Abstract: A system for machining a bevel on a disk shaped part including a grinding device having an abrasive, a device for securing the part including a support to which the part is fitted and which is integral with an axis of rotation. The securing device further includes a system for orienting the axis of rotation to define the angle of the bevel and a system for moving the support closer to the abrasive in order to machining the part under stress. The invention concerns the field of crystals for timepieces.

Abstract: A polishing apparatus capable of precisely controlling a polishing profile, particularly a polishing profile in an edge portion, of a wafer is disclosed. The polishing apparatus includes: a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring.

Abstract: The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.

Abstract: A workholder includes a connecting member, a polishing member mounted on the connecting member, an elastic member sleeved on the connecting member, and a fixing assembly for movably receiving the connecting member. An end of the elastic member resists the polishing member, and the other end of the elastic member resists the fixing assembly, such that the connecting member is moveable to adjust a position of the polishing member when polishing.

Abstract: An apparatus for grinding a continuously cast slab having a longitudinal axis and a rectangular cross-sectional shape with two opposite wide faces and two opposite narrow faces apparatus has a frame, two transversely spaced grinders carried on the frame, and a holder having two transversely spaced grippers engageable with the opposite faces of the slab in a vertical position with the wide faces of the slab vertical for grinding of the wide faces of the slab by the grinders and in a horizontal position offset by 90° to the vertical position with the wide faces of the slab horizontal for grinding of the narrow faces of the slab.

Abstract: A flexure assembly comprising a flexure stack comprising a plurality of individual webs connected together with a force in an x-direction to produce a friction in a z-direction orthogonal to the x-direction between the plurality of webs, the friction holding the plurality of webs in engagement. In some embodiments, the flexure assembly includes a second flexure stack fixedly spaced from the first stack comprising a second plurality of individual webs connected together with a second force in the x-direction to produce a second friction in the z-direction between the second plurality of webs. The flexure assembly may be used, for example, for supporting a workpiece such as a slider row bar in a lapping machine.

Abstract: A grinding method of grinding the back side of a workpiece having a projection on the front side thereof. The grinding method includes a holding jig preparing step of preparing a holding jig having a circular recess and an annular projection surrounding the circular recess, a setting step of setting the workpiece in the circular recess of the holding jig with the back side of the workpiece exposed, a liquid curing agent supplying step of supplying a liquid curing agent into the circular recess (either before or after the setting step), a fixing step of curing the liquid curing agent with the workpiece set in the circular recess and the liquid curing agent present in the circular recess, thereby fixing the workpiece in the circular recess, and a grinding step of grinding the back side of the workpiece and the annular projection of the holding jig by using grinding means.

Abstract: The device is a U-shaped housing comprising slidable platform embodiments providing defined and directed platform movements toward the task of shaping a rotating workpiece substantially at 90 degrees and 180 degrees to the axis of rotation. The device provides for sliding surface planes configured to accept abrasive materials and implements at predetermined angles for the purpose of trimming imperfections and truing model car wheels and axles. As an alternative to more complex machine shop equipment, the child, applying sandpaper to the platform surfaces and a triangular file or rectangular file on platform insets is enabled to effectively direct an abrasive surface which is configured at 90 degrees and 180 degrees to the axis of rotation for the purpose of truing the model car wheel and axle. To further enhance the child's participation, the workpieces can effectively be manually rotated in the slidable platform abrasion workstation device.

Abstract: To facilitate with high accuracy adjustment of a minute angle degree and also to sufficiently secure the rigidity of a whole device after the adjustment.

Abstract: The present invention facilitates with high accuracy the adjustment of a minute angle degree, and also is capable of sufficiently securing the rigidity of the whole device after the adjustment and provides good operability, accuracy, and rigidity. Provided are a workpiece attaching body having a workpiece attaching surface and a rotating body rotatably supporting the workpiece attaching body.

