Abstract: A cable connection device includes a cable connector and a magnetic switch. The magnetic switch includes diametrically magnetized first and second annular magnets juxtaposed in a longitudinal direction of the cable connector and extending around a longitudinal axis of the cable connector, and an annular magnetic guide of ferromagnetic material surrounding an outer periphery of the first and second annular magnets. The first annular magnet is fixed relative to the annular magnetic guide, and the second annular magnet is rotatable between ON and OFF positions relative to the annular magnetic guide. In the ON position the first and second annular magnets are magnetically aligned in the longitudinal direction, and in the OFF position the first and second annular magnets are magnetically inverted in the longitudinal direction.

Abstract: A recreational vehicle may include a chassis, at least one axle assembly, and a vehicle body. The vehicle body may be supported by the chassis. The axle assembly may be coupled to the chassis and may provide motive support and underbody clearance to the chassis. The chassis may include a plurality of longitudinal main rails that span at least a portion of a length of the recreational vehicle and define a length of at least one crawl space. The plurality of lateral crawl space cross members may extend between and interconnect the plurality of longitudinal main rails and define a width of the at least one crawl space. A floor of the recreational vehicle, the plurality of longitudinal main rails, and the plurality of lateral crawl space cross members may collectively define the at least one crawl space.

Abstract: A method includes: vacuuming at least one area among a plurality of areas formed concentrically between a top face of the elastic film and the top ring body under a state where a bottom face of the substrate is supported by a support member and a top face of the substrate contacts a bottom face of the elastic film; measuring a flow volume of gas in an area located outside one or more areas to be vacuumed; determining whether the substrate is adsorbed to the top ring based on the flow volume of the gas; and after it is determined that the substrate is adsorbed to the top ring, separating the elastic film to which the substrate is adsorbed from the support member.

Abstract: A processing apparatus includes a chuck table, a processing unit configured to process a workpiece held on the chuck table, a height measuring unit fitted to the processing unit, the height measuring unit measuring, as height data, heights at a plurality of coordinates of the holding surface measured while a moving unit is moved, a reading unit capable of reading an information medium, and a control unit. The chuck table includes an information medium on which identifying information distinguishing the chuck table is recorded. The control unit includes a height data recording section configured to record the height data and the identifying information in association with each other, and a processing control section configured to control a height of the processing unit during processing on the basis of the height data associated with the identifying information read by the reading unit.

Abstract: A fiber optic connector and cable assembly includes a cable with one or more strength members secured to a connector that is connectable to both a hardened and a non-hardened fiber optic adapter. The cable can include multiple cable types with various shapes and strength member configurations. The connector includes a connector housing having a one-piece main body and a cover piece mounted thereon. The one-piece main body defines a plug portion compatible with the adapters. A ferrule assembly is mounted in the plug portion and biased outwardly by a spring. An insert within the connector housing includes a spring stop for holding the spring and a cable retention portion for securing the strength members of the cable. The spring stop and the cable retention portion can be included on a one-piece insert or they can separately be included on separate inserts.

Abstract: The present invention concerns a method for sharpening a worn removable machining tip (3) and the corresponding sharpened tip. The tip having a first cutting edge (7) damaged after a first use (u1), said tip having, in the state prior to the use of same, specific dimensional and geometrical parameters within a defined tolerance range and said first undamaged cutting edge (7) having a defined sharpness, the method involves sharpening the cutting face (9) by removing material from said cutting face on said first damaged edge (7), in order to make said tip (3) match said specific dimensional and geometrical parameters within said defined tolerance range, having a second cutting edge (7?) of said defined sharpness.

Abstract: A method of allowing a work-piece to obtain its free state shape while bonded to an adhesive fixture includes allowing the fixing surfaces to change shape or position relative to a fixture base without degrading the holding strength of the adhesive joints. A floating adhesive fixture may use one or more floating adhesive fixture devices. Each device includes a fixture element with an integral fixing surface that can displace relative to the fixture, a clamping system that can release or prevent this motion, and a suspension that keeps the fixture element in a nominal position when the clamping system is disengaged. A method includes unclamping the fixture elements and allowing them to displace as the adhesive joints and work-piece reduce strain energy. The clamping of the fixture elements prepares the fixture for the ensuing manufacturing process.

