Solid Polymer Derived From Reactant Containing Element Other Than C, H, O, Or N Or Chlorine-containing Reactant Of Three Or More Carbon Atoms Patents (Class 523/435)
  • Patent number: 11897973
    Abstract: A resin composition includes the following components or a prepolymer thereof: (A) 100 parts by weight of a polyolefin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1) having a pH value of 10 or less. In Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time. The prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B). An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including resin filling uniformity, dissipation factor variation rate under heat, glass transition temperature, Z-axis ratio of thermal expansion, peeling strength and thermal resistance after moisture absorption.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: February 13, 2024
    Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
    Inventors: Chenyu Shen, Rongtao Wang, Xing He, Penghui Fu
  • Patent number: 11898057
    Abstract: The purpose of the present invention is to provide a weather-resistant hard coat composition for a glass-substitute substrate capable of efficiently forming a coating film excelling in weather resistance, scratch resistance, and toughness. The present invention provides: a weather-resistant hard coat composition for a glass-substitute substrate, the composition containing a polyorganosilsesquioxane having a constituent unit represented by Formula (1); a cured product thereof; and a laminate having a glass-substitute substrate and a coating film formed on at least one surface of the glass-substitute substrate. The coating film is a layer of a cured product of the weather-resistant hard coat composition for a glass-substitute substrate. [In formula (1), R1 represents a group containing an active energy ray-curable functional group.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: February 13, 2024
    Assignee: DAICEL CORPORATION
    Inventors: Kunio Shimizu, Hiroshi Takahashi, Akihiro Shibamoto
  • Patent number: 11866608
    Abstract: The purpose of the present invention is to provide a weather-resistant hard coat composition for a metal, the composition being capable of efficiently forming a coating film excelling in weather resistance, scratch resistance, and flexibility. The present invention provides: a weather-resistant hard coat composition for a metal, the composition containing a polyorganosilsesquioxane having a constituent unit represented by Formula (1); a cured product thereof; and a coated metal substrate having a metal substrate and a coating film formed on at least one surface of the metal substrate. The coating film is a layer of a cured product of the weather-resistant hard coat composition for a metal. [In Formula (1), R1 represents a group containing an active energy ray-curable functional group.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: January 9, 2024
    Assignee: DAICEL CORPORATION
    Inventors: Kunio Shimizu, Hiroshi Takahashi, Akihiro Shibamoto
  • Patent number: 11840630
    Abstract: A resin composition includes 50 parts by weight of a vinyl-containing polyphenylene ether resin, 1 part by weight to 30 parts by weight of a styrene-butadiene-styrene block copolymer and 0.5 part by weight to 30 parts by weight of a zinc molybdate-covered silica, wherein the zinc molybdate-covered silica has a mass ratio of zinc molybdate to silica of between 1:9 and 2:8. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including gel time stability, copper foil peeling strength, difference rate of dissipation factor and conductive anodic filament test.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: December 12, 2023
    Assignee: ELITE MATERIAL CO., LTD.
    Inventors: Yu-Te Lin, Chien-Cheng Wang
  • Patent number: 11765991
    Abstract: A particulate material metering system includes a controller configured to determine a radius of curvature of a path of a lead vehicle coupled to an agricultural implement. The controller is configured to determine a lead time of the lead vehicle relative to the agricultural implement based on a speed of the lead vehicle and/or the agricultural implement. The controller is configured to determine a radius of curvature of a path of the agricultural implement based on the radius of curvature of the path of the lead vehicle at a determination time, in which the determination time is a current time minus an offset time, and the offset time is based on the lead time. The controller is configured to determine target particulate material flow rates of respective metering devices of the particulate material metering system based on the radius of curvature of the path of the agricultural implement.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: September 26, 2023
    Assignee: CNH Industrial Canada, Ltd.
