Abstract: An air cooling system is provided. The air cooling system includes multiple air moving units and an air deflecting apparatus. The multiple air moving units are disposed upstream of air flowing through a heating component. The air deflecting apparatus is disposed between an air outlet of the multiple air moving units and the heating component. The air deflecting apparatus is configured to perform layering and deflecting for outgoing air of the multiple air moving units and divide the air into at least two layers. Air at each layer is supplied jointly by the multiple air moving units, and air directions of air in at least two adjacent layer spaces are different. According to the present disclosure, a heat dissipation impact resulting from a failure of a single air moving unit in the multiple air moving units can be effectively avoided.

Abstract: A server cabinet includes a cabinet body and an air blocking device. The air blocking device includes a frame and a foam body installed on the frame. The frame defines an opening. The foam body includes a first foam body and a second foam body connected with the first foam body. The junction of the first foam body and the second foam body is surrounded by the opening.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: A chassis includes a bottom plate, a number of fans mounted to the bottom plate, an air guiding member mounted to the bottom plate and near the fans, and a number of data storage devices received in the air guiding member. The air guiding member includes a top plate and a partition plate below the top plate. The partition plate is near the fans. The partition plate divides the air guiding member into a first aisle below the partition plate and a second aisle above the partition plate. The top plate and the partition plate bound an opening. The data storage devices are located below the partition plate. A part of airflow from the fans flows into the first aisle; another part of airflow from the fans flows through the second aisle and the opening, and flows toward the data storage devices away from the fans.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: A container data center includes a container having a raised floor defining a number of vents, a server system including a cabinet supported on the raised floor adjacent to the vents, a cooling device, an adjusting plate movably installed to the cabinet for covering or uncovering the vents, a driving member, a temperature sensor mounted to the cabinet, and a micro control unit (MCU) electrically connected to the driving member and the temperature sensor. The cooling device releases cooling air into the container under the raised floor. The temperature sensor senses the temperature in the cabinet. The MCU receives the sensed temperature and compares the sensed temperature with a preset temperature, to direct the driving member to drive the adjusting plate to move relative to the vents.

Abstract: A notebook computer 1 is provided with: a casing 20a in which electronic components including a CPU are accommodated; and a heat-dissipating unit 30 that includes a heat-dissipating component 37 having a plurality of fins 37a to which heat is transferred from the CPU, and a fan 31 for supplying air to the heat-dissipating component 37, and, in the heat dissipating unit 30, heat exchange between heat transferred from the CPU to the heat-dissipating component 37, and air supplied from the fan 31, is performed to release heated air to the exterior of the casing 20a. A communicating path 36 is formed, between an air outlet 32b of the fan 31, and an inflow surface 37b of the heat-dissipating component 37, for communicating therebetween, and a dust removal path 38 is formed in the communicating path 36 so as to communicate with the exterior of the casing 20a.

Abstract: A telecommunications cabinet in which active equipment can be mounted. The cabinet including an airflow ducting arrangement located in the interior region of the cabinet. The airflow ducting arrangement accommodating thermal cooling of active equipment having internal side-to-side air cooling arrangements.

Abstract: A rack-mounted server system includes a rack, a number of server units mounted in the rack adjacent to a front end of the rack, a fan module, and a number of power units located beside the server units. The rack includes a back wall defining an air outlet aligned with the server units. The fan module is fixed to the back wall and fitted in the air outlet. The power units are arranged in front of the fan module. An air-guide plate is mounted in the rack between the fan module and the power units to guide a part of the airflow generated by the fan module to flow through the power units.

Abstract: A datacenter or server farm having servers mounted to blow air at an angle in a hot aisle. The angled air flow can provide a cyclonal effect in the hot aisle, enhancing heat convention in the hot aisle.

Abstract: A housing includes a wall having an aperture and a vented panel, the vented panel including a first wall having a first side and a second side and an opening, a second wall having a first side, a second side facing the first wall first side and an opening, and a panel interior, the housing further including an air filter having an inner side and an outer side relative to the interior mounted against the second wall first side over the second wall opening with the filter inner side facing the housing interior, a water dam mounted along the filter bottom portion at the filter inner side, the water dam being higher than any water barrier mounted along the filter bottom portion outer side, whereby, any water reaching the filter bottom is substantially prevented from draining into the housing interior. Also an air filter usable in the housing.

