With Provision To Conduct Electricity From Panel Circuit To Another Panel Circuit Patents (Class 439/65)
  • Patent number: 11921550
    Abstract: A circuit board, a display panel and a display apparatus are provided. The circuit board includes a main circuit board and an adapter circuit board stacked on the main circuit board. The adapter circuit board is provided with at least one first pad region, and the first pad region includes a hollowed region penetrating through the adapter circuit board and multiple first pads distributed around the hollowed region. The main circuit board is provided with at least one second pad region including multiple second pads, and the first pads of each of the first pad regions are respectively soldered to the multiple second pads of a corresponding second pad region.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: March 5, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Fan Li, Qiang Tang, Lianbin Liu, Yunhan Xiao, Xiaolong Zhu, Hengzhen Liang
  • Patent number: 11849559
    Abstract: An interconnection structure used in an electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: December 19, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Xuguang Yang, Zhiwen Yang, Shaohua Zhang, Zelong Jiao
  • Patent number: 11837814
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 5, 2023
    Assignee: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, Jr., Mark W. Gailus, Daniel B. Provencher
  • Patent number: 11800645
    Abstract: An apparatus for interfacing with an RF/microwave subsystem is provided. The apparatus includes a printed circuit board that includes: a controller, and a connector constructed to provide control signals and power signals to a subsystem in accordance with instructions from the controller, and a mechanical interface constructed to provide a mechanical connection between the subsystem and the printed circuit board.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: October 24, 2023
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Thomas Petelik, Steven Bode, Matthew Anderson
  • Patent number: 11777244
    Abstract: A socket connector includes an array of socket contacts arranged in rows and columns. The socket contacts have upper mating interfaces for mating with a first electronic package and lower mating interfaces for mating with a second electronic package. The socket contacts are configured to electrically connect the first and second electronic packages. Each socket contact includes an upper cap, a lower cap, and a spring beam helically coiled between the upper cap and the lower cap. The spring beam is compressible. The upper cap, the lower cap and the spring beam are additive manufactured such that the upper cap, the lower cap and the spring beam form a unitary, three-dimensional conductive structure to electrically connect the first and second electronic packages.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: October 3, 2023
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventor: Brian Patrick Costello
  • Patent number: 11777253
    Abstract: A receptacle connector 20 includes a housing 200 in which a recess 203 for housing a plug connector 30 is formed on a side opposite to a surface mounted on a substrate of the housing, a required number of contacts 220 arranged between end portions of the housing 200, and reinforcement metal fittings 230 each of which is provided on one of the end portions of the housing 200. The reinforcement metal fitting 230 has a cantilever resilient piece 235 that extends in the arrangement direction of the contacts 220, and a contact piece 236 that extends from a free end portion of the cantilever resilient piece 235 and comes into contact with the plug connector 30 when the receptacle connector 20 and the plug connector 30 are fitted to each other.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: October 3, 2023
    Assignee: FUJIKURA LTD.
