Abstract: Cloth cleaning device of a polishing machine which is capable of fully cleaning a polishing cloth including a part in the vicinity of a center roller. The cloth cleaning device includes an arm movable in a plane parallel to the polishing cloth between a first position above the polishing cloth and a second position outside of the polishing cloth. A jet nozzle is attached to the arm and directs high pressure water toward the polishing cloth. An enclosing member encloses the jet nozzle so as to prevent the high pressure water, which has been directed out from the jet nozzle, from scattering. The jet nozzle is oriented toward the center roller and the high pressure water is directed toward the part of the polishing cloth in the vicinity of the center roller when the arm moves the jet nozzle close to the center roller.

Abstract: A wafer carrier head assembly for holding a wafer in chemical mechanical planarization applications is dis;losed that includes a downwardly protruding wafer retaining ring that moves independent of the wafer carrier head and retains an edge of the wafer on said polishing surface. An adjustable wafer holding mechanism that applies one of a uniform downward force and a uniform upward force to the wafer is also included. Application of the upward force allows the wafer holding mechanism to retain and transport the wafer to a polishing surface. Application of the downward force allows the wafer holding mechanism to retain the wafer on the polishing surface and allows the wafer to be uniformly polished. The wafer carrier head assembly herein disclosed is also configured to pivotally accommodate changes in parallelism between the wafer and the polishing surface when the wafer is being polished.

Abstract: A polishing tool used for a CMP process is disclosed. The polishing tool includes a polishing platen for holding a wafer faced-up thereon and carrying the wafer to move to and fro between a first position and a second position, a polishing pad for polishing the wafer, and a holder for holding the polishing pad to self-rotate and carrying the polishing pad to move across the wafer surface and further driving the polishing pad to polish the wafer.

Abstract: The present invention relates to an apparatus and method for polishing substrate surfaces. The method can include the steps of holding a substrate against a polishing surface and depositing slurry on the polishing surface. The method can further include the step of moving the holding device in a substantially curvilinear path relative to the polishing surface, or the step of moving the polishing surface in a substantially curvilinear path relative to the holding device. The apparatus comprises a polishing surface, a holding device for holding a substrate against the polishing surface, and a slurry supply system for depositing slurry on the polishing surface. The apparatus further includes a moving structure for moving the holding device in a substantially curvilinear path along the polishing surface, or a moving structure for moving the polishing surface in a substantially curvilinear path relative to the holding device. The substantially curvilinear path is preferably substantially a figure eight path.

Abstract: A polishing pad has a first layer, a second layer, a hole and a plug. The hole is formed in the polishing pad and has a first section in the first layer of the polishing pad and a second section in a second layer of the polishing pad. The plug is embedded in the hole and has an upper portion and a lower portion. The upper portion of the plug fits into the first section of the hole, and the lower portion of the plug fits into the second section of the hole. Since the plug has a height of the polishing pad, the problem of depositions, such as water droplets, has been solved. The endpoint detection can thus be precisely controlled.

Abstract: A porous, roll-grinding tool has an abrasive surface which is adapted to contact and grind the surface of a roll and configured to a planar polygonal shape having 4 to 20 sides. Using the grinding tool, a roll can be ground within a satisfactory dimensional tolerance, with feed marks crossing the circumferential direction of the roll at a small feed mark pitch inclination angle, so that no streaky printing defects will be produced when the ground roll is used in printing.

Abstract: A holder in a brush-cleaning installation, preferably for combined use in the brush-cleaning and centrifugal-drying process, contains a carrier part from which there extend, in a spider-shaped manner, a plurality of carrying arms. On the carrying arms there is mounted, in a rotatable manner in each case, a guide roller which, in addition to positioning the semiconductor wafer vertically, also makes it possible for the semiconductor wafer to be positioned horizontally with the aid of an annular collar on a bottom section of the guide roller.