    Inventors: Craig M. Pridmore, Anthony C. Rapley, Gregory Jacob Erker
  • Patent number: 11744169
    Abstract: A particulate material metering system includes a controller configured to determine a radius of curvature of a path of a lead vehicle coupled to an agricultural implement. The controller is configured to determine a lead time of the lead vehicle relative to the agricultural implement based on a speed of the lead vehicle and/or the agricultural implement. The controller is configured to determine a radius of curvature of a path of the agricultural implement based on the radius of curvature of the path of the lead vehicle at a determination time, in which the determination time is a current time minus an offset time, and the offset time is based on the lead time. The controller is configured to determine target particulate material flow rates of respective metering devices of the particulate material metering system based on the radius of curvature of the path of the agricultural implement.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: September 5, 2023
    Assignee: CNH INDUSTRIAL CANADA, LTD.
    Inventors: Craig M. Pridmore, Anthony C. Rapley, Gregory Jacob Erker
  • Patent number: 11732720
    Abstract: A turbomachine inner housing for a radial turbomachine, wherein the turbomachine inner housing includes a partial joint along a longitudinal axis, in particular a rotor longitudinal axis, such that the turbomachine inner housing can be divided into a lower part and an upper part, wherein the turbomachine inner housing is designed for a radial turbomachine with at least two stages, wherein the turbomachine inner housing has a return stage in each case between two stages, wherein the lower part and/or the upper part is designed in one piece so as to span at least two stages at least in sections. In order to improve a turbomachine inner housing of this kind, the lower part and/or the upper part is designed in one piece so as span at least two stages at least in sections.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: August 22, 2023
    Assignee: SIEMENS ENERGY GLOBAL GMBH & CO. KG
    Inventors: Dieter Nass, Shahrouz Nejati-Rad, Kai Schickmann
  • Patent number: 11709290
    Abstract: The present disclosure provides heat-curable coating compositions for optical articles. The coating compositions include a multifunctional epoxy monomer in combination with a UV absorber. The inclusion of at least one multifunctional epoxy monomer and at least one UV absorber provide epoxy coatings that exhibit excellent adhesion on a variety of lens substrates.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: July 25, 2023
    Assignee: Essilor International
    Inventors: Haipeng Zheng, Christopher Thai
  • Patent number: 11674062
    Abstract: An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: June 13, 2023
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Tien-Chieh Chao, Masayuki Nakajima, Hongying Zhou, Shanti Swarup, Umesh C. Desai
  • Patent number: 11667583
    Abstract: Methods for embedding photocatalytic titanium dioxide in concrete surfaces to reduce pollutants via photocatalytic reactions are provided herein. One method includes mixing a solvent compound with an anatase titanium dioxide (TiO2) photocatalyst, applying an amount of concrete treatment compound to an upper surface of the concrete, the concrete treatment compound comprising a mixture of a liquid carrier compound with the anatase titanium dioxide (TiO2) photocatalyst.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: June 6, 2023
    Assignee: Pavement Technology, Inc.
    Inventors: Colin Durante, Craig Higgins
  • Patent number: 11661529
    Abstract: A heat dissipating paint composition for forming a heat dissipating coating is disclosed. The heat dissipating paint includes a prepolymer and a curing agent. The prepolymer includes a main chain containing an epoxy resin and a linear side chain bonded to the main chain and having 5 to 101 carbon atoms.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: May 30, 2023
    Assignees: HONDA MOTOR CO., LTD., DAI NIPPON TORYO CO., LTD
    Inventors: Ryosuke Kodaira, Kazutaka Yokoyama, Takanori Kobayashi, Megumi Sakai, Toshiyuki Mizuno, Ryo Nakatani, Takahiro Inoue
  • Patent number: 11619337
    Abstract: A powder coating material including a main material resin containing an epoxy resin; a phosphorus flame retarder; and at least one inorganic particulate substance selected from metal hydroxides and hydrous metal compounds. The inorganic particulate substance has an average particle size of 0.01 to 9 ?m. The inorganic particulate substance is present in an amount of 80 to 200 parts by mass relative to 100 parts by mass of the main material resin.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: April 4, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirotake Imada, Yasukazu Nakatani, Tomohiro Shiromaru
  • Patent number: 11523518
