Abstract: Provided is a method of phasing a threaded grinding stone, as well as a device therefor, the aforementioned method and device being such that contact or non-contact of a threaded grinding stone with a disk dresser can be detected with high accuracy, with the result that the phasing of the threaded grinding stone can be accurately performed. For the purpose of achieving the above, a threaded grinding stone (14) is phased with respect to a disk dresser (32) prior to the engagement of the threaded grinding stone (14) with the disk dresser (32) during dressing. In performing this phasing, it is determined whether or not the threaded grinding stone (14) contacted the disk dresser (32), on the basis of a voltage (V) which is commensurate with the amplitude of the elastic wave generated in the threaded grinding stone (14) at the time when the threaded grinding stone (14) contacted the disk dresser (32).

Abstract: An object of the present invention is to provide a method of polishing silicon wafers, capable of suppressing generation of undesired sounds from carriers and reducing the thickness variation of the wafers after polished. The method is a wafer polishing method in which wafers 20 are polished by supplying a polishing solution to surfaces 30a of a pair of polishing pads 30 positioned above and below carriers 10 each having a circular hole 11 for retaining the wafers 20, the carriers 10 being thinner than the wafers 20; and sliding the polishing pads 30 relatively to the carriers 10, thereby simultaneously polishing both surfaces of the wafers 20 retained in the carriers 10. The method is characterized in that information sourced from the carriers 10 when a difference between the thickness of the carriers 10 and the thickness of the wafers 20 reaches a predetermined value is detected to calculate the thickness of the wafers 20, thereby terminating polishing.

Abstract: A gear grinding machine, whose tool spindle (18) is supported on a first swivel-motion unit (17) seated on a first linear-motion unit (15), has a second linear-motion unit (19) which is arranged on the first linear-motion unit (15) and carries a dressing spindle (21) that is capable of being driven in rotary movement.

Abstract: Some embodiments comprise an apparatus for reseating valves, where an eccentric, non-rotational motion is applied in a grinding or lapping process. Other embodiments comprise a micrometer that permits repeatable application of pressure against a plate when the apparatus is removed and reinstalled. In yet other embodiments, levered arms provide an expedient mechanism for positioning a reseating apparatus.

Abstract: The described embodiment relates generally to the polishing of a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. More particularly, a method and an apparatus are described for calibrating a polishing process in which a precise amount of material can be removed. Accurate measurement of such a polishing process can be especially helpful in accurately determining material removal rates and pad wear occurring across curved surfaces and edges where such parameters tend to be difficult to predict.

Abstract: The present invention relates to a grinding machine for grinding a workpiece, in particular cams, with a grinding wheel having a profile with a grinding region running substantially parallel to the axis of rotation of the grinding wheel and at least one profile section which does not run parallel to the axis of rotation of the grinding wheel, a control unit for controlling the grinding process, wherein the control unit is configured in such a manner that, with reference to position information on positions of edges of the workpiece in the direction of the longitudinal axis of the workpiece, the edges of the workpiece are successively deburred or chamfered by the at least one profile section of the grinding wheel during or after the grinding of the workpiece.

Abstract: A method for grinding the surface of non-round workpieces. The method includes the steps of clamping a workpiece within a machining unit; machining the workpiece; without unclamping the workpiece, contactlessly measuring the workpiece using an optical measuring device having a conoscopic holography sensor with a characteristic measuring range; and machining and measuring the workpiece in an alternating manner to iteratively approach the desired measurements of a specified form by adjusting the distance between the optical measuring device and the surface of the workpiece depending on there being a deviation of the surface from the specified form so that a respectively measured area of the surface of the workpiece remains within the measuring range of the optical sensor.

Abstract: A core grinding wheel that has a grinding layer on an outer periphery of a core is used. An ultrasonic wave is output from an ultrasonic sensor to the grinding layer via grinding fluid. An ultrasonic measuring device control unit calculates a thickness of the grinding layer on the basis of a sonic velocity in the grinding layer and an arrival time difference between a reflected wave from a surface of the grinding layer and a reflected wave from a surface of the outer periphery of the core. A grinding process and a truing process are controlled on the basis of an outside diameter of the grinding wheel, which is calculated on the basis of the measured thickness of the grinding layer and an outside diameter of the core.