Abstract: According to one embodiment, a polishing device includes a stage, a polishing unit, a warp suppressing unit, and an adsorbing mechanism. A semiconductor wafer is mounted onto the stage. The stage is rotatable around a first shaft. The polishing unit applies a force to and polishes a rear surface of the semiconductor wafer mounted on the stage. The warp suppressing unit applies a force to, during the polishing, an outer circumferential part of a front surface of the semiconductor wafer. The adsorbing mechanism adsorbs, during the polishing, a first region in the rear surface of the semiconductor wafer. The first region is on a center side relative to an area at which the polishing is performed.

Abstract: A fiber optic connector fiber stub remover and method for automated fiber stub removal. The device has a top plate with a platen opening, and a platen with a well that carries a polishing film over the well. An air pocket is formed between the polishing film and the well. The platen is positioned with a top surface of the polishing film accessible via the platen opening. A fixture holds connector ends of fiber optic cables with fiber stubs extending therefrom, and a weight biases the fiber stubs into contact with the polishing film. A motor is controlled by a motor control unit to control a ramp up time and final speed of movement of the platen over a timespan. Each connector ends moves independently relative to the polishing film. The air pocket provides shock absorption of the polishing film so that an ideal pressure is exerted on each fiber stub during stub removal.

Abstract: A carrier may be configured and operated to engage a lapping plate with a plurality of physically separated sliders attached to a common adhesive of the carrier. The carrier can be constructed to have at least one finger adjacent to and capable of translating a single slider of the plurality of physically separated sliders.

Abstract: An assembly includes a carrier device having proximal and distal ends. The carrier device includes a workpiece platform along the proximal end. The workpiece platform supports one or more slider bars. The carrier device attaches to a lapping machine. An adaptive component, including at least one spring, has a first portion that couples to the carrier device and a second portion that couples to a grinding-slicing machine.

Abstract: A retaining ring for a polishing system is disclosed. The retaining ring has a process-resistant coating over a portion thereof. The process-resistant coating is a thin, smooth, conformal layer that is resistant to wear and chemical attack. The process-resistant coating is formed by a method that includes vapor deposition from a precursor gas mixture, which may deposit polyparaxyxylene from a gas mixture comprising paracyclophane. Adhesion of the process-resistant coating to the retaining ring may be enhanced by treating the surface of the ring prior to forming the coating. Resistance of the coating to the process may be further enhanced by treating the surface of the coating with an etching or deposition gas to impart texture.

Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

Abstract: The invention provides a holder for a polished work in which the warpage suppression or plate thickness accuracy of the holder for a polished work is improved, the generation of scratches in a polished work is suppressed so as to improve the abrasion resistance, and furthermore, economic advantages are provided. The holder for a polished work of the invention includes a first resin layer produced by impregnating a first resin composition into a first fiber base material, and heating and pressurizing the first fiber base material as an outermost layer, the first fiber base material is a glass fiber base material, and a structure derived from a resin having a novolac skeleton is included in a proportion of 50 mass % or more in the first resin layer excluding the first fiber base material.

Abstract: Method for mounting an optical lens (10) to be polished on a spindle (20) of a polishing device, the optical lens (10) comprising a first and a second main surface (101, 102), the method comprising: an optical lens (10) providing step (S1), in which an optical lens (10) whose first main surface (101) is to be polished is provided, a mounting step (S2), in which the optical lens (10) is mounted on the spindle (20), wherein, the mounting step (S2) further comprises a support device positioning step (S3), in which a support device (30) is positioned between the spindle (20) and the second surface (102) of the optical lens (10) so as to be rotated by the spindle (20) and to have a contact surface (31) partly in contact with the second main surface (102) of the optical lens (10) that partly extends beyond the second main surface (102) of the optical lens (10).

Abstract: One or more slider bars are attached to at least one component of a multi-component carrier device. The multi-component carrier device is attached to a lapping arm of a lapping machine and the one or more slider bars attached to the carrier device are lapped. The at least one component of the multi-component carrier device is attached to a grinding/cutting machine. At least one of a grinding operation or a cutting operation is performed on the one or more slider bars.

