Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device. These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.

Abstract: Disclosed are compositions containing at least one epoxy resin A with on average more than one epoxy group per molecule; at least one epoxy adduct B with on average one epoxy group per molecule; at least one thixotropic agent C, based on a urea derivative in a non-diffusing support material; and at least one curing agent D for epoxy resins, which is activated by an increased temperature. Also disclosed are compositions containing at least one core-shell polymer E and/or filler F and/or reactive diluent G.

Abstract: An epoxy adhesive composition of an epoxy resin, an epoxy terminated liquid rubber, filler, and an amine curing package for said epoxy resin is disclosed. Advantageously, a short chain diol will be incorporated into the adhesive in order to enhance reactivity and strength build. Advantageously, a mixture of amines will be used in the curative including multifunctional aliphatic amines that improve adhesion and strength build; tertiary amines which are used to enhance adhesion and strength build, polyamides which can be used to provide flexibility; and amine-terminated rubbers (ATBN) which can improve toughness and impact resistance to the cured system. The preferred short chain diol is glycerin. Surfaces of adherends are joined with the dried residue of the epoxy adhesive composition by applying the epoxy resin composition to one or both surfaces, joining the surfaces, and applying pressure, optionally with heating.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.

Abstract: A composition contains a polyester; an aromatic epoxy compound, in an amount sufficient to provide 5 to 300 milliequivalents of epoxy per kilogram of polyester; and 0.5 to 6 weight percent, based on the weight of the polyester, and an ethylene-glycidyl methacrylate containing copolymer; and/or a copolyester copolymer, wherein the copolyester comprises, based on the weight of the copolyester, 15 to 95 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a C2-C6 aliphatic diol, and 5 to 85 weight percent of polyester units derived from the reaction of a C6-C24 aromatic dicarboxylic acid or a chemical equivalent thereof with a poly(alkylene oxide) glycol having a molecular weight of 400-6,000 and a carbon to oxygen ratio of 2.0-4.3. The compositions have excellent hydrolytic resistance, and are suitable for making automotive and electronic parts.

Abstract: The invention is a composition comprising applying to a substrate a stream of an adhesive comprising: one or more epoxy resins; one or more rubber modified epoxy resins; one or more toughening compositions comprising the reaction product of one or more isocyanate terminated prepolymers and one or more capping compounds having one or more phenolic, benzyl alcohol, aminophenyl, or, benzylamino groups wherein the reaction product is terminated with the capping compounds; one or more curing agents for epoxy resins and one or more catalysts which initiate cure at a temperature of about 100° C. or greater; and optionally; fillers adhesion promoters, wetting agents or rheological additives useful in epoxy adhesive compositions; wherein the adhesive composition has a viscosity at 45° C. of about 20 Pa·s to about 400 Pa.s. The composition can be used as an adhesive and applied as a stream using a high speed streaming process.

Abstract: An adhesive film for semiconductor assembly includes a binder portion 1, a sub-binder portion, and a cured portion, wherein the binder portion 1 and the sub-binder portion co-exist in a co-continuous phase structure after curing begins.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: Multi-component epoxy-amine primer systems are disclosed, which include an epoxy component and an amine component that includes a mercaptan terminated material. At least one of the epoxy component and the amine component includes a sulfur-containing polymer. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems.

Abstract: Epoxy adhesive compositions are provided. Specifically, the composition is a two-part, low-heat cure epoxy structural adhesive composition with a unique, well-balanced array of properties. The composition comprises components (A) and (B) where component (A) comprises at least one compound having an average epoxy functionality of at least two and optionally an epoxy functionalized liquid rubber and where component (B) comprises a polyamine, a polyamide and optionally an epoxy reactive liquid rubber. The compositions are useful as structural adhesives in bonding operations in industrial manufacturing such as automobile manufacturing.

Abstract: A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.

Abstract: A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.

Abstract: Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.

Abstract: Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compositions. The reaction products based on tricarboxylic anhydrides or tetracarboxylic anhydrides are distinguished by having on average more than one imide group and carboxyl group per molecule. The compositions may optionally also contain condensation products obtained from tri- or poly-functional polyols and/or tri- or poly-functional amino-terminated polymers and cyclic carboxylic anhydrides, wherein the latter reaction products contain on average more than one carboxyl group per molecule. These compositions additionally contain conventional rubber-modified epoxy resins together with liquid and/or solid polyepoxy resins and conventional hardeners and accelerators and optionally fillers and rheology auxiliaries.

Abstract: A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by: CH2=CR2CO−(R1O)n−OCOCR2=CH2  (1) wh

Abstract: Liquid coating compositions having improved mar and scratch resistance are disclosed. The coatings generally comprise one or more particles that have been modified to render the particles more surface active. The improved resistance is achieved without affecting the appearance or mechanical performance of the coatings. Methods for using the coatings, and the substrates coated therewith, are also disclosed.

Abstract: A curable, two-component mortar composition is described, which is based on a curable epoxide resin, at least one reactive diluent for the epoxide resin, an amine curing agent and one or more inorganic fillers, as well as, optionally, curing catalysts, rheological aids, thixotropizing agents, stabilizers, dispersants, agents to control the reaction rate and wetting agents, the amine curing agent of the curable epoxide resin and the reactive diluent being kept separate from one another to inhibit any reaction, wherein the mortar composition contains a cross-linking reactive diluent, which has functional epoxy groups with an epoxy functionality of at least 2. The mortar composition is used to fasten anchoring means in boreholes.

Abstract: An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.

Abstract: A resin composition applicable to semiconductor or electric devices comprises (A) a polyarylenesulfide resin, (B) a bisphenol epoxy resin, (C) an oxazoline group-containing amorphous polymