy
  • Patent number: 11245215
    Abstract: A connector for a display device is capable of visually detecting defects when an FPCB is connected to a PCB in the display device, e.g., a tablet and a smart phone. The connector includes a first gaff-type connection portion disposed at one end portion of a flexible printed circuit board, and a second gaff-type connection portion disposed at one end portion of a printed circuit board and fitted to the first gaff-type connection portion.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: February 8, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinyoung You, Sangyoon Lee
  • Patent number: 11239586
    Abstract: A cable assembly module includes: a front mating member; a rear cable linked behind the mating member and including a pair of signal wires; a pair of signal contacts retained upon the front mating member, each of said signal contacts including a middle retaining section associated with the front mating member, a front mating section spaced from the front mating member in a deflectable manner, and a rear connecting section mechanically and electrically connected to the corresponding signal wires, respectively; and a pair of grounding contacts located by two sides of the pair of signal contacts; wherein the front mating sections are adapted for being directly mated with circuit pads of a printed circuit board disposed in a plane, and the rear cable extends along a direction inclined with the plane.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: February 1, 2022
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jie Zheng, Terrance F. Little
  • Patent number: 11211731
    Abstract: A connector is mateable with a mating connector along a predetermined direction. The mating connector comprises a mating lock portion. The connector comprises at least a connector main. The connector main comprises a holding member, a plurality of contacts and two lock portions. The contacts are held by the holding member. Each of the lock portions has a held portion and a spring portion. The held portion is held by the holding member. The spring portion is resiliently deformable. The spring portion has a locking protrusion and a resilient supporting portion. The locking protrusion and the mating lock portion lock a mated state where the connector and the mating connector are mated with each other. The connector main has a space which is positioned inward in a first direction beyond the spring portion. The space allows resilient deformation of the spring portion.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: December 28, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Junji Oosaka
  • Patent number: 11202380
    Abstract: An engine control system includes an integrated engine control module assembly having an engine control module and an adapter module. The integrated engine control module assembly further includes a first connector, a second connector, and a hermetic enclosure. The first connector includes a connection circuit configured to connect the integrated engine control module assembly to engine hardware. The second connector is configured to connect the adapter module to engine hardware. The hermetic enclosure houses the engine control module and is configured to protect the engine control module from environmental conditions.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: December 14, 2021
    Assignee: Cummins Inc.
    Inventors: Nikhil Pandey, Daniel R. Harshbarger, William D. Meyer, Mark Swain
  • Patent number: 11128068
    Abstract: A circuit board arrangement, and method for assembling at least one connection element, provides a first circuit board and a second circuit board arranged in a parallel orientation to one another in different planes, and at least one rigid connection element communicates between the first and the second circuit boards and the connection element has an exterior housing which encloses an internal conductor part, and the exterior housing constitutes a first electrical path between the first and second circuit boards, and the internal conductor part constitutes a second electrical path between the first and second circuit boards.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: September 21, 2021
    Assignee: ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG
    Inventors: Andreas Gruber, Tobias-Lars Hoeher, Tobias Stadler
  • Patent number: 11056844
    Abstract: A connector has a main portion formed as a part of a multilayer wiring board and having a tongue shape. The multilayer wiring board is provided with a surface conductive layer and an inner conductive layer. The inner conductive layer is located apart from and inward of the surface conductive layer in an up-down direction. The main portion is provided with a grounding plate formed in the surface conductive layer and a plurality of contacts formed in the inner conductive layer. Each of the contacts is, at least in part, exposed and contactable in the up-down direction. Since the grounding plate and the contacts are formed in the conductive layers of the multilayer wiring board, the connector can possess desired electric characteristics in high accuracy.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: July 6, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Kentaro Toda
  • Patent number: 11038310
    Abstract: A bidirectional duplex electrical connector includes: two insulation seats; two rows of first terminals, wherein the first terminal has an elastically movable portion, a fixing portion and a pin, a front section of the elastically movable portion is curved to form a contact, and a rear section of the elastically movable portion and the fixing portion horizontally rest against the insulation seat, the insulation seat has a fixing structure fixing the fixing portions of the two rows of first terminals, and the rear sections still can elastically move; one row of second terminals, wherein the second terminal has two elastic arms each having a contact projecting toward a middle, and the second terminal has a vertical plate surface; and a metal housing covering the two insulation seats.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: June 15, 2021
    Assignee: KIWI INTELLECTUAL ASSETS CORPORATION
    Inventor: Chou Hsien Tsai
  • Patent number: 10993345
    Abstract: A storage card insertable into a host system is provided that includes a plurality of storage devices connectors. The storage card include slot offset features to offset a circuit board of the storage card from a host system slot alignment. This offset provides for storage device connector placement on both sides of the storage card. The storage card also can include a Peripheral Component Interconnect Express (PCIe) switch circuit configured to communicatively couple the PCIe signaling of the plurality of storage device connectors and PCIe signaling of a host connector of the storage card, where the PCIe switch circuit is configured to receive storage operations over the PCIe signaling of the host connector of the storage card and transfer the storage operations for delivery over the PCIe signaling of selected ones of the plurality of storage device connectors.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: April 27, 2021
    Assignee: Liqid Inc.
    Inventors: Bryan Schramm, Andrew Rudolph Heyd, Brenden Michael Rust, Christopher R. Long, Sumit Puri
  • Patent number: 10973137
    Abstract: An ECU 1 includes a circuit board 10, a connector 20 fixed to the circuit board 10 and a resin portion 50 covering the circuit board 10 and the connector 20. The connector 20 includes a housing body 22 and a cut-off receiving portion 27 projecting from the housing body 22. The cut-off receiving portion 27 includes a flange portion 28 projecting outward from the housing body 22 and a flexible wall 29 extending from the flange portion 28 and inclined to be closer to the housing body 22 toward a tip, and a part of the flexible wall 29 is embedded in the resin portion 50.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: April 6, 2021
    Inventors: Hirokazu Komori, Naomichi Kawashima, Hiroki Hirai, Makoto Higashikozono, Masanori Moriyasu
  • Patent number: 10957997
    Abstract: A connector assembly includes, a housing, a circuit board that includes a conductive front pad and a conductive rear pad electrically connected to the front pad, and a cable that includes an insulated conductor having a conductor surrounded by an insulating material. The conductor has a diameter not greater than 24 AWG. The uninsulated front end of the conductor is terminated at the rear pad and includes a preformed bend. The connector assembly also includes a recess formed in an external surface and on a lateral side of the housing. The recess is designed to receive and house a spring member of a pull tab that is assembled to the housing. The vertical separation between the recess and the circuit board is h, the average thickness of the cable is t, and h?3t. The preformed bend may include first and second portions connected by a substantially flattened joint.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: March 23, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: YunLong Qiao, Saujit Bandhu, Kok Hoe Lee, Vincent Tan
  • Patent number: 10949361
    Abstract: A solid state disk comprising includes a plurality of protected flash memory modules each having a plurality of flash memory devices, a flash memory controller, power protection circuitry and interconnect interface. Each of the protected flash memory modules is removably inserted into a socketed interconnect and coupled thereby to a circuit board having a multicore flash processor, host interface and program code store. The multicore flash processor executes program code stored in the program store to enable an external agent interacting with the solid state disk via the host interface to perceive the solid state disk as having a single flash controller instead of the multiple flash controllers disposed respectively on the protected flash memory modules.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: March 16, 2021
    Assignee: Nimbus Data, Inc.
    Inventor: Thomas Isakovich
  • Patent number: 10868101
    Abstract: A display apparatus includes a substrate, a wire having an inner edge including first and second portions, a first insulating layer covering a portion of the substrate, and a second insulating layer. The portion of the substrate covered by the first insulating layer is closer to a center of the substrate than the wire, the first insulating layer covers a part of the first portion of the wire and a part of the second portion of the wire, and a first end of the first insulating layer is disposed on the wire. The second insulating layer covers the first insulating layer and has a second end disposed on the wire. A distance between the first end and the second end covering the first portion of the wire is different from a distance between the first end and the second end covering the second portion of the wire.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: December 15, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kiwook Kim, Kwangmin Kim, Yangwan Kim, Jisu Na, Minwoo Byun
  • Patent number: 10862233
    Abstract: A power interface (100), a mobile terminal and a power adapter are provided. The power interface (100) includes a body portion (110), data pins (120) and power pins (130). The body portion (110) is configured to be coupled to a circuit board, and there are multiple spaced data pins (120) connected with the body portion (110). There may be multiple spaced power pins (130) connected with the body portion (110). The power pins (130) and the data pins (120) are arranged at intervals. At least one of the multiple power pins (120) includes a widened section (132), and a cross-sectional area of the widened section (132) is greater than a cross-sectional area of each of the data pins (120) to increase a current load capacity of the power pin (130).
