Abstract: There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape 1 produced according to the method for producing an abrasive tape of the invention is used in a process for varnishing a magnetic disk and produced according to a process for preparing a slurry by kneading and dispersing abrasive particles 5 and a binding agent 6; a process for forming a coating film by applying the slurry on a support 2; a process for forming an abrasive particle layer 3 by hardening the coating film; and a process for forming a coating layer 4 on the surface of the abrasive particle layer 3.

Abstract: An apparatus for chemical mechanical polishing (CMP) of a wafer has a rotatable platen to hold a polishing pad, a polishing head for holding the wafer against the polishing pad, an optical monitoring system and a position sensor. The platen has a hole therein, the optical monitoring system includes a light source to direct a light beam through the aperture toward the wafer from a side of the wafer contacting the polishing pad and a detector to receive reflections of the light beam from the wafer, and the position sensor senses when the hole is adjacent the wafer such that the light beam generated by the light source can pass through the hole and impinge on the wafer.

Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.

Abstract: The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.

Abstract: A method for manufacturing a polishing pad that has high level of optical detection accuracy and is prevented from causing slurry leak from between the polishing region and the light-transmitting region includes preparing a cell-dispersed urethane composition by a mechanical foaming method; placing a light-transmitting region at a predetermined position on a face material or a belt conveyor, continuously discharging the cell-dispersed urethane composition onto part of the face material or the belt conveyor where the light-transmitting region is not placed; placing another face material or belt conveyor on the discharged cell-dispersed urethane composition; curing the cell-dispersed urethane composition to form a polishing region including a polyurethane foam, so that a polishing sheet is prepared; applying a coating composition containing an aliphatic and/or alicyclic polyisocyanate to one side of the polishing sheet and curing the coating composition to form water-impermeable film; and cutting the polishing

Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.

Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.

Abstract: A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad.

Abstract: A structured abrasive article comprises a backing, and an abrasive layer disposed on and secured to the backing. The abrasive layer comprises shaped abrasive composites, each comprising abrasive particles dispersed in a binder. Each the shaped abrasive composites independently comprises: a base disposed on the backing; a plurality of walls extending away from the base, and a grinding surface not contacting the base. Adjacent walls share a common edge. Each wall independently forms a dihedral angle with the base of less than or equal to 90 degrees. The grinding surface has a plurality of: cusps, and facets that contact a recessed feature. At least a portion of the recessed feature is disposed closer to the base than each of the cusps. Each cusp is formed by an intersection of two of the walls and at least one of the facets. Use of the structured abrasive article to abrade a workpiece is also disclosed.

Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.

Abstract: A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.

Abstract: An object of the present invention is to provide a polishing pad which enables high accuracy optical end-point detection in a state where polishing is carrying out, and which can prevent slurry leakage from a polishing layer to a cushion layer even in the case of being used for a long period. Another object is to provide a method for producing a semiconductor device using the polishing pad. The present invention relates to a polishing pad in which a polishing layer having a polishing region and a light-transmitting region, and a cushion layer having a through hole are laminated via a double-sided adhesive sheet such that the light-transmitting region and the through hole are laid one upon another, wherein a transparent member is stuck on an adhesive layer of the double-sided adhesive sheet in the through hole.

Abstract: A structured abrasive article includes a backing having a structured abrasive layer disposed on and secured thereto. The structured abrasive layer includes shaped abrasive composites that comprise abrasive particles and nonionic polyether surfactant dispersed in a crosslinked polymeric binder. The abrasive particles have a mean particle size of less than 10 micrometers. The nonionic polyether surfactant is not covalently bound to the crosslinked polymeric binder and is present in an amount of from 2.5 to 3.2 percent by weight based on a total weight of the shaped abrasive composites. The structured abrasive articles are useful for abrading a workpiece.

Abstract: An abrasive article includes an abrasive layer having an array of protrusions. The abrasive layer has a thickness not greater than about 500 mils. The abrasive article is free of a backing layer.

Abstract: The present invention provides a polishing pad which can improve qualities of an object to be polished by improving the flatness of the object. A polishing surface 1a of a polishing pad 1 is subjected to a mechanical process, such as buffing, so that the flatness of the surface is improved, and corrugations on the polishing surface have a cycle of 5 mm-200 mm and a largest amplitude of 40 ?m or less. As a result, the flatness of the object polished by the polishing pad 1, such as a silicon wafer, is improved.

Abstract: Abrasive articles containing solid abrasive particles (A) selected from the group consisting of inorganic particles, organic particles and inorganic-organic hybrid particles (a1) having an average primary particle size of from 1 to 500 nm as determined by laser light diffraction and having electron donor groups (a2) chemically bonded to their surface are provided. The said solid abrasive particles (A) are distributed throughout or on top of or throughout and on top of a solid matrix (B). A method for manufacturing abrasive articles and a method for processing substrates useful for fabricating electrical and optical devices are provided. The said methods make use of the said abrasive articles.

