Abstract: A sharpening apparatus for sharpening the blades of a forage harvester chopper drum includes a carriage to which is mounted a grindstone carrier that holds a grindstone that is moved across the chopper drum during sharpening operation. The grindstone carrier includes an element which is mounted to the carriage for movement towards the chopper drum in order to advance the grindstone. The carrier element contains a threaded bore in which is received a threaded shaft that has a ratchet wheel fixed to it. A pawl is located in the path of movement of the ratchet wheel so as to be engaged thereby when the carriage reaches a reversal point at one side of the drum, this engagement causing the ratchet wheel to be rotated by an angular distance occupied by one tooth so that the threaded shaft causes the grindstone carrier to move axially therealong and toward the chopper drum so as to advance the grindstone.

Abstract: A machining cell and process for deburring root edges of a turbine blade. The machining cell defines a work area enclosing a robot to pick up and transport a blade package between working stations within the cell. A supply conveyor transports the part to an orienter station inside the cell where the part is checked for type and proper orientation prior to being picked up by the robot and moved to a deburring station. The robot manipulates the package into engagement with an active cutting tool to remove material from the root edges. The robot then transports the package to a brushing station located within the cell. The robot moves the package so that edges of the root are subjected to the abrasive action of a rotating brush wheel. The finished part is then transported by the robot to a discharge conveyor which feeds the finished part outside of the cell.

Abstract: Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality of outer surfaces, and a securing element to securely position the bumped device during engagement with the planarization member. Through application of “additive” and/or “subtractive” processes, the solder balls are substantially planarized.

Abstract: An orbiting head is rotatably mounted in the housing. The orbiting head has an axial end with a grinding surface for contact with the workpiece having its surface finished. The orbiting head defines a fluid passage with one end having an opening at the grinding surface. A spindle arbor is connected to the orbiting head and rotates with the orbiting head. The spindle arbor also defines a passage having one end connected to the passage of the orbiting head, and having another end connected to a fluid source. A drive is connected to the spindle arbor for driving the spindle arbor and the orbiting head in rotation. The orbiting head is rotated, and the grinding surface is placed into contact with the surface of the workpiece, and in relative rotation to the surface of the workpiece. Fluid is then moved through the passages from the fluid source to the opening in the grinding surface, and from the opening to an area between the grinding surface and the workpiece.

Abstract: A sharpener assembly for a food slicer includes a rotatable frame with a sharpening member and a truing member operatively connected for rotation with the frame. The frame is mounted on a food slicer to place the sharpening member and truing member on opposed sides of a slicer knife. The frame is rotated to rotate the sharpening member and the truing member into contact with respective sides of the slicer kife.

Abstract: A method of truing a grinding wheel includes the steps of providing a material containing a metallic material selected from the group consisting of metals in groups IVA, VA and VIA of the periodic table and alloys thereof, rotating a grinding wheel having a treatment surface to be trued, and contacting the material with the treatment surface of the grinding wheel.

Abstract: A method for manufacturing semiconductor wafers is provided. According to this invention, wafers are obtained by slicing a single-crystal semiconductor ingot. The sliced wafers are beveled at their peripheral rims. The beveled wafers are flattened by a lapping process. The front and the rear surfaces of the flattened wafers are spin-etched with an acid etchant liquid. The glossiness of the rear surfaces of the spin-etched wafers is controlled to a value of 130-300 %. The front surfaces of the wafers whose rear surfaces have been spin-etched are polished, thereby obtaining mirror-polished surfaces. The front surfaces may also be spin-etched prior to polishing.

Abstract: A powered coping and profile cutting and/or sanding apparatus is able to impart any shape to the surface of a body of material (17) at any angle, simple or compound, relative to the body of material. The apparatus comprises a reciprocating "frame"(36) encasing thin stacking metal sheets (42) which are adjustable in a forward/backward direction for allowing multiple shape setups. The sheets (42), which are oriented vertically, have saw teeth at their top sections (42a) and no teeth at their bottom sections (42b). Adhesive-backed sandpaper (78) is affixed to the bottom section (42b) after the shape is set. This allows a cutting phase and a sanding phase with the same profile. The entire reciprocating frame (36) pivots multidirectionally within two planes, and may be locked at any angle. The reciprocating frame (36) is movable in a forward/backward direction.

