Abstract: A curing agent for epoxy resins, containing at least one amine adduct of formula (I) which can be obtained as an addition product of a mixture of a primary diamine, a monoalkylated other diamine and a polyepoxide. The curing agent makes it possible to produce low-odor, low-emission epoxy resin products, in particular coatings, which have a surprisingly low viscosity, a high curing rate, a high final hardness, and a surprisingly appealing surface.

Abstract: A self-healing hydrophobic epoxy resin composition is provided. The self-healing epoxy resin composition comprises an epoxy resin component and a hardener component, the hardener component comprises at least 0.1 weight % of a modified epoxy resin hardener. The modified epoxy resin hardener is a reaction product of an amino modified oligomericsiloxane and a carboxylic acid anhydride. A process for preparing the modified epoxy resin hardener is also disclosed.

Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%.

Abstract: A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin system exhibits high glass transition temperature.

Abstract: Acrylic polymers, 1K coating compositions including the same, and multilayer coating systems including a topcoat layer formed from the 1K coating compositions are provided herein. In an embodiment, a 1K coating composition includes an acrylic polymer having a nominal Tg of at least 25° C. and a melamine crosslinker. The acrylic polymer includes a free radical-polymerized backbone and pendant chains bonded thereto. A first pendant chain of the acrylic polymer includes a first segment and a second segment. The first segment includes an ester linkage and a secondary hydroxyl group. The second segment is connected to the first segment and includes an ester linkage and a branched hydrocarbon chain. A second pendant chain of the acrylic polymer includes a primary hydroxyl group or a urethane-containing group formed therefrom.

Abstract: The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer.

Abstract: [Problem] A conventional sheet-like adhesive has low adhesion to an adherend and, at the same time, is required to be heated at a high temperature of 100° C. or higher when adhered to an adherend, and hence, when an adherend is an electronic part with deterioration by a high temperature, damage to the adherend is large. In addition, since a sheet-like adhesive in the B-stage hardly exhibited flowability when heating, bubbles may be remained when there is unevenness on an adherend. [Solution] A heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.: the component (A): a film forming component having an epoxy equivalent of 7000 to 20000 g/eq and having compatibility with the component (B); the component (B): an epoxy resin having an epoxy equivalent of 150 to 5000 g/eq and comprising 0 to 20% by weight of a solid epoxy resin at 25° C.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.

Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.

Abstract: A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin composition. A laminate formed using the prepreg exhibits excellent flame retardancy, solder heat resistance, and lead-free heat resistance, has a small coefficient of linear expansion in the thickness direction, and has excellent adhesion to a conductor circuit.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and which is the reaction product of: (i) a polyester epoxy block or graft copolymer having acetoacetoxy functionality; and (ii) a crosslinking component. The crosslinking component may include at least one imine functional compound having an average of at least two imine groups per molecule which are reactive with acetoacetoxy functionality.

Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.

Abstract: Disclosed herein are a resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board, the resin composition including: a composite epoxy resin containing a bisphenol A type epoxy resin, a cresol novolac epoxy resin, a rubber-modified epoxy resin, a phosphorus based epoxy resin, and an alkyl sulfonated tetrazole-modified epoxy resin; and a curing agent. The insulating film and the prepreg according to the present invention may have basically low coefficient of thermal expansion, excellent heat resistance, a high glass transition temperature, and excellent adhesion force with the metal.

Abstract: The present invention relates to an interlayer insulating composition for a multilayer printed wiring board including: an epoxy resin including a naphthalene-modified epoxy resin, a cresol novolac epoxy resin, and a rubber-modified epoxy resin; a thermoplastic resin; a curing agent; and an inorganic filler and a multilayer printed wiring board including the same as an insulating layer. The present invention can provide an insulating composition excellent in adhesion between an insulating layer and a Cu layer to secure normal operation and reliability of a final substrate. Further, since the present invention properly includes an epoxy resin and a thermoplastic resin regardless of an increase in the content of an inorganic filler, it is possible to secure the reliability of the substrate by preventing an insulating film from being brittle and improving toughness of the insulating film while maintaining a low thermal expansion rate.

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: Compounds VB of the formula (I) or (II), said compounds being particularly suitable as curing agents for epoxide resins. The compounds can be produced easily and rapidly. They can be used in the form of aqueous curing agents and form stabile aqueous emulsions in particular. This facilitates the formulation of ECC compounds for use primarily as coatings.

Abstract: Disclosed herein is a primer composition for metal materials, capable of forming a primer layer excellent in adhesion properties and film-forming properties on the surfaces of various metal materials such as common steel, stainless steel, aluminum, aluminum alloy, copper, and zinc plating to impart high bond strength and high bond durability when the metal materials are bonded with an epoxy-based adhesive. The primer composition is intended to be applied onto the surface of a metal material to be bonded with an epoxy-based adhesive and includes an epoxy resin containing both a bifunctional epoxy resin containing at least a bisphenol A-type epoxy resin and a multifunctional epoxy resin containing at least a phenol novolac-type epoxy resin, a curing agent composed of cyandiamide, a curing catalyst composed of imidazole, and an inorganic oxide filler composed of silica and titanium oxide.

Abstract: The present invention relates to stable, zero or low VOC epoxy-containing polysiloxane oligomer compositions that provide for a high degree of chemical resistance to compositions containing organic resins, while at the same time, maintaining or improving the flexibility of these organic resin-containing compositions, to processes for preparing epoxy-containing polysiloxane oligomer compositions, and to uses in coatings, sealants, adhesives, and composites containing the same.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: An inorganic filler containing (1) from 50 to 60 parts by weight of SiO2; (2) from 5 to 20 parts by weight of Al2O3; (3) from 0 to 10 parts by weight of CaO; (4) from 15 to 30 parts by weight of B2O3; (5) from 0 to 5 parts by weight of MgO; (6) from 0 to 1 parts by weight of Na2O, K2O or a combination of both; and (7) from 0 to 5 parts by weight of TiO2; based on a total weight of the filler, and having a maximum particle diameter below 100 ?m is introduced. A resin composition containing the inorganic filler and application in printed circuit boards are also introduced. A laminate prepared by the inorganic filler provides a good drilling function, a good dielectric performance and a good high frequency transmission function in high frequency transmission printed circuit board.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, the adduct particles of the epoxy-based compound and the imidazole-based compound are coated with an ethyl cellulose film, and the surface thereof is crosslinked with a polyfunctional isocyanate compound. The epoxy-based compound, the imidazole-based compound, and ethyl cellulose are dissolved in a predetermined saturated hydrocarbon-based solvent under stirring and heating. Then, the epoxy-based compound and the imidazole-based compound are subjected to adduct reaction to obtain a slurry of the adduct.

Abstract: A halogen- and phosphorus-free thermosetting resin composition is provided, which is mainly a varnish resin formed by mixing a mixture of two curing agents, an epoxy resin mixture, and an inorganic additive. The mixture of two curing agents is formed by mixing a phenolphthalein modified benzoxazine phenol aldehyde curing agent and an amino triazine novolak, and the epoxy resin mixture is formed by mixing an epoxy resin having an oxazolidone ring or a polyamide-imide-modified epoxy resin and a Bisphenol F epoxy resin.

Abstract: A latent epoxy resin curing agent is provided which exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, adduct particles formed through adduct reaction of an epoxy-based compound with the particulate imidazole-based compound are coated with an ethyl cellulose film. Furthermore, the surfaces of the adduct particles may be crosslinked with a polyfunctional isocyanate compound. A mixture of the epoxy-based compound, the particulate imidazole-based compound, and ethyl cellulose in a predetermined saturated hydrocarbon-based solvent is heated under stirring. Then, the epoxy-based compound and the particulate imidazole-based compound are subjected to adduct reaction to give a slurry of the adduct. After the slurry is cooled, the latent epoxy resin curing agent is filtrated.

Abstract: The present invention relates to a lacquer composition, particularly an adhesive and corrosion-protective lacquer for rare earth magnets, on the basis of an epoxy resin mixture, a setting accelerator, a silane-based epoxy functional adhesion promoter and a solvent or a solvent mixture, wherein the lacquer composition includes 5 to 20 wt. %, with respect to the amount of solid resin in the base of the epoxy resin mixture, of a highly viscous epoxy resin based on bisphenol-A with an elastomer content of more than 30 wt. %.

Abstract: A cationic electrodeposition coating composition including amino group-containing modified epoxy resin (A), blocked polyisocyanate curing agent (B), metal compound (C), and nitrogen oxide ion (E), wherein metal compound (C) is contained in an amount of 10 to 10,000 ppm calculated as metal, and nitrogen oxide ion (E) is contained in an amount of 50 to 10,000 ppm relative to the mass of the cationic electrodeposition coating composition. A coated article in which an electrodeposition coating film is formed on an untreated steel sheet exhibits excellent corrosion resistance, in particular, excellent hot salt water immersion resistance at 55° C.; and a multilayer coating film formed by a 3-coat 1-bake coating method on the electrodeposition coating film, which is formed on the untreated steel sheet, exhibits excellent corrosion resistance in a combined corrosion cycle test.

Abstract: A cationic electrodeposition coating composition including amino group-containing modified epoxy resin (A), blocked polyisocyanate curing agent (B), phenol resin (C), metal compound (D), and nitrogen oxide ion (E), wherein the metal compound (D) is contained in an amount of 10 to 10,000 ppm calculated as metal and the nitrogen oxide ion (E) is contained in an amount of 50 to 10,000 ppm, relative to the mass of the cationic electrodeposition coating composition. The cationic electrodeposition coating composition exhibits excellent anti-corrosion properties when coated onto untreated steel sheets.

Abstract: Disclosed herein is a curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct. Additionally disclosed is a process comprising agitating a solution of an amine, an epoxy resin, and an elastomer-epoxy adduct as a dispersant at an elevated temperature in an organic medium.

Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

Abstract: A two-component epoxy adhesive composition comprises a) a first component comprising a first epoxy resin and a second epoxy resin being flexibilized by an elastomer, and b) a second component comprising at least one amine compound with one or more primary and/or secondary amino groups having a molecular weight of less than 450 g/mole. The ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is from 0.01:1 to 0.5:1. The mixing of components a) and b) results in a wash-off resistant composition upon heat-curing in a crash-stable structural adhesive.

Abstract: The present invention is one liquid type cyanate-epoxy composite resin composition comprised of cyanate ester resin (A), epoxy resin (B), and potential curing agent (C), characterized in that the above potential curing agent is the potential curing agent containing phenol resin (b) as well as modified amine (a) which has one or more amino groups having an active hydrogen within a molecule obtained by reacting polyamine compound (a-1) with epoxy compound (a-2). The one liquid type cyanate-epoxy composite resin composition having storage stability, curing properties and high heat resistance properties at the same time can be realized by this composition.

Abstract: The present invention is a cyanate-epoxy composite resin composition comprised of a cyanate ester resin (A), an epoxy resin (B), and a latent curing agent (C), characterized in that the latent curing agent (C) is composed of a modified polyamine (c1), a phenol resin (c2) and one or more kind of polycarboxylic acid (c3). The above modified polyamine (c1) is a modified polyamine, which is obtained by the reaction of polyamine compound (c1-1) with epoxy compound (c1-2), containing one or more amino group having an active hydrogen within a molecule.

Abstract: Activators for heat-curing epoxy resin compositions, as well as use thereof in heat-curing epoxy resin compositions. These activators are distinguished by a good activation effect as well as good storage stability.

Abstract: A process of forming a solid epoxy-imidazole catalyst, the process including: contacting an imidazole, an amine, and one or more epoxy resins, in the absence of added solvent, to form a solid epoxy-imidazole catalyst. In other aspects, embodiments disclosed herein relate to an epoxy-imidazole catalyst, as well as curable compositions, processes for forming curable compositions, and processes for forming a thermoset resin using the epoxy-imidazole catalyst formed in the absence of added solvent.

Abstract: The present invention relates to a two-component epoxy adhesive composition comprising a) a first component comprising a first epoxy resin and a second epoxy resin, the second epoxy resin being flexibilized by an elastomer, and b) a second component comprising at least one amine compound with one or more primary and/or secondary amino groups, said amine compound having a molecular weight of less than 450 g/mol. The ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is 0.01:1 to 0.5:1. The mixing of the two components a) and b) results in a wash-off resistant composition. Said wash-off resistant composition results upon heat-curing in a crash-stable structural adhesive.

