Abstract: The object of the present invention is to enable efficient vibration processing by applying a sufficient displacement amount and response speed to an object to be vibrated. In grinding of an outer surface of a workpiece W, first and second supporting members are provided for supporting two opposed points of the workpiece, and first and second vibrators comprising a plurality of piezoelectric elements are arranged in blind holes formed in the center of the first and second supporting members. The first and second vibrators are activated with sine wave signals which differ in phase by 180 degrees so as to cause the first and second supporting members to expand and shrink in the back-and-forth direction. The displacement amount is amplified and the processing is performed. Also, the second supporting member can move back and forth toward the first supporting member.

Abstract: A tool sharpener accessory having a base mounted on a support, a pivoting member pivotally mounted on the base and pivoting in at least a seesaw motion relative to the base, the pivoting ember having an axis of rotation adaptable for extending transverse to the axis of rotation of the grinding stone, and a securing mechanism for securing the tool to the pivoting member.

Abstract: The object of the present invention is to enable efficient vibration processing by applying a sufficient displacement amount and response speed to an object to be vibrated. In grinding of an outer surface of a workpiece W, first and second supporting members are provided for supporting two opposed points of the workpiece, and first and second vibrators comprising a plurality of piezoelectric elements are arranged in blind holes formed in the center of the first and second supporting members. The first and second vibrators are activated with sine wave signals which differ in phase by 180 degrees so as to cause the first and second supporting members to expand and shrink in the back-and-forth direction. The displacement amount is amplified and the processing is performed. Also, the second supporting member can move back and forth toward the first supporting member.

Abstract: A fixture for slider lapping includes a holding portion for holding the object with its surface to be lapped toward the lapping surface of the lapping device; a main body for mounting the lapping fixture to the lapping device; a plurality of load-applied portions which are arranged along said longitudinal direction and independent from said main body, said load-applied portions receiving a load which presses the surface to be lapped to the lapping surface tightly from at least the lapping device; a plurality of connection members connecting said holding portion and said main body along said longitudinal direction at intervals; and a plurality of wrist portions connecting said connection members and said holding portion; wherein at least one wrist portion is disposed between said adjacent connection members; at least one wrist portion is disposed at each outer side of the connection members which are located at both ends of the longitudinal direction.

Abstract: A device for the machining of surfaces comprises a first housing unit (1), at which the device is to be supported, and a second housing unit (2), in which at least one tool holding fixture (9) for the grinding tool respectively polishing tool is rotatable mounted. The first and the second housing unit (1, 2) are joined with one another relatively rotatable to each other. Furthermore the device comprises a driving unit to drive the at least one tool holding fixture (9) and to drive the second housing unit (2) for rotation relative to the first housing unit (1). As a result of the superposition of the rotation of the individual tool holding fixtures with the rotation of the housing units, in which the tool holding fixtures are mounted, arise a better and faster machining result, a good superposition of the grinding marks and thus a symmetrical grinding pattern.

Abstract: A work chamfering apparatus includes a work holding portion. The work holding portion includes a work table and a clamper. The work table has an upper surface having two end portions each formed with holding grains projecting out of the upper surface. The two end portions of the upper surface of the work table have a static friction coefficient greater than 0.1, which is greater than that of a center portion. When chamfering, first, the work is held by the work table and a generally U-shaped member of the clamper. At this time, the two end portions of the upper surface of the work table contact a lower surface of the work, whereas lower surfaces of respective end portions of the U-shaped member contact an upper surface of the work. In this state, a rotating center of the work is between the lower surfaces, and the lower surfaces are apart generally equally from the rotating center.

Abstract: An apparatus for lapping a workpiece including a plurality of magnetic heads supported by a tool is disclosed. The lapping apparatus comprises a rotary-lapping table having an abrasive surface, and a lapping device assembly provided so as to be movable with respect to the abrasive surface of the lapping table. The lapping device assembly includes a device provided at a lower portion of the lapping device assembly for supporting the tool and a device for respectively applying predetermined loads to a plurality of load applying portions of the tool. The load applying portions of the tool is disposed along the longitudinal direction of the tool. The load-applying device applies the loads from a plurality of different directions to at least one of the load applying portions of the tool so that the tool is deformed into a predetermined shape.

Abstract: An end mill grinder have two independently adjustable grinding wheels. The end mill grinder includes two grinding wheels which are located next to each other. Each grinding wheel is rotated by a motor. The grinding wheels are positioned in a manner which allows the first grinding wheel to grind primary clearances of the end mill, while the second grinding wheel grinds secondary clearances of the end mill. The end mill is guided toward the grinding wheels by a finger guide attached to a carriage which supports and retains the end mill. The end mill grinder allows the grinding of primary and secondary clearances in one step.

Abstract: A lapping machine for lapping a row bar includes a lap plate for providing a lapping surface, a row tool having a plurality of bend cells formed by defining a plurality of slits, a pressure mechanism for pressing the row tool toward the lapping surface of the lap plate, and a bend mechanism for bending the bend cells of the row tool toward the lapping surface of the lap plate. The bend mechanism includes an air cylinder unit having a plurality of double-acting air cylinders, a plurality of racks operatively connected to the double-acting air cylinders, respectively, a plurality of drive pinions arranged coaxially and meshing with the racks, respectively, each drive pinion having a lever for driving the corresponding bend cell, a plurality of support pinions arranged coaxially and meshing with the racks, respectively, and a guide mechanism for guiding each rack, the respective drive pinion, and the respective support pinion in substantially the same plane.

Abstract: A grinding control unit installed in a tool bit grinder and adapted to control the feeding of a bit relative to a grinding wheel of a grinding unit of the tool bit grinder, the grinding control unit including a U-shaped support, a chuck adapted to hold the bit to be ground, a feeder adapted to control feeding stroke of the bit a swinging control mechanism adapted to control swinging stroke of the bit when feeding the bit, enabling two lips of the tip of the bit to be ground, a horizontal displacement control mechanism adapted to control the depth of bit feeding stroke, enabling the spur of the bit to be well ground.

Abstract: A roll grinding system includes a roll with a pair of longitudinally opposite ends, a longitudinal axis extending between the ends, and an outer surface. A material removal tool is movable in a travel path along a length of the roll. The material removal tool has a generally flat working surface oriented generally parallel to the travel path. A longitudinal displacement drive is connected with the material removal tool for moving the material removal tool along the travel path. A pair of supports are respectively positioned at and rotatably carry a corresponding end of the roll. At least one transverse displacement drive is provided, with each transverse displacement drive being connected with a corresponding support and configured to move the corresponding support in directions generally toward and away from the longitudinal axis.

Abstract: Lapping machine comprising a revolving turret (11) carrying at least several laps (13 to 17) that can be brought selectively into the machining position so that the laps can machine, in turn, one and the same cylindrical internal surface of a component. The laps comprise at least one expansion lap (17) and several progressive laps (15). The expansion lap (17) preferably has a stationary connector part (20) on its non-rotating part that can be coupled automatically to a moving connector part (21) when the expansion lap is in the machining position.

Abstract: A hand operated orbital sander having a hand grip portion provided with a fluid supply inlet connected to a source of pressurized fluid and a fluid discharge; a base portion for mounting a sanding pad and having a chamber, a fluid inlet for directing fluid into the chamber and a fluid outlet for discharging fluid from the chamber; a resiliently deformable sleeve portion for connecting the base portion to depend from the hand grip portion and defining a conduit for placing the fluid outlet in flow communication with the fluid discharge; a fluid operated rotor rotatably supported by the base portion within the chamber and mounting an eccentric weight for imparting orbital movement to the base portion; and a flexible conduit for connecting the supply inlet to the fluid inlet to apply pressurized fluid to the rotor to effect rotation thereof.

Abstract: Apparatus and method for grinding semiconductor chips and other specimens prior to microscopic examination thereof by supporting a specimen on a specimen mount, fixing the specimen mount to a lower end of a lower arm, connecting an upper end of the lower arm to a swingable arm by a horizontal pivot which permits the lower arm and specimen mount to move upwardly and downwardly relative to the swingable arm, providing a stop to limit downward movement of the specimen mount relative to the swingable arm when the lower arm reaches a zero position, moving the swingable arm downwardly to lower the specimen to engage an underlying rotatable grinding platen to define a zero position, and continuing to move the swingable arm downwardly beyond the zero position by an amount corresponding to the amount of material to be removed from a lower portion of the specimen so that the stop will prevent removal of additional material.

Abstract: An polishing apparatus which can effectively polish a bottom wall of a wafer in a notch portion is disclosed. The apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member for turning the table around a predetermined axis which is approximately parallel with the rotary axis of the rotary buff so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.