Abstract: An alkali-developable photopolymerizable composition is disclosed, comprising (1) a photopolymerization initiator or a photopolymerization initiator system, (2) an addition polymerizable monomer having an ethylenically unsaturated double bond, and (3) a resin obtained by reacting a copolymer comprising at least a repeating unit represented by formula (I): ##STR1## wherein Ar.sup.1 represents a phenyl group or a phenyl group substituted with an alkyl group having from 1 to 4 carbon atoms, an alkoxy group having from 1 to 4 carbon atoms, an aryl group having from 6 to 10 carbon atoms, an aralkyl group having from 8 to 12 carbon atoms, a halogen atom, or a combination of two or more of these substituents; and x represents a molar content of the repeating unit in the copolymer, ranging from 0.85 to 0.55,and a repeating unit represented by formula (II): ##STR2## wherein y represents a molar content of the repeating unit in the copolymer, ranging from 0.15 to 0.

Abstract: The present invention provides a photosensitive resin composition into which a photosensitive group can be easily given and introduced and which is excellent in conservation, stability, heat resistance, practical physical properties and sensitivity and which can inhibit cracks from occurring at the time of development.The photosensitive resin composition of the present invention comprises 100 parts by weight of a polyimide, 10-100 parts by weight of an isocyanurate having a (meth)acrylic group, 10-100 parts by weight of a polyalkylene glycol di(meth)acrylate, and 0.5-20 parts by weight of a photopolymerization initiator. This composition can be utilized to obtain a patterned polyimide film having heat resistance.This composition can be applied to uses of electronic materials such as interlayer films of multi-layer boards of printed-wiring boards, and the like.

Abstract: Ultraviolet radiation-curable primary and secondary coating compositions for optical fibers are disclosed. The primary coatings comprise a hydrocarbon polyol-based reactively terminated aliphatic urethane oligomer; a hydrocarbon monomer terminated with at least one end group capable of reacting with the terminus of the oligomer; and an optional photoinitiator. The secondary coatings comprise a polyester and/or polyether-based aliphatic urethane reactively terminated oligomer; a hydrocarbonaceous viscosity-adjusting component capable of reacting with the reactive terminus of (I); and an optional photoinitiator. Also disclosed are optical fibers coated with the secondary coating alone or with the primary and secondary coatings of the invention.

Abstract: A photosensitive cover coating agent forming an insulating, protective coating having superior compatibility, sensitivity, heat resistance, adhesion, electrical properties and flexibility is provided,which coating agent is obtained by mixing a polymer (A) of repetition units of the formula ##STR1## wherein R.sup.1 is ##STR2## R.sup.2 is a divalent organic group, a compound (B) containing two or more (meth)acryloyl groups in one molecule,a compound (C) of the formula ##STR3## wherein Z is a divalent aliphatic or alicyclic group, R.sup.3 is H, monovalent organic group or characteristic group and R.sup.4 is H or --Z--R.sup.3, in 0.01 to 0.80 mol equivalent based on compound (B), the total quantity of (B) and (C) being 20 to 200 wt. parts per 100 wt. parts of (A), anda photopolymerization initiator or a sensitizing agent (D), in 0.5 to 20 wt. parts per 100 wt. parts of (A).

Abstract: A photosensitive polymer composition comprising, in admixture, a polymer predominantly comprising a recurring unit of the formula (I): ##STR1## wherein x is a tri- or tetravalent organic group, Y is a divalent organic group, and n is equal to 1 or 2 and a compound having a urea bond of the formula (II): ##STR2## wherein R.sup.1 is a group having a functional group capable of forming a dimer or polymer upon exposure to radiation, R.sup.2 and R.sup.3 are independently a hydrogen atom or a monovalent organic group is shelf stable and applicable as relatively thick coatings having sufficient photosensitivity to form semiconductor element surface protective films.