Abstract: A blade holding jig arrangement for either grinding or honing a blade including a mounting bracket assembly with an elongate guide bar and a device for rigidly supporting the guide bar. A support arm can be pivotally mounted on the guide bar by means of a tubular support mounted on one end of the arm and extending perpendicular thereto. The guide bar extends through a passageway in the tubular support. The support arm can be moved along the guide bar for grinding. A clamp unit for clamping a blade includes a U-bracket with two legs and two clamping jaws adjustably mounted on the U-bracket between the legs. The clamp unit is attached to an end section of the arm remote from the one end of the arm. The clamping jaws can be moved towards one another in order to clamp the blade.

Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, an information receiver receives information while the lapping plate is being used to lap a slider. The information indicates the quality of a lapping plate. A quality determiner that evaluates the quality of the lapping plate based on the information while the lapping plate is being used to lap the slider.

Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, information that indicates the quality of a lapping plate is received while the lapping plate is being used to lap a slider, and the information is used to evaluate the quality of the lapping plate while the lapping plate is being used to lap the slider.

Abstract: A polishing apparatus is provided for polishing an optical fiber connector. The optical fiber connector includes a connector housing and a ferrule. The polishing apparatus includes a mount to receive and hold the optical connector and a base to support the mount. The base further includes a dispenser portion. The polishing apparatus further includes a polishing strip dispensable by the dispensing portion of the base. The polishing strip has a portion thereof extending through a passageway formed in the mount, where a first surface of the polishing strip is disposed proximate to an end face of the ferrule of the optical connector disposed in the mount. In an exemplary aspect, the polishing strip comprises one or more polishing media disposed on a backing material.

Abstract: A double-grinding-wheel type drill bit grinding device with a single driving shaft comprising a power source disposed on a base, two grinding wheels being disposed at opposite ends of the single driving shaft extending out of the power source. The grinding device further comprises two pair of first grinding and second grinding seats, each pair of first and second grinding seats being disposed close to the respective grinding wheels at both ends of the driving shaft, a clamping assembly for clamping a drill bit to support the drill bit upon sequential insertion into one pair of the first and second grinding seats, and a positioning device being disposed on a front surface of the base for providing alignment of the drill bit within the clamping assembly prior to the insertion of the drill bit into one pair of the first and second grinding seats. The power source is a pneumatic motor and is provided with a vacuum passage for facilitating dust discharge.

Abstract: A blade sharpening device is provided for honing a cutting edge of a blade. The device includes a block with a top honing surface, and a jig assembly mounted on the block. The jig assembly holds a blade in a fixed position adjacent the honing surface, and directed towards the honing surface, so that a sharpening stone can be manually moved on the top honing surface and across the blade edge for sharpening. The stone can be moved longitudinally, laterally, and circularly. The jig assembly is pivotally mounted on the block for a desired sharpening angle, and vertically adjustable so that the blade edge is substantially flush with the top honing surface of the block.

Abstract: A lens presser for holding an eyeglass lens includes: a base member which is to be attached to a distal end of a lens chucking shaft; an abutting member which has an abutting surface which is to be abutted on a rear refractive surface of the lens; a movable member to which the abutting member is to be attached; a circular-arc-shaped concave portion which is formed in one of the base member and the movable member and has a radius center of a circular arc on a central axis of the chucking shaft; and a circular-arc-shaped convex portion which is formed in the other of the base member and the movable member and is fitted into the concave portion so as to slide only in a direction of the circular arc. The movable member is tiltable with respect to the base member.

Abstract: A rotary blade sharpener is comprised of a motorized platen positioned in a housing with a surrounding wall and an open top. An abrasive sheet with an adhesive bottom surface is adhered to a disc, which is tightened to the platen by a knob. The disc is color coded to indicate the grit of the abrasive sheet. An adjustable support rack is hinged to the housing above the platen. A jig is positioned on the rack and arranged to slide side to side thereon. The jig is arranged to receive and securely hold a blade and position it against the abrasive sheet. The rack is adjustable to position a beveled front end of the blade flat on the abrasive sheet. A lubricant container with a drip tube is attached to the housing. A cutout in the surrounding wall is arranged to enable grinding a flat side of the blade.

Abstract: An apparatus, system, and method thereof for material positioning and shaping. The apparatus includes a two-section positioning system which includes a guide and follower thereon for positioning along a path.

Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.

Abstract: A lapping carrier for machining a row of magneto-resistive elements is disclosed. The lapping carrier includes a plurality of movable elements, the movable elements terminating at an outer surface to form a generally planar mounting surface for a row of magneto-resistive elements. The lapping carrier is formed of a ceramic material. A method for lapping or machining a row of magneto-resistive elements is also disclosed.

Abstract: A clamping wafer holder for chemical-mechanical planarization (“CMP”) machines is provided. It comprises a plate having a surface for receiving on it the wafer, and a retainer around the surface. The retainer includes at least two jaws shaped and arranged such that they define a recess with the surface. The wafer is placed in the recess. An actuator is coupled with the retainer and adjusts it from an open position where the jaws are separated from each other, to a closed position where the jaws clamp an edge portion of the wafer. When the retainer is in the closed position the jaws preferably contact each other and define a continuous cylindrical inner surface. The surface can have a stopper that engages a flat zone of a wafer. Where the shape of the jaws does not match exactly the periphery of the wafer, elastic inserts are mounted on the jaws. A vacuum source is coupled with the plate, to hold the wafer in the holder during reorientation.

Abstract: When electric elements are formed on a ceramic bar or the like, the positional displacement of the respective elements occurs due to a division exposing process or the like. An object of the present invention is to provide a device and a method which unify the non-polished portion of the respective elements by conducting polishing while a complicated deformation or the like is given to the ceramic bar. To achieve this object, the ceramic bar or like is held by using a jig, and a plurality of loads are applied to portions of the jig where the ceramic bar or the like is held, to thereby deform the ceramic bar or the like and polish the element in that state. In this situation the load applied points are disposed so as to avoid the boundaries of the division exposure.

Abstract: A gas turbine component blank is shaped by clamping the gas turbine component blank into a fixture that accurately positions the gas turbine component blank in three dimensions. The positioning is accomplished against stops accurately machined into a base of the fixture, by first supporting the gas turbine component blank on one set of stops that prevents movement in the direction perpendicular to a plane of the base, and then operating a movable clamp to force the gas turbine component blank against other sets of stops that limit the movement of the gas turbine component blank in directions lying in the base plane. The clamp has a compound movement that simultaneously forces the gas turbine component blank against stops that prevent movement in orthogonal directions lying in the base plane. The gas turbine component blank is thereafter shaped, preferably by grinding the sides of the root precursor of the gas turbine component blank.

Abstract: A grinding jig for shaping generic recoil pads to custom fit the butt end of a gunstock. The jig includes an upright and a recoil pad mounting arm that function as an angle-capturing device. The upright and pad mounting arm are adjusted so that they fit flush against the butt and top or toe portions of the gunstock. The pad is then mounted in an upside down position on the pad mounting arm. The jig, with attached recoil pad, is then manually manipulated to bear against a vertically disposed sanding or grinding instrument.

Abstract: An angle-measurement assist device suitable for a visual inspection to determine a blade angle of a dental scaler is provided with a holder having a flat face thereof adapted to be in contact with a bladed portion of the scaler, a permanent magnet mounted to the holder, and first, second and third pins projecting from the holder in the directions which are perpendicular to one another, whereby an operator is permitted to make a visual inspection to determine whether the scaler is sharpened to have a target blade angle on the basis of an extending direction of the first pin, with the assist device magnetically retained on the scaler.

Abstract: A fixture for selectively locating and retaining hydraulic gerotor rotors in position in respect to a grinding wheel, the fixture clamping the rotor between two oversized positioning rolls located in rotor lobe valleys on opposite sides of the rotor.

Abstract: A fixture securely holds a blank having at least two spaced apart locators. The fixture has a base with spaced apart end walls, one supporting a clamping mechanism and the other supporting an abutment, at least one of which is free to pivot in relation to the end wall that supports it. Upon securing the blank into the fixture, the clamping mechanism mates with one of the locators on the blank and forces another of the locators into contact with the abutment. A method includes providing a blank having a least two spaced apart locators, providing a fixture having a base with two spaced apart end walls, one supporting a clamping mechanism and the other supporting an abutment, at least one of which is fee to pivot in relation to the end wall that supports it, and securing the bland into the fixture where in the clamping mechanism mates with one of the locators and forces another of the locators into contact with the abutment.