    Abstract: According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: December 6, 2022
    Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Kou Noguchi, Hiroshi Ueda
  • Patent number: 11364712
    Abstract: The present invention relates to a hard coating film and an image display apparatus comprising same, the hard coating film having a hard coating layer formed on at least one surface of a polyimide-based substrate, the hard coating layer comprising the cured product of a hard coating composition, wherein the hard coating composition comprises a solvent for swelling a polyimide-based resin, and the hard coating film is configured such that when the reflectivity thereof is measured in the range of 400 nm to 800 nm, the maximum amplitude difference in the oscillations of the reflectivity is controlled at 0.5% or less, and thus can prevent an interference pattern.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: June 21, 2022
    Assignee: DONGWOO FINE-CHEM CO., LTD
    Inventors: Geo San Lim, Min Kyung Kang, Seung Hee Kim
  • Patent number: 11187982
    Abstract: A photosensitive resin composition comprising (A) a silicone resin containing an epoxy and/or phenolic hydroxyl group, (B) a photoacid generator, and (C) a cure promoter selected from diazabicycloundecene, diazabicyclononene, an organic salt of diazabicycloundecene derivative, and an organic salt of diazabicyclononene derivative is shelf stable. A photosensitive resin coating obtained therefrom may be processed to form a fine size pattern. The resin coating has improved film properties including chemical resistance, adhesion to substrates, mechanical properties, electric insulation, and copper migration resistance, and is thus fully reliable as an insulating protective film.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: November 30, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Hitoshi Maruyama
  • Patent number: 11168237
    Abstract: Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: November 9, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: Hae-Seung H. Lee, Jay S. Schlechte
  • Patent number: 11137524
    Abstract: Provided is a hard coating film including a polyamideimide substrate layer and a hard coating layer, each of which has a predetermined refractive index, with a difference in the refractive index between those layers being 0.05. The substrate layer has a tensile modulus of 3 to 7 GPa, at a thickness of 80 ?m, as measured according to ASTM D111. The present invention relates to a hard coating film having improved mechanical and optical properties.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: October 5, 2021
    Assignees: SK Innovation Co., Ltd., SK ie technology Co., Ltd.
    Inventors: Jong Nam Ahn, Keon Hyeok Ko, Byoung Sun Ko, Sang Yoon Park, Jin Su Park, Ho Chul Yoon, Tae Sug Jang
  • Patent number: 11084914
    Abstract: Display substrates having a hard coat layer on a colorless polyimide substrate are formed from hard coat compositions having certain organic solvents that do not substantially impact the optical and mechanical properties of the colorless polyimide substrate.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: August 10, 2021
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael Mulzer, Jieqian Zhang, Joseph Kao
  • Patent number: 11066586
    Abstract: Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: July 20, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Hiroki Tanaka, Naoko Tsuji, Akira Yamakawa
  • Patent number: 10815363
    Abstract: Glass flakes of the present invention include glass flake substrates and a coating covering at least a portion of the surface of each of the glass flake substrates and composed of a binder. The binder includes a silane coupling agent, an epoxy resin, and a carbodiimide compound as essential components and includes, as an optional component, a crosslinking agent other than a carbodiimide compound. The total amount of the carbodiimide compound and the crosslinking agent is 20 mass % or less with respect to the total mass of the binder.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: October 27, 2020
    Assignee: NIPPON SHEET GLASS COMPANY, LIMITED
    Inventors: Shinichi Kato, Nobuaki Tai
  • Patent number: 10731063
    Abstract: Methods and compositions useful in papermaking and tissuemaking applications are provided. Some embodiments of the methods and compositions comprise a polyaminoamide (“PAA”) polymer functionalized with an acrylamidophenyl boronic acid and a crosslinked polyaminoamide functionalized with an acrylamidophenyl boronic acid. The methods and compositions provide useful properties for creping that include good adhesion even under excessively wet conditions, improved film uniformity, and good film durability, while maintaining good film softness and rewettability necessary for efficient runnability of the tissue machine.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: August 4, 2020
    Assignee: ECOLAB USA INC.