Abstract: A module for a telecommunications subrack as well as a telecommunication subrack are disclosed. The module is a horizontal plug in unit including a power part that includes power filtering functions for securing power feed to a backplane of the subrack as well as to a number of fans also arranged on the module for cooling of the subrack. The module also includes connectors arranged in the rear of the module for connecting the module to the backplane as well as connectors arranged in the front of the module for accommodating power cables. The telecommunications subrack includes a cage configured to accommodate cards, an air intake with filter and two or more removably mounted modules. Each of these modules includes a power part that includes power filtering functions for securing power feed for the subrack, input connectors arranged in the front of the module for accommodating power cables, fans for cooling of the subrack, and output connectors for connecting the module to a backplane of the subrack.

Abstract: A computer includes a backplane, an enclosure, a motherboard, a shielding cover, a guiding plate, and a fan. The enclosure covers on the backplane. The motherboard is located on the backplane. The motherboard includes a plurality of heat generating elements. A shielding cover covers the motherboard and located in the enclosure. The shielding space is defined in the shielding cover. The guiding plate is located on the backplane adjacent to the shielding cover. A heat dissipating space is defined between the shielding cover and the guiding plate. The heat dissipating space communicates with the shielding space. The fan is located in the heat dissipating space. The fan is adapted to generate airflow from the shielding space and is adapted to dissipate the airflow through the heat dissipating space.

Abstract: A heat dissipation structure includes a circuit board that is disposed inside an outer casing having a chassis formed with air inlet holes, and in which a first electronic component generating heat when driven and a second electronic component not generating heat when driven are mounted on one surface of a base plate, and a heat sink that releases the heat generated in the first electronic component. Here, in the heat sink, a heat dissipation unit positioned facing the base plate, an eaves portion protruding from the heat dissipation unit, and a pair of enclosing portions protruding from ends of the eaves portion in a direction perpendicular to a protruding direction from the heat dissipation unit, and at least one of the air inlet holes is formed in a position facing the eaves portion.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: An air shield is mounted to a cabinet to replace a server unit. The air shield includes a supporting shell detachably mounted in an opening defined the cabinet through which the server unit can enter the receiving space, and an adjusting apparatus slidably installed to the supporting shell. The supporting shell defines a number of vents communicating with the receiving space of the cabinet. The adjusting apparatus includes a number of spaced shield pieces. The adjusting apparatus is operated, to move the shield pieces to cover, partially cover, or uncover the vents of the supporting shell.

Abstract: An electronic device includes an air dam module. The air dam module includes a frame defining a vent, a first rotating member, a second rotating member, and two third rotating members. The first rotating member is rotatably connected to a surface bounding the vent, to vertically block a lower half of the vent by its gravity. The second rotating member is rotatably connected to the surface bounding the vent. The third rotating members are rotatably connected to opposite ends of the second rotating member. The second and third rotating members vertically block an upper half of the vent by their gravities.

Abstract: The front case of the unit case contains a circuit section including a power semiconductor module, and the rear case contains a cooling fin assembly of the semiconductor module and a cooling fan. The cooling air ventilated through the wind channel by the cooling fan is discharged upward from the unit case. The water-proof cover is placed over the top of the unit case. The water-proof cover includes an exhausting structure formed with openings downward at the left and right sides of a front part of the water-proof cover to form an exhausting path; and a ventilation guide formed around an exhausting port inside a rear part of the water-proof cover. The cooling air discharged to the inside space of the water-proof cover by the cooling fan is ventilated through the ventilating path and exhausted outside through the exhausting path.

Abstract: A system and method for chassis cooling is provided. A preferred embodiment comprises an orthogonal backplane along with a hybrid cooling air flow. One air flow is routed horizontally through aligned and suitable openings on the backplane, vertically over components to be cooled, and horizontally out of the chassis. A second air flow is routed horizontally over components and through aligned and suitable openings on the backplane before it is routed horizontally out of the chassis.