Abstract: The present invention relates to a system for controllably removing photoresist. A CMP system is employed for polishing the photoresist. A non-abrasive polishing liquid adapted to react with the photoresist to sufficiently modify bonding in the photoresist is employed to facilitate surface layer removal of the photoresist by applied mechanical stress from the CMP system.

Abstract: A method of lapping semiconductor wafers includes the step of transmitting sounds generated during the lapping process to a receiver, allowing the operator to use sound to more quickly detect problems associated with starting the lap process.

Abstract: A rotary chemical-mechanical polishing apparatus with multiple fluid-bearing platens for use in semiconductor fabrication is described together with a method for chemical-mechanical polishing of semiconductor substrates (“wafers”). A single polishing pad is affixed to a pad backing composed of a thin metal membrane. A polishing fluid is introduced onto an upper surface of the polishing pad. One or more wafers are held face down upon the upper surface of the polishing pad by carriers. Fluid-bearing platens are placed below a lower surface of the pad backing and located directly underneath each wafer. While polishing wafers, the polishing pad and pad backing are rotated about their common center, each carrier and wafer pair is rotated about its common center, the carriers apply a down force on the wafers, and the fluid-bearing platens support the pad backing. The fluid-bearing platens support the pad backing with a fluid flow that exerts a pressure on the pad backing.

Abstract: A surface grinding method is provided by which grinding striations are produced so that the striations can fully be removed by a polish-off amount less than required in a conventional way in mirror polishing following surface grinding using an infeed type surface grinder, in which two circular tables, opposite to each other, which are driven and rotate independently from each other, are arranged so that the peripheral end portion of one table coincides with an axial center of a rotary shaft of the other table all time, the two circular tables being located so as to be shifted sideways from each other; not only is a grinding stone held fixedly on an opposite surface of the one table, but the wafer is fixed on an opposite surface of the other table; the two tables are rotated relatively to each other; and at least one table is pressed on the other while at least one table is relatively moved in a direction, so that a surface of the wafer is ground, wherein the surface of the wafer is ground while controlling a

Abstract: A polishing apparatus has a turntable with a polishing surface, a top ring for pressing a workpiece against the polishing surface under a given pressure to polish the workpiece, and a dresser for dressing the polishing surface. The polishing surface has an outer circumferential edge portion cut off or the dresser has a predetermined outside diameter, such that the polishing surface has an outer circumferential edge positioned in alignment with or radially inwardly of an outer circumferential edge of the dresser in the radial direction of the turntable when the polishing surface is dressed by the dresser.

Abstract: A surface polishing apparatus for polishing a surface of a ferrite core for a deflecting yoke is disclosed. The surface polishing apparatus is used to polish an inner wall surface of a hole portion and an outer wall surface of a lower end portion of a substantially trumpet-shaped ferrite core having a diameter increasing from an upper end portion thereof to the lower end portion thereof. In the surface polishing apparatus, the inner wall surface of the hole portion and the outer wall surface the lower end portion of the ferrite core are polished simultaneously using a grindstone whose grinding surfaces to be respectively contacted with the inner wall surface of the hole portion and the outer wall surface of the lower end portion of the ferrite core are formed integral with each other.

Abstract: A method and apparatus for cleaning a surface of a microelectronic substrate. In one embodiment, the apparatus can include a support member having a manifold in fluid communication with a source of liquid and in fluid communication with at least one exit aperture. A porous brush member can be coupled to the support member such that a contact portion of the brush is positioned against the exit aperture to receive liquid directly from the exit aperture. The liquid can flow from the exit aperture through the contact member and to the surface of the microelectronic substrate to keep the contact portion moist. The contact portion can be moistened as it cleans the microelectronic substrate or between cleaning cycles. The liquid can also be supplied to the contact portion at a rate sufficient to remove particulates and other contaminants from a porous outer surface of the contact portion.

Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

Abstract: The present invention relates to improved chemical mechanical polishing apparatus, which reduce air sharp pressure on the polish head for preventing the breakage unpolished wafer. The improved chemical mechanical polishing apparatus of present invention is composed of a wafer head, a polish head, a damper and a sensor. The flowing speed of gas is reduced by making the diameter of the gas line connected to the damper air inlet smaller than the diameter of the gas line connected to the damper air outlet. The initial air sharp pressure is reduced and make &Dgr;P=Pwafer−Ppolish<0, by adding an air temporary storage machine in between the inlet and the outlet.

Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.

Abstract: A polishing system has a polishing pad, a wafer retainer for pressing an insulating layer formed on a semiconductor wafer against polishing slurry spread over a polishing pad and a measuring apparatus for measuring the thickness of different portions of the insulating layer, and the measuring apparatus has measuring electrodes embedded in the polishing pad, a first calibration electrode also embedded in the polishing pad and a second calibration electrode embedded into the lower surface of the wafer retainer, wherein the first calibration electrode and the measuring electrodes are opposed to the second calibration electrode and an electrode formed in a dicing area of the semiconductor wafer during the polishing so that the measuring apparatus determines the thickness at the different portions on the basis of a first capacitance between the first calibration electrode and the second calibration electrode and a second capacitance between the measuring electrodes and the electrode in the dicing area.

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract: There is disclosed a polishing machine capable of flattening a wafer surface uniformly. The machine can modify the flatness of the surface during polishing. The machine has an index table and a polishing head 18. The table attracts the wafer to be polished such that the wafer faces upward. The table rotates to the primary polishing station. The polishing head has a pressure application cylinder 21 and a base plate 22. The cylinder is held to a carrier at a given angle. The base plate holds polishing cloth 24 and is mounted to the cylinder so as to be swingable in three dimensions. The cloth touches the wafer surface and rotates at a high speed, thus flattening it. At the second polishing station, polishing cloth attached to another polishing head touches the wafer surface and rotates at a high speed, thus finally polishing the wafer surface.

Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Abstract: A method and apparatus for polishing hard discs uniformly while minimizing frictional electricity between the discs and polishing materials as well as preventing from frictionally heated deformation. A turntable for placing a disc thereon is freely rotatable without being connected to any motor or other driving force. A polishing material rotates horizontally and polishes the surface of the disc by contacting with the surface. The turntable relatively slides against the surface of the polishing material. A spindle of the polishing material is slightly inclined toward the center of the turntable from a vertical axis of the disc. The turntable is rotated in a direction opposite to the rotating direction of the disc. The rotation of the turntable is induced by the rotation of the polishing material transmitted by the friction between disc and turntable. The disc is substantially electrically connected to the ground during the polishing.

Abstract: An end-face polishing and cleaning apparatus comprises at least one jig plate for supporting ferrules each fixed to an end of a respective optical fiber. At least one set of a polishing machine and a cleaning machine is provided for polishing and cleaning the end-faces of the ferrules while the ferrules are supported by the jig plate. A movable mounting device supports the jig plate and moves the jig plate between the polishing machine and the cleaning machine to polish and clean the end-faces of the ferrules. The movable mounting device has a holding member for supporting the jig plate, an elevation shaft for moving the holding member in a vertical direction, and a moving device for moving the holding member in a horizontal direction.

Abstract: A process for surface grinding of a flange surface of a wheel hub onto which a brake disk can be mounted for a motor vehicle includes the mounting of the wheel bearing on the wheel hub before the grinding operation. An outer bearing ring is then clamped on a stationary support and, as the wheel hub is rotated, the surfaces ground by a cup-shaped grinding disk rotated about an axis parallel to that of the axis of rotation of the hub.

Abstract: The polishing pad for a chemical mechanical polishing apparatus and a method of making the same. The polishing pad has a covering lawyer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.

Abstract: A method of polishing semiconductor wafers is provided. The method will not impair the original (pre-polishing) contour of semiconductor wafers, and semiconductor wafers can be polished so as to have high flatness. In the method according to this invention, a silicon rubber sheet 2 is fixed on a base 4, and an abrasive cloth 5 is secured on the silicon rubber sheet 2. A template 1 of thickness close to that of a semiconductor wafer 10 is secured on a backing pad 32. The semiconductor wafer 10 is restrained by the template 1 and is impelled in to contact with the abrasive cloth 5 to polish effectively.

