Abstract: The invention relates to a process for preparing a fibre-reinforced composite or a fibre-reinforced coating, which comprises impregnating reinforcing fibres with a radiation-curable composition comprising a polymerisable monomer and a polymer which is dissolved or dispersed in the monomer, and exposing the impregnated fibres to radiation to effect curing of the composition.

Abstract: The present specification discloses a hygroscopic polyester copolymer with a hydrophilic compound copolymerized, containing a cross-linking agent and controlled in moisture absorbing and releasing property, and a fiber using the polyester copolymer. The fiber can be used as a comfortable material for underwear, sports wear, interlinings, etc. as highly hygroscopic woven and knitted fabrics, etc. of high quality.

Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.

Abstract: Novel photosensitive polymer films are provided that include (1) a polymer carrier having .dbd.N--C(.dbd.O)-- groups; (2) an initiation system for photo polymerization; (3) polymerizable compounds; and (4) other chemicals as appropriate. The photosensitive polymer films demonstrate short pump times, short DRAW times, short fix times, and reduced noise levels equal to one-third to one-fifth the noise level of prior photosensitive polymer films.

Abstract: An alkali-developable photopolymerizable composition is disclosed, comprising (1) a photopolymerization initiator or a photopolymerization initiator system, (2) an addition polymerizable monomer having an ethylenically unsaturated double bond, and (3) a resin obtained by reacting a copolymer comprising at least a repeating unit represented by formula (I): ##STR1## wherein Ar.sup.1 represents a phenyl group or a phenyl group substituted with an alkyl group having from 1 to 4 carbon atoms, an alkoxy group having from 1 to 4 carbon atoms, an aryl group having from 6 to 10 carbon atoms, an aralkyl group having from 8 to 12 carbon atoms, a halogen atom, or a combination of two or more of these substituents; and x represents a molar content of the repeating unit in the copolymer, ranging from 0.85 to 0.55,and a repeating unit represented by formula (II): ##STR2## wherein y represents a molar content of the repeating unit in the copolymer, ranging from 0.15 to 0.

Abstract: A composition for a protective film, which comprises the following components (A), (B), (C) and (D), wherein the proportions of the main components (A) and (B) are substantially from 5 to 60 wt % of (A) and from 35 to 90 wt % of (B), based on the total amount of the composition: (A) a photopolymerizable polyfunctional (meth)acrylate monomer and/or oligomer; (B) an oligomer or polymer of a non-acrylic epoxide; (C) a photopolymerization initiator; and (D) an epoxy-curing agent.

Abstract: The present invention provides a photosensitive resin composition into which a photosensitive group can be easily given and introduced and which is excellent in conservation, stability, heat resistance, practical physical properties and sensitivity and which can inhibit cracks from occurring at the time of development.The photosensitive resin composition of the present invention comprises 100 parts by weight of a polyimide, 10-100 parts by weight of an isocyanurate having a (meth)acrylic group, 10-100 parts by weight of a polyalkylene glycol di(meth)acrylate, and 0.5-20 parts by weight of a photopolymerization initiator. This composition can be utilized to obtain a patterned polyimide film having heat resistance.This composition can be applied to uses of electronic materials such as interlayer films of multi-layer boards of printed-wiring boards, and the like.

Abstract: A class of unsaturated resins which are suitable for use in radiation curable coatings has been developed. The resins comprise N-vinyl-N-acyl oligomers made by reacting a secondary N-vinylamide with a polyisocyanate monomer which is reacted with at least one mono- or polyhydric alcohol to form a urethane linkage.

Abstract: This invention relates to vinyl ether-based coatings for which properties such as color stability, thermal stability, mechanical stability, hydrolyric stability, and resistance to embrittlement may be maintained and properties hydrogen generation and blocking are minimized. The invention also relates to stabilizers which control these properties in the coatings.