Abstract: The present disclosure relates to an adjustable air suction device, comprising a driving structure, an air suction structure, and a link structure. The driving structure and the air suction structure are disposed on a housing of an electronic device. The link structure is disposed inside the housing. Both ends of the link structure correspond to the driving structure and the air suction structure, respectively. The driving structure drives one end of the link structure to move towards a first direction, and drives the other end of the link structure to move towards a second direction. The other end of the link structure pushes the air suction structure, and projects from the housing. Besides, the air suction structure corresponds to a heat dissipating device of the electronic device and draws a great deal of fluids into the electronic device for dissipating the heat of the electronic components in the electronic device.

Abstract: A method for cooling an electronic image assembly using ambient gas. Exemplary embodiments of the method include the steps of circulating a closed loop of circulating gas around the electronic image assembly, directing a flow of ambient air through a first manifold, allowing the flow of ambient air to cross the flow of circulating gas without allowing the two to mix, directing the flow of ambient air behind the electronic image assembly and directing the flow of ambient air through a second manifold. The circulating gas may be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing. A heat exchanger may be included with some embodiments of the method.

Abstract: A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.

Abstract: Individually cooling one or more computers in a rack of computers in a data center including an air intake chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center and a plurality of openings at a top end for providing air into a plurality of flexible air channels; and a plurality of flexible air channels, each air channel having a first end opening into the air intake chamber and having an opening at a second end and having a connector to connect the second end of the flexible air chamber to a particular position in the rack corresponding to the location of a particular computer in the rack.

Abstract: A thermal management system for an electronic equipment enclosure is provided. The thermal management system includes an intake duct for routing cold air in the front of the electronic equipment enclosure to the side of electronic equipment enclosure and one or more blanking panels for separating cold air in the front of the electronic equipment enclosure and hot air in the back of the electronic enclosure, as needed, for example, depending on the configuration of the thermal management system and/or the electronic equipment enclosure. The intake duct includes a front cover, which acts as an additional blanking panel, when installed, changing the airflow pattern of the electronic equipment enclosure, for example, from side-to-side to front-to back.

Abstract: An air guiding device includes two opposite first air guiding apparatus and a second air guiding apparatus mounted on tops of the first air guiding apparatus. Each first air guiding apparatus includes a stretchable first guiding piece. The second air guiding apparatus includes a stretchable second guiding piece. Distal ends of the first and second air guiding pieces are pulled out toward the same direction, the first and second guiding pieces cooperatively bound an airflow channel.

Abstract: A control system for providing thermal management of electronic equipment housed in a cabinet enclosure. The system can include a plurality of sensors in proximity to the cabinet enclosure for monitoring a temperature, a pressure and a humidity associated with the electronic equipment; and a controller in communication with the sensors for receiving data from the sensors, where the controller adjusts the temperature, the pressure and the humidity associated with the electronic equipment.

Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.

Abstract: An apparatus on which a fan can be mounted, including a casing; a plurality of cooling fan units arranged in line on a lower portion of the casing and capable of being inserted into and removed from the casing on an individual basis; and a plurality of plate members disposed above the line in which the cooling fan units are arranged and above a gap between the cooling fan units, the plate members extending in a direction to which an upper surface of each of the cooling fan units is substantially perpendicular and in which the cooling fan unit is inserted into and removed from the casing, wherein each of the plate members is supported so as to be able to pivot about its lower end portion toward both directions.

Abstract: A system is provided in one example embodiment that includes at least one rack for electronic equipment, each rack including: at least one sensor configured to measure an environmental condition, an air conditioning system, an ingress port configured to allow air to flow into a corresponding rack from an environment surrounding the racks, and an egress port configured to allow air to flow out of a corresponding rack and into the environment surrounding the racks. The system also includes a housing that surrounds the racks and that defines the environment surrounding the racks. The air that flows out through the egress ports of the racks conditions the air in the environment surrounding the racks.

Abstract: Provided is an apparatus, a system, and a method for operating the same. The apparatus, in one embodiment, includes a chassis having a front configured to accept one or more circuit boards, a back, and first and second sides. The apparatus, in this embodiment, further includes one or more slots located within the chassis, each slot configured to receive one of the circuit boards at an angle with respect to the first and second sides. The slots, in this embodiment, at least partially define a first plenum opening to the front and a second plenum opening to the back. The apparatus additionally includes a fan assembly coupled to one of the first plenum or the second plenum.

