Solid Polymer Derived From Reactant Containing Element Other Than C, H, O, Or N Or Chlorine-containing Reactant Of Three Or More Carbon Atoms Patents (Class 523/435)
  • Patent number: 6617028
    Abstract: The present invention discloses a phosphorus- and nitrogen-containing resin hardener, which has a structure represented by the following formula: wherein R2 represents a hydrogen atom or a group represented by the following formula: wherein n is an integer of from 0 to 20, and R represents phenylene, naphthylene or a group represented by the following formula: wherein A represents —O—, —S—, —SO2—, —CO—, —CH2—, —C(CH3)2— or a group represented by the following formula: provided that at least one R2 is not a hydrogen atom; and R1 represents NHR2, C1-6alkyl or phenyl; in the above groups represented by R and A, the aromatic group can be substituted by one or more substituents selected from the group consisting of hydroxy, amino, carboxy and C1-6alkyl. The present invention also discloses a flame retarding composition containing said hardener.
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: September 9, 2003
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen Yuan Hwang, Hong Hsing Chen, An Pang Tu
  • Patent number: 6555601
    Abstract: A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual turns of the wire-form material from one another with the aid of a thermally curable epoxy resin composition, which composition is solid at room temperature and comprises the following constituents: (a) an epoxy resin which is solid at room temperature, selected from (a1) polyglycidyl ethers based on novolaks; (a2) diglycidyl ethers based on bisphenols, and (a3) mixtures of more than one of components (a1) and (a2); (b) a crosslinking agent for component (a); (c) a suitable accelerator for the reaction of component (a) and component (b); (d) from 15 to 70 percent by weight, based on the overall weight of the composition, of filler selected from (d1) calcium carbonate, (d2) quartz flour, (d3) wollastonite whose particles have an average ratio of length
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: April 29, 2003
    Assignee: Vantico Inc.
    Inventors: Dean Tallak Behm, Ulrich Weidmann, Philip David Willis, Felix Bleuel, Hans-Fred Buchmann, Dieter Glauch
  • Patent number: 6508910
    Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: January 21, 2003
    Assignee: Hexcel Corporation
    Inventors: Ligui Zhou, Philippe D. Christou
  • Patent number: 6509395
    Abstract: Branched polymer defoamers for pigment dispersants. The branched polymers are the reaction products of a linking agent defined by formula (I): R(Y)3  (I) wherein each Y group is a halogen atom or one Y group is a halogen atom and two Y groups together represent an epoxy oxygen atom, which is attached to two adjacent carbon atoms in the R group to form an epoxy group, and R is an alkanetriyl group containing from 3 to 10 carbon atoms, and b) at least one compound having the formula (II) R1X(EO)n(PO)m(BO)pZ  (II) wherein R1 is a substituted or unsubstituted, saturated or unsaturated, organic group having from 4 to 36 carbon atoms; x is —O—, —S—, or —NR2—where R2 is hydrogen or a C1-C4 alkyl group; Z is hydrogen, —NHR2 in place of a terminal —O— group wherein R2 has the meaning given above, or —SH, in which the —SH group is present in place of a terminal —O— group; n is a number of from 0 to 100, e.g.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: January 21, 2003
    Assignee: Cognis Corporation
    Inventors: Kenneth Breindel, David W. Brown
  • Patent number: 6506822
    Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone stress-reducing agent further includes (D) a foam-suppressing composition comprising (D-i) an oil compound consisting of a hydrophobic organopolysiloxane and finely divided silica, (D-ii) a hydrophilic polyoxyalkylene-modified silicone oil, and optionally, (D-iii) a polyoxyalkylene polymer. The epoxy resin composition has the advantages of improved infiltration to semiconductor device-substrate gaps and minimized formation of internal and surface voids.
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: January 14, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuhiro Ichiroku, Miyuki Wakao, Toshio Shiobara
  • Publication number: 20020123540
    Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.