    Inventors: Gary Samuel Furman, Jr., David J. Castro, Christopher Kaley, Kevin McDonald, Mingli Wei
  • Patent number: 10643914
    Abstract: Provided is a semiconductor device capable of self-repairing cracks or peels occurring in sealing materials. A semiconductor module includes a member including a semiconductor element, an insulating substrate bonded onto one surface of the semiconductor element, and a printed circuit board for coupling with an external circuit connected to the other surface of the semiconductor element, which are sealed with a sealing material. In the semiconductor module, the sealing material includes a first thermosetting resin and a microcapsule particle containing a second thermosetting resin precursor.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: May 5, 2020
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Yuji Takematsu, Kenji Okamoto
  • Patent number: 10501840
    Abstract: A method of forming a smooth aerodynamic surface that permits laminar flow of air over the smooth aerodynamic surface. Selected portions of a surface of a substrate material are ablated utilizing a laser to form a treated substrate surface having a predefined roughness. The treated substrate surface is coated to form a solid layer of material having a smooth aerodynamic surface that promotes laminar flow. The solid layer of material has a lower modulus of elasticity than the substrate material to provide durotaxis when an insect impacts the solid layer of epoxy material to thereby reduce adhesion of insect residue or other matter to the smooth aerodynamic surface.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: December 10, 2019
    Assignee: United States of America as represented by the Administer of NASA
    Inventors: Christopher J. Wohl, Jr., Frank L. Palmieri
  • Patent number: 10434685
    Abstract: A release agent for being coated onto a tire bladder made of a zinc-oxide-incorporated butyl rubber during pneumatic-tire molding, the release agent containing (A) organopolysiloxane, which contains a carboxy group indicated by the general formula (1) below (in the formula, R1 is a substituted or unsubstituted C1-C30 monovalent hydrocarbon group excluding R2, R2 is a carboxy-group-substituted C1-C30 monovalent organic group, R3 is R1 or R2, and n is an integer of 3 to 2000.). This release agent produces a longer service life of a tire bladder and leads to reduced tire production cost because the amount of silicone that migrates to the tire side is low when the tire is released, and repeated mold-release performance is enhanced.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: October 8, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Inokuchi, Takakazu Minato, Nobuaki Honsho
  • Patent number: 10392505
    Abstract: There is provided a thermoplastic polyester resin composition, comprising a specified amount of a multivalent hydroxyl compound (B) having five or more hydroxyl groups and a specified amount of an epoxy compound (C) that are to be blended with a thermoplastic polyester resin (A).
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: August 27, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yusuke Tojo, Makito Yokoe, Hideyuki Umetsu
  • Patent number: 10311346
    Abstract: Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: June 4, 2019
    Assignee: CompoSecure, LLC
    Inventor: John Herslow
  • Patent number: 10040896
    Abstract: Compositions comprising Silane functionalized compounds are provided. In one embodiment, the silane functionalized compounds include an epoxy resin derived backbone having silane functional groups pendant to the backbone or serving as end caps. The compositions comprising silane functionalized compounds may be utilized in a variety of applications including in coating formulations, adhesive formulations, composite materials, and combinations thereof.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: August 7, 2018
    Assignees: HEXION, INC., MOMENTIVE PERFORMANCE MATERIALS INC.