Abstract: An apparatus (10) for altering a surface of a bowling ball (14) has a bowing ball holder (12) with a surface altering mechanism (16). The bowling ball holder (12) includes a portion (18) to receive the bowling ball (14). The surface altering mechanism (16) is positioned in the ball receiving portion (18) of the bowling ball holder (12). The surface altering mechanism (16) applies a surface pattern onto the bowing ball (14).

Abstract: A blade sharpening stand including a support base body comprised of a pair of supporting stands spacedly provided, a blade set plate swingably attached at its rear side to the rear end of the support base body, a blade holder provided in the blade set plate for holding a blade of a knife on the blade set plate, and a guide roller provided on the front end of the support base body in a manner bridging the pair of supporting stands. A blade is held by the blade holder on the blade set plate after the blade set plate is set at desired inclined angle, and a grind stone set on the cutting edge of the blade and on the guide roller is moved back and forth to sharpen the cutting edge of the blade.

Abstract: An eyeglass support is adapted for pinch-holding the eyeglass (5) between three first contact portions (41-43) and three second contact portions (61-63). The first contact portions form a height reference for positioning the eyeglass whereas the second contact portions ensure application of the eyeglass against the first contact portions while conforming to any possible shape for the eyeglass. The support suits for being incorporated in a reflection measurement apparatus. In particular, it is useful for measuring reflection of eyeglasses provided with antireflecting coatings or for rating a protection against UV hazards which is provided by an eyeglass to a wearer of the eyeglass.

Abstract: A TSV (through silicon via) reveal process using CMP (chemical mechanical polishing) may be acoustically monitored and controlled to detect TSV breakage and automatically respond thereto. Acoustic emissions received by one or more acoustic sensors positioned proximate a substrate holder and/or a polishing pad of a CMP system may be analyzed to detect TSV breakage during a CMP process. In response to detecting TSV breakage, one or more remedial actions may automatically occur. In some embodiments, a polishing pad platen may have one or more acoustic sensors integrated therein that extend into a polishing pad mounted on the polishing pad platen. Methods of monitoring and controlling a TSV reveal process are also provided, as are other aspects.

Abstract: A retainer ring of a chemical mechanical polishing apparatus includes a base portion having a ring shape, the base portion including a pressurizing surface and a combining surface opposite the pressurizing surface, slurry inflowing portions on the pressurizing surface of the base portion, the slurry inflowing portions having groove shapes, and minute grooves at least on a surface portion of the slurry inflowing portions.

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

Abstract: A carrier for a slider row bar for a lapping process. The carrier has a mounting structure comprising a material configured to have a first modulus of at least 1,000,000 Pa at a first period of time and a second modulus of 500 Pa to 500,000 Pa at a second period of time subsequent to the first period. The change from the first modulus to the second modulus is due to an external stimulus on the material.

Abstract: A chemical mechanical planarization apparatus includes a table, a polishing pad and a detector. The polishing pad is disposed at the table. The detector detects an abnormal condition of the polishing pad.

Abstract: A system, fixture and method for media finishing a cluster of airfoils are provided. The fixture may include a base having a first end and a second end, a receptacle disposed on the base and configured to receive the stator cluster, and at least one mock airfoil disposed at each of the first and second ends of the base in alignment with the airfoils of the cluster.

Abstract: A polishing jig is provided that is capable of being used with different types, styles, and numbers of optical axes. For example, the polishing jig may be used with a variety of simplex connectors and with duplex connectors of at least first and second types. The first and second types of duplex connectors have different distances between the optical axes of their respective ferrules. The polishing jig may also be used with optical connectors having three or more ferrules having three or more respective optical axes.

Abstract: A platen for polishing a surface of a wafer has a reaction plate, a polishing plate, and a bladder. The reaction plate has a top and bottom surface, and defines a longitudinal axis. The polishing plate is positioned coaxially with the reaction plate. The polishing plate has a second top surface and a second bottom surface. The second top surface is adjacent to the bottom surface of the reaction plate. The bladder is coaxially located along a radially outer portion of either the top or bottom surface of the reaction plate. The bladder is connected with the polishing plate and able to expand to deform the polishing plate with respect to the bottom surface of the reaction plate.