Abstract: The present invention relates to an epoxy resin varnish composition with high glass transition temperature for laminate plate, wherein the resin composition comprises: (A) a new dihydrobenzoxazine thermosetting resin obtained by reacting compounds: (a) phenolic products from reaction of di- or multifunctional epoxy resin and di-functional phenolic compounds; (b) mono- or di-functional primary amines; (c) di-functional phenols; and (d) formaldehyde or paraformaldehyde, (B) one or more epoxy resins, (C) novolac resin curing agents, and (D) curing promoters. For the epoxy resin varnish composition, crosslinking density of resin is increased due to using modified dihydrobenzoxazine thermosetting resin with multiple functional groups, so that mechanical strength and heat resistance of the obtained substrate are remarkably improved, and solubility problem of dihydrobenzoxazine in solvent is solved to greatly elevate production efficiency.

Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

Abstract: The present invention relates to a two-component epoxy adhesive composition comprising a) a first component comprising a first epoxy resin and a second epoxy resin, the second epoxy resin being flexibilized by an elastomer, and b) a second component comprising at least one amine compound with one or more primary and/or secondary amino groups, said amine compound having a molecular weight of less than 450 g/mol. The ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is 0.01:1 to 0.5:1. The mixing of the two components a) and b) results in a wash-off resistant composition. Said wash-off resistant composition results upon heat-curing in a crash-stable structural adhesive.

Abstract: The invention provides a composition comprising a polyester amide acid (A) obtained by reacting a tetracarboxylic dianhydride (a1), a diamine (a2) and a multivalent hydroxy compound (a3); a pigment (B); and an epoxy resin (C), which is most suitable for an ink-jet ink composition for a color filter.

Abstract: A low viscosity composition for use in varying applications, such as an encapsulant, anti-corrosive, adhesive and/or thermal interface material in an electronic device is provided. The composition comprises a blend one or more resins, one or more curing agents, one or more reactive diluents and one or more thermally conductive filler having particles with a high aspect ratio.

Abstract: The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Specifically, the fluxing curative comprises a salt that is a reaction product of an imidazole component and a carboxylic acid component having at least 10 carbon atoms per molecule. Additionally, the invention is directed to an underfill solution comprising the fluxing curative and a method of attaching an integrated circuit device using the underfill solution.

Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.

Abstract: The present invention relates to a block polymeric material. Typically the block polymer comprises units capable of having an average cationic charge density of about 15 or less, preferably 5 or less, more preferably from about 0.05 to about 5, even more preferably from about 0.05 to about 2.77, even more preferably from about 0.1 to about 2.75, most preferably from about 0.75 to about 2.25 units per 100 daltons molecular weight at a pH of from about 4 to about 12. The polymeric material is a suds enhancer and a suds volume extender for personal care products such as soaps and shampoos. The compositions have increased effectiveness for preventing re-deposition of grease during hand and body washing. The polymers are also effective as a soil release agent in fabric cleaning compositions.

Abstract: A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90° C. to form a homogeneous solution, which, when cooled to less than approximately 70° C., simultaneously initiates a Diels-Alder reaction between the furan and the bismaleimide and a epoxy curing reaction between the amine curative and the oxirane group to form a thermally-removable adhesive. Subsequent heating to a temperature greater than approximately 100° C. causes the adhesive to melt and allows separation of adhered pieces.

Abstract: A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: A lubricating coating compound used for forming a thermosetting synthetic resin lubricating film, wherein a resin composition composed of an epoxy resin, a curing agent, a reactive silicone oil with an epoxy group, and a triazinethiol is dissolved in an organic solvent, wherein if the sum of the epoxy resin and the curing agent is set to 100 parts by weight, the sum of the reactive silicone oil with an epoxy group and the triazinethiol is 2 to 30 parts by weight.

Abstract: A curing agent for epoxy resin which comprises at least one selected from the compound of the formula (1) and its salt, as an effective component wherein X is —(CH2)n- or —(CH2)1-Y—(CH2)m- , Y is —N(R1)—, —O— or —S—, R1 is alkyl having 1 to 8 carbon atoms or amino. n is a number of 2, 3, 5 to 11, 1 and m are each a number of 1 to 8.

Abstract: Resin systems containing a dicyclopentadiene-based epoxy resin and an ortho-alkylated aromatic diamine hardener exhibit low moisture absorption, high Tg and good retention of properties under hot and wet conditions. These properties make the resin systems especially useful in aerospace applications.