Abstract: A biocompatible material which is the product of graft-copolymerization of a water-soluble vinyl and/or an acrylate monomer with a sorption complex of polysilicic acid and collagen that has been rid of pigments, glycoproteins and proteoglycans, or a product obtained by virtue of chemical destruction, with the aid of hydrofluoric acid, of the afore-mentioned product of graft-copolymerization, containing up to 25 mass percent of polysilicic acid (in terms of SiO.sub.2), up to 12 mass percent of protein, and maximum 1 10.sup.-6 mole/g of an anion of hydrofluoric and hydrofluoric acids, methods of making the same and products produced thereby.

Abstract: A curable adhesive composition is disclosed, comprising a polymerizable prepolymer, a reactive diluent, and a polymerization initiator, wherein said composition further comprises an inorganic filler and/or a (meth)acrylate having an isocyanurate ring.The adhesive composition of the invention is curable by the action of heat or light and is extremely useful as an adhesive for surface mounting devices.

Abstract: The present invention provides a photosensitive resin composition which comprises, as essential components:(A) a polyamic acid having a recurring unit represented by the following formula [I]: ##STR1## wherein R.sub.1 and R.sub.2 each represents an organic group selected from the group consisting of an aromatic group, an alicyclic group, an aliphatic group, and a heterocyclic group and m is 1 or 2,(B) an amide compound having carbon-carbon double bond, and(C) a photosensitizer.

Abstract: This invention relates to radio-derivatized polymers and a method of producing them by contacting non-polymerizable conjugands with radiolysable polymers in the presence of irradiation. The resulting radio-derivatized polymers can be further linked with ligands of organic or inorganic nature to immobilize such ligands.

Abstract: Compositions which include an acidified epoxy oligomer, a free radical photoinitiator and a monomer capable of being polymerized by the photoinitiator are used to form aqueous developable, photodefined coatings useful as permanent solder marks for printed circuits and permanent plating resists for additive printed wiring boards. The process for using the compositions include application as a fluid in solvents; drying; exposing to ultraviolet light; developing in an aqueous alkaline solution; and crosslinking the acidified, epoxy oligomers. The articles produced include printed wiring boards with the permanent, photoimaged resist composition thereon.

Abstract: Compositions which include an acidified epoxy oligomer, a free radical photoinitiator and a monomer capable of being polymerized by the photoinitiator are used to form aqueous developable, photodefined coatings useful as permanent solder marks for printed circuits and permanent plating resists for additive printed wiring boards.The process for using the compositions include application as a fluid in solvents; drying; exposing to ultraviolet light; developing in an aqueous alkaline solution; and crosslinking the acidified, epoxy oligomers. The articles produced include printed wiring boards with the permanent, photoimaged resist composition thereon.

Abstract: In a photosensitive recording material suitable for producing plates or resist patterns, the photopolymerizable recording layer contains as polymeric binder a film-forming copolymer which has a multiphase morphology, one phase having a glass transistion temperature below room temperature and a further phase having a glass transition temperature above room temperature and this copolymer having been obtained by free radical copolymerization of one or more macromers with one or more further olefinically unsaturated copolymerizable organic compounds.

Abstract: A photosensitive composition comprising:(a) a polymer(b) 1 to 20% by weight, based on the weight of polymer (a), of a compound having a terminal ethylenically unsaturated group;(c) 0.1 to 20% by weight, based on the weight of polymer (a), of an oxime ester compound(d) 0.01 to 10% by weight, based on the weight of polymer (a), of a coumarin compound having a wave length of the absorption peak of 330 to 550 nm; has high photosensitivity to an actinic light of a wave length of 400 to 500 nm and is capable of forming heat-resistant images, patterns or films.

Abstract: Compounds of the general formula I ##STR1## are described in which Q denotes ##STR2## R denotes alkyl, hydroxyalkyl or aryl, R.sup.1 and R.sup.2 denote H, alkyl or alkoxyalkyl,R.sup.3 denotes H, methyl or ethyl,D.sup.1 and D.sup.2 denote saturated hydrocarbon groups,E denotes alkylene, cycloalkylene, arylene, saturated or unsaturated heteroyls or a group of the formula II ##STR3## a and b denote integers from 1 to 4. c denotes an integer from 1 to 3,m denotes 2, 3 or 4, depending on the valency of Q, andn denotes an integer from 1 to m, where all radicals of the same definition may be identical to or different from one another.The compounds are suitable as polymerizable compounds for photopolymerizable mixtures and are distinguished by ready polymerizability in combination with photoinitiators and long shelf lives in the layer.