Abstract: A home appliance and method including an appliance body having an oven access opening; an oven door for selectively covering the oven access opening; and a window in the oven door for viewing the oven contents, the window having a treated window portion for obscuring the view of the oven contents behind the treated window portion, the treated window portion being fabricated using a window treatment apparatus for supporting a window for treatment, the window treatment apparatus including a support stand defining a window support area, a blocking element mounted to the window stand for movement into and out of a covering relation with the window support area, the blocking element having a window cover plate having a window cover area smaller in area than the window support area, with the difference in the area of the window support area and the window cover area defining a window treatment area.

Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

Abstract: An elastic membrane is used in a substrate holding apparatus for holding a substrate such as a semiconductor wafer and pressing the substrate against a polishing surface. The elastic membrane includes a plurality of concentrically circumferential walls configured to define a plurality of pressurizing areas for pressing the substrate. The pressurizing areas includes a central pressurizing area located at a central part of the elastic membrane, an annular edge pressurizing area located at the outermost part of the elastic membrane, and a plurality of intermediate pressurizing areas located between the central pressurizing area and the annular edge pressurizing area. The area width of at least one of the intermediate pressurizing areas is set in a range to allow a polishing rate responsive width not to vary even when the area width is varied.

Abstract: An aspect of the present invention pertains to a method of fabricating wafers. One embodiment comprises a method of processing a substrate having defects into a wafer. The method comprises grinding the substrate to flatness while supporting the substrate in a grinding apparatus so that there is minimum or substantially zero stress on the substrate. Another aspect of the present invention comprises a substrate holder for holding a substrate as part of grinding processes to produce a flat surface on the substrate.

Abstract: A process is provided for polishing a silicon electrode utilizing a polishing turntable and a dual function electrode platen secured to the polishing, which can comprise a plurality of electrode mounts arranged to project from an electrode engaging face of the dual function electrode platen. The electrode mounts and mount receptacles can be configured to permit non-destructive engagement and disengagement of the electrode engaging face of the electrode platen and the platen engaging face of the silicon electrode. The silicon electrode can be polished by (i) engaging the electrode engaging face of the electrode platen and the platen engaging face of the silicon electrode via the electrode mounts and mount receptacles, (ii) utilizing the polishing turntable to impart rotary, and (iii) contacting an exposed face of the silicon electrode with a polishing surface as the silicon electrode. Additional embodiments are contemplated, disclosed and claimed.

Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.

Abstract: A flexure assembly comprising a flexure stack comprising a plurality of individual webs connected together with a force in an x-direction to produce a friction in a z-direction orthogonal to the x-direction between the plurality of webs, the friction holding the plurality of webs in engagement. In some embodiments, the flexure assembly includes a second flexure stack fixedly spaced from the first stack comprising a second plurality of individual webs connected together with a second force in the x-direction to produce a second friction in the z-direction between the second plurality of webs. The flexure assembly may be used, for example, for supporting a workpiece such as a slider row bar in a lapping machine.

Abstract: An example component polishing method includes polishing a component protecting portions of the component during the polishing using a barrier spaced from the component. The barrier is configured to move together with the component during the polishing.

Abstract: Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.

Abstract: An apparatus, system, and method are provided for reducing edge damage of a disk during chemical mechanical polishing. The apparatus includes a disk carrier configured to receive a disk, the disk having an outside edge and an inside edge, a raised ring adjacent the outside edge of the disk and extending from a surface of the disk carrier to a height greater than a height of the disk, and a raised column adjacent the inside edge of the disk and having a height greater than a height of the disk. The system includes a disk carrier for receiving a disk, a raised ring adjacent the outside edge of each opening, and plugs insertable into a central opening in the disk and having a height greater than a height of the disk. The method includes providing the apparatus, inserting a disk into the apparatus, and polishing the disk.

Abstract: The present disclosure relates to a two-phase cleaning element that enhances polishing pad cleaning so as to prevent wafer scratches and contamination in chemical mechanical polishing (CMP) processes. In some embodiments, the two-phase pad cleaning element comprises a first cleaning element and a second cleaning element configured to successively operate upon a section of a CMP polishing pad. The first cleaning element comprises a megasonic cleaning jet configured to utilize cavitation energy to dislodge particles embedded in the CMP polishing pad without damaging the surface of the polishing pad. The second cleaning element is configured to apply a high pressure mist, comprising two fluids, to remove by-products from the CMP polishing pad. By using megasonic cleaning to dislodge embedded particles a two-fluid mist to flush away by-products (e.g., including the dislodged embedded particles), the two-phase pad cleaning element enhances polishing pad cleaning.