    Inventors: Soichi Sugaya, Kiyotaka Yamada, Yasuyuki Akiyama, Kazunori Takei
  • Patent number: 11721922
    Abstract: When a multipole connector set is viewed from a height direction and when a first ground terminal assembly, a first signal terminal assembly, and a second ground terminal assembly are arranged in a length direction as follows: A connection portion at the outermost side in a width direction of the first ground terminal assembly is a first connection portion, a connection portion at the outermost side in the width direction of the second ground terminal assembly is a second connection portion, a connection portion arranged at the innermost side in the width direction of the first ground terminal assembly is a third connection portion, and a connection portion at the innermost side in the width direction of the second ground terminal assembly is a fourth connection portion. All connection portions of the first signal terminal assemblies are inside a quadrangle connecting the first, second, third and fourth connection portions.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: August 8, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Minoru Mamuro, Daisuke Okubo
  • Patent number: 11721928
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: August 8, 2023
    Assignee: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, Jr., Mark W. Gailus, Daniel B. Provencher
  • Patent number: 11705670
    Abstract: A backplane connector includes a housing, a number of terminal modules, a metal shielding surrounding portion and a mounting block. The housing includes a base, a receiving groove and a number of insulating protrusions integrally extending from the base. The terminal module includes a first signal terminal and a second signal terminal. The first signal terminal has a first mounting foot. The second signal terminal has a second mounting foot. The metal shield surrounding member includes a first tail portion, a second tail portion and a hollow portion sleeved on the insulating protrusion. The mounting block is received in the receiving groove. As a result, the shielding effect of the backplane connector is improved.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: July 18, 2023
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Xiaogang Liu, Kun Liu, Rongzhe Guo, Chuanqi Gong, Tao Song
  • Patent number: 11658431
    Abstract: A connector that is easy to manufacture, does not cause short molds, does not cause flux to adhere to the contact part of the terminals, and enables for miniaturization and high reliability. A connector body and a plurality of terminals attached to the connector body are provided; the connector main body is a member integrated with the terminals by insert molding, and includes a protruding part extending in the longitudinal direction thereof that retains the terminals, and a flange protruding outward in the width direction from a side surface of the mounting surface side end of the connector main body. The terminal includes a standing part in which a surface is exposed on a side surface of the protruding part, and a tail part connected to the mounting surface side end of the standing part via a curved connecting part, extending outward in the width direction from the flange, and a tail part soldered to a substrate.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: May 23, 2023
    Assignee: Molex, LLC
    Inventor: Daishi Gondo
  • Patent number: 11646512
    Abstract: [Object] To provide a contact that can hold down effects caused by solder, even if an elastic contacting portion is extending from a location contacting a first member. [Solving means] The contact includes a base portion, an elastic contacting portion and a gap forming portion. The base portion is configured solderable on a component mounting surface of the first member. The elastic contacting portion is configured elastically deformable and relatively swingable with respect to the base portion, and when contacting a contacted surface of the second member, is configured to elastically deform to be in pressurized contact with the contacted surface.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: May 9, 2023
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Tetsuya Yada, Tatsuya Nakamura
  • Patent number: 11569620
    Abstract: An electrical connector is attached to a wiring substrate and mated with a counterpart connector connected to a signal transmission medium. A shell of the electrical connector has a pair of wall parts that contact a ground member on the counterpart connector. One wall part distant from the signal transmission medium includes a first side plate that has one end attached to a ground conductive path of the wiring substrate and extends in a direction away from the wiring substrate, a joining part that has one end joined to another end of the first side plate, and a second side plate that has one end joined to another end of the joining part and extends in a direction closer to the wiring substrate. The second side plate has a contact piece that extends in a direction away from the wiring substrate and elastically contacts the ground member.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: January 31, 2023
    Assignee: DAI-ICHI SEIKO CO., LTD.
    Inventor: Takashi Masunaga
  • Patent number: 11552524
    Abstract: A stator module for driving a rotor of an electrical planar-drive system comprises a power module, a stator assembly arranged on a top surface of the power module, and a connector. The power module is embodied to provide drive currents for driving the rotor. The stator assembly comprises coil conductors electrically connected to the power module via the connector for charging with the drive currents. The power module and the stator assembly each have a plate-shaped embodiment. The power module is mechanically fastened to the stator assembly by the connector. The stator assembly comprises a contact structure with contact holes arranged side by side, and the power module comprises a connecting arrangement with further contact holes arranged side by side. The connector comprises contact pins arranged side by side to engage in the further contact holes of the connecting arrangement, and in the contact holes of the contact structure.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: January 10, 2023
    Assignee: Beckhoff Automation GmbH
    Inventors: Rolf Brinkmann, Lukas Bentfeld, Uwe Pruessmeier
  • Patent number: 11466374
    Abstract: A catalytic system for CO2 capture and sequestration. The system includes a reduction cell for separating a carrier medium having an anode generating oxygen, a cathode generating hydrogen, and a CO precursor from the carrier medium. In addition, the system includes a power supply for providing electrical power to the anode and the cathode. An electrolysis process occurs where oxygen, hydrogen, CO precursors are produced. The anode and the cathode include a plurality of geometrical constructs to increase an active surface area of a catalytic surface of the anode and cathode to increase an efficiency of the electrolysis process. The geometrical constructs may include vias and pillars. In one embodiment, a capillary action is produced for CO2 sequestration across the catalytic surface having a plurality of vias.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: October 11, 2022
    Inventor: Terence Collier
  • Patent number: 11445599
    Abstract: A multi-layer PCB has conductive vias (134) passing through multiple layers. A layer may have a conductive non-functional feature (710) physically contacting a via but not surrounding the via, to make the PCB more resistant to thermal stresses while, at the same time, reducing the parasitic capacitance compared to a prior art non-functional pad (310n).
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: September 13, 2022
    Assignee: Dell Products L.P.
    Inventors: Umesh Chandra, Bhyrav M. Mutnury
  • Patent number: 11417976
    Abstract: An electrical connector includes a connector housing and a plurality of conductive terminals mounted in the connector housing. The plurality of conductive terminals include a plurality of ground terminals and a plurality of signal terminals. The ground terminals and the signal terminals are each made of a lossy metal. A surface of each of the signal terminals is coated with a low lossy metal.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: August 16, 2022
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Liang Huang, Wei Peng, Hongtao Liu
  • Patent number: 11411338
    Abstract: A CPU socket has an insulative housing equipped with two groups of contacts of different pitches from each other wherein either each group of contacts are arranged with the corresponding contacting arms extending in opposite directions to counterbalance the imposed/reaction forces itself or the two group of contacts are arranged with the corresponding contacting arms extending in opposite direction to somewhat counterbalance the imposed/reaction force during receiving a CPU therein, and or in a mixed manner, i.e., one group of contact with the corresponding contacting arms in the same direction while the other of contacts with the corresponding contacting arms extending in both opposite directions to achieve the total reaction forces in a substantial balanced manner.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: August 9, 2022
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Shan-Yong Cheng, Chao-Chieh Chen, Ming-Lun Szu
  • Patent number: 11316294
    Abstract: Miniaturized electrical connector systems are disclosed herein. In exemplary aspects disclosed herein, the connector system includes a twinaxial female connector having a housing and at least one dielectric positioned therein. The at least one dielectric defines two parallel channels configured to receive at least a portion of two conductors of a twinaxial cable. The twinaxial female connector includes an oval interface configured to orient and align the conductors of the twinaxial cable with mating pins of a male connector. The twinaxial female connector further includes two spring-type interconnects positioned within the oval interface, each configured to directly contact a conductor of the twinaxial cable and a mating pin of the male connector. The twinaxial female connector further includes a retaining clip attached to an exterior of the housing with a lever arm biased towards and pivotable from an engaged orientation. Such features reduce the manufacturing complexity, cost, and overall size.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: April 26, 2022
    Assignee: Corning Optical Communications RF LLC
    Inventors: Thomas Edmond Flaherty, IV, Daniel Michael Grabowski, Brian Lyle Kisling
  • Patent number: 11277914
    Abstract: A printed circuit board assembly includes a first printed circuit board with first surface and second surface with a slit portion and a second printed circuit board with third surface and fourth surface with a first end portion and a second end portion. The first end portion is fitted in the slit portion and a tip of the first end portion protrudes from the second surface. The first printed circuit board includes first electrodes arranged along the slit portion in a longitudinal direction of the slit portion on the second surface. The second printed circuit board includes second electrodes arranged in the first end portion on the third and fourth surfaces. The second electrodes are joined to the first electrodes with solder. The first printed circuit board includes a support fixed to the first surface. The second printed circuit board is attached to the support by an adhesive substance.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: March 15, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shusaku Nakase, Yusuke Morimoto
  • Patent number: 11251117
    Abstract: An integrated circuit interconnect structure includes a first metallization level including a first metal line having a first sidewall and a second sidewall extending a length in a first direction. A second metal line is adjacent to the first metal line and a dielectric is between the first metal line and the second metal line. A second metallization level is above the first metallization level where the second metallization level includes a third metal line extending a length in a second direction orthogonal to the first direction. The third metal line extends over the first metal line and the second metal line but not beyond the first sidewall. A conductive via is between the first metal line and the third metal line where the conductive via does not extend beyond the first sidewall or beyond the second sidewall.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Manish Chandhok, Leonard Guler, Paul Nyhus, Gobind Bisht, Jonathan Laib, David Shykind, Gurpreet Singh, Eungnak Han, Noriyuki Sato, Charles Wallace, Jinnie Aloysius
  • Patent number: 11245237
    Abstract: According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: February 8, 2022
    Assignees: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES. LTD.
    Inventors: Yoshiro Adachi, Yoshifumi Uchita, Manabu Sudou, Yoshio Oka
  • Patent number: 11205870
    Abstract: A connector includes a first insulator, a second insulator and a contact connected to the flexible conductor, the flexible conductor having an internal conductive portion and an external conductive portion, a sheet-like member being sandwiched between the circumferential edges of the first insulator and the second insulator while overlapping the flexible conductor to attach the connector to the sheet-like member, the first insulator positioned on a side of the flexible conductor in a position where the sheet-like member and the flexible conductor overlap each other having a cutout formed to correspond to the flexible conductor, a part of the external conductive portion adjacent to the internal conductive portion of the flexible conductor entering the cutout when the sheet-like member is bent at an edge of the first insulator together with the flexible conductor.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: December 21, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Seiya Matsuo, Akihiro Matsunaga
  • Patent number: 11178765
    Abstract: An electronic device includes first and second circuit boards and an interposer substrate. The first principal surface of the interposer substrate faces the first circuit board, and the second principal surface of the interposer substrate faces the second circuit board. A first input/output pad and a first auxiliary pad are provided on the first principal surface of the interposer substrate, and a second input/output pad and a second auxiliary pad portion are provided on the second principal surface of the interposer substrate. The first circuit board includes a land that is connected to the first input/output pad and the first auxiliary pad, and the second circuit board includes a land that is connected to the second input/output pad and the second auxiliary pad portion.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: November 16, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takahiro Baba
  • Patent number: 11158968
    Abstract: A connector body includes mating guide parts having mating recesses into which counterpart mating guide parts are inserted, the reinforcing bracket includes a body part attached to end wall parts of the mating guide parts, and a pair of left and right connection arms connected to both ends of the body part, the connection arms extending to the longitudinal center of the connector body and being attached to side wall parts of the mating guide parts, the connection arm includes a side plate part and a side wall upper cover part connected to an upper end of the side plate part, at least a part of the outside of the side plate part is covered with an outside part of the side wall part, and the side wall upper cover part is curved such that a tip faces the mating recess and covers at least a part of the upper surface of the inside part of the side wall part.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: October 26, 2021
    Assignee: Molex, LLC
    Inventors: Daiki Tanaka, Naoto Sasayama
  • Patent number: 11139617
    Abstract: An electrical connector includes an insulating body and multiple differential signal terminal pairs, each having two differential signal terminals. Each differential signal terminal has a main body portion, a strip connecting portion extending upward from an outer side of the main body portion, an elastic arm extending upward from the main body portion, and a contact portion extending upward from the elastic arm. A through slot runs through the elastic arm, forming an inner elastic arm and an outer elastic arm at two opposite sides of the through slot. The outer elastic arm is adjacent to the strip connecting portion. A consistent pitch is formed between the contact portions of the differential signal terminals. A first distance between two adjacent inner elastic arms in each differential signal terminal pair is less than a second distance between two adjacent outer elastic arms in two adjacent differential signal terminal pairs.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: October 5, 2021
    Assignee: LOTES CO., LTD
    Inventor: Jun Zhang
  • Patent number: 11128070
    Abstract: An electrical terminal includes a terminal body, at least one interference lug, and at least one circuit connection part. The terminal body includes a front end and a back end in a longitudinal direction. The interference lug is arranged in parallel to the longitudinal direction and extends outwardly in a horizontal direction perpendicular to the longitudinal direction. The at least one circuit connection part is connected to the terminal body. An electrical connector is also provided, and the electrical connector includes a base and the electrical terminal. The base includes at least one installation trough, and a guiding groove is arranged in the at least one installation trough, the at least one interference lug is adapted to slide into the guiding groove, so as to guide and position the electrical terminal.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: September 21, 2021
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventor: Yung-Chih Hung
  • Patent number: 11095057
    Abstract: An electrically conductive contact is disclosed and includes a fastening section integrally joined between a body and a tapered lead-in section. The fastening section is adapted for press-fitting into a hole of a substrate, such as a printed circuit board. The fastening section includes a pair of beams with a web joined in-between. The web has a center portion disposed between a pair of ramp portions. Each of the ramp portions has a sloping planar surface. The center portion has an opening extending therethrough and is offset in a normal direction. The fastening section is configured such that when the fastening section is press-fit into the hole of the substrate, the beams deflect both laterally and angularly.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: August 17, 2021
    Assignee: Interplex Industries, Inc.