Abstract: A shallow notch 1 as a tentative mark is engraved on a periphery of an ingot at a position corresponding to a predetermined crystal orientation in the step of grinding the periphery of the ingot. After the ingot is sliced to wafers, a mark 2 for indication of a crystal orientation is carved on a sliced wafer at a position determined on the basis of the notch 1 by laser marking. Thereafter, the wafer is chamfered to a round shape, and the notch 1 is removed by the chamfering. Since a part where the mark 2 shall be carved is determined on the basis of the notch 1, the mark 2 is efficiently carved on the wafer without the necessity of subjecting each wafer to an X-ray analyzer.

Abstract: A glass-plate working apparatus 1 includes: a supporting device 7 for supporting a glass plate 6 from a glass plate carrying-in section 2; a main cutter head device 9 for forming a main cut line 8 for bend-breaking on the glass plate 6 supported by the supporting device 7; a maincutter-head moving device 10 for relatively moving the main cutter head device 9; bend-breaking head devices 13 and 14 for forming edge cut lines 11 for bend-breaking on the glass plate 6 and for pressing the glass plate 6 to bend-break the glass plate 6; and bend-breaking head moving devices 15 and 16 for moving the bend-breaking head devices 13 and 14.

Abstract: The rotational center of a grinding wheel is eccentric to a slicing side in a slice feed direction with regard to the rotational center of an inner diameter saw. As a result, the diameter of the grinding wheel can be smaller, and the slice movement distance of the ingot can be shorter. Therefore, it is possible to provide a low-priced slicing machine with built-in grinder wherein a slicing time is short and the grinding face is accurate.

Abstract: An improved tool includes a milling tool rotatable about an axis, and a coaxially mounted grinding wheel positioned slightly axially towards a workpiece from the milling tool. The milling tool provides rough finish on a workpiece, and the grinding tool follows, providing finish grinding. The present invention recognizes that the grinding tool will be deflected away from the workpiece at high speed due to centrifugal forces. The present invention positions the milling tool relative to the grinding wheel at a location that compensates for the expected deflection of the grinding wheel, and achieves the desired amount of grinding. In further features of this invention, the phenomena of deflection of the grinding wheel due to increased speed is utilized to compensate for wear on the milling tool.

Abstract: A photo filmstrip (14) of a regular length (L) is produced from photo film web (45) having a predetermined width (W). The photo filmstrip and the photo film web have a back surface, an emulsion surface, a pair of lateral edge faces (45a), and four corner edges (45b, 45c) defined between the back surface, the emulsion surface, and the lateral edge faces. At least one of the lateral edge faces and at least one of the corner edges of the photo film web are abraded while the photo film web is conveyed. Photo film dust, created in the abrasion is eliminated from the photo film web. Perforations (34) are formed in the photo film web. The photo film web is cut by the regular length into the photo filmstrip, which is wound into a cassette shell.

Abstract: A machine for simultaneously milling and grinding a workpiece comprises milling and grinding wheels rotatable about respective first and second parallel axes, the second axis being offset radially with respect to the first axis. A single motor drives the milling and grinding wheels at different relative speeds. The grinding wheel is mounted to a hub which includes an axially flexible portion to enable the grinding surface to be axially adjusted. The milling wheel includes an array of milling cutters with a large gap formed between leading and trailing ones of the milling cutters to accommodate the offset grinding wheel. The radial spacing of the milling cutters from the axis of rotation of the milling wheel progressively increases from the leading milling cutter to the trailing milling cutter.