    Type: Application
    Filed: December 18, 2001
    Publication date: September 5, 2002
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tzong-Ming Lee, Hsun-Tien Li, Kai-Chi Chen, Mei-Ling Chen
  • Patent number: 6440257
    Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: August 27, 2002
    Assignee: Hexcel Corporation
    Inventors: Ligui Zhou, Philippe D. Christou
  • Patent number: 6437042
    Abstract: A suspension containing crosslinked silicone particles with a lower mean particle diameter and a better dispersion in certain organic resins is prepared by emulsifying a condensation crosslinkable silicone composition containing (A) an organopolysiloxane having at least two silanol groups per molecule and (B) a crosslinker, but no (C) condensation catalyst, in water using a surfactant. A tin (II) salt of an organic acid with no more than ten carbon atoms is then emulsified in water with a surfactant, and added as the component (C) to the emulsion of condensation crosslinkable silicone composition. This crosslinks the emulsion of condensation crosslinkable silicone composition.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: August 20, 2002
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Kazuo Kobayashi, Yoshitsugu Morita, Ken Tanaka
  • Patent number: 6433041
    Abstract: An efficient method is provided for producing water based coating compositions that are capable of forming highly scratch and abrasion resistant matte coatings in which crosslinked silicone particles are well dispersed. The method involves addition to a water based coating composition of a waterborne suspension of crosslinked silicone particles having an average diameter of 0.1-200 &mgr;m. The method is characterized in that the suspension is a waterborne crosslinked silicone particle suspension provided by effecting crosslinking of a condensation reaction crosslinkable silicone composition comprising (A) an organopolysiloxane containing at least two silanol groups in each molecule, (B) a crosslinker, and (C) a condensation reaction catalyst. The crosslinking is effected in the emulsified composition in an aqueous solution of an anionic surfactant.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: August 13, 2002
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Kazuo Kobayashi, Yoshitsugu Morita, Ken Tanaka
  • Patent number: 6403690
    Abstract: A halogen-free flame retardant resin composition comprising a radically polymerizable resin which is modified with a phosphorus-containing compound of the formula (1): in which R is a hydrogen atom or a group of the formula: —(CH2)n—R1 in that R1 is a group derived from a compound having at least two phenolic hydroxyl groups or epoxy groups, and n is an integer of 0 to 3.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: June 11, 2002
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Kiyotaka Komori, Keiko Kashihara, Kenji Ogasawara, Akiyoshi Nozue, Shigehiro Okada
  • Publication number: 20020055557
    Abstract: Water base coating material compositions form coating films of superior flat finish properties. They contain silicone particles with at least two kinds of different average particle size. According to the method of making the composition, a water base coating material composition can be formed by adding an aqueous suspension of silicone particles to a water base coating material composition where the aqueous suspension contains at least two kinds of silicone particles with different average particle size.
    Type: Application
    Filed: August 27, 2001
    Publication date: May 9, 2002
    Inventors: Yoshitsugu Morita, Kazuo Kobayashi, Ken Tanaka
  • Patent number: 6376100
    Abstract: A composition comprising (A) 100 parts of a liquid epoxy resin, (B) 100-300 parts of a spherical inorganic filler having a maximum particle size of up to 50 &mgr;m and a mean particle size of 0.5-10 &mgr;m, (C) 0.1-6 parts of a reactive functional group-containing silicone compound, and (D) 0.01-10 parts of a curing accelerator is suitable as an underfill material for flip-chip type semiconductor devices. The composition has improved thin film infiltration and eliminates voids and other defects.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: April 23, 2002
    Assignee: Shin Etsu-Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Kazuaki Sumita
  • Patent number: 6372826
    Abstract: A curable composition useful for repairing worn surfaces on housings comprising an admixture of: (1) a mixture of (a) an one-component epoxy resin, (b) solvent and (c) reactive diluent, wherein said epoxy resin is present in a major amount in said mixture; (2) graphite powder; and (3) polytetrafluoroethylene powder.
    Type: Grant
    Filed: December 6, 1995
    Date of Patent: April 16, 2002
    Assignee: Turbine Controls, Inc.
    Inventors: Glen R. Greenberg, Robert M. Richardello, Richard L. Frentzel
  • Patent number: 6358629
    Abstract: There is provided a resin composition having high flame retardancy, which improves high temperature storage of an epoxy resin composition comprising an epoxy resin having biphenyl structure without a halogenated flame retardant and an antimony compound as a conventional flame retardant. High temperature storage was improved, a glass transition temperature (Tg) became not less than 150° C. and V-0 class in flame retardance standard (UL94) was accomplished by employing (1) an epoxy resin having biphenyl structure mainly as an epoxy resin, (2) a phenolic aralkyl resin mainly as a curing agent, (3) 0.5 to 30 parts by weight of a polyimide resin as an additive based on total 100 parts by weight of the epoxy resin and the curing agent, (4) a polysiloxane compound modified with polyether containing an amino group as a flame retardant, (5) not less than 87% by weight of a fused silica as an inorganic filler based on the total composition.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: March 19, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Fumiaki Aga
  • Patent number: 6353080
    Abstract: A flame retardant epoxy resin composition containing not more than 10% by wgt. of halogen, comprising an epoxy resin, stated concentrations of phosphoric acid ester, nitrogen—containing cross-linking agent having an amine functionality of at least 2 and a catalyst capable of promoting the reaction of the phosphoric acid ester with the epoxy resin and promoting the curing of the epoxy resin with the cross-linker, and optionally a Lewis acid in a stated amount.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: March 5, 2002
    Assignee: The Dow Chemical Company
    Inventors: Joseph Gan, Alan Goodson, Raymond A. Koenig, John P. Everett
  • Publication number: 20010049405
    Abstract: A stain/topcoat system for non-porous thermoset and/or thermoplastic articles comprises a pigmented stain, and a topcoat comprising one or more non-siloxane film-forming polymers, an emulsion of one or more curable organopolysiloxanes, a weatherability agent having a functional group that is reactive with carboxylate functional sites and water. The topcoat displays exceptional adhesion and weatherability to pigmented stained surfaces.
    Type: Application
    Filed: December 29, 2000
    Publication date: December 6, 2001
    Applicant: Therma-Tru Corporation
    Inventor: Cem A. Porter
  • Patent number: 6265469
    Abstract: Epoxy resin adhesive formulations are disclosed which improve the bonding strength of laminates without loss of flexibility. These epoxy resin adhesive formulations comprise one or more epoxy resins, rubber compounds, curing compounds, a hindered piperidinyloxy compound, and optionally one or more fillers.
    Type: Grant
    Filed: September 2, 1999
    Date of Patent: July 24, 2001
    Assignee: Du Pont Wirex Ltd
    Inventors: Chien-Hwa Chiu, Der-Jen Sun, Ya-Fen Tsai, Chien-Yu Chen
  • Patent number: 6262147
    Abstract: The present invention provides a thermosetting organic solvent type coating capable of forming a cured coating film having a TUKON hardness at 20° C. of 15 or more and the minimum value of dynamic modulus E′ at a frequency of 110 Hz in the temperature range of 150-200° C., of 1×109 dyn/cm2 or more. The cured film formed from the coating, as compared with the cured films formed from conventional organic solvent type coatings used as a top coat for automobile (e.g. an organic solvent type coating containing, as main components, a hydroxyl group-containing acrylic resin and a melamine resin, or a carboxylic-epoxy type coating), is at least equivalent in weatherability, finish appearance, acid resistance, etc. and superior in stain resistance.
    Type: Grant
    Filed: August 26, 1999
    Date of Patent: July 17, 2001
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Satoshi Ikushima, Seiji Wada, Yasumasa Okumura, Haruhiko Aida, Motoshi Yabuta, Yoshiyuki Yukawa, Ken-ichi Hasada
  • Patent number: 6207731
    Abstract: A cathodic electrocoating composition comprises an aqueous carrier, a film forming binder, comprising an epoxy-amine adduct and a blocked polyisocyanate crosslinking agent, dispersed in the carrier, and a novel additive comprising the reaction product of (1) a polyoxy alkylene di or monoamine; (2) a glycidoxy alkyl alkoxy silane; and (3) a glycidyl compound selected from the group consisting of a glycidyl ester of a carboxylic acid and an alkyl glycidyl ether, which reaction product is hydrolyzed in the presence of acid and water to convert alkoxysilane moieties to silanol moieties. The electrocoat composition produces coatings having a smoother appearance with better edge coverage and fewer craters.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: March 27, 2001
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Allisa Gam
  • Patent number: 6207235
    Abstract: A one-pack coating composition is disclosed. The composition comprises (A) an oligomer or polymer containing an acid anhydride group, a blocked hydroxyl group and an epoxy group as indispensable functional groups in the same or different molecules, (B) a heat-potential curing catalyst which comprises a complex of an organometallic compound and an electron-donating compound or an onium salt and which exhibits its activity upon heating, (C) an ultraviolet absorber comprising a triazine or oxalic anilide, and (D) a hindered amine light stabilizer having a piperidine ring of the following structure: wherein R represents R1—CO—, a C2 to C20 alkyl group or R1—O— (R1 being a C2 to C20 alkyl group), and R2, R3, R4 and R5 independently from each other represent a C1 to C3 alkyl group, or a phenolic antioxidant. A method for coating using this coating composition is also disclosed.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: March 27, 2001
    Assignee: Mazda Motor Corporation
    Inventors: Mika Ohsawa, Yoshiaki Marutani, Hiroyuki Uemura, Kazuhi Koga, Hiroshi Kubota
  • Patent number: 6177489
    Abstract: A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.