Abstract: Liquid radiation-curable formulation, in particular for stereolithography, based on at least one compound that contains free radically polymerisable groups, and at least one photoinitiator suitable for the polymerisation, which formulation additionally contains a polyoxyalkylene-polysiloxane block copolymer that is selected from copolymers of the chemical formulaeR.sup.1 --(OC.sub.c H.sub.2c).sub.d --{[T]--(C.sub.c H.sub.2c O).sub.d-1 --(C.sub.c H.sub.2c)}.sub.g --OR.sup.1 (I) ##STR1## wherein: R.sup.1 is a hydrogen atom or a C.sub.1 -C.sub.8 alkyl group;R.sup.2 is a methyl or phenyl group;[T] is a polysiloxane group [PS] terminated as described in the specification in more detail;[PS] is the group of formula ##STR2## and [Alk] is an alkylene group of 3 to 10 carbon atoms, as well as novel block copolymers of formulae (I) and (II). The cured formulations have, inter alia, superior impact strength.

Abstract: Disclosed is a novel polyimide precursor having an aromatic polyamide ester structure containing amido groups and carboxylic acid ester groups composed of carboxylic groups and organic groups bonded thereto by ester linkage, wherein the ester groups comprise 20 to 80 mole %, based on the total molar amount of the ester groups, of groups each independently selected from the group consisting of a methyl group, an ethyl group, an n-propyl group, an isopropyl group and an allyl group and 20 to 80 mole %, based on the total molar amount of the ester groups, of organic groups each independently selected from organic groups having 4 to 11 carbon atoms and containing a terminal ethylenic double bond.

Abstract: Ultraviolet radiation-curable primary and secondary coating compositions for optical fibers are disclosed. The primary coatings comprise a hydrocarbon polyol-based reactively terminated aliphatic urethane oligomer; a hydrocarbon monomer terminated with at least one end group capable of reacting with the terminus of the oligomer; and an optional photoinitiator. The secondary coatings comprise a polyester and/or polyether-based aliphatic urethane reactively terminated oligomer; a hydrocarbonaceous viscosity-adjusting component capable of reacting with the reactive terminus of (I); and an optional photoinitiator. Also disclosed are optical fibers coated with the secondary coating alone or with the primary and secondary coatings of the invention.

Abstract: A photo-curable resin composition containing a polycarbonate having a number average molecular weight of between 200 and 10,000 and containing at least two (meth)acrylate groups in the molecule, or a diglycidyl phthalate (meth)acrylate, an organic polymer fine powder having an average particle diameter of between 1 .mu.m and 50 .mu.m and a photo-radical polymerization initiator; and a coating liquid to be applied to a resin pattern. This resin composition is useful for preparing a clasp pattern exhibiting a theoretical form for retention, durability, etc., i.e., a cast clasp basic pattern, for producing, by a lost wax method, a cast clasp which is a metal component for holding a partial denture, retaining it and supporting it.

Abstract: A photosensitive cover coating agent forming an insulating, protective coating having superior compatibility, sensitivity, heat resistance, adhesion, electrical properties and flexibility is provided,which coating agent is obtained by mixing a polymer (A) of repetition units of the formula ##STR1## wherein R.sup.1 is ##STR2## R.sup.2 is a divalent organic group, a compound (B) containing two or more (meth)acryloyl groups in one molecule,a compound (C) of the formula ##STR3## wherein Z is a divalent aliphatic or alicyclic group, R.sup.3 is H, monovalent organic group or characteristic group and R.sup.4 is H or --Z--R.sup.3, in 0.01 to 0.80 mol equivalent based on compound (B), the total quantity of (B) and (C) being 20 to 200 wt. parts per 100 wt. parts of (A), anda photopolymerization initiator or a sensitizing agent (D), in 0.5 to 20 wt. parts per 100 wt. parts of (A).

Abstract: A photosensitive polymer composition comprising, in admixture, a polymer predominantly comprising a recurring unit of the formula (I): ##STR1## wherein x is a tri- or tetravalent organic group, Y is a divalent organic group, and n is equal to 1 or 2 and a compound having a urea bond of the formula (II): ##STR2## wherein R.sup.1 is a group having a functional group capable of forming a dimer or polymer upon exposure to radiation, R.sup.2 and R.sup.3 are independently a hydrogen atom or a monovalent organic group is shelf stable and applicable as relatively thick coatings having sufficient photosensitivity to form semiconductor element surface protective films.