Abstract: A container includes a server mounted therein and separates a cold aisle from a hot aisle. A shutter opens and closes an opening provided in the cold aisle and communicating with the outside. Another shutter opens and closes an opening provided in the hot aisle and communicating with the outside. An air conditioner cools air taken in from the cold aisle and exhausts the air to the hot aisle. A management server controls opening and closing of the shutters based on any of an acquired pressure in the cold aisle and an operating state of the air conditioner.

Abstract: A server including a chassis, an electronic module, a fan module and a handle is provided. The chassis has a first wedging portion. The electronic module is disposed in the chassis. The fan module is disposed in the chassis and is adjacent to the electronic module. The handle is pivotally connected to the fan module and has a second wedging portion, and the first wedging portion is used for wedging the second wedging portion. When the handle is rotated, the fan module is moved relatively to the first wedging portion for entering or exiting the chassis.

Abstract: The invention relates to a cover for at least one air-conditioning device arranged on a cladding element, in particular of a switchgear cabinet. The cover has a cover housing having a front wall and side parts connected thereto. The side parts keep the front wall at a distance from the cladding element. At least one holder for the cover housing is fitted to the cladding element. According to the invention, the holder comprises vertical hook elements into which the cover housing can be suspended by hook receptacles in the direction of gravity.

Abstract: A cooling management system including component racks, a cooling system, pressure measurement devices, and a computing system within a structure. Each component rack includes an exothermic apparatus. The structure includes warm air aisle spaces and cold air aisle spaces located between the component racks. The cooling system feeds cold air into each cold air aisle space. The cold air flows through the component racks resulting in displacement of warm air from each exothermic apparatus. The warm air flows into the warm air aisle spaces and is directed back to the cooling system. The pressure measurement devices measure differential pressure values between the cold air aisle spaces and the warm air aisle spaces. The computing system monitors the differential pressure values, perform calculations associated with the differential pressure values, and control a fan speed of at least one fan within the cooling system based on the calculations.

Abstract: An electrical cabinet for receiving functional electrical units, each including a plurality of electrical devices arranged on a bracket; and a mechanism for attaching the functional electrical units, the attaching mechanism configured to receive the functional electric units along a separation plane defining a first space located toward a front portion, and a second space located toward a back portion; a partition dividing the second space into a first subspace located toward the front portion and a second subspace located toward the rear portion, the partition configured in the electrical cabinet to form at least two passages enabling an airflow to circulate between the first subspace and the second subspace; and a cooling source arranged to be in contact with the airflow.

Abstract: A cooling system includes one or more air channeling sub-systems that provide cooling air to electronic equipment, at least one heat removal sub-system that removes heat from the cooling air in at least one of the air channeling sub-systems, at least one temperature sensor measures a wet bulb temperature of outside air, and at least one controller. At least one of the air channeling sub-systems includes an outside air damper operable allow outside air into the air channeling sub-system. The at least one controller at least partially opens the outside air damper if a wet bulb temperature measured at the at least one temperature sensor drops to or below a predetermined temperature.

Abstract: An electronic device housing device includes a housing, a plurality of slots that are arranged side by side inside the housing, the slots each housing the electronic device, a gas passage that guides a gas flowing into each of the slots in a direction across the slots, a connection substrate provided inside the housing to extend upright, the connection substrate being arranged to face the slots, the connection substrate including a connected portion to which a connecting portion of the electronic device housed in each of the slots is to be connected, a ventilation port provided at an end portion of the connection substrate, the ventilation port allowing the gas to flow into through the gas passage from each of the slots, and a fan that sucks the gas flowing into each of the slots into the ventilation port through the gas passage.

Abstract: Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.