Abstract: A substrate carrying mechanism includes: a base; a substrate holding member placed on the base and capable of holding a substrate and of being advanced and retracted relative to the base; four or more detecting units respectively for detecting different parts of the edge of a substrate held by the substrate holding member when the substrate holding member holding a substrate is retracted; and a controller that determines whether or not a notch formed in the edge of the substrate has been detected by one of the detecting units, on the basis of measurements measured by the four or more detecting units and corrects an error in a transfer position where the substrate is to be transferred to the succeeding processing unit on the basis of measurements measured by the detecting units excluding the one detecting unit that has detected the notch of the substrate.

Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.

Abstract: An apparatus for grinding hand knives, in particular for meat processing, with at least one grinding tool is proposed, by means of which a knife ground finish, in particular during the reconditioning of hand knives after use, is made possible in a repeatable manner with reproducible grinding quality. This is achieved according to the invention in that a knife magazine (6, 7) for accommodating at least one hand knife is provided, in that a driven manipulating device (3, 4, 5) having at least one knife gripper (5) is provided, in that at least one sensor unit (22) for at least partly recording the knife contour is provided, and in that an electronic evaluating and control unit for evaluating the sensor data and for activating the manipulating device (3, 4, 5) is provided.

Abstract: A method and system for providing transducer(s) including a disk structure and having an air-bearing surface (ABS) are described. The disk structure resides a distance from the ABS and has a disk dimension substantially perpendicular to the ABS. Lapping control and disk windage ELGs are provided. The lapping control ELG has first and second edges first and second distances from the ABS. The disk windage ELG has edges different distances from the ABS. A difference between these edges corresponds to the disk dimension. A windage resistance of the disk windage ELG is measured and a disk windage determined. The disk windage corresponds to a difference between designed and actual disk dimensions perpendicular to the ABS. A lapping ELG target resistance is determined based on the disk windage. The transducer is lapped. Lapping is terminated based on a resistance of the lapping control ELG and the lapping ELG target resistance.

Abstract: A method and system for providing a perpendicular magnetic recording (PMR) head are disclosed. A PMR pole having a bottom and a top wider than the bottom is provided. The PMR pole may be formed by depositing a PMR pole layer, then removing part of the PMR pole layer, leaving the PMR pole. The PMR pole may also be provided by forming a trench having the desired profile in a photoresist layer, depositing the PMR pole layer, then removing the photoresist layer, leaving the PMR pole in the location of the trench. A side gap is deposited over the PMR pole. A side shield is provided on the side gap. A planarization that removes part of the side shield on the PMR pole is performed. A top gap is provided on the PMR pole, substantially covering the entire PMR pole. A top shield is provided on the top gap.

Abstract: A device for measuring tooth surface deviation includes a contact detector that measures the deviation at the tooth surface of a dresser with respect to a grinding tooth surface formed on a helical grinding tooth of a grinding tool when the grinding tool and a dresser toothed wheel are rotated synchronously in a state in which the grinding tooth surface and the dresser tooth surface of the dresser toothed wheel can be brought into contact, and detects contact between the grinding tooth surface and the dresser tooth surface; and a controller that changes the speed of rotation of the dresser toothed wheel in such a way that the detection result of the contact detector comes within the range of contact determination data, and also measures the amount by which the grinding tool and the dresser toothed wheel have been changed in one revolution of the dresser toothed wheel.

Abstract: A method of reducing manufacturing defects of semiconductor wafers during a back-grinding process. The method includes receiving a semiconductor wafer on a chuck table, wherein said chuck table has a surface upon which a front side of the wafer is placed, and wherein said chuck table has one or more holes in surface and one or more sensors placed in said one or more holes. The method further includes grinding at least a portion of a back side of the semiconductor wafer. The method further includes monitoring a parameter, while grinding, measured by the one or more sensors and adjusting the grinding based at least on the monitored parameter.

Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.

Abstract: An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.