Abstract: A row of disk drive slider blanks with magneto-resistive read sensors are lapped after being mounted on the flat surface of a row carrier used to mount the row assembly on a row bending tool. Residual stresses present in the row due to wafer processing are relieved by removing the kerf areas between the slider blanks prior to lapping to prevent the stresses from causing inaccuracies in the lapping process. The stability of sliders below 30% can be enhanced by using wafers thicker than is required and then slicing the extra material from the row of slider blanks after it has been bonded to the row carrier either before or after the lapping process.

Abstract: A system for enhancing lens preparation which allows for error compensation to provide nearly error-free lens fining and/or polishing. The system employs a flexure to allow three degrees of freedom for a lens being prepared. The system also employs a Hall effect circuit board to monitor movement of the flexure to account for error, provide feedback to a controller so that compensation for such error can be effected and so that proper force may be maintained. The flexure and the sensor feedback subsystem enable nearly error-free lens surfaces.

Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.

Abstract: A clamping wafer holder for chemical - mechanical planarization ("CMP") machines is provided. It comprises a plate having a surface for receiving on it the wafer, and a retainer around the surface. The retainer includes at least two jaws shaped and arranged such that they define a recess with the surface. The wafer is placed in the recess. An actuator is coupled with the retainer and adjusts it from an open position where the jaws are separated from each other, to a closed position where the jaws clamp an edge portion of the wafer. When the retainer is in the closed position the jaws preferably contact each other and define a continuous cylindrical inner surface. The surface can have a stopper that engages a flat zone of a wafer. Where the shape of the jaws does not match exactly the periphery of the wafer, elastic inserts are mounted on the jaws. A vacuum source is coupled with the plate, to hold the wafer in the holder during reorientation. The actuator is advantageously operated by the vacuum source.

Abstract: The sharpening device for dental instruments comprises a chuck head holder having an arcuate member to one end of which the chuck head with the chuck is radially attached while the arcuate member is guided in a base of the device. The grinding head with the grinding wheel comprises a grinding head bearing which is rotatable around the mid-perpendicular of the base and includes a pivot which extends in parallel to the surface of the base and on which the grinding head turns, the latter being under the action of a tension spring in such a manner that the grinding wheel surface, which is disposed at an angle with respect to the mid-perpendicular, is pressed against the surface to be treated of the instrument. Moreover, the chucking assembly allows an essentially improved chucking of the instrument due to a thrust bolt which is actuated by an eccentric member and presses the shank of the instrument against the chuck opening. The head of the thrust bolt may be movable in order to adapt to the shape of the shank.

Abstract: A grinding fixture that allows a variety of helical shapes to be ground upon a variety of cutting inserts. The grinding fixture includes a bottom sine base for varying a first angle. A shaft is rotatably attached to the bottom sine base for providing rotation of the insert about an axis. A primary slide is rotatably attached to the shalt in parallel relation to the top surface of the bottom sine base for adjusting the position of a locating point on the insert in a first direction relative to the axis of rotation. The locating point is adjusted in a second direction relative to the axis of rotation by a cross slide attached to, and disposed in perpendicular relation with, the primary slide. A top sine assembly is fixedly attached to the cross slide for varying a second angle and includes a connection surface for fixedly connecting the insert holder to the sine assembly.

Abstract: An adapter for use with a powered grinding tool having a driven grinding wheel has a pivotally mounting part on a body thereof, and a drill bit holder engageable with the mounting part in either of two orientations for sharpening a tip of a drill bit clamped in a set position in the drill bit holder at the grinding wheel, the engagement being completed when the drill bit engages on a stop bar at the front of the mounting part. Also disclosed is a setting arrangement for setting the drill bit in its holder including stop means for engagement by the drill tip upon longitudinal setting of the drill bit, and drill rotation setting means slidable relative to the stop means for rotational setting of the drill bit. A powered grinding tool having the features of the adapter formed as part thereof is also disclosed.