    Type: Grant
    Filed: January 6, 1998
    Date of Patent: January 23, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Satoshi Okuse, Kazutoshi Tomiyoshi, Toshio Shiobara, Takayuki Aoki, Eiichi Asano, Shigeki Ino
  • Patent number: 6103788
    Abstract: The present invention relates to a curable resin composition for use in water-based coating materials which includes as essential components an emulsion polymer (A) containing tertiary amino groups obtained by carrying out emulsion polymerization of a vinyl monomer containing a tertiary amino group with another copolymerizable vinyl monomer in a water-based medium, and a compound (B) containing, at least, an epoxy group and a hydrolyzable silyl group, with this composition preferably also including a water-based compound (C) obtained by adding a neutralizing agent to a vinyl polymer (I) containing acidic groups and/or tertiary amino groups so as to neutralize at least 10% of the acidic groups and/or the tertiary amino groups, and then dispersing or dissolving in water, and/or a compound (D), which is not included in compound (B), and contains hydrolyzable silyl group and/or a silanol group.
    Type: Grant
    Filed: July 22, 1997
    Date of Patent: August 15, 2000
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Nobuo Harui, Akifumi Yamamoto, Hidehisa Nakamura
  • Patent number: 6071990
    Abstract: A composition for use in silicone coatings comprising an epoxy resin, an amine functional silane, an organometallic compound and an organic solvent. The composition is used in combination with OH-terminated diorganosiloxane coatings to form resilient films having good freeze-release properties and improved abrasion resistance over previously known coatings.
    Type: Grant
    Filed: July 20, 1993
    Date of Patent: June 6, 2000
    Assignee: General Electric Company
    Inventors: Chak-Kai Yip, James Wayne Gordon, Nabil Saba
  • Patent number: 6063828
    Abstract: A curable underfill encapsulant composition, suitable for use in semiconductor packaging, comprises one or more mono- or polyfunctional maleimide compounds, or one or more mono- or polyfunctional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, with a free radical curing agent, and optionally, one or more fillers.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: May 16, 2000
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Bodan Ma, Quinn K. Tong
  • Patent number: 6015848
    Abstract: The present invention provides a thermosetting organic solvent type coating capable of forming a cured coating film having a TUKON hardness at 20.degree. C. of 15 or more and the minimum value of dynamic modulus E' at a frequency of 110 Hz in the temperature range of 150-200.degree. C., of 1.times.1O.sup.9 dyn/cm.sup.2 or more. The cured film formed from the coating, as compared with the cured films formed from conventional organic solvent type coatings used as a top coat for automobile (e.g. an organic solvent type coating containing, as main components, a hydroxyl group-containing acrylic resin and a melamine resin, or a carboxylic-epoxy type coating), is at least equivalent in weatherability, finish appearance, acid resistance, etc. and superior in stain resistance.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: January 18, 2000
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Satoshi Ikushima, Seiji Wada, Yasumasa Okumura, Haruhiko Aida, Motoshi Yabuta, Yoshiyuki Yukawa, Ken-ichi Hasada
  • Patent number: 5985956
    Abstract: An organic solvent-containing coating composition useful as a finish for automobiles and trucks in which the film-forming binder comprises a component having at least two acid groups, a polymer having both epoxy and silane functionality and an acrylic-core polymer having stabilizer components soluble in the solvent.
    Type: Grant
    Filed: August 13, 1997
    Date of Patent: November 16, 1999
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Robert John Barsotti, Ying Kao Lee, Laura Ann Lewin
  • Patent number: 5942073
    Abstract: Adhesive/adherend systems of this invention comprise a siloxane-modified adhesive component and a siloxane-modified adherend component. The siloxane-modified adhesive component is prepared by combining an epoxy resin with an organosilane ingredient, a polysiloxane resin, an amine hardener, an organometallic catalyst, a base catalyst, and any thickener and extender pigment. The siloxane-modified adherend component is prepared using a polysiloxane resin and may also contain other resins such epoxy, phenolic, polyester, vinyl ester, polyurethane, polyamide, melamine, furan, acrylate, thermoplastic polyvinyl chloride, polyethylene, polycarbonate, ABS, polystyrene, ethylene vinyl acetate, polyvinyl acetate, polyamide, and polypropylene resins.
