Abstract: An epoxy resin powder coating composition with excellent adhesibility which comprises a bisphenol A type mixed epoxy resin having a number average molecular weight of from 800 to 2,000 comprising a mixture of a bisphenol A type epoxy resin having an average molecular weight of from 350 to 1,000 and a bisphenol A type epoxy resin having a number average molecular weight of from 2,500 to 8,000, an imidazole base compound, dicyandiamide, a pre-reacted product of an imidazole base compound with epoxy resin, and a filler.

Abstract: The invention relates to a novel electrocoating composition for metallic substrates that exhibits "thick-build" protective properties at "medium-build" thicknesses. It is composed of a self-addition epoxy resin-polyamine adduct, a blocked isocyanate cross-linker, a polyglycol-polyamine grind resin, a plasticizer, an anti-cratering agent and pigments.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a triphenol-alkane type resin or a polymer thereof with a specific organopoly-siloxane. The composition provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and is less likely to exert stress to the semiconductor devices. It exhibits distinct characteristics when used as a sealing compound for semiconductor devices, especially in the case where the element is bonded directly to a printed circuit board or heat sink. It is very unlikely that a semiconductor device sealed with it would become warped.

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Abstract: The invention discloses a high solids wire enamel having a surprisingly low viscosity. The enamel comprises a mixture of high molecular weight and low molecular weight linear hydroxy polyethers, a phenolic resin, an isocyanate and possibly a melamine. The resulting enamel has excellent flexibility and resistance to crazing.

Abstract: An adhesive composition which is curable by electromagnetic induction heating when it is applied to various substrates, said adhesive comprising a mixture of(I) An epoxy resin component and(II) A hardener component and(III) From 2 to 60% by weight of (I) and (II) of an electromagnetic energy absorbing material is described.

Abstract: A high solids coating composition which comprises 10-96 percent by weight resin solids of a low molecular weight epoxy oligomer, 2-35 percent by weight crosslinking glycoluril-formaldehyde resin and a primary sulfonic acid catalyst. The oligomer is condensed upon heating into a high molecular weight polymer film with simultaneous crosslinking with the crosslinking agent to provide the desired film properties.

Abstract: This invention relates to a storage stable, heat reactive, adhesive dispersion composition comprising a solid epoxy resin containing more than one epoxy group and a solid, sterically unhindered, tertiary amine catalyst in a liquid vehicle which is a non-solvent for the solids but in which said solids are at least partially soluble in the melt. Heating said dispersion to a temperature at or above which the solids melt results in a thermoset product usable as an adhesive, sealant or coating.

Abstract: An adhesive composition containing: (a) a nitrogen atom-free epoxy compound, (b) a poly N-glycidyl type epoxy resin, (c) a nitrile rubber having a carboxyl group, and optionally (d) a finely divided silica, a clay substance treated with an onium compound, or a mixture thereof. The compounding ratio by weight of the components (a), (b), (c) and (d) is as follows:0.05.ltoreq.(b)/(a).ltoreq.190.05.ltoreq.[(a)+(b)]/(c).ltoreq.1.750.0125.ltoreq.(d)/(c).ltoreq.0.75This adhesive composition has excellent adhesion strength, soldering heat resistance, flexibility, and chemical resistance, and has a small resin flow property.

Abstract: A novel adhesive has been developed that is particularly adapted for use in bonding automotive components made of sheet molding compound. It is comprised of suitable amounts of cross-linkable epoxy novolac resin; an epoxy flexibilizer; natural and colloidal silica; and an imidazole curing agent substituted in the one position with a short chain hydroxyalkyl group. The adhesive cures to a high bond strength in three minutes at 150.degree. C. It is resistant to degradation due to temperatures up to 200.degree. C., salt spray, humidity and water soak.