Abstract: A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.

Abstract: An inner ring for a carrier head has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. An outer ring for a carrier head has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad.

Abstract: The invention relates to a device (1) for the insertion, guidance and evacuation of cylindrical parts to be ground in a centreless grinder (10). According to the invention, micrometric means (4, 40, 41) for adjustment of the alignment of the guides at the entry (3) to and the exit (5) from the guide chute (2) are provided and these micrometric adjustment means are independent from each other. The invention enables very precise adjustment of the alignment and prevents any shift of the parts.

Abstract: A planing device with a feed path for moving a material piece. The device includes a cutterhead on one side of the feed path, and a hold down unit on an opposing second side. The hold down unit includes a contact member that is held in a downward position towards the feed path. A cut control member is positioned upstream from the cutterhead. In use, the depth of cut and resulting amount of material removed from the one surface of the piece is dependent upon the thickness of the piece. One or more additional cutterheads may be positioned downstream to remove additional material from the piece.

Abstract: A semiconductor manufacturing apparatus includes at least one inner retaining ring, and an outer retaining ring. The at least one inner retaining ring applies a first pressure to the polishing pad, and retains a substrate on the polishing pad. The outer retaining ring applies a second pressure to the polishing pad, and retains the at least one inner retaining ring on the polishing pad. Control of the first pressure is independent with respect to control of the second pressure.

Abstract: A chemical mechanical polishing head includes a base assembly that includes at least one component formed of a composite plastic having a tensile modulus approximately equal to or greater than aluminum, a retaining ring secured to the base assembly, and a flexible membrane secured to the base assembly to form a pressurizable chamber between the base assembly and an upper surface of the flexible membrane. A lower surface of the flexible membrane providing a substrate mounting surface.

Abstract: A polishing fixture assembly for an optical element includes a first composite panel, a second composite panel, and a core member sandwiched between the first composite panel and the second composite panel and coupling the first composite panel to the second composite panel. At least one mirror mounting insert is coupled to each of the first and second composite panels.

Abstract: A retaining ring includes a generally annular lower portion and a generally annular upper portion. The lower portion has a bottom surface for contacting a polishing pad during polishing and a top surface. The upper portion has a bottom surface secured to the top surface of the lower portion and a top surface configured to be mechanically affixed to and abut a rigid base of a carrier head. The lower portion is a first plastic, and the upper portion is a different second plastic that is about the same or more rigid than the first plastic.

Abstract: An apparatus for machining an elongated workpiece with a tool a support column having a generally planar and vertical front wall and a pair of generally planar, parallel, and vertical side walls projecting rearward from respective outer edges of the front wall. A workpiece holder on the front wall can hold the workpiece forward of the front wall in a vertical orientation. A vertical guide secured to one of the side walls carries a vertical slide shiftable along the vertical guide. A front horizontal guide on the vertical slide forward of the front wall from the guide carries tool holder shiftable in the front horizontal guide on the vertical slide forward of the front wall and is adapted to hold the tool.

Abstract: A lapping carrier includes a base having first and second opposed major surfaces and at least one aperture extending from the first major surface to the second major surface. A wear layer is disposed on the first major surface of the base.

Abstract: An apparatus (10) for altering a surface of a bowling ball (14) has a bowing ball holder (12) with a surface altering mechanism (16). The bowling ball holder (12) includes a portion (18) to receive the bowling ball (14). The surface altering mechanism (16) is positioned in the ball receiving portion (18) of the bowling ball holder (12). The surface altering mechanism (16) applies a surface pattern onto the bowing ball (14).

Abstract: According to one embodiment, a substrate processing method will be disclosed. The method includes attaching a substrate to be processed onto a supporting substrate via an adhesive layer, removing an outer peripheral edge portion of the substrate to be processed together with the adhesive sticking to the outer peripheral edge portion, and grinding a surface of a side opposite to the supporting substrate of the substrate to be processed whose outer peripheral edge portion is removed.