Abstract: Radiation curable coating compositions for providing solvent-resistant abhesive coatings comprise polyfluorinated acrylates and methacrylates, polyethylenically unsaturated crosslinking agents and a film-forming organic polymer. The compositions can be used after radiation curing to render substrates oil, soil, and water repellent. The cured compositions have particular use as release coatings in image transfer systems wherein a fused xerographic image is transferred from the release coated surface, to another surface due to the particular characteristics of the coatings. Novel poly(fluorooxyalkylene)urethane acrylate compounds are also disclosed.

Abstract: A molding of modified polyphenylene oxide resin comprises a composite of modified polyphenylene oxide containing polyphenylene oxide having structure expressed in the following general formula (I) as a basic skeleton, which resin composite preferably contains a cross linking agent, more preferably phosphoric ester serving as a cross linking agent, while the molding is cross-linked by irradiation to ionizing radiation: ##STR1## where R.sub.1, R.sub.2, R.sub.3 and R.sub.4 represents univalent substituents selected from a group of hydrogen, alkyl group, halogen, alkoxyl group and haloalkoxyl group, and n represents a natural number.

Abstract: The present invention relates to a photosensitive polymer composition comprising the following components A, B and C:A: 100 parts by weight of ethylenically unsaturated compounds,B: 3 to 40 parts by weight of a polyamide or 3 to 32 parts by weight of a polyesteramide soluble in the ethylenically unsaturated compounds andC: 0.01 to 10 parts by weight of a photopolymerization initiator, and a solid photosensitive printing plate material comprising the above-mentioned photosensitive polymer composition and a support, which solid photosensitive printing plate material can be easily prepared from a substantially solvent-free starting material and usable for the production of a printing plate, flexible printing plate and flexographic printing plate developable with water and/or an alcohol.

Abstract: The invention relates to a thermoplastic solid composition which can be cured by the application of a radiation, for example UV, and to solid products which can be handled and stored and are obtained by shaping such a composition, before application of the radiation.The solid thermoplastic composition comprises at least one solid thermoplastic polymer and a radiation-crosslinkable oligomer containing at least two ethylenic unsaturations, each of these unsaturations being situated either at the end of a chain or in a pendent position. The weight ratio of the solid thermoplastic polymer to the radiation-crosslinkable oligomer is between 55/45 and 964, preferably between 70/30 and 96/4, respectively.The products obtained after crosslinking by the application of radiation have good mechanical properties, even at elevated temperature.The compositions of the invention can be used particularly for producing packaging sheets having the shape of the product to be wrapped, and of prosthetic components.

Abstract: Polyimides which contain aliphatic groups can be radiation-crosslinked with chromophoric aromatic polyazides. Solutions in organic solvents can be used as radiation-sensitive coating agents for preparing insulating or protective coatings and as photoresists having high thermal, mechanical and chemical stability.

Abstract: Polymer compositions comprising a segmented urethane block polymer and an elastomer having a glass transition temperature between -40.degree. and +15.degree. C. possess a good combination of properties, including relatively high damping and modulus values. Radiation cross-linked tubing prepared from these compositions finds application in the jacketing of marine sonar detection arrays comprising hydrophones.

Abstract: Novel compositions of matter which crosslink under the action of light and which contain(A) an aliphatically unsaturated polycondensation product which can contain structural elements of the formula I ##STR1## (B) a bisimide of the formula II ##STR2## and a sensitizer and can, if desired, also contain a further crosslinking agent, where R, R', R.sub.1, Y, Y' and R.sub.4 are as defined in claim 1, are suitable, inter alia, for preparing printing plates or for use as photoresist materials.