    Inventors: Antonina Nikitenko, Matthew Pinnow, Amitabh Bansal
  • Patent number: 9902803
    Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 27, 2018
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sung-Hwan Park, Sang-Yong Tak
  • Patent number: 9773958
    Abstract: An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: September 26, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Nan Chan, Shu-Chen Huang, Chih-Hao Lin, Wen-Bin Chen, Kai-Chi Chen
  • Patent number: 9732182
    Abstract: Provided are alkoxysilylated epoxy compounds, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: August 15, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Sung-Hwan Park, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sang-Yong Tak
  • Patent number: 9670309
    Abstract: A novolac epoxy compound having an alkoxysilyl group of which composite has low CTE and increase of glass transition temperature, and requiring no coupling agent, a production method thereof, an epoxy composition including the same and a cured article thereof, are provided. A novolac epoxy compound having an alkoxysilyl group of Formulae I-1 to I-4, a production method of the novolac epoxy compound having an alkoxysilyl group by the epoxidation, alkenylation and alkoxysilylation of a novolac epoxy compound, a production method of the novolac epoxy compound having an alkoxysilyl group by the epoxidation and alkoxysilylation of a novolac epoxy compound, an epoxy composition including the novolac epoxy compound having an alkoxysilyl group, and a cured article, are provided. The cured article, i.e., the composite of the epoxy composition has improved chemical bonding efficiency due to alkoxysilyl groups. Low CTE and high glass transition temperature are exhibited.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: June 6, 2017
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Sang-Yong Tak, Su-Jin Park, Sung-Hwan Park
  • Patent number: 9392689
    Abstract: A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a fluoropolymer with a curable functional group. Also disclosed is a method of producing the metal-clad laminate.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: July 12, 2016
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshihisa Yamamoto, Hiroyuki Yoshimoto, Hideto Nakagawa
  • Patent number: 9353259
    Abstract: Provided is a thermoplastic resin composition having high flame resistance and high fluidity during injection molding, and improved impact resistance in a molded article. A method for producing a thermoplastic resin composition, the method including the step (1) of obtaining a polyester resin mixture by melt-kneading 50 to 80 parts by weight of crystalline polyester resin and 20 to 50 parts by weight of amorphous polyester resin with an extruder, and the step (2) of mixing the polyester resin mixture, a polycarbonate resin, a flame retardant, a dripping inhibitor and a toughening agent, wherein the cylinder temperature of the extruder is 250 to 280° C.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: May 31, 2016
    Assignee: KONICA MINOLTA, INC.
    Inventors: Yiqiang Yu, Masashi Mamino, Ryuji Kitani
  • Patent number: 9346942
    Abstract: A thermoplastic resin composition includes a thermoplastic resin including a polycarbonate resin; a siloxane compound represented by Formula 1; and surface-modified hydrophobic silica: wherein R1 and R2 are the same or different and are each independently C1 to C5 alkyl; R3 and R4 are the same or different and are each independently C2 to C10 alkylene; A1 and A2 are the same or different and are each independently a glycidoxy group, an epoxy group, an amine group, a hydroxyl group, a hydrogen atom, a vinyl group, a (meth)acryloyl group, or an aryl group; and n is an integer from 2 to 80. The thermoplastic resin composition can exhibit excellent properties in terms of impact resistance, heat resistance, scratch resistance, surface gloss, mar resistance, and the like.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: May 24, 2016
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Yeon Wook Chung, Yong Hee Kang, Kyu Young Kim, Byeong Yeol Kim, Joong In Kim
  • Patent number: 9267029
    Abstract: There is provided a method of making a nano-composite having individual nano-sized silica particles dispersed in a polymer matrix, the method comprises the step of curing a substantially homogeneous mixture of surface-functionalized nano-sized silica particles, a polymerizable resin and a curing agent, wherein said substantially homogeneous mixture is substantially free of alcoholic solvent to form the nano-composite.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: February 23, 2016
    Assignee: Agency for Science, Technology and Research
    Inventors: Nopphawan Phonthammachai, Chaobin He, Xu Li, Hong Ling Chia
  • Publication number: 20150111044
    Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.
    Type: Application
    Filed: December 23, 2014
    Publication date: April 23, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takaaki OGASHIWA, Hiroshi TAKAHASHI, Tetsuro MIYAHIRA, Yoshihiro KATO
  • Patent number: 9012537
    Abstract: There may be provided a process for producing a polyimide siloxane solution composition having a further improved long-term viscosity stability; and a polyimide siloxane solution composition. In the process for producing the polyimide siloxane solution composition by polymerizing/imidizing a tetracarboxylic acid component and a diamine component consisting of (a) a diaminopolysiloxane, (b) a diamine having a polar group and (c) a diamine other than (a) and (b) in a solvent, the tetracarboxylic acid component and the diamine component excluding (b) the diamine having a polar group are polymerized/imidized to provide a reaction mixture solution, and then (b) the diamine having a polar group is added to the reaction mixture solution last, and the mixture is polymerized/imidized.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: April 21, 2015
    Assignee: Ube Industries, Ltd.