    Inventor: Jeffrey D. Parrish
  • Patent number: 11071227
    Abstract: An accessory rod assembly for positioning cables and cable management accessories in a cable manager includes a base member, an accessory rod, and a rotatable knob. The base member has a front, a rear, and two sides, the front including a forward-facing socket, the rear including a first hook protruding rearwardly therefrom, and one of the two sides including a threaded portion. The accessory rod has an extruded construction and a generally uniform, at least partially cylindrical cross-sectional shape along its length. The at least partially cylindrical cross-sectional shape is defined by two opposed arcuate portions interconnected by a midsection portion. Adjacent edges of the two opposed arcuate portions define a drop-in T-slot channel that extends along the length of the accessory rod. The rotatable knob has a handle and a threaded end received within the threaded portion of the base member.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: July 20, 2021
    Assignee: Chatsworth Products, Inc.
    Inventors: Preston Ellis Hennrich, James I. Lawrence, John W. Robertson, Johnny C. Fraga, Jared Keith Davis
  • Patent number: 10992074
    Abstract: An electrical connector includes an insulative housing, a plurality of passageways, a plurality of blade type contacts retained to the retaining grooves in the corresponding passageways, a spacer located in a rear receiving space of the housing with corresponding slits through which tails of the contacts rearwardly extend, and a plurality of wires having the inner conductors soldered upon the tails of the contacts behind the spacer. A waterproof glue plate fills the receiving space of the housing to enclose the exposed inner conductors and the corresponding tails. A plurality of passages are formed in one side of the peripheral wall, through which the wires extend in a vertical direction perpendicular to the horizontal direction along which the contacts extend. The spacer forms a recess to receive a protrusion of the glue plate, and the protrusion is located adjacent to the passages for assuring sealing around said passages.
    Type: Grant
    Filed: January 18, 2020
    Date of Patent: April 27, 2021
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Yu-Jia Deng, Bin Peng, Jian-Kuang Zhu, Kuo-Chun Hsu
  • Patent number: 10985499
    Abstract: Provided is an electric connector capable of preventing damage to a housing and deformation of a bracket even if it is miniaturized. An electric connector (10) according to the present disclosure includes: a first connector (20) having a first housing (30) with a recess (35) formed in a first surface and a first bracket (54) held by the first housing (30) while facing the first surface; and a second connector (60) fitted with the first connector (20), the second connector having a second housing (70) with a projection (76) fitted into the recess (35), the projection being formed on a second surface corresponding to the first surface, and a second bracket (94) held by the second housing (70) while facing the second surface and electrically connected to the first bracket (54).
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: April 20, 2021
    Assignee: KYOCERA CORPORATION
    Inventors: Kenji Miyamoto, Munenobu Yoshida
  • Patent number: 10980117
    Abstract: A mid-plane board including a first connector configured to receive a first signal from a first circuit board is provided. The mid-plane board includes a second connector configured to provide the first signal to a second circuit board. The first circuit board forms a first plane and the second circuit board forms a second plane, and the first plane and the second plane are substantially parallel. The mid-plane board also includes a cutout configured to allow a coplanar connector to bridge the mid-plane board and provide a second signal from the first circuit board to the second circuit board. The second signal is a high-end signal and the first signal is a low-end signal, and the mid-plane board is disposed on a plane substantially orthogonal to the first circuit board and the second circuit board.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: April 13, 2021
    Assignee: Cadence Design Systems, Inc.