Abstract: A radiation crosslinked molding of a urethane resin composition comprising a thermoplastic urethane resing having incorporated therein a polyfunctional monomer selected from the group consisting of trimethylolpropane triacrylate, trimethylolpropane trimethacrylate and triacrylformal., is disclosed. The molding according to the present invention has excellent resistance to hot water and heat.

Abstract: A photosensitive resin composition which is excellent in flexibility and impact resilience, which is less affected by humidity is provided. This composition comprises a soluble synthetic polymer, a photo-polymerizable unsaturated compound, and a photo-polymerization initiator, wherein the soluble synthetic polymer comprises an addition polymer obtained by the reaction between a diamine compound having amino groups selected from primary and secondary amino groups and having no amide bonds in its molecule and a diisocyanate compound; and the addition polymer contains a polyoxyalkylene glycol component in an amount of 20 to 80% by weight.

Abstract: Compositions which include an acidified epoxy oligomer, a free radical photoinitiator and a monomer capable of being polymerized by the photoinitiator are used to form aqueous developable, photodefined coatings useful as permanent solder marks for printed circuits and permanent plating resists for additive printed wiring boards. The process for using the compositions include application as a fluid in solvents; drying; exposing to ultraviolet light; developing in an aqueous alkaline solution; and crosslinking the acidified, epoxy oligomers. The articles produced include printed wiring boards with the permanent, photoimaged resist composition thereon.

Abstract: Toughenable polymer compositions cross-linkable thermally or by the effect of U.V. radiation are composed of:1) A polyphenylene ether (PPE) deriving from the (co)polymerization of one or more substituted phenols by oxidative coupling;2) At least one mono-unsaturated monomer compound able to (co)polymerize in the presence of radical initiators;3) Optionally, at least one polyunsaturated monomer compound able to (co)polymerize in the presence of radical initiators;4) At least one radical polymerization initiator;5) Possibly at least one (co)polymer with elastomeric characteristics;6) Usual additives, stabilizers, accelerators and flame retardant agents.Finished articles essentially composed of an intimately copenetrated polymer blend are obtained by thermal treatment or U.V. radiation of these compositions contained in suitable moulds either along or in combination with other reinforcement materials.

Abstract: Non-crystalline elastomeric acetal polymers are disclosed which have ethylenic unsaturation in the polymer backbone. The polymers are synthesized by the ring-opening polymerization of 1,3-dioxolane, 1,3-dioxepane, and the cyclic formal of an ethylenically unsaturated diol having at least 4 adjacent carbon atoms in its main chain. The preferred cyclic formal is 4,7-dihydro-1,3-dioxepin. Because of the ethylenic unsaturation, the elastomeric acetal polymers can be vulcanized or cured with multifunctional vinyl monomers to produce elastomers with improved properties, such as better elasticity, decreased thermoplasticity and decreased solubility. The elastomeric acetals in any of their embodiments are particularly useful for blending with crystalline acetal polymers to improve the impact resistance of the crystalline acetal polymers.

Abstract: Photocurable and solvent-developable compositions based on photopolymerizable (meth)acrylates, a photoinitiator for (meth)acrylates, an organic polymeric binder which comprises free carboxyl groups and has an acid number of at least 60, a blocked polyisocyanate crosslinking agent which has a cleavage temperature of at least 100.degree. C., and an inert solvent in an amount such that the photocurable composition is pourable, are described.

Abstract: An electrically conductive resist material is disclosed, comprising at least one polymer which is sensitive to ionizing radiation and a soluble electrically conductive oligomer or polymer. A process for producing the resist material is also described, comprising admixing an electrically conductive oligomer or polymer dissolved in a solvent to at least one polymer which is sensitive to ionizing radiation. The resist material is useful in preparing electron beam resists which prevent electrostatic charging and resultant electrostatic fields.

Abstract: A curable composition which comprises a homogeneous blend of (a) a solvent soluble polyimidesiloxane containing about 0.2-30 weight percent silicon and (b) an ethylenically unsaturated multifunctional monomer. The siloxane units in the polyimide-siloxane have from 10 to about 200 ##STR1## linkages per unit, more preferably from about 15 to about 100 linkages, and most preferably from about 40 to about 60 ##STR2## linkages per siloxane unit. Another embodiment provides the composition produced by curing the above-described composition. The curable compositions of this invention can be cured by either actinic radiation, e.g., uv light, or thermal radiation. In the cured composition, the polymer produced upon polymerization of the monomer, and the polyimide portion of the polyimide-siloxane form a homogeneous blend, in which the siloxane portion of the polyimide-siloxane is phase separated.