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: December 8, 2020
    Assignee: Guangdong OPPO Mobile Telecommunications Corp., Ltd.
    Inventors: Guodong Gu, Feifei Li
  • Patent number: 10804650
    Abstract: Electrical connector technology is disclosed. In one example, a connector for coupling an electronics sub-assembly to an electronics assembly comprises a connector body having and a sub-assembly interface configured to electrically couple to an electronics sub-assembly. The connector has a circuit board interface configured to electrically couple to a circuit board of an electronics assembly. The connector has at least two rows of contacts configured to electrically couple the circuit board to the electronics sub-assembly. The at least two rows of contacts are aligned offset relative to each other such that any ground contact of one row avoids intersection of a plane in which any ground contact of the other row resides to at least partially cancel row-to-row crosstalk when the at least two rows of contacts are transmitting signals at a predetermined high-speed bit rate.
    Type: Grant
    Filed: December 31, 2016
    Date of Patent: October 13, 2020
    Assignee: Intel Corporation
    Inventors: Jeffrey Lee, Brent R. Rothermel, Kemal Aygun
  • Patent number: 10775427
    Abstract: A circuit board for transmitting a high speed signal and for the high speed signal to be detected comprises a substrate, an insulating layer and two metal printed wires. The insulating layer is disposed on the substrate, and comprises a first surface, a second surface and a test opening, with the first surface facing away from the substrate, the second surface facing the substrate, and the test opening passing through the first surface and formed above the second surface. Said two metal printed wires are configured to transmit the high speed signal and embedded in the insulating layer between the first surface and the second surface. At least one of the metal printed wires comprises a test section which is aligned to the test opening of the insulating layer and exposed by the test opening.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: September 15, 2020
    Assignee: WIWYNN CORPORATION
    Inventors: Yu-Nan Chu, Yung Jung Du, Yi Tang Chen
  • Patent number: 10716232
    Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component (e.g., capacitor) of an electronics assembly, and a radial retention component supported about an inner surface (e.g., annular groove) of the opening of the collar body. The radial retention component (e.g., elastomeric O-ring) is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: July 14, 2020
    Assignee: Raytheon Company
    Inventors: Derek B. Wells, Kenneth P. Walsh, Jr., Gregory S. Renaud, Dimitry Zarkh
  • Patent number: 10680366
    Abstract: A connector assembly and a jumper connector thereof are provided. The jumper connector includes a first jumper connector body case for being coupled to a first board edge connector, a second jumper connector body case for being coupled to a second board edge connector, and conductive terminals. The first and second jumper connector body cases are coupled to each other to form an internal receiving space for accommodating the conductive terminals, and the conductive terminals are movable to correspond in position to the first and second board edge connectors respectively. By such structural design, even if circuit boards incur problems like poor processing quality or position offset, the jumper connector according to the present invention can still effectively bridge and join the board edge connectors on the circuit boards, thereby desirably accomplishing electrical connection between multiple circuit boards on electronic equipment.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: June 9, 2020
    Assignee: TARNG YU ENTERPRISE CO., LTD.
    Inventors: Mu-Jung Huang, Ying-Chung Chen
  • Patent number: 10660228
    Abstract: A storage card insertable into a host system is provided that includes a plurality of storage devices connectors. The storage card include slot offset features to offset a circuit board of the storage card from a host system slot alignment. This offset provides for storage device connector placement on both sides of the storage card. The storage card also can include a Peripheral Component Interconnect Express (PCIe) switch circuit configured to communicatively couple the PCIe signaling of the plurality of storage device connectors and PCIe signaling of a host connector of the storage card, where the PCIe switch circuit is configured to receive storage operations over the PCIe signaling of the host connector of the storage card and transfer the storage operations for delivery over the PCIe signaling of selected ones of the plurality of storage device connectors.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: May 19, 2020
    Assignee: Liqid Inc.