    Inventors: Gidon Maas, Pinchas Herman, Vu Nguyen, Hoa Pham, Febin George
  • Patent number: 10958007
    Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: March 23, 2021
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Huilin Ren, Marc B. Cartier, Jr., Trent K. Do, Mark W. Gailus
  • Patent number: 10944210
    Abstract: Provided is an electric connector capable of preventing damage to a housing and deformation of a bracket even if it is miniaturized. An electric connector (10) according to the present disclosure includes: a first connector (20) having a first housing (30) with a recess (35) formed in a first surface and a first bracket (54) held by the first housing (30) while facing the first surface; and a second connector (60) fitted with the first connector (20), the second connector having a second housing (70) with a projection (76) fitted into the recess (35), the projection being formed on a second surface corresponding to the first surface, and a second bracket (94) held by the second housing (70) while facing the second surface and electrically connected to the first bracket (54).
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: March 9, 2021
    Assignee: KYOCERA CORPORATiON
    Inventors: Kenji Miyamoto, Munenobu Yoshida
  • Patent number: 10943865
    Abstract: According to one embodiment, a device includes: a semiconductor in a first region of interconnects stacked in a first direction; a first conductor including a first body and a first protrusion, the first body provided in a first region, the first protrusion protruding from the first body in a second direction and overlapping with a second region adjacent to the first region in the second direction; a plug on the first protrusion; a insulator between the plug and the interconnects; a second conductor including a second body and a second protrusion, the second body on the first body and contacting the semiconductor, and the second protrusion on the first protrusion and protruding to the second body; and a first layer on the first protrusion, contacting the second protrusion and the insulator, and extending between the second protrusion and the insulator.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: March 9, 2021
    Assignee: Toshiba Memory Corporation
    Inventor: Takamasa Ito
  • Patent number: 10939546
    Abstract: Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: March 2, 2021
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Clarke O. Fowler, Voi Nguyen
  • Patent number: 10931044
    Abstract: The disclosure relates to a board-to-board connector including a body, multiple terminals and a pair of metal fittings. The body has an accommodating recess. The terminal is disposed on the body and a portion of each of the terminals extends to the accommodating recess. The metal fittings are disposed on the body and beside the accommodating recess. The terminals are located between metal fittings. Each of the metal fittings has at least one limiting portion that extends to the accommodating recess. The limiting portion leans against a corner of the accommodating recess so that the metal fittings and the body generate a two-dimensional limitation. A board-to-board connector assembly is also provided.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: February 23, 2021
    Assignee: Advanced Connectek Inc.
    Inventors: Ta-Teh Meng, Mei Shi, Ya-Ping Liang, Wen-Liang Men, Zheng Li, Ping Shi, Meng Liu, Bo-Wen Xu, Jia-Ying Wu, Hsin-Yu Chang
  • Patent number: 10907816
    Abstract: A connector comprises a first connector and a second connector to be connected with the first connector. The first connector includes a first housing, a holding portion, and a stopper. The second connector includes a second housing, a held portion, and an engagement portion. At the waiting position, the first connector and the second connector are movable between positions in a wall contact state, at which the leading end of the second connector is in contact with the wall defining the receiving space of the first connector, and positions in a stopped state, at which the stopper of the first connector and the engagement portion of the second connector are in contact with each other.