Abstract: Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the substrate and receiving a reflected light from the substrate; obtaining a plurality of spectral profiles at predetermined time intervals, each spectral profile indicating reflection intensity at each wavelength of the reflected light; selecting at least one pair of spectral profiles, including a latest spectral profile, from the plurality of spectral profiles obtained; calculating a difference in the reflection intensity at a predetermined wavelength between the spectral profiles selected; determining an amount of change in the reflection intensity from the difference; and determining a polishing endpoint based on the amount of change.

Abstract: A constant force finishing system used to finish a surface of a workpiece includes at least a first movement device arranged to apply a first movement to a finishing tool, the first movement having a range of distance D1. The finishing system also includes a constant force device (CFD) in mechanical communication with the finishing tool, the CFD arranged to apply a second movement in conjunction with the first movement to the finishing tool, the second movement having a range of ?1, where D1>>?1.

Abstract: A method of prepping a surface using a high-frequency forced pulsed waterjet entails generating a high-frequency signal having a frequency f using a high-frequency signal generator, applying the high-frequency signal to a transducer having a microtip to cause the microtip of the transducer to vibrate to thereby generate a forced pulsed waterjet through an exit orifice of a nozzle having an exit orifice diameter d and a length L. The forced pulsed waterjet prepares the surface to within a predetermined range of surface roughness. The surface roughness is determined by selecting operating parameters comprising a standoff distance (SD), a traverse velocity VTR of the nozzle, a water pressure P, a water flow rate Q, a length-to-diameter (L/d) ratio, a microtip-to-orifice distance (a), the frequency f, and an amplitude A of the high-frequency signal.

Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.

Abstract: A wafer polishing apparatus includes a rotatable turntable for holding a polishing pad and at least one rotatable polishing head adapted for attachment of at least one wafer alignment assembly. A wafer alignment assembly includes an upper plate and a lower plate connected by three lever assemblies symmetrically positioned about a wafer alignment assembly axis of rotation. Each of the lever assemblies comprises a spherical joint, an elongated cylindrical hinge, and a kinematic axis which intersects a center of rotation for the spherical hinge, an axis of rotation for the elongated cylindrical hinge, and a gimbal point about which a wafer may tilt during polishing. The gimbal point may be positioned above, coincident with, or below a working surface of a polishing pad by adjustment of the lever assemblies. Some embodiments of the invention comprise steps in a method for polishing a wafer in a wafer polishing apparatus.

Abstract: A honing tool holder utilizes pressure of a through-the-spindle coolant delivery system for automatically feeding the honing elements or stones of an attached honing tool when in the bore of a work piece, and for automatically stopping the feeding when a particular condition such as a bore size, is reached, so as to enable use of an in-process adjustable feed honing tool in a machine tool, machining center, or the like, lacking a feed mechanism or system but including a coolant delivery system. The holder can also include apparatus to automatically prevent feed past a limit. Both the feed force and feed limit can be adjustable, at least the latter by simple movements of the tool holder by the machine tool.

Abstract: A piston processing apparatus includes a work attaching head capable of fixing a piston material, a work rotating device, a grinding wheel, a grinding wheel rotating device, first and second moving mechanisms for moving the grinding wheel, a rotational angle detector for detecting a rotational angle of the work attaching head, a first and second position detectors for detecting a position of a grinding surface of the grinding wheel, a controller controls the first and second moving mechanisms to grind the outer circumferential surface by the grinding wheel based on target-position information of the grinding surface corresponding to a position on the outer circumferential surface of the piston material. According to the piston processing apparatus, the outer circumferential surface of the piston material can be processed into a three-dimensional shape with high-accuracy, and a piston that can improve fuel efficiency.

Abstract: A coated abrasive product, comprising a first section and a second section, the first and the second sections being continuously joined together by a splice. The first section includes at least one first splice mark adjacent to the splice, wherein the first splice mark is a marking or a cluster of markings. A method of processing an article with such a coated abrasive product, and a method of acquiring information of such a coated abrasive product, respectively, includes detecting at least one characteristic of at least one first splice mark of the first section of the abrasive product, and comparing the detected characteristic to a database, wherein the detected characteristic of the first splice mark conveys approach of the splice and the end of the first section. The method of processing an article further includes providing a signal to skip the splice to thereby prevent the article being processed with splice area of the abrasive product.