    Type: Grant
    Filed: May 5, 1997
    Date of Patent: August 24, 1999
    Assignee: Ameron International Corporation
    Inventors: Norman R. Mowrer, John F. Kane, Colin G. Hull
  • Patent number: 5939472
    Abstract: Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.
    Type: Grant
    Filed: April 30, 1997
    Date of Patent: August 17, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiromi Ito, Takumi Kikuchi, Hirofumi Fujioka, Hirozoh Kanegae, Yoshifumi Itabashi, Fumio Nogami
  • Patent number: 5905104
    Abstract: The invention provides a protective coating composition for use on substrates including steel, aluminum, iron and the like. This composition further provides abrasion resistance, electrical resistance, ultra-violet protection, corrosion resistance and heat resistance. It can be particularly useful for coating high temperature stacks, mufflers, manifolds, boilers, ovens, furnaces, steam lines, heat exchangers, barbecue equipment, cooking utensils and other parts that require such powder coating composition. This composition further provides good initial adhesion.This invention also provides a powder coating composition containing a hydroxyl-functional silicone resin, a glycidyl-functional acrylic resin and an optional flow control agent.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: May 18, 1999
    Assignee: H. B. Fuller Licensing & Financing, Inc.
    Inventors: Wayne G. Eklund, Paula Torrejon Ramos, Charles J. Torborg
  • Patent number: 5859095
    Abstract: This invention relates to aqueous epoxy resin-containing compositions and to such compositions which are particularly useful for depositing coatings on metalic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin or a mixture of resins containing more than 50% by weight of at least one water-dispersible or emulsifiable epoxy resin, (B) chromium trioxide, and (C) water, said composition further characterized as being substantially free of strontium chromate. The aqueous compositions may also contain other ingredients including zinc and/or ferro alloys, and polytetrafluoroethylene as a lubricant to aid metal stamping operations, and a soluble colorant.
    Type: Grant
    Filed: October 16, 1996
    Date of Patent: January 12, 1999
    Assignee: Morton International, Inc.
    Inventors: Richard T. Moyle, Karl P. Anderson, James Paczesny, John Pisapia, Lori E. Whitherup
  • Patent number: 5760109
    Abstract: Proposed is a novel organopolysiloxane composition in the form of a water-base emulsion suitable for use as a surface-coating agent on rubber articles such as automobile parts to impart excellent smoothness of the surface, abrasion resistance, adhesion to the rubber surface and so on. The composition comprises: (a) an organopolysiloxane having a viscosity of at least 10000 centipoise at 25.degree. C. and having a molecular structure consisting of the difunctional siloxane units and the trifunctional siloxane units terminated at each molecular chain end with a hydroxy group, in the form of an aqueous emulsion; (b) a hydrolysis-condensation product of an epoxy group-containing dialkoxy silane in the form of an aqueous emulsion; (c) a water-soluble organic amino compound having at least two amino groups in a molecule and containing no silicon atom; and (d) silicone rubber particles in the form of an aqueous dispersion, each in a specified weight proportion.
    Type: Grant
    Filed: August 8, 1996
    Date of Patent: June 2, 1998
    Assignee: Shin-Etsu Chemical, Co., Ltd.
    Inventors: Yoshinori Inokuchi, Satoshi Kuwata
  • Patent number: 5736593
    Abstract: The present invention relates to a ternary polymer blend particularly suited for use in tire treads and carcass ply compounds. The ternary blend is composed of, based on 100 parts by weight of the ternary polymer blend, from about 76 to 94 parts by weight of polyisoprene; 3 to 12 parts by weight of epoxidized natural rubber; from about 3 to 12 parts of chlorosulfonated polyethylene.
    Type: Grant
    Filed: January 23, 1997
    Date of Patent: April 7, 1998
    Assignee: The Goodyear Tire & Rubber Company
    Inventor: Paul Harry Sandstrom
  • Patent number: 5708057
    Abstract: A silicone-modified water-based coating composition is disclosed wherein a suspension of silicone rubber particles in water is added to a water-based coating composition such that the resulting system is storage-stable and forms a mat film when dried or cured, which film is soft to the touch.