Abstract: Provided herein is a process for producing a layered sheet. The process involves preparing a cell dispersed urethane composition by a mechanical foaming method. The cell dispersed urethane composition is applied to a base material sheet and cured to produce a polyurethane foam layer of uniform thickness. A releasing sheet may be utilized to make the thickness of the polyurethane foamed layer uniform. Also, provided herein is a layered sheet produced by the above process. The polyurethane foamed layer may have spherical fine cells having an average cell diameter of 20 to 300 ?m. The polyurethane foamed layer may have a specific gravity of 0.2 to 0.5. The polyurethane foamed layer may also have a Asker C hardness of 10 to 50 degrees.

Abstract: A method for manufacturing a polishing pad containing substantially spherical cells and having high thickness accuracy includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition from a single discharge port to a substantially central portion in the width direction of a face material A, while feeding the face material A; laminating a face material B on the cell-dispersed urethane composition; then uniformly adjusting the thickness of the cell-dispersed urethane composition by thickness adjusting means; curing the cell-dispersed urethane composition with the thickness adjusted in the preceding step without applying any additional load to the composition so that a polishing sheet including a polyurethane foam is formed; and cutting the polishing sheet.

Abstract: Provided is a durable abrasive article which can conform even to a surface of a complicated shape and has an excellent abrasive power and which does not give any deep flaw to become a problem at a subsequent step and is not broken even when used in sanding the surface of the complicated shape. The abrasive article comprises a flexible resin film, an abrasive grain layer formed on the surface of the resin film, and an extremely flexible resin layer formed on the abrasive grain layer, wherein the flexible resin film has a thickness of 10 to 200 ?m, a tensile strength of 30 to 130 MPa and an elongation of 3 to 250%, wherein the abrasive grains of the abrasive grain layer are of P280 to P12, and wherein the extremely flexible resin layer has a 100% M of 1 to 20 MPa, a tensile strength of 20 to 90 MPa and an elongation of 250 to 1000%.

Abstract: A polishing pad, comprising a mounting surface and an opposing polishing surface with a polishing pattern having at least one aperture thereon, is formed with an adhesive layer adhered to the mounting surface with uniform adhesive strength therebetween. Embodiments include applying an adhesive layer to the mounting surface with uniform pressure prior to forming the polishing pattern on the polishing surface. Embodiments also include forming the polishing pattern having at least one aperture, forming a fitter having a surface pattern opposite to the polishing pattern and having a projection, positioning the fitter on the polishing pattern so that the projection fills the aperture in the polishing pattern forming a composite having substantially parallel opposing surfaces, applying pressure to bond the adhesive layer to the mounting surface with substantially uniform adhesive strength therebetween, and removing the fitter.

Abstract: A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surface corresponding to the polishing surface. The polishing pad is characterized by: a pressure sensitive adhesive formed on the reverse surface of the substrate and used to couple with a bottom layer, and the horizontal adhesion of the pressure sensitive adhesive is higher than the vertical adhesion of the pressure sensitive adhesive.

Abstract: A polishing pad of excellent durability and adhesion between the polishing layer and the base material layer includes a polishing layer arranged on a base material layer, wherein the polishing layer includes a thermosetting polyurethane foam having roughly spherical interconnected cells having an average cell diameter of 20 to 300 ?m The polyurethane foam includes an isocyanate component and an active hydrogen-containing compound as starting material components, and the active hydrogen-containing compound includes 30 to 85% by weight of a high-molecular-weight polyol having 2 to 4 functional groups and a hydroxyl value of 20 to 100 mg KOH/g.

Abstract: A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.

Abstract: A polishing disc for a tool for the fine machining of optically active surfaces, particularly on spectacle lenses as workpieces, comprises a main body which has a center axis and on which there is fixed an intermediate layer which is softer than the main body and on which a polishing agent carrier rests. The intermediate layer has, with respect to the center axis, a radial inner region of substantially constant axial thickness and an adjoining radial outer region. The latter is formed or is fixed to the main body in a particular way so as to prevent the edge of the polishing disc from being imprinted on the machined surface of the workpiece in the form of very fine, scratch-like microstructures. Also proposed is a simple method which can be used to produce such a polishing disc.

Abstract: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.

Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.

Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.

Abstract: A grinding tool for natural stone floors, artificial stone floors and industrial floors allows a greatest possible adaptation to the unevennesses of worn natural and artificial stone floors to be restored by using diamond tools that are flexibly attached. The diamond tools are fixed on a mat so that each individual diamond tool can adapt individually to the grooves and unevennesses of an animated natural stone and stone floor. The grinding pattern of a surface machined with said grinding tool corresponds to a newly produced natural stone or artificial stone floor.

