Abstract: The present invention relates to a panel clamp securable to a variety of mounting mechanisms. The clamp includes first and second members, each having an edge extending beyond at least a portion of its side surface to form an overhang, and each includes a plurality of holes passing therethrough. When the overhang of the first member is fitted over a top surface of a panel and the overhang of the second member is fitted over a bottom surface of the panel, such that the plurality of holes in the first member is substantially aligned with the plurality of holes in the second member, mechanical fasteners can be inserted through the plurality of holes to secure the first and second members to the panel. An additional mechanical fastener is inserted through the clamp to secure the clamp to a mounting mechanism.

Abstract: The present invention relates to a panel clamp securable to a variety of mounting mechanisms. The clamp includes first and second members, each having an edge extending beyond at least a portion of its side surface to form an overhang, and each includes a plurality of holes passing therethrough. When the overhang of the first member is fitted over a top surface of a panel and the overhang of the second member is fitted over a bottom surface of the panel, such that the plurality of holes in the first member is substantially aligned with the plurality of holes in the second member, mechanical fasteners can be inserted through the plurality of holes to secure the first and second members to the panel. An additional mechanical fastener is inserted through the clamp to secure the clamp to a mounting mechanism.

Abstract: A rotary cutting tool includes a shaft having and outer surface and having a longitudinal axis, a plurality of helical flutes formed in the shaft about the longitudinal axis, a plurality of helical cutting edges formed at an interface with the outer surface and a respective helical flute about the longitudinal axis, and a plurality of end cutting edges located on an axial distal end of a cutting portion of the shaft, the end cutting edges being contiguous with a corresponding one of the plurality of helical cutting edges and forming a corner in the transition between each of the end cutting edges and the corresponding one of the plurality of helical cutting edges. A hone edge extends along a portion of each of the end cutting edges, the associated corner and a portion of the corresponding one of the plurality of helical cutting edges.

Abstract: The present invention relates to an electric sharpening machine for chain saws capable of correctly sharpening the teeth of every kind of saw; this system according to the invention allows to rotate all the upper group with the motor and the grinding wheel, to balance the chain stop situated on the vice and, in addition, to turn the saw of 180°; in this way it is possible to let the abrasive vice sharpening the saw teeth rotate, both in case of left and right teeth, towards the inner part opposite to the position of the operator.

Abstract: An abrasive apparatus adopted to abrade a curved surface of workpiece includes: an abrading head including an abrading tip having a substantially spherical outer surface and a rotating shaft supporting the abrading tip, the abrading head being positioned to face the curved surface; a thrust moving mechanism for relatively moving the abrading head and the curved surface; a lateral moving mechanism for relatively moving the abrading head and the curved surface; a pivotal moving mechanism for relatively moving the abrading head and the curved surface pivotally around a center point; and a controller for controlling the abrading head, the thrust moving mechanism, the lateral moving mechanism and the pivotal moving mechanism synchronously so that the abrading tip contacts and presses the curved surface at any point thereon with a substantially constant pressure in a direction consistent with a normal line thereat.

Abstract: An polishing apparatus which can effectively polish a bottom wall of a wafer in a notch portion is disclosed. The apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member for turning the table around a predetermined axis which is approximately parallel with the rotary axis of the rotary buff so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.