Abstract: A base developable negative acting photoresist composition which is thermally stable, provides high resolution at short exposure times and is capable of development by means of conventional aqueous alkaline developers. The present compositions comprise an alkali soluble hydroxylated polyamide and/or polyimide binder material, a photopolymerizable compound containing at least two ethylenically-unsaturated double bonds, and a light-sensitive photoinitiator.

Abstract: The present invention relates to a negative photoresist consisting essentially ofa) at least one solid film-forming polyphenol,b) at least one compound which contains at least two epoxide groups or at least two vinyl ether groups or at least one epoxide and vinyl ether group in the molecule,c) at least one cationic photoinitiator for component b) andd) if appropriate customary additives.The resist can be developed under aqueous-alkaline conditions.

Abstract: A light-sensitive mixture is disclosed which containsa) a compound having at least one acid-cleavable C-O-C bond,b) a compound which forms a strong acid on exposure andc) a binder which is insoluble in water but soluble in aqueous alkaline solutions andd) a compound having at least one polymerizable or light-crosslinkable olefinic double bond. The mixture is suitable for producing printing plates, relief copies and photoresists, becoming soluble in alkaline developers on short exposure and insoluble on prolonged exposure as a result of crosslinking.

Abstract: (I) A photosensitive resin composition comprising(i) a thermoplastic elastomer selected from(A) a poly(amide-imide) ester produced by reacting a polyamide-forming monomer with either an aromatic carboxylic acid or its anhydride and either a polyalkylene glycol or an .alpha.,.omega.-dihydroxy hydrocarbon,(B) a poly(amide-imide) urethane produced by reacting the above poly(amide-imide) ester with a diisocyanate compound, and(C) a poly(amide-imide) urethane produced by reacting the above diisocyanate compound with a mixture of polymer diol and a poly(amide-imide) ester obtained from a Chthd 2-C.sub.4 alkylene glycol and a polyamide-forming monomer, and(ii) an ethylenic unsaturated compound, and(iii) a photopolymerization initiator,(II) a photosensitive sheet for printing plate formation which comprises a resin layer formed of the above composition, and(III) the above defined thermoplastic elastomer.

Abstract: A photosensitive composition comprising:(a) a polymer(b) 1 to 20% by weight, based on the weight of polymer (a), of a compound having a terminal ethylenically unsaturated group;(c) 0.1 to 20% by weight, based on the weight of polymer (a), of an oxime ester compound(d) 0.01 to 10% by weight, based on the weight of polymer (a), of a coumarin compound having a wave length of the absorption peak of 330 to 550 nm; has high photosensitivity to an actinic light of a wave length of 400 to 500 nm and is capable of forming heat-resistant images, patterns or films.

Abstract: Esters of trihydric or tetrahydric alcohols with alkenylphosphonic or -phosphinic acids, which can be polymerized by means of actinic light, are disclosed. They are combined with polymeric binders, in particular water-soluble polymers, and free-radical-forming photoinitiators to form photopolymerizable mixtures which are suitable for the preparation of photoresists and the production of printing plates. The mixtures show reduced temperature sensitivity and have long shelf lives.

Abstract: The present invention relates to an electric material, and particularly it relates to an organic substance having a polyacetylene linkage which exhibits electrical conductivity and nonlinear optical effect.More particularly, the present invention provides a process for producing an organic substance having a polyacetylene linkage which can be utilized, for example, as an electric material, said process comprising immersing a substrate having a hydrophilic surface in a solution of a substance containing an acetylene (--C.tbd.C--) group and a chlorosilane (--SiCl.sub.3) group dissolved in a nonaqueous organic solvent, thereby subjecting the substance containing an acetylene group and a chlorosilane group to chemical adsorption on the surface of the substrate, subjecting said substance to polymerization reaction by the use of radiation such as X-rays, electron beams, .gamma.-rays, or the like, and thereby producing a polyacetylene.