Abstract: A heat dissipating system includes a housing having a compartment divided into first and second air channels by a partitioning board. The partitioning board includes an opening through which the first air channel is in communication with the second air channel. A driving unit is mounted in the first air channel. The driving unit includes a rotating shaft extending through the opening into the second air channel. A first impeller is mounted in the first air channel, coupled to the rotating shaft, and aligned with the opening. A second impeller is mounted in the second air channel, coupled to the rotating shaft, and aligned with the opening. The first and second impellers mounted in the first and second air channels are driven by the driving unit to simultaneously dissipate heat generated by electronic elements in the first and second air channels while having a simplified structure.

Abstract: A cooling system for a hand-held electronic device includes a casing including a compartment, at least one air inlet in communication with the compartment, and at least one air outlet in communication with the compartment. A wind driving assembly is mounted in the compartment and includes a frame, a package, and a thermally conductive cover. The thermally conductive cover engages with the frame and the package. An impeller is rotatably arranged in the frame having an outlet hole adjacent to the at least one air outlet. The package receives at least one electronic element that generates heat during operation. The thermally conductive cover includes an inlet hole in communication with an interior of the frame. An air channel is formed between the thermally conductive cover and an interior wall face of the casing. The at least one air inlet intercommunicates with the inlet hole via the air channel.

Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.

Abstract: A mounting apparatus includes a case. The case includes a first bracket and a second bracket. The first bracket defines a space. The second bracket is configured for securing a fan and is connected with the first bracket. The second bracket has a volume equal to or less than the volume of the first bracket space.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: A data room air circulation system has adjacent racks located side by side. The racks have a front, a rear, and a first and second side. A computer system component is mounted in at least one of the racks. A cold aisle, containing cold air, is located at the front of the racks. As the cold air passes through the component, hot air is formed and discharged to a hot aisle located at the rear of the racks. A baffle, having a front end, a rear end, and a hot air side is located between the racks. The front baffle end is attached to the front of one of the racks, and the rear end is attached to the rear of the other of the racks. The baffle separates the cold aisle from the hot aisle for at least the height of the baffle.

Abstract: An arc-resistant switchgear enclosure has interior compartments with outlet vent openings that are selectively closed by vent flaps. The vent flaps are propped in an open position by props that extend from the vent flaps and contact supports. The props have a latch portion that latches the vent flap when the vent flap is in the closed position.

Abstract: An air guide unit is disclosed, which is adapted to be disposed between the back of a motherboard and a chassis. The motherboard and the chassis are joined by at least a first locking unit and a second locking unit. The air guide unit comprises an annular side wall. The annular side wall comprises: a first engagement portion adapted to engage with the first locking unit; and a second engagement portion adapted to engage with the second locking unit, wherein the engagement of the first engagement portion with the first locking unit and the engagement of the second engagement portion with the second locking unit limit the movement of the air guide unit in a first direction and a second direction. The second direction is perpendicular to the first direction.

Abstract: A chilled-air duct for providing chilled air from an under-floor plenum space to electronics modules disposed in a rack or cabinet. The duct has a generally right triangular profile formed by a substantially vertical forward wall and a sloping rear wall. A single vent extends from a sidewall of the duct and alongside the forward wall to direct chilled air flowing through the duct to a space in front of the electronics modules. The vent extends from near a base of the duct to a top wall thereof. Air-blocks can be disposed in the vent opening to customize airflow from the duct. Flow and distribution of chilled air from the vent is at least partially equalized by the profile of the duct. The duct is freestanding and can be disposed alongside a rack or within a cabinet between a mounting frame and a sidewall thereof.

Abstract: A container is provided. A rack is provided in the container, and a server is mounted to the rack. A fan unit is provided in the container, and a large-sized fan and first and second small-sized fans of which diameters are smaller than that of the large-sized fan are alternately arranged on an opposing surface of the fan unit opposed to the rack. A CPU temperature sensor measures a temperature of a heat generation component incorporated in the server. A fan operation management unit controls rotation of the large-sized fan and rotation of the first small-sized fan and the second small-sized fan according to the CPU temperature sensor.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: A server includes a chassis, a motherboard, a number of data storage devices, a number of system fans, and a power supply mounted in the chassis. The system fans generate an airflow flowing through the chassis, from a front portion of the chassis to a rear portion of the chassis. The power supply includes a power fan causing an airflow directed rearwards through the front portion of the chassis to prevent a disturbance with the airflow from the system fans.