    Type: Grant
    Filed: June 18, 1992
    Date of Patent: January 13, 1998
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Yoshitsugu Morita, Atsushi Sakuma, Noriyasu Yokoyama, Keiji Yoshida
  • Patent number: 5705540
    Abstract: Disclosed is a resin composition excellent in mechanical and electrical properties. The composition contains an inorganic filler such as fused silica or silicon nitride having the surface covered with a substance resulting from decomposition of a polysilane compound and a base resin such as an epoxy resin or a maleimide resin.
    Type: Grant
    Filed: January 10, 1997
    Date of Patent: January 6, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Ken Uchida, Yasuyuki Hotta, Shuzi Hayase
  • Patent number: 5700581
    Abstract: The present invention discloses chip (die) bond adhesive formulations preferably comprising a siloxane containing epoxide preferably a diglycidyl ether derivative, an anhydride curing additive which is soluble in the epoxide without the use of a solvent, and, optionally comprising, and oligomeric/polymeric co-additive of the type poly(alkylacrylate or -methacrylate), in conjunction with thermal and electrically conductive fillers and conventional co-catalysts used for curing epoxy systems to provide reworkable epoxy adhesives. Also disclosed are adhesive formulations comprising a siloxane containing epoxide and a hydroxybenzophenone curing additive which is soluble in the epoxide without the use of a solvent. The chips can be bonded to the substrate by conventional heating and curing techniques. With epoxy adhesive compositions comprising polyacrylate additives, the die bonded assembly can be reworked by heating the assembly to about 180.degree. C. to 250.degree. C.
    Type: Grant
    Filed: June 26, 1996
    Date of Patent: December 23, 1997
    Assignee: International Business Machines Corporation
    Inventors: Krishna G. Sachdev, Michael Berger, Mark S. Chace
  • Patent number: 5691401
    Abstract: The present invention provides curable resin compositions containing finely divided particles of a cured organosiloxane material with microparticles of silica bound to the surfaces of the particles. The particle size of the cured organosiloxane material and the particle size and properties of the silica are within specified limits.
    Type: Grant
    Filed: May 18, 1995
    Date of Patent: November 25, 1997
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Yoshitsugu Morita, Atsushi Sasaki
  • Patent number: 5684066
    Abstract: The present invention discloses a method for the preparation of heat-resistant protective coatings wherein powder-based compositions are cured at temperatures greater than about 205.degree. C. to form high-film-build coatings which are substantially free of coating defects.
    Type: Grant
    Filed: November 18, 1996
    Date of Patent: November 4, 1997
    Assignee: H.B. Fuller Licensing & Financing, Inc.
    Inventors: Wayne G. Eklund, Stephen C. Hart
  • Patent number: 5624978
    Abstract: This invention relates to aqueous epoxy resin-containing compositions useful for depositing coatings on metallic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin; (B) a non-ionic emulsifier, (C) chromium trioxide, (D) a conductive pigment, (E) water, and, optionally, polytetrafluorethylene as a lubricant. The compositions may also contain phosphoric acid or an alkylphosphoric acid. These compositions are useful in coil coating operations to improve the electrocoatability of a metal substrate, in particular, steel, galvanized or aluminized substrates. The basecoated metal can then be conventionally coated or electro coated with weldable or non-weldable primer coatings and may be followed by the application of decorative topcoats.
    Type: Grant
    Filed: October 28, 1994
    Date of Patent: April 29, 1997
    Assignee: Morton International, Inc.
    Inventors: Jeffrey N. Soltwedel, Karl P. Anderson, Lori E. Witherup, Wendy M. Holtmann, John R. Sekerak
  • Patent number: 5597867
    Abstract: This invention provides a novel thermoplastic elastomer composition which is rich in flexibility and excellent in rubber elasticity over a broad temperature range, high-temperature creep characteristics, low-temperature impact resistance, mechanical strength and moldability, and have good oil resistance, good light discoloration resistance and extremely excellent toning properties in spite of thermoplastic elastomer and which is characterized by being obtained by dynamically heat-treating a mixture of (a) 100 parts by weight of a carbon-to-carbon double bond-containing rubber, (b) 5 to 300 parts by weight of a thermoplastic resin, (c) 0.5 to 30 parts by weight of an organosiloxane crosslinking agent having at least two SiH groups in the molecule, (d) 0.001 to 20 parts by weight of a hydrosilylating catalyst, (e) 0.5 to 20 parts by weight of a compatibilizing agent and, if necessary, (f) 30 to 300 parts by weight of a paraffinic oil.