    Inventors: Bryan Schramm, Andrew Rudolph Heyd, Brenden Michael Rust, Christopher R. Long, Sumit Puri
  • Patent number: 10530081
    Abstract: A dual connector assembly includes first and second electrical connectors. The first electrical connector has a first housing holding a first contact. The first housing has a mating end mated with a first mating connector and a mounting end mounted to a circuit board. The first housing has a first mounting block including a first mounting surface. The second electrical connector has a second housing holding a second contact. The second housing has a mating end mated with a second mating connector and a mounting end coupled to the mounting end of the first housing. The second housing has a second mounting block facing the first mounting block such that the second mounting surface engages the first mounting surface to locate the second housing relative to the circuit board. The mounting end of the second housing is held spaced apart from the circuit board by the first electrical connector.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: January 7, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Brian Patrick Costello, William Charles McGee, III
  • Patent number: 10490917
    Abstract: The present disclosure relates to a motor-driving device with an improved structure of a circuit module. According to the present disclosure, the boards are coupled to each other via a connector or a bolt. This removes wires use, and reduces an assembly tolerance, thereby to improve the device productivity.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: November 26, 2019
    Assignee: LSIS CO., LTD.
    Inventors: Hong-Seok Kim, Dong-Sik Kim, Chun-Suk Yang
  • Patent number: 10453383
    Abstract: An embodiment display panel may include a housing including a recess, a substrate disposed in the recess, and a plurality of light emitting diodes (LEDs) attached to a front side of the substrate, in which the plurality of LEDs form a front surface of the display panel. The display panel may further include a back cover enclosing the recess and a back side of the substrate. The back cover may form a back surface of the display panel, and the back cover may be configured to prevent ingress of water or dust through a thickness of the back cover. The display panel may further include a power supply disposed in the recess and physically attached to the back cover and not to the housing or substrate, in which the power supply is configured to power the plurality of LEDs.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: October 22, 2019
    Assignee: ULTRAVISION TECHNOLOGIES, LLC
    Inventors: Matthew Foster, William Y. Hall
  • Patent number: 10448505
    Abstract: A wiring board includes recesses recessed to an inside of the wiring board, in a plan view, in portions connecting a far end surface to side surfaces, and an outer peripheral electroconductive layer disposed over a surface extending from the far end surface to the recesses. To electrically connect an electroconductive member to the outer peripheral electroconductive layer of the wiring board by, for example, joining such as soldering, the electroconductive member can be disposed in the recesses to be connected to the outer peripheral electroconductive layer. This structure prevents the electroconductive member from excessively protruding outward from the surface of the wiring board. Thus, a device having the wiring board installed therein can be made compact.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: October 15, 2019
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventor: Kazushige Akita
  • Patent number: 10431947
    Abstract: An electrical component socket includes a socket body arranged on a circuit board and including a receiving portion configured to receive an electrical component. The socket body includes an arrangement portion in which a row of contact pins to be in contact with leads of an IC package is arranged. At least one of these contact pins and another one of the contact pins adjacent to the at least one of the contact pins have an arrangement pitch that is narrower than a pitch between the terminals of the electrical component, and the other one of the contact pins and still another one of the contact pins adjacent to the other one of the contact pins have an arrangement pitch that is substantially equal to the pitch between the terminals of the electrical component.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: October 1, 2019
    Assignee: ENPLAS CORPORATION
    Inventor: Yuta Sugawara
  • Patent number: 10361498
    Abstract: A board-to-board connector includes a first circuit board and a second circuit board. The first circuit board has at least one cut. The second circuit board includes a tongue assembly disposed corresponding to the cut, a plurality of connection portions disposed on two opposite surfaces of the tongue assembly, and a plurality of conductive portions electrically connected to the first circuit board. Therefore, the board-to-board connector can effectively reduce the distance between the first circuit board and the second circuit board, which is applicable to the increasingly lightweight and compact electronic devices.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: July 23, 2019
    Assignees: NICECONN TECHNOLOGY CO., LTD.
    Inventors: Yi-Fang Chuang, Nai-Chien Chang
  • Patent number: 10355415
    Abstract: An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: July 16, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung Joon Kim, Min-Seok Kim, Sigwan Kim, Jung-Woo Kim