Abstract: Methods of fabricating magnetic write heads and electrical lapping guides (ELG's) using a split gap deposition process is described. A removal process is performed on a magnetic material to define a main write pole and to define a corresponding ELG for the main write pole. A first non-magnetic gap layer is deposited. A mask and liftoff process is performed to deposit an electrically conductive material on the first gap layer disposed along a front edge of the ELG. A second non-magnetic gap layer is then deposited and a shield is fabricated for the write pole.

Abstract: A method and apparatus for buffing tread from a tire carcass, the method comprising the steps of: positioning a sensor at a first lateral location along a width of the tread; receiving a first signal from the sensor, the first signal generated as a function of a distance between the sensor and a belt in the tire and a tire characteristic; selecting a first signal response curve from a plurality of signal response curves based upon the first lateral location of the sensor, the selected signal response curve representing the function of the distance between the sensor and the tire belt and the tire characteristic; determining from the response curve the distance between the sensor and the belt for the signal response received; buffing tread from the tire until the distance between the sensor and the belt reaches a final distance. The steps are repeated at a second lateral location.

Abstract: In prior art, an additional radial inward movement that is performed in accordance with a rotating cam disk is imparted on the grinding disk in order to relief-grind the cutting teeth and the chamfer of taps and the cutting teeth of thread formers. The invention relates to a cam disk which can be rotated about an axis and is provided with a control cam. The control cam forms a group of curves according to a large number of possible undercut contours on the grinding teeth of the tap or thread former, which are to be relief-ground. In order to obtain a specific undercut contour on a cutting tooth, a limited angle of rotation is selected from the control cam. The area is mechanically, optically, or electronically scanned by means of a scanning device. To this avail, the cam disk performs an oscillating rotary movement only above the selected section of the control cam.

Abstract: A glass manufacturing device includes a working container, a loading device, a sand blower, a shielding device, and a supporting device. The loading device is received in the working container and configured for loading a glass substrate in place. The sand blower is arranged opposite to the loading device and configured for sandblasting the glass substrate. The supporting device is used for supporting the shielding device and pressing the shielding device onto the glass substrate during the process of sandblasting. The shielding device includes a shielding cover having a number of shielding units. The shielding units are configured to shield portions of the glass substrate and prevent the portions of the glass substrate from being cut during sandblasting.

Abstract: According to one embodiment, a method for manufacturing a thin film magnetic head includes forming on a substrate magnetic head portions having a magnetoresistive element and resistance detection elements for measuring an amount of polishing; slicing the substrate to form at least one row bar; polishing the ABS of each row bar; forming rails on the polished ABS; and cutting each row bar to separate each magnetic head portion. The step of polishing the ABS includes measuring a resistance of each resistance detection element and a resistance of each magnetoresistive element; calculating an offset value between the resistance detection element and the magnetoresistive element; and calculating a final resistance of the resistance detection element by using the calculated offset value. When the resistance of the resistance detection element reaches the final resistance, polishing of the ABS of the row bar is terminated. Other methods are presented as well.

Abstract: In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.

Abstract: An apparatus and method for machining workpieces is provided, in particular, for grinding the surface of non-round workpieces. The workpiece is clamped within a machining unit and the surface of this workpiece is contactlessly measured by means of a measuring device while the workpiece is clamped within the machine.

Abstract: An eyeglass lens processing apparatus including a lens edge position detecting unit for obtaining edge positions, an edge corner processing tool for processing an edge corner of the lens, a correction data input unit for inputting correction data to avoid interference between an edge and a nose pad arm, wherein the correction data includes data on a position of interference between the nose pad arm and the edge, data necessary for setting an amount of processing at an interference position, and an edge processing range, a processing data computing unit for determining a path of processing the edge corner, based on edge position data and the correction data, to obtain data on correction processing and a processing controller for processing the edge corner of the lens by the edge corner processing tool in accordance with the correction processing data.

Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

Abstract: A method of processing an article with a coated abrasive product, including a repeat of a single marking, comprises detecting at least two characteristics of the repeat of a single marking. The repeat is placed along the length of the abrasive product at a first major surface, wherein each of the detected characteristics conveys independent information regarding the abrasive product. The method further includes comparing the information to a database. A method of acquiring information of the coated abrasive product includes detection and comparing steps.

Abstract: An eyeglass lens processing apparatus includes a processing control unit (50) which in the soft processing mode, roughs the lens such that the torque threshold value is set to a value T?s lower than the threshold value T?N of a normal processing mode, and when torque detected by a sensor unit does not exceed the threshold value T?s, a axis-to-axis distance varying unit or a lens rotating unit is controlled so that a cutting amount per rotation of the lens reaches a threshold cutting amount, and when the detected torque exceeds the threshold value T?s, the axis-to-axis distance varying unit or the lens rotating unit is controlled so that the torque becomes lower than the threshold value T?s to decrease the threshold cutting amount.

Abstract: The invention describes a control unit for a sanding machine, which winds and unwinds the abradant paper over a contact device. This control unit continuously detects the position of one or more of these sanding machines, the abradant unwinding, the movement of the transport system and the position of the workpiece. These parameters are used to regulate the sanding machine(s) in such a way that the workpieces are fed through and the sanding operation executed without interruption.

Abstract: The invention relates to a method for the production of a rotor of a rotary screw compressor (1) with a cylindrical basic shape, which has a helical profile (2) at its outer circumference, wherein the method comprises the steps of: a) Pre-processing of the workpiece (1) by bringing in the profile (2), wherein the profile (2) has a stock compared with the finished shape, b) Pre-grinding of the profile (2) by a rough-machining process in a grinding machine, wherein a part of the stock is removed and c) Finish-grinding of the profile (2) by a finish-machining process in the grinding machine, wherein the remainder of the stock is removed and the finished shape of the profile (2) is produced. To improve the efficiency of the production especially of rotors of rotary screw compressors and ensure a high quality of the production the invention is characterized in that the pre-grinding and/or the finish-grinding is carried out with a grinding worm (3) by a continuous generative grinding process.

Abstract: An eyeglass lens processing apparatus includes a processing control unit (50) which in the soft processing mode, roughs the lens such that the torque threshold value is set to a value T?s lower than the threshold value T?N of a normal processing mode, and when torque detected by a sensor unit does not exceed the threshold value T?s, a axis-to-axis distance varying unit or a lens rotating unit is controlled so that a cutting amount per rotation of the lens reaches a threshold cutting amount, and when the detected torque exceeds the threshold value T?s, the axis-to-axis distance varying unit or the lens rotating unit is controlled so that the torque becomes lower than the threshold value T?s to decrease the threshold cutting amount.

Abstract: According to an aspect of an embodiment, a method for manufacturing a storage medium includes providing a medium plate member for forming the storage medium and a guide member; and aligning the medium plate member and the guide member so that the medium plate member and the guide member are placed adjacently and the surfaces of the medium plate member and the guide member form a substantially common plane. The method further includes guiding a burnishing member for burnishing the medium plate member onto the surface of the guide member; and sliding the burnishing member on the guide member onto the medium plate member so as to burnish the surface of the medium plate member.

Abstract: In a system or method for controlling wafer back-grinding, a chuck table has a surface for supporting a semiconductor wafer during a back-grinding process, one or more holes in the surface, and one or more sensors disposed in the one or more holes for monitoring a parameter during back-grinding. A computer-implemented process control tool is coupled to receive one or mote outputs from the one or more sensors and control the back-grinding process based on the received one or more outputs.

Abstract: An apparatus for monitoring the thickness of a conductive layer on a substrate includes a support to hold a substrate having a conductive layer, an eddy current monitoring system including a first plurality of core portions, and a motor to cause relative motion between the support and the eddy current monitoring system such that the substrate moves across the first plurality of core portions in a direction that defines a first axis. At least one core portion is positioned further from a second axis than at least two other core portions. The second axis is orthogonal to the first axis.