    Type: Grant
    Filed: May 30, 2016
    Date of Patent: February 2, 2021
    Assignees: SAKAI DISPLAY PRODUCTS CORPORATION, ACES ELECTRONICS CO., LTD
    Inventors: Nobukazu Kato, I-chiao Tso, Takahiro Yoshikawa
  • Patent number: 10902754
    Abstract: A flat panel display is provided. A first metal joining surface on a display panel includes a first transverse part and a first longitudinal part, and the area occupied by the first transverse part along a transverse direction is larger than the area occupied by the first longitudinal part along the transverse direction. A second metal joining surface on a flexible wiring substrate includes a second transverse part and a second longitudinal part, and the area occupied by the second transverse part along the transverse direction is larger than the area occupied by the second longitudinal part along the transverse direction. The above design can increase the contact area between the first metal joining surface and the second metal joining surface after the expanding offset between the display panel and the flexible wiring substrate occurring in a thermal joining process, to guarantee electrical signals transmitting normally and improve displaying effect.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: January 26, 2021
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Weinan Yan
  • Patent number: 10886648
    Abstract: A communication module includes a wiring board including ground wiring, an electronic component provided on the wiring board, and a first connector provided on the wiring board and electrically connected to the electronic component via the wiring board. The first connector includes a metal member electrically connected to the ground wiring, and a plurality of pins arranged in an arrangement direction and including a plurality of high-frequency signal pins used for transmission of a high-frequency signal and a plurality of non-high-frequency signal pins for a use different from the transmission of the high-frequency signal. The plurality of high-frequency signal pins include a plurality of first pins successively arranged in the arrangement direction. None of the plurality of non-high-frequency signal pins is interposed between the plurality of first pins and the metal member.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: January 5, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Makoto Aoki
  • Patent number: 10886670
    Abstract: A connector device for connection with a counter piece for establishing a mechanical and electric connection, wherein the connector device comprises at least two printed circuit board elements each comprising an electrically insulating core and at least one comprising an electrically conductive structure at least partially on the respective electrically insulating core, and at least one embedded component embedded within the respective electrically insulating core and electrically coupled to the respective electrically conductive structure, wherein the at least one electrically conductive structure is arranged at least partially on an exposed surface of the connector device and is configured for establishing the electric connection with the counter piece upon establishing the mechanical connection with the counter piece.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: January 5, 2021
    Assignee: AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
    Inventors: Martin Fischeneder, Markus Kastelic, Markus Leitgeb, Nick Renaud-Bezot
  • Patent number: 10847872
    Abstract: Disclosed are a wearable device and a smart watch. A printed circuit board (PCB) is provided in the wearable device. An antenna and an extension component for extending a reference ground of the antenna are assembled on the PCB board, the extension component being disposed outside the PCB board, and being connected to the PCB board by using a metal connector. A first connection end of the metal connector is connected to the PCB board, and a second connection end of the metal connector is connected to the extension component. The technical solutions provided in the present invention can overcome the shortcomings of low transmit power of an antenna and poor receiving sensitivity of the antenna in a current wearable device.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: November 24, 2020
    Assignee: Goertek Inc.
    Inventors: Jianguo Zhang, Peijie Zhao, Lin Wang
  • Patent number: 10826204
    Abstract: A conductive member includes a conductive portion (13) in which conductive plates (12) are arranged at intervals in a plate thickness direction. An insulating portion (14) covers the conductive portion (13) and insulates between the plates (12). Each of the plates (12) has a penetrating connection hole (15) enabling electrical connection of each plate (12) to the outside. The connection holes (15) are disposed at positions displaced in a plate surface direction in the plates (12) and are exposed to the outside via open holes (17, 18) provided in the plates (12) and the insulating portion (14).
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: November 3, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hajime Matsui, Yasuo Omori
  • Patent number: 10777925
    Abstract: According to one embodiment, a connector includes an insulating material part, and a plurality of first through conductive parts surrounded with the insulating material part, penetrating the insulating material part in a first direction, and arranged in a second direction perpendicular to the first direction, wherein each of the first through conductive parts includes a single bent portion, and the first through conductive parts are bent in the same direction.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: September 15, 2020
    Assignee: Toshiba Electronic Devices & Storage Corporation
    Inventors: Minoru Takizawa, Kenichi Agawa
  • Patent number: 10761292
    Abstract: The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: September 1, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Young Don O, Sang Yeon Han
  • Patent number: 10756464
    Abstract: A connector assembly having three types of connector elements including a first connector 10 and a second connector 20, each of which is respectively mounted to one of two mounting members P1, P2, and an intermediate connector 30, which is located between the two connectors, i.e., the first connector 10 and the second connector 20, and is connected to the two connectors, wherein one of the three types of connector elements has protrusion portions 52;13C protruding in the direction of connection of the connector elements, said protrusion portions are abuttable against other connector elements or mounting members with an abutment force, and, in the process of connection of the connector elements, the above-mentioned protrusion portions are deformable in the above-mentioned direction of connection by abutment forces that exceed the sliding forces acting between the terminals 43, 14, 24 of the connector elements.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: August 25, 2020
    Assignee: HIROSE ELECTRIC CO., LTD.
    Inventor: Takeshi Okuyama
  • Patent number: 10741945
    Abstract: In accordance with one embodiment, an electrical connector can be mounted to a first printed circuit board to obtain a first current capacity, and the electrical connector can be mounted to a second printed circuit board to obtain a second current capacity that is lower than the first current capacity.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: August 11, 2020
    Assignee: FCI USA LLC
    Inventors: Thomas Brungard, Michael Percherke, Christopher J. Kolivoski, Christopher S. Gieski, Nazareth Eppley, Charles Copper, Thierry Goossens
  • Patent number: 10724724
    Abstract: Lighting systems that provide improvements in various aspects are contemplated. In one aspect, light fixtures can comprise at least one of an occupancy sensor, a constant current module, an external power supply, a plurality of lighting elements mounted on a heat sink, a sealing mechanism, and top and bottom housings having tabs to removably couple with one another. In another aspect, a disconnect comprising a plug and socket housing is contemplated.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: July 28, 2020
    Inventors: Philip Gustav Ericson, Jeffrey Lawrence Harlan, Wade Lane Morgan, Charles Edward Markley
  • Patent number: 10721818
    Abstract: The present disclosure relates to a method for positioning at least two circuit boards in a housing having a non-conductive surface, a first securement location for securing the first circuit board, and a second securement location for securing the second circuit board, wherein at least one conductive trace is arranged in the housing and is connected non-releasably with the housing, and wherein the conductive trace electrically contacts the first securement location with the second securement location, the method comprising securing the circuit boards in the securement locations of the housing such that the first circuit board is electrically in contact with the first securement location and the second circuit board is electrically in contact with the second securement location, wherein the first circuit board and the second circuit board are electrically in contact with one another via the at least one conductive trace.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: July 21, 2020
    Assignee: Endress+Hauser SE+Co. KG
    Inventors: Romuald Girardey, Dietmar Birgel, Armend Zenuni, Marc Baret, Peter Klöfer
  • Patent number: 10665970
    Abstract: A plug contact for electrically contacting a circuit board by insertion of the plug contact into a contact hole of the circuit board, the plug contact having two resilient contact legs, a terminal region, and a connecting region which connects the two contact legs to one another and to the terminal region, wherein the plug contact is punched out of a metallic flat material in one piece. As a result, the plug contact only has a small overall height, and the two contact arms each have a first region and a second region which are arranged at an angle ? relative to one another, such that the two contact legs are bent approximately in an L shape, and wherein the two first regions adjoin the connection region and the ends of the two second regions form the free ends of the contact legs.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: May 26, 2020
    Assignee: PHOENIX CONTACT GMBH & CO. KG
    Inventor: Ralf Geske
  • Patent number: 10622769
    Abstract: A modular infrastructure management device comprises a housing and at least one circuit board. The housing includes a base plate, first modular slots disposed along the first edge of the base plate and second modular slots disposed along the second edge of the base plate. The first and second modular slots are configured to removably receive at least one first communication card module and at least one second communication card module. The circuit board is disposed on the base plate and comprises first and second connectors for electrically coupling to the first and second communication card modules.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: April 14, 2020
    Assignee: ZPE Systems, Inc.
    Inventors: Arnaldo Zimmermann, Livio Ceci