Abstract: A rough grinding process grinds the workpiece W supported by the supporting device by the rough grinding wheel until a preset stock amount for finish grinding remains, and then the finish grinding process finish grinds the stock amount while the workpiece W is continuously supported by the supporting device. The stock amount for finish grinding is set based on at least one of a thermal displacement of the multifunction grinding machine and a changing amount of grinding force of the rough grinding wheel. A profile remaining the stock amount for finish grinding is a profile not depending on a profile of the rough grinding wheel.

Abstract: A method for grinding the surface of non-round workpieces. The method includes the steps of clamping a workpiece within a machining unit; machining the workpiece; without unclamping the workpiece, contactlessly measuring the workpiece using an optical measuring device having a conoscopic holography sensor with a characteristic measuring range; and machining and measuring the workpiece in an alternating manner to iteratively approach the desired measurements of a specified form by adjusting the distance between the optical measuring device and the surface of the workpiece depending on there being a deviation of the surface from the specified form so that a respectively measured area of the surface of the workpiece remains within the measuring range of the optical sensor.

Abstract: An apparatus and method for machining workpieces is provided, in particular, for grinding the surface of non-round workpieces. The workpiece is clamped within a machining unit and the surface of this workpiece is contactlessly measured by means of a measuring device while the workpiece is clamped within the machine.

Abstract: Abrasive articles have an adhesive layer in contact with a liner having protrusions that contact the adhesive layer.

Abstract: The invention relates to a method for grinding convex running surfaces and exact outside diameters on undulated workpieces. In a clamping, a first convex running surface is ground on a discoid partial section of an undulated workpiece during a first grinding operation while using a first grinding wheel that comprises at least one concave lateral surface. A second grinding wheel is used to grind a desired outside diameter on the discoid partial section as well as on other partial sections of the undulated workpiece during a second grinding operation.

Abstract: Polishing pads used in the manufacturing of microelectronic devices, and apparatuses and methods for making and using such polishing pads. In one aspect of the invention, a polishing pad for planarizing microelectronic-device substrate assemblies has a backing member including a first surface and a second surface, a plurality of pattern elements distributed over the first surface of the backing member, and a hard cover layer over the pattern elements. The pattern elements define a plurality of contour surfaces projecting away from the first surface of the backing member. The cover layer at least substantially conforms to the contour surfaces of the pattern elements to form a plurality of hard nodules projecting away from the first surface of the backing member. The hard nodules define abrasive elements to contact and abrade material from a microelectronic-device substrate assembly. As such, the cover layer defines at least a portion of a planarizing surface of the polishing pad.

Abstract: A grinding machine includes a rotating grinding wheel and workpiece moving apparatus operable to move a workpiece towards and away from the wheel. The apparatus is arranged to move a workpiece support arcuately about an axis to move a workpiece towards or away from the wheel. A motor turns the workpiece to present different parts of the workpiece to the wheel, and an orientation detector signals the orientation of the workpiece so that the operations of the workpiece moving apparatus, and the motor can be coordinated to cause a desired profile to be ground on the workpiece. The machine also comprises correcting apparatus operable in response to the operation of the workpiece moving apparatus to cause the output of the orientation detector to be altered to compensate for angular alterations in the point of contact of the workpiece with the grinding wheel caused by the arcuate movement of the workpiece support.

Abstract: The present invention achieves machining operation without grind-burning and grinding crack and improves the profile accuracy of a workpiece, by automatically generating X/C axis data that controls the headstock and the wheel spindle head while taking into account speed, acceleration, change in acceleration and contact arc length.