    Type: Grant
    Filed: December 11, 1995
    Date of Patent: January 28, 1997
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Motoyoshi Tsujimoto, Sumiya Miyake
  • Patent number: 5547711
    Abstract: Self-crosslinking preparation made from water, alkoxysiline compounds containing perfluoroalkyl groups, compounds soluble in water or emulsifiable or dispersible in water containing perfluoroalkyl groups and optionally further constituents, which preparations are storage stable and suited for the protection of glass, stony material, textiles, leather and paper.
    Type: Grant
    Filed: May 19, 1995
    Date of Patent: August 20, 1996
    Assignee: Bayer Aktiengesellschaft
    Inventors: Stephan Kirchmeyer, Klaus Pohmer, Tillmann Hassel
  • Patent number: 5527841
    Abstract: Disclosed is a silicone-based coating composition in the form of an aqueous dispersion of organopolysiloxanes suitable for the surface treatment of a rubber article to impart the surface with excellent lubricity and abrasion resistance so as to be useful for upgrading, for example, wind shields in automobiles. The coating composition comprises, as the effective ingredients, four organopolysiloxanes each in the form of an aqueous dispersion or solution including (a) an organopolysiloxane having a branched molecular structure consisting of two types of the siloxane units of the general formulas R.sup.1.sub.2 SiO and R.sup.1 SiO.sub.1.5, in which R.sup.1 is a monovalent hydrocarbon group, (b) a hydrolysis-condensation product of an epoxy group-containing dialkoxy silane compound, (c) a hydrolysis-condensation product of an aminoalkyl group-containing dialkoxy silane compound and (d) cured silicone rubber particles in a specified proportion.
    Type: Grant
    Filed: December 23, 1994
    Date of Patent: June 18, 1996
    Assignee: Shin-Etsu Chemical Co., Ltd
    Inventors: Yoshinori Inokuchi, Satoshi Kuwata, Toshikatu Kanehara
  • Patent number: 5514735
    Abstract: An under-coating composition comprising 100 weight parts of chlorinated polyolefin resin including 15 to 35 wt. % of chloride and 1 to 70 weight parts of epoxy resin having an equivalent epoxy weight of less than or equal to 600 is capable of eliminating the pretreatment of a surface of polyolefin resin substrate which is to be overcoated and improving the adhesion strength between the over-coatings and the surface of the substrate of polyolefin resin. Especially, the coating surface according to the present invention is much improved in resistance to hot water and resistance to humidity. Further, the use of the under-coating composition according to the present invention permits an over-coating film to have a high resistance to water decoloration.
    Type: Grant
    Filed: August 15, 1994
    Date of Patent: May 7, 1996
    Assignees: Daikyo Co., Ltd., Shinto Paint Co. Ltd.
    Inventors: Tatsuya Takenaka, Mikio Fukunaga
  • Patent number: 5500464
    Abstract: A two-pack type curable composition comprising:A. a first liquid containing an organic elastomeric polymer having at least one silicon-containing reactive group in a molecule and a curing agent for an epoxy resin, andB. a second liquid containing an epoxy resin, at least one organic tin compound selected from the group consisting of compounds of the formulae: ##STR1## wherein R.sup.1 is a monovalent hydrocarbon group, and R.sup.2 is a monovalent aliphatic hydrocarbon group having 7 to 19 carbon atoms, and an inorganic filler, which composition has good storage stability.
    Type: Grant
    Filed: January 10, 1994
    Date of Patent: March 19, 1996
    Assignee: Kanegafuchi Chemical Industry Co., Ltd.
    Inventors: Michihide Homma, Atsuko Yoshihara, Hiroshi Wakabayashi, Katsuhiko Isayama
  • Patent number: 5468461
    Abstract: An anticorrosive primer composition comprises (1) 100 parts by weight of an epoxy resin having a number-average molecular weight of from 500 to 10,000, (2) from 10 to 60 parts by weight of an aromatic polyamine containing from 2% to 30% by weight, based on the aromatic polyamine, of a promoter selected from the group consisting of phenol compounds and cresol compounds, (3) from 10 to 60 parts by weight of a polyisocyanate, (4) from 10 to 40 phr, based on the sum of components (1), (2), and (3), of silica particles of colloidal silica or fumed silica or a mixture of these, (5) from 0.5 to 5 phr of a lubricant, and (6) an organic solvent. The composition is particularly suitable for use to apply onto the chromate coating of a chromated, zinc-plated steel sheet.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: November 21, 1995
    Assignees: Nippon Paint Co., Ltd., Sumitomo Metal Industries, Ltd.