Abstract: A carrier head that holds an object such as a wafer for a polishing system can be rotated during polishing. One such carrier head includes a sensor that determines the relative orientation of (or the angle between) a movable chuck and a fixed drive structure. A control system uses these measurements to select the edge pressure applied to the wafer or the chuck to control the attack angle of the wafer against polishing pads. By actively adjusting the attack angle, a carrier head can accommodate torques about an axis not in the plane of contact between the wafer and the polishing pad even when the wafer is otherwise free to rotate about the axis. One carrier head includes a drive plate with projections ending with balls that are disposed in matching openings in a carrier plate. Radial elongation of openings and curvature of the balls permit rotation of the carrier plate about an axis in plane passing between the carrier and drive plates.

Abstract: A fixture securely holds a blank having at least two spaced apart locators. The fixture has a base with spaced apart end walls, one supporting a clamping mechanism and the other supporting an abutment, at least one of which is free to pivot in relation to the end wall that supports it. Upon securing the blank into the fixture, the clamping mechanism mates with one of the locators on the blank and forces another of the locators into contact with the abutment. A method includes providing a blank having a least two spaced apart locators, providing a fixture having a base with two spaced apart end walls, one supporting a clamping mechanism and the other supporting an abutment, at least one of which is fee to pivot in relation to the end wall that supports it, and securing the bland into the fixture where in the clamping mechanism mates with one of the locators and forces another of the locators into contact with the abutment.

Abstract: A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A fixture for holding a semiconductor chip during a polishing process can be made to also hold the chip while the chip is inspected by a scanning electron microscope. In this manner, the polishing of the chip may be inspected and monitored without removing the chip from the polishing fixture. This allows polishing to be resumed, if necessary, with more precision. This results because the position of the chip with respect to the polishing fixture has not been altered by removing and then resecuring the chip as would be otherwise necessary for microscopic inspection of the chip.

Abstract: A bumper finishing apparatus comprises a guided fixture for carrying a bumper past a fixed rotary finishing head. An external drive moves the fixture as guided by a guide profile to coordinate travel of the bumper past the finishing head so that the finishing head abrades the bumper surface in a manner to achieve the desired finish.

Abstract: A dental curet and sharpening machine system has been developed for convenient, accurate, and rapid sharpening of dental curets. Curets comprising a cutting blade, shank, and handle have been designed so that, regardless of the instrument's rake angle, the arc center of the toe on the face of the cutting blade which is to be sharpened lies on the longitudinal center axis of the instrument and at a constant distance from reference means on the instrument handle. The sharpening machine comprises a base, a sharpening element, and an instrument guide unit. The instrument guide unit can position the blade face of a curet of any rake angle in a plane with the arc center of the toe on the blade's face coincident with an axis about which the guide unit can be swung while the blade is engaged with the sharpening element during the cutting procedure. The invention comprises three aspects: (1) the curets; (2) the sharpening machine; and (3) the method of sharpening the curets.

Abstract: A lapping apparatus for uniformly laps work pieces. The lapping apparatus includes a rotary lapping plate, a lapping base including a plurality of pads contacting the lapping plate, an adapter including first and second surfaces for supporting the mounting base contacting the lapping plate, and a supporting mechanism provided on the lapping base for supporting the second surface of the adapter by a supporting point. As the adapter supporting the work piece is supported on two points on the work piece and one supporting point of the lapping plate, the lapping surface of the work piece may follow as the lapping plate. Accordingly, it becomes possible to uniformly lap the work piece regardless of accuracy of the lapping base.

Abstract: An apparatus for polishing a semiconductor wafer is provided which includes a wafer carrier having on its lower surface a non-uniform surface structure means to vary the force against a wafer during a polishing operation so that the polishing is enhanced and imparts a planar surface across the polished wafer. Preferred non-uniform surface structure means include use of a wafer carrier having on its lower surface a backing film having a first central portion having a predetermined compressibility and a second peripheral portion having a different compressibility than the first portion. Another non-uniform surface structure means to vary the force against the wafer comprises a wafer carrier having on its lower surface a raised circumferential region around the periphery of the carrier.

Abstract: A tool and method for holding an integrated circuit (IC) sample so that only a cross-section of the processed layers of the sample is polished and exposed. The tool includes (a) a mounting block with a recess, (b) a pivoting member pivotably attached in the recess so as to be pivotable between a first position at which an edge of the sample can be ground at a first angle of approximately 25.degree. and a second position at which the sample can be polished at a second angle of approximately 0.degree. to expose the cross-section of the processed layer without polishing the more resistant substrate, (c) a sample holder removably attached to the pivoting member with a face inclined at the first angle for attachment of the sample, and (d) a level corrector for adjusting a side-to-side tilt of the mounting block.

Abstract: Apparatus and method for grinding semiconductor chips and other specimens prior to microscopic examination thereof by supporting a specimen on a specimen mount, fixing the specimen mount to a lower end of a lower arm, connecting an upper end of the lower arm to a swingable arm by a horizontal pivot which permits the lower arm and specimen mount to move upwardly and downwardly relative to the swingable arm, providing a stop to limit downward movement of the specimen mount relative to the swingable arm when the lower arm reaches a zero position, moving the swingable arm downwardly to lower the specimen to engage an underlying rotatable grinding platen to define a zero position, and continuing to move the swingable arm downwardly beyond the zero position by an amount corresponding to the amount of material to be removed from a lower portion of the specimen so that the stop will prevent removal of additional material.

Abstract: A fixture of disc-like form for holding connector mounted optical fiber ferrules. When the connector is attached to the fixture, the ends of the ferrule and fiber extend slightly beyond the plane of the bottom surface of the fixture so that the end surfaces may be polished by movement of the fixture over a sheet of polishing paper. The ferrule, and consequently the fiber, are rotationally locked to the fixture to prevent relative movement therebetween during the polishing operation by an element removably positionable in cooperative engagement with the disc. The element is rotationally locked to both the disc and the fiber optic connector.

Abstract: A dental instrument sharpening system includes an instrument arm for holding a chiral bladed dental instrument and for facilitating movement of at least one of the chiral blades of the dental instrument to a rotatable sharpening stone. A positioning mechanism, coupled to the instrument arm, positions at least one of the chiral blades of the dental instrument in a desired predetermined position. The positioning mechanism includes a clamping mechanism and indexed slotted member. The indexed slotted member has index protrusions, such as protruding nubs, that matingly engage with indentations in the handle of the dental instrument. The handle of the dental instrument includes at least one index indentation such as a conical indentation. The index indentation and the corresponding index protrusion mate to properly position the blade of the dental instrument in a predetermined longitudinal and axial position in the clamping mechanism.

Abstract: A dental curet and sharpening machine system has been developed for convenient, accurate, and rapid sharpening of dental curets. Curets comprising a cutting blade, shank, and handle have been designed so that, regardless of the instrument's rake angle, the arc center of the toe on the face of the cutting blade which is to be sharpened lies on the longitudinal center axis of the instrument and at a constant distance from reference means on the instrument handle. The sharpening machine comprises a base, a sharpening element, and an instrument guide unit. The instrument guide unit can position the blade face of a curet of any rake angle in a plane with the are center of the toe on the blade's face coincident with an axis about which the guide unit can be swung while the blade is engaged with the sharpening element during the cutting procedure. The invention comprises three aspects: (1) the curets; (2) the sharpening machine; and (3) the method of sharpening the curets.

Abstract: To provide an apparatus that may impart a complicated bend deformation to an object to be machined such as a ceramic bar elongated in one direction or the like, and may reduce the non-uniformity in machining amount of the object to be machined upon the machining work of the object to be machined, specifically a correcting mechanism for deforming the object to be machined together with a jig holding the object to be machined is provided in a machining apparatus. The correcting mechanism includes a base, a plurality of levers provided at first ends with pins, a shaft fixed to the base for rotatably supporting the levers, and a plurality of correcting drive means coupled to second ends of said levers for pivoting the levers to the shaft to thereby pivoting the pins.