    Inventors: Susumu Takasaki, Hiroo Yamashita, Seiichirou Takabayashi, Tomoko Hayashida, Mitsuo Yamanaka, Takafumi Hirakawa
  • Publication number: 20150105493
    Abstract: The present invention relates to an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition forms chemical bonds and exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. The cured product exhibits good flame retardant property by the introduction of the alkoxysilyl group.
    Type: Application
    Filed: March 14, 2013
    Publication date: April 16, 2015
    Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sook-Yeon Park, Sung-Hwan Park, Sang-Yong Tak
  • Publication number: 20150099070
    Abstract: There is provided a composition for curing a resist underlayer film used as an underlayer of a resist for nanoimprint in nanoimprint lithography of a pattern forming process by heat-baking, light-irradiation or both of them to form the resist underlayer film. A composition for forming a resist underlayer film used for nanoimprint in a pattern forming process using nanoimprint by performing heat-baking, light-irradiation, or both of them, the composition comprising a silicon atom-containing polymerizable compound (A), a polymerization initiator (B) and a solvent (C). The polymerizable compound (A) may contain silicon atoms in a content of 5 to 45% by mass. The polymerizable compound (A) may be a polymerizable compound having at least one cation polymerizable reactive group, a polymerizable compound having at least one radical polymerizable reactive group, or a combination of them, and the polymerization initiator (B) may be a photopolymerization initiator.
    Type: Application
    Filed: December 15, 2014
    Publication date: April 9, 2015
    Inventors: Satoshi TAKEI, Tomoya OHASHI
  • Patent number: 8987354
    Abstract: Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 24, 2015
    Inventors: Jingxu Zhu, Hiran Perinpanayagam, Mohammad S. Mozumder, Hui Zhang, Wen Shi
  • Publication number: 20150080486
    Abstract: A flame retardant containing composition resistant to becoming sticky from moisture is prepared by the introduction of epoxy containing compound either into the ethyleneamine polyphosphates or into the polymeric composition.
    Type: Application
    Filed: May 19, 2012
    Publication date: March 19, 2015
    Inventor: Robert Valentine Kasowski
  • Publication number: 20150073069
    Abstract: The present invention provides a curable coating composition comprising at least one linear or cyclic polysiloxane containing at least one quaternary ammonium group, a process for producing the aforesaid coating composition, and a process for producing a coating with the curable coating composition, and also the coatings and coating compositions themselves that are obtainable by the processes described.
    Type: Application
    Filed: August 25, 2014
    Publication date: March 12, 2015
    Inventors: Berend-Jan De Gans, Sascha Herrwerth, Alexandra Trambitas, Verena Dahl, Sylvia Hicking, Giuseppe Giuffre
  • Publication number: 20150065608
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including an amino triazine novolac curing agent having an amino group and a hydroxyl group to have improved coefficient of thermal expansion and glass transition temperature properties, and improved acid resistant property that discoloration of the product is not generated, and an insulating film and a prepreg as products manufactured by using the same.
    Type: Application
    Filed: April 9, 2014
    Publication date: March 5, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geum Hee Yun, Jin Seok Moon, Dae Hui Jo, Seong Hyun Yoo, Hyun Jun Lee, Jin Young Kim
  • Publication number: 20150064909
    Abstract: Provided are: a resin mold material and a resin replica mold material composition for imprinting having a superior mold releasability; a resin mold and a resin replica mold resulting from containing the material composition; and a method for producing them. The resin mold material or resin replica mold material composition for imprinting contains 100 parts by weight of a mold resin or replica mold resin for imprinting and 0.1 to 10 parts by weight of a curable fluoropolymer (A). Preferably, the fluoropolymer (A) has a weight-average molecular weight of 3,000 to 20,000 and results from including as repeating units (a1) an ?-position substituted acrylate having a fluoroalkyl group having 4 to 6 carbon atoms and (a2) and 5 to 120 parts by weight of a high-softening-point monomer exhibiting a glass transition point or softening point of at least 50° C. in the homopolymer state.
    Type: Application
    Filed: April 9, 2013
    Publication date: March 5, 2015
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Tsuneo Yamashita, Masamichi Morita, Yoshiko Kuwajima
  • Publication number: 20150057393
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same.
    Type: Application
    Filed: December 3, 2013
    Publication date: February 26, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seok Moon, Hyun Jun Lee, Seong Hyun Yoo, Jin Young Kim, Geum Hee Yun
  • Publication number: 20150031798
    Abstract: A composite material is disclosed for use in a high-voltage device having a high-voltage electrical conductor, the material containing a polymeric matrix and at least one fiber embedded in the polymeric matrix, the fibers having an average diameter of less than about 500 nm.
    Type: Application
    Filed: August 18, 2014
    Publication date: January 29, 2015
    Inventors: Jens ROCKS, Walter Odermatt
  • Publication number: 20150004374
    Abstract: A plasticized ultraviolet or electron beam (UV/EB) cationically cured coating, such as a release layer or print from UV/EB cured inks, comprises polymers with a reactive plasticizer incorporated therein. The cured coating contains the plasticizing additives permanently attached to the polymer matrix, locking them in place, and permanently flexibilizing the cured coating. The cured coating finds use on varied substrates including printable substrates used in conventional printers and those with release layers for adhesive labels. Coating formulations which form these cationically cured coatings comprise cationically polymerizable monomers and/or oligomers, a reactive plasticizer which is food grade, cosmetic grade, medical grade or biologically benign when incorporated in the polymer backbone, and a catalyst.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventors: Steven Nahm, Larry G. Venable
  • Publication number: 20140378579
    Abstract: The present invention relates to a thermosetting resin composition comprising (A) An unsaturated polyester resin comprising fumaric acid building blocks and/or a methacrylate functional resin, whereby the resin has a molecular weight Mn of from 450 up to and including 10000 Dalton and the amount of such unsaturated polyester resin and methacrylate functional resin is from 30 up to and including 80 wt. %; (B) An ethylenically unsaturated compound copolymerizable with (A); present in an amount from 10 up to and including 60 wt. %; (C) A core-shell rubber in an amount from 0.1 up to 6 wt. %, whereby the core has a Tg of less than ?30° C. and the average particle diameter of the core-shell rubber is from 50 up to and including 1000 nm; and (D) An epoxy compound in an amount from 0.3 up to and including 10 wt. %; whereby the amounts are given relative to the total weight (in g) of the summed amount of (A), (B), (C) and (D).
    Type: Application
    Filed: March 11, 2013
    Publication date: December 25, 2014
    Applicant: DSM IP Assets B.V.
    Inventors: Giacomo Perfetti, Johan Franz Gradus Antonius Jansen, Bahri Widjanarko
  • Patent number: 8916622
    Abstract: A heat-curable composition comprises—from 25 to 65% by weight of a mixture of epoxy-functional monomers, said mixture consisting of at least one polyfunctional epoxy monomer selected from monomers comprising from 4 to 8 glycidyl groups and/or cycloaliphatic epoxy groups, and at least one bi- or tri-functional epoxy monomer selected from monomers comprising two or three glycidyl groups and/or cycloaliphatic epoxy groups, —from 25 to 70% by weight of at least one organic solvent selected from glycol monoethers, —from 2.5 to 5% by weight, relative to the total weight of epoxyfunctional monomers (a) and (b), of at least one blocked strong acid catalyst, said heat-curable composition not containing any non-epoxyfunctional monomers, in particular not containing any acrylic, methacrylic or silane monomers.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: December 23, 2014
    Assignee: Essilor Internatonal (Compagnie Générale d'Optique)
    Inventor: Robert Valeri
  • Publication number: 20140367149
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, a build-up film, a prepreg, and a printed circuit board. More specifically, disclosed herein are a build-up film prepared by using a resin composition containing a cage type silsesquioxane instead of the epoxy resin, and a multilayer printed circuit board including the build-up film or a prepreg.
    Type: Application
    Filed: November 12, 2013
    Publication date: December 18, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jun Young Kim