Abstract: A vertically stacked planarization machine includes two or more vertically stacked individual platens on which wafers are polished. The wafers are held by wafer holders which may rotate the wafers. The individual platens are orbited in order to polish the wafers. Alternatively, the individual platens are rotated in order to polish the wafers. The platens may have a top and bottom polishing pad for polishing multiple wafers. A single wafer holder, using hydraulic or pneumatic means, between two platens will hold and exert pressure on both a downward wafer and an upward wafer. The pressure exerted onto the top and bottom wafers by the dual wafer holder is designed to be equal to prevent any bowing of the platen. Preferably, the platens are supported by three vertical members positioned at 120 degree intervals around the circumference of the platens to form a platen stack.

Abstract: A planarizing system which significantly reduces the problems associated with non-uniform removal of surface material across the face of a semiconductor wafer or other comparable workpiece. The invention involves a planarizing apparatus that takes the leading edge of a wafer out of contact with the polishing pad while concomitantly enhancing slurry penetration and distribution at the polishing pad-wafer interface. This result is accomplished by combining: means for deflecting upward a portion of a flexible polishing pad as it passes in rotation beneath a wafer to form a raised polishing pad area, and means for positioning the wafer such that the wafer's leading edge overhangs the front edge of the raised polishing pad area during the planarization procedure. The invention also encompasses a method of using the planarizing apparatus to uniformly remove surface material across the face of a wafer.

Abstract: A semiconductor wafer polishing apparatus includes a housing and a turntable mounted in the housing. The turntable has an axis of rotation and a surface for affixing a semiconductor wafer. The polishing apparatus also includes a motor mounted to the housing and connected to the turntable to supply a torque for rotating the turntable about the axis of rotation. A polishing assembly is connected to the housing and extends adjacent to the turntable surface. A polishing pad is affixed to the polishing assembly and is positionable to contact the semiconductor wafer. Some polishing pads are cylindrical in form. Other polishing pads have a conical form.

Abstract: A vertically stacked planarization machine includes two or more vertically stacked individual platens on which wafers are polished. The wafers are held by wafer holders which may rotate the wafers. The individual platens are also orbited in order to polish the wafers. The platens may have a top and bottom polishing pad for polishing multiple wafers. A single wafer holder, using hydraulic or pneumatic means, between two platens will hold and exert pressure on both a downward wafer and an upward wafer. The pressure exerted onto the top and bottom wafers by the dual wafer holder is designed to be equal to prevent any bowing of the platen. The platens are supported by three vertical members positioned at 120 degree intervals around the circumference of the platens to form a platen stack. Transport elevators are used to carry the wafers to and from the wafer holders and the platens.

Abstract: A polishing pad having a polishing surface with radially extending tapered channels is disclosed. The polishing surface includes an inner radius within an outer radius, and the channels extend from the inner radius to the outer radius. Preferably, the outer radius is spaced from an outer circumferential edge of the polishing surface, the inner radius is an inner circumferential edge of the polishing surface, and the channels taper laterally and vertically at the outer radius. The channels are dimensioned and configured to direct slurry from the inner radius to the outer radius. The channels can be shaped with opposing sidewalls that are parallel in a first portion and diagonally converge in a second portion to form a sunburst pattern, or alternatively, with opposing sidewalls that continuously curve in a first rotational direction to form a starfish pattern.

Abstract: A vertically stacked planarization machine includes two or more vertically stacked individual platens on which wafers are polished. The wafers are held by wafer holders which may rotate the wafers. The individual platens are also orbited in order to polish the wafers. The platens may have a top and bottom polishing pad for polishing multiple wafers. A single wafer holder, using hydraulic or pneumatic means, between two platens will hold and exert pressure on both a downward wafer and an upward wafer. The pressure exerted onto the top and bottom wafers by the dual wafer holder is designed to be equal to prevent any bowing of the platen. The platens are supported by three vertical members positioned at 120 degree intervals around the circumference of the platens to form a platen stack. Transport elevators are used to carry the wafers to and from the wafer holders and the platens.