    Inventors: Yasushi Hosoda, Toshiaki Shiota, Nobukazu Suzuki, Satoshi Ikeda, Taketosi Odawa, Koichi Kimura, Hisataka Yamamoto
  • Patent number: 5466727
    Abstract: Described herein is a primer composition which comprises a solution or dispersion of: (a) about 2 percent to about 30 percent by weight of a film-forming resin; (b) about 2 percent to about 80 percent by weight of a reaction product of an epoxy silane and an amino silane, wherein the amino silane contains at least two amine groups per molecule, which is prepared by (1) contacting an amino silane and epoxy silane in amounts such that the molar ratio of epoxy silane to amino silane in the reaction mixture is less than about 1.8:1.0 and then (2) adding additional epoxy silane to the reaction mixture so that the molar ratio of epoxy silane to amino silane is at least about 2:1 in a volatile solvent. It has been discovered that the primer of the invention enhances the bonding of a non-porous substrate, such as glass, to a second substrate, particularly when used in conjunction with a "fast cure" adhesive comprised of an isocyanate-functional prepolymer and dimorpholinodiethyl ether.
    Type: Grant
    Filed: August 5, 1994
    Date of Patent: November 14, 1995
    Assignee: Essex Specialty Products, Inc.
    Inventor: Harry W. Hsieh
  • Patent number: 5447975
    Abstract: Mixtures of PVF, bis-phenol-epichlorohydrin copolymer, hindered phenol, phosphite and mercaptoarylimidazole permit formation of thick PVF articles.
    Type: Grant
    Filed: December 2, 1994
    Date of Patent: September 5, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Ronald E. Uschold
  • Patent number: 5434199
    Abstract: Epoxy molding compositions for surface mount applications are disclosed. The compositions contain multifunctional epoxy resin and multifunctional hardener along with silicone rubber particles, organofunctional silicone fluid and a high loading of silica.
    Type: Grant
    Filed: October 7, 1994
    Date of Patent: July 18, 1995
    Assignee: Rohm and Haas Company
    Inventors: Michael K. Gallagher, Michael A. Petti
  • Patent number: 5432211
    Abstract: A lubricating paint including a resin mix, a lubricant additive and silica. The resin mix consists of a urethane resin with molecular weight of over 3,000 and an epoxy resin, with the solids of the urethane resin accounting for 50-97 wt % of the solids of the resin mix. The lubricant additive accounts for 2-40 wt % of all of the solids in the lubricating paint. The silica accounts for 5-100 wt % of all of the resin solids in the lubricating paint. The lubricating paint of the invention exhibits improved formability, corrosion resistance (rust resistance) and lubricity as compared with prior art paints. It also has improved weldability, stain resistance and chemical resistance.
    Type: Grant
    Filed: February 23, 1994
    Date of Patent: July 11, 1995
    Assignee: Nihon Parkerizing Co., Ltd.
    Inventors: Ryoji Morita, Osamu Furuyama, Shigeo Tanaka
  • Patent number: 5411999
    Abstract: A composition useful in the fabrication of molded articles contains a blend of a polycarbonate, a high impact rubbery modifier such as a core-shell polymer and a catalyst quencher selected from a Group IB or IIB metal phosphate salts such as sodium dihydrogen phosphate wherein the hydroyltic stability is improved via the incorporation of an epoxy-functional polyester derived from the reaction of a polyfunctional epoxy compound and a carboxylic acid-functional polyester.
    Type: Grant
    Filed: August 22, 1994
    Date of Patent: May 2, 1995
    Assignee: General Electric Company
    Inventor: Robert R. Gallucci
  • Patent number: 5391594
    Abstract: A free-flowing silicone polymer powder, having an average particle size of 1 to 1000 microns and prepared by mixing a polydiorganosiloxane with a silica filler, is uniformly dispersed in an organic resin using conventional equipment, such as a single screw or, preferably, a twin screw extruder. When employed at a concentration of about 0.5 to 25 parts by weight of powder per 100 parts by weight of resin, a significant improvement in the burn character of the modified resin is obtained such that the rate of heat release, generation of smoke and evolution of toxic carbon monoxide gas is significantly reduced relative to the unmodified resin.
    Type: Grant
    Filed: June 29, 1992
    Date of Patent: February 21, 1995
    Assignee: Dow Corning Corporation
    Inventors: David J. Romenesko, Robert R. Buch