Abstract: A plate-like glass material working device 1 provided with a breaking-off unit 2, an input unit 3 for inputting various breaking-off data items and commands to the device; a storage unit 5 from which data on the shape of a target plate of glass 300 stored beforehand therein is read out in accordance with a command from the input unit 3; a display unit 7 for displaying thereon the shape of the Target plate of glass 300 on the basis of the shape data read out from the storage unit 5 and displaying the shape of a plate-like glass material 6 to be worked, an end cutting line forming position and a pressing position on the plate-like glass material in accordance with breaking-off data and a command from the input unit 3; and a control unit 8 for controlling the operation of the breaking-off unit 2 in correspondence to the shape of the target plate of glass 300, the shape of the plate-like glass material 6, end cutting line forming position and pressing position displayed on the glass material on the display unit 7

Abstract: The present invention provides a glass cutting apparatus for cutting glass to a predetermined pattern. The glass cutting apparatus includes a rotatable workpiece holder which is adapted to rotatably hold a glass workpiece and overlaying pattern thereon. A cutting unit is provided which includes at least one cutter blade for scoring the glass workpiece which is held by the workpiece holder, and a pattern follower which is adapted to abut against the pattern held by the workpiece holder during the scoring of the glass workpiece by the cutter blade. The glass cutting apparatus of the present invention may additionally include a grinding unit having a rotatable grinder for grinding an edge of the glass workpiece held by the workpiece holder and a pattern follower adapted to abut against the pattern held by the workpiece holder during grinding of the edge of the glass workpiece by the grinder.

Abstract: A cutter apparatus comprising an on-the-sleigh robot, a motor having a vertical output shaft and capable of shifting vertically, a rotary cutter detachably connected at the end of the output shaft of the motor, and a cordless TV camera installed on the robot. In particular, the rotary cutter has a disk-shaped support plate, whose side surface is abrasive, upper and lower disks parallel to each other, which are arranged in a row in axial direction to sandwich the support plate inbetween and whose exposed faces, respectively, are abrasive, a tapered reamer extending axially upward from the center of the upper disk, and a binder assembly to bind the tapered reamer, the upper and lower disks, and the support plate together and to fix the rotary cutter about an output shaft of the motor.

Abstract: Burrs formed at the ends of a bore during a honing operation performed by a single pass honing tool are removed by a deburring attachment which is carried on the leading end of the tool. The attachment includes one set of spring-loaded blades which remove burrs at one end of the bore as the tool is retracted from the bore and further includes an axially spaced set of spring-loaded blades which remove burrs at the opposite end of the bore during retraction of the tool.

Abstract: The diameter, the orientation flat width/notch depth and the length of the block 10p are measured by the measuring devices 71a, 71b and 71c respectively and then the machining errors .DELTA.Dp, .DELTA.Wp and .DELTA.Lp in the measured values against the set values are calculated at the error calculation unit 833. Then .DELTA.Dp, .DELTA.Wp and .DELTA.Lp are stored in memory at the memory unit 834 in correspondence with the identification codes IDi and IDj of the grinding device 5i (i=1-N) and the cutting device 6j (j=1-M) that performed the machining. Then at the average value calculation unit 835, the average values of .DELTA.Dp and .DELTA.Wp for each of the grinding devices 51-5N and the average value of the .DELTA.Lp for each of the cutting devices 61-6M are calculated. The average values of .DELTA.Dp and .DELTA.Wp are supplied to the corresponding grinding device 5i as the diameter correction value and the width/depth correction value respectively and the average value of .DELTA.

Abstract: A glass plate working machine includes table 20 on which glass plate 22 is placed, breaking unit 3 for forming a cutting line on glass plate 22 placed on table 20, and pressing the glass plate in the vicinity of a portion of the glass plate 22 formed with the cutting line to break that portion off; and moving unit 67 connected to the breaking unit 3 for moving same linearly along a surface of glass plate 22 placed on table 20. Breakage by breaking unit 3 and movement by moving unit 67 are controlled by a numerical control unit.