Abstract: An optical fiber end-surface polishing device has an improved ferrule fixing device allowing ferrules with optical fibers to be attached to or detached from a holder plate for polishing by a simple operation. The optical fiber end-surface polishing device, having a ferrule fixing device, simultaneously polishes the end surfaces of a plurality of ferrules with optical fibers fixed to and supported by a holder plate. The device includes ferrule accommodating sockets provided on the holder plate and having through holes for accommodating ferrules; and ferrule presser levers supported by stationary shafts substantially parallel to the through holes and biased toward descent by biasing devices, wherein each of the ferrule presser levers is movable between an angular position where the ferrules inserted into the associated ferrule accommodating sockets are downwardly pressed and an angular position where the polished ferrules can be detached.

Abstract: Device is described that reduces the forces needed to release a wafer from a wet polishing surface after polishing. Device comprises attachment adapted to be mounted to a polishing apparatus to permit attachment surface, configured to mate with two regions of the wafer, to tilt relative to the polishing surface. Means for defining adhesive force between attachment surface and one of the two wafer regions, and means for defining adhesive force between attachment surface and other of the two wafer regions which is different than that defined between attachment surface and the one wafer region so as to cause a non-parallel relationship between the one wafer face and polishing surface, are provided. Unbalanced force causes a non-parallel relationship between wafer and polishing pad and facilitates separation and lifting of wafer from polishing surface.

Abstract: A universal stone polishing composition which includes an abrasive constituent and a composition which is a source of Group Ia or Group IIa metal ions when mixed with water.

Abstract: The present invention discloses a glass sheet chamfering machine which is improved such that it is suitable for a partial chamfering for a glass sheet. In the conventional glass sheet chamfering machine, and in carrying out a partial chamfering with this conventional machine, at the moment when one of the two glass sheet shape sensing rollers departs from the end point of the glass sheet, one of the rollers is turned to the direction of the straight edge, so that the chamfering wheel is also automatically turned. Consequently, the chamfering direction is deviated, with the result that the chamfering becomes impossible, or a defective chamfering is generated. The present invention eliminates such conventional disadvantage, by arranging that, even if one of the two rollers departs from the corner, the chamfering wheel is not turned.

Abstract: An abrasive cloth dresser which can efficiently remove reaction products soaked into abrasive cloths for polishing semiconductor wafers etc. without scattering the reaction products. The abrasive cloth dresser includes a rotating hollow arm shaft 7, a high-pressure pure water jetting head 8 provided at a distal end of the hollow arm shaft, and a brush hood 11 provided at a distal end of the high-pressure pure water jetting head 8 and having a brush 16 planted thereto. The high-pressure pure water jetting head 8 includes a jet nozzle 83 through which high-pressure pure water is jetted for impacting reaction products soaked into a piece of abrasive cloth 3 to come out for removal. The brush 16 is elliptical in shape, and has a planted bristle density which is lower in a brush left-hand portion 161 near the high-pressure pure water injection center IC, but higher in a brush central portion 162 and a brush right-hand portion 163.

Abstract: An apparatus for successively grinding the edges of a series of like, sheetlike articles, such as glass sheets, and especially irregularly shaped glass articles such as automotive windows. The apparatus includes a frame, a table rotatably secured to the frame, a clamp for clamping an article on the table, and a template of the article carried by the table, but at an elevation below that of the article. The apparatus also has a swing arm assembly which carries a spindle near its outer free end, an inner end of the swing arm assembly being pivotally secured to the frame, the swing arm assembly being movable in a plane to move the spindle toward or away from the table. The spindle of the swing arm assembly has a rotatable grinding wheel which is positioned to engage the edge of an article on the table and a motor drive for rotating the grinding wheel. The spindle further has a cam follower which is positioned to engage the edge of the template when the grinding wheel engages the article.