Abstract: The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel in a reciprocating direction, in which the ingot is sliced with controlling a temperature of the ingot by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while the slurry for adjusting an ingot temperature is supplied to the ingot only at the exit side of the wire caused to travel in the reciprocating direction. As a result, there is provided a method and a wire saw apparatus in which rapid cooling of an ingot especially in a time close to end of slicing of the ingot can be alleviated, consequently degradation of a nano-topography can be suppressed, and further high-quality wafers having a uniform thickness can be sliced when slicing the ingot by using a wire saw.

Abstract: The present invention relates to a method and apparatus for conditioning a polishing pad used in chemical mechanical polishing in which a consistent pressing force can be provided between an abrasive conditioning member and the polishing pad. Specifically, a moveable weight member is provided that can be selectively moved along a length of a support arm in the conditioning apparatus. The position of the weight member relative to the position at which the abrasive conditioning member is mounted alters the resultant pressing force in view of the change in moment created. In a particular example, the positioning of the weight member can be automatically controlled using a drive mechanism controlled by a control unit, such as a computer.

Abstract: A lapping tool for lapping a wafer section in a well controlled manner, has a head with an actuator for bending the row tool, and a force multiplier coupled between the actuator and row tool to multiply the force generated by the actuator for application of greater bending force to the row tool than can be generated by the actuator. Furthermore, at least two actuators, which are controlled together, simultaneously apply force to one force multiplier, so as to further increase bending force. The increase in available force permits the use of a row tool of a ceramic or other material that is substantially stiffer than stainless steel, such as a row tool having a coefficient of thermal expansion that is substantially similar to that of the rowbar itself. The tool further includes structures for tilting or otherwise orienting the wafer section relative to the lapping plate.

Abstract: An eyeglass lens processing apparatus includes: a lens rotation unit rotating a lens; a processing tool rotation unit processing the lens; an axis-to-axis distance changing unit for changing an axis-to-axis distance between the chuck shaft and the processing tool rotation shaft; a lens surface configuration acquiring unit which acquires a front surface curve configuration and a rear surface curve configuration of the lens; a lens outer diameter acquiring unit which acquires an outer diameter of a lens; a calculation unit which calculates a thickness of the lens and calculates a cutting depth of the lens, so that torque applied onto the chuck shaft in rough processing becomes substantially constant, based on the calculated lens thickness and a processing distance from the rotation center of the lens; and a control unit which controls the axis-to-axis distance changing unit in accordance with the calculated cutting depth and for rough processing the lens.

Abstract: In a manufacturing process of a head slider, a plurality of head elements are formed on a wafer, each head element comprising: a return pole, a coil, and a main pole. The wafer is cut into respective head elements so that individual head sliders are formed. A ratio of an amplitude of an electrical signal applied to the coil of the write head on the head slider to an amplitude of output from an independent magnetic field sensor not embedded in the head slider is calculated, where the independent magnetic field sensor is disposed near the main pole so as to be opposed to the main pole across the air bearing surface, and where the ratio is calculated while a displacement between the main pole and the magnetic field sensor is swept. A flare point height of the main pole is determined from the calculated amplitude ratio.

Abstract: In order to grind bar-shaped workpieces which have a non-circular cross-section and flat faces which are parallel to each other, two partial operations are performed consecutively. First, the bar-shaped workpiece is rough ground and finished on the faces by way of double-disk face grinding. The bar-shaped workpiece is clamped on the longitudinal sides in the first clamping position thereof, and the bar-shaped workpiece is transported between two clamping jaws, which clamp the workpiece in the second clamping position thereof on the faces. The first clamping position is then released, and the bar-shaped workpiece is rotated by the clamping jaws. A CNC-controlled peripheral grinding step is performed based on CX interpolation principles. This rough grinds and finishes the longitudinal sides of the bar-shaped workpiece. Transport from the first to the second clamping position is effected by a clamping station, which concomitantly forms the holder for the face grinding operation.

Abstract: A polishing apparatus to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units to detect rotation rates of the stools, a pressurizing unit to compress the work between the pair of the stools, a slurry supply unit to supply a slurry to the stools, and a control unit to reduce, when determining that a frictional force between the polishing surface and the work exceeds a threshold, at least one of a load applied by the pressurizing unit, the rotation rate of the stools, and a supply amount of the slurry.