Abstract: A double-sided pressure-sensitive adhesive tape 10 according to an embodiment of the present invention includes: a first pressure-sensitive layer 30 that serves as a pressure-sensitive adhesive surface to a surface plate; a second pressure-sensitive adhesive layer 40 that serves as a pressure-sensitive adhesive surface to a polishing member; and a substrate 20 between the first pressure-sensitive adhesive layer 30 and the second pressure-sensitive adhesive layer 40. In the double-sided pressure-sensitive adhesive layer 10 having such a layer structure, the loop tack adhesive strength of the first pressure-sensitive adhesive layer 30 is 16 N/50 mm or less.

Abstract: A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.

Abstract: A polishing pad of excellent durability has a polishing layer is arranged on a base material layer, and the polishing layer comprises a thermosetting polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 300 ?m.

Abstract: Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

Abstract: A honing tool for honing holes in workpieces, having an abrasive portion including a first abrasive layer therearound of abrasive particles of a first size, including a region having a second abrasive layer of abrasive layers of a second size sufficiently smaller than the first size, so as to be disposed in interstices between abrasive particles of the first abrasive layer without altering the diametrical size of the first layer, and so as to provide enhanced wear resistance.

Abstract: The present invention relates to a method for producing a glass substrate for a magnetic disk, the method including a step of polishing a main surface of a circular glass plate while supplying a polishing slurry containing a polishing material, in which polishing is performed, after a polishing surface is subjected to dressing treatment, by using a polishing pad having: a first resin foam layer which forms the polishing surface, includes a resin foam having pores with a pore diameter of more than 20 ?m and has a thickness of 400 ?m or less; and a second resin foam layer which is provided between a platen for fixing the polishing pad and the first resin foam layer, includes a resin foam having pores with a pore diameter of 20 ?m or less and has a thickness of 50 to 250 ?m, and in which a total thickness of the first resin foam layer and the second resin foam layer is 550 ?m or less, and a international rubber hardness degree of the polishing pad measured by the M method according to JIS K6253 is 40 IRHD or mor

Abstract: The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on the buffer layer for adsorbing a workpiece, and the compression ratio of the buffer layer is higher than that of the adsorption layer. Thereby, due to low hardness, good adsorption effect, and high compression ratio, the composite sheet of the present invention has good buffer effect.

Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.

Abstract: A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.

Abstract: A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveable in an axis normal to a polishing surface of the polishing elements. Different densities of the polishing elements may be positioned within different areas of the surface of the polishing pad.

Abstract: Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.

Abstract: A polishing pad including a polishing layer and a base layer is provided. Disposed under the polishing layer, the base layer includes a porous inner layer and at least one surface layer. The porous inner layer has an upper surface and a lower surface. The surface layer is disposed on at least one of the upper surface and the lower surface of the porous inner layer. The surface layer has a pore ratio no larger than 0.3%, or is completely non-porous.

Abstract: A polishing pad has one or more polishing elements made from a hydrogel material having an intrinsic ability to absorb water. The hydrogel material may or may not have micropores, but has a water absorption capability of 4%-60% by weight, a wet tensile strength greater than 1000 psi, a flexural modulus greater than 2000 psi, and a wet Shore D hardness between 25-80, inclusive. The hydrogel material may be made from one or a combination of the following moieties: urethane, alkylene oxides, esters, ethers, acrylic acids, acrylamides, amides, imides, vinylalcohols, vinylacetates, acrylates, methacrylates, sulfones, urethanes, vinylchlorides, etheretherketones, and/or carbonates.

Abstract: A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by removing conductive and dielectric material from a substrate while minimizing downtime of the polishing tool. In some embodiments, the polishing article may be a dielectric material or a conductive material and is configured to include a longer usable lifetime to minimize replacement and downtime of the tool.

Abstract: A polishing pad has an opaque polishing layer with an aperture therethrough and a polishing surface, and a solid light-transmissive window in the aperture. The solid light-transmissive window includes an outer portion secured to the polishing layer and an inner portion secured to the outer portion. The outer portion has a upper surface recessed relative to the polishing surface, whereas the inner portion has an upper surface that is substantially co-planar with the polishing surface.

Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) 201 and the wafer held by a holding member (top ring) 52 and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring 52 for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag 202 for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.

Abstract: A sanding implement for filing nails or for general sanding purposes includes a readily compressible elongated body having contoured sides, with a sheet of sand paper bonded to at least one of a pair of planar surfaces defined between the sides, the sides of a substantial thickness to provide smooth side surfaces able to be comfortably gripped by a user during use.

Abstract: An abrasive article includes an abrasive layer having an array of protrusions. The abrasive layer has a thickness not greater than about 500 mils. The abrasive article is free of a backing layer.

Abstract: A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described.

Abstract: A flexible, hand-held sanding pad comprises a conformable, multi layered, semicircle pad having a surface capable of providing temporary adhesive attachment for a sheet of pressure-sensitive adhesive-coated abrasive material.

Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.

Abstract: The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.