Abstract: Disclosed is a water-developable photosensitive resin composition capable of hot melt molding, which comprises:(i) a water soluble or water dispersible polyvinyl alcohol prepared by saponifying a copolymer which is obtained from copolymerizing 0 to 20 mol % of a monomer not having an ionic group (hereinafter referred to as "nonionic monomer"), 0 to 10 mol % of an ionic group-containing monomer (hereinafter referred to as "ionic monomer") and the remaining amount of a vinyl ester in the presence of a thiolic acid wherein the total content of the ionic monomer and nonionic monomer is 0.1 to 20 mol %; said polyvinyl alcohol having a terminal mercapto group, a saponification degree of the vinyl ester unit of 50 to 70 mol %, and a hot melt flow starting temperature of 60.degree. to 130.degree. C.(ii) a polymerizable monomer, and(iii) a photopolymerization initiator.

Abstract: Titanocenes containing .pi.-cyclopentadienyl ligands, in which one or two carbocyclic or heterocyclic aromatic rings are attached to the metal atom, said aromatic rings being substituted by fluorine in at least one of the two ortho-positions relative to the metal-carbon bonds, are suitable photoinitiators for the photopolymerization of ethylenically unsaturated substrates. They are distinguished by high sensitivity, stability to air and heat, and are very effective in the range from UV light to visible light.

Abstract: A flexible and nonbrittle negative-working photoresist composition comprises a polymeric binder, a photoinitiator composition, and a polymerizable cyclohexyleneoxyalkyl acrylate monomer characterized by the structural formula: ##STR1## wherein R is H or CH.sub.3,a is an integer of from 1 to 10 andb is 1 or 2.

Abstract: The invention relates to a blend of divinyl ethers and their use as diluents for irradiation curable resins, which blend comprises between about 65 wt. % and about 35 wt. % of a hydrophobic divinyl ether containing from 6 to 30 carbon atoms and having a Tg of from about 20.degree. C. to about 150.degree. C. and between about 35 wt. % and about 65 wt. % of a hydrophilic polyethylene glycol divinyl ether.

Abstract: A shaped article having a thermal recovery property comprising a urethane resin composition, wherein said urethane resin composition comprises 100 parts by weight of a thermoplastic urethane resin and from 0.1 to 50 parts by weight of at least one polyfunctional monomer selected from the group consisting of trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, and triacrylformal, said composition is irradiated with electron beams or gamma-rays for a total dose of from 3 to 50 Mrad, subsequently deformed at a temperature not lower than the softening point of said composition, and then cooled to a temperature lower than said softening point while maintaining the deformed shape of said resin composition.

Abstract: A pressure sensitive adhesive film reducible in the adhesive force by the application thereto of ultraviolet light which comprises:(a) a base film permeable to ultraviolet light; and(b) a layer of a pressure sensitive adhesive formed on one side of the base film, the adhesive comprising:(i) at least one elastic polymer selected from the group consisting of a polymer mainly composed of an acrylic acid ester copolymer and a saturated copolyester mainly composed of dibasic carboxylic acids and dihydroxy alcohols;(ii) an ultraviolet light polymerizable acrylic acid ester having not less than two acryloyl or methacryloyl groups in the molecule and having a molecular weight of not more than about 1000, in amounts of about 15-200 parts by weight in relation to 100 parts by weight of the elastic polymer; and(iii) a photopolymerization initiator in amounts sufficent to induce the photopolymerization of the ultraviolet light polymerizable acrylic acid ester;The film is especially suitable for use as a dicing film in di

Abstract: A photosensitive polyimide polymer composition comprising a solvent soluble polyimide condensation product of an aromatic dianhydride and an aromatic diamine, a polyfunctional ethylenically unsaturated monomer and a photoinitiator. The solvent soluble polyimides of the composition are prepared from at least one compound selected from 2,2-hexafluoro-bis-(3,4-dicarboxyphenyl)tetracarboxylic dianhydride; 1,1-bis-[4-(1,2-dicarboxyphenyl)]-1-phenyl-2,2,2-trifluoroethane dianhydride; 2,2-hexafluoro-bis(3-aminophenyl)propane; 2,2-hexafluoro-bis(4-aminophenyl)propane; 2,2-hexafluoro-bis-[4-(3-aminophenoxy)phenyl]propane; 2,2-hexafluoro-bis-[4-(4-aminophenoxy)phenyl]propane and 1,1-bis-(4-aminopheny)-1-phenyl-2,2,2-trifluoroethane or mixtures thereof.

Abstract: A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises(a) a flexible metal strip,(b) a layer of a first resist adhered to one surface of the metal strip, and(c) a layer of a second resist adhered to the opposite surface of the metal strip,the second resist being a negative-working resist comprising(1) a polymeric binder,(2) a photopolymerizable monomer mixture, and(3) a photoinitiator composition. The negative-working resist exhibits excellent flexibility and adhesion to the metal and superior performance during high temperature processing, whereby it serves effectively as a support for the beam leads.

Abstract: Ultraviolet curable terpolymers of trioxane, from at least 65 weight percent to about 75 weight percent of 1,3-dioxolane and from about 2 weight percent to about 20 weight percent of a monoethylenically unsaturated aliphatic diol formal having at least 4 carbon atoms in its main chain, e.g., 4,7-dehydro- 1,3-dioxepin, which are non-crystalline at room temperature or above are disclosed. These terpolymers, when admixed with a multifunctional crosslinking monomer, e.g., a multifunctional acrylate such as 1,6-hexanediol diacrylate, and a photosensitizer, e.g., a benzoin compound such as benzoin isobutyl ether, can be cured to an insoluble, non-tacky, rubbery state using UV radiation. The thus-cured polymeric materials form useful crosslinked films, and when cryogenically ground to a suitable small particle size can be blended with conventionally prepared crystalline oxymethylene homo-, co- and terpolymers to improve the latters' impact properties.

Abstract: Prepregs which are tacky to dry to the touch can be prepared by impregnating a solid reinforcing material with a liquid, solvent-free composition containing (a) an epoxide resin, (b) a photopolymerizable compound, (c) a heat-activatable curing agent for the epoxide resin (a) and, if appropriate, a photopolymerization catalyst for the photopolymerizable compound (b), and the composition is exposed to actinic radiation. The composition solidifies thereby to give an essentially solid layer as the result of photopolymerization of the photopolymerizable compound, whereas the epoxide resin remains substantially in a heat-curable state. In accordance with the invention, a substituted or unsubstituted aliphatic, cycloaliphatic or araliphatic amine is used as the heat-activatable curing agent (c), and the photopolymerizable compound (b) is employed in such a ratio to the heat-curable component (a) that, after irradiation with actinic light, the composition can still be shaped by thermoplastic methods.

Abstract: The present invention provides a resinous composition of modified phenolic compounds comprising a phenolic compound and an unsaturated cycloacetal, the composition being curable with an active energy rays, the improvement residing in the use of an onium salt. The cured material has no appreciable odor of acrolein and is stable in storage.

Abstract: A process is disclosed for producing an abrasion resistant UV curable photopolymerizable composition for coating substrates. The process involves dense grafting and comprises hydrolyzing in an aqueous acidic solution a trialkoxysilane to render it organophillic followed by dispersion with fine silica or alumina. Grafting of the hydrolyzed trialkoxysilane to the silica or alumina is effected through dehydration. The grafted material is then dispersed into intimate contact with one or more photopolymerizable monomers and photoinitiators.

Abstract: This invention relates to a thermosetting plastisol dispersion composition comprising(1) poly(phenylene oxide) (PPO) in powder form, which is insoluble in the reactive plasticizer at room temperature and plasticizable at a temperature at or above the fluxing temperature;(2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer containing at least one ethylenically unsaturated group and (c) a mixture of (a) and (b); said liquid reactive plasticizer being capable of solvating the PPO at the fluxing temperature and being present in an amount ranging from 5 to 2,000 parts per 100 parts by weight of (1); and(3) 0.01 to 10% by weight of (2) of either a thermal initiator or photoinitiator for plasticizers present in the composition.The plastisol dispersion after fluxing can form a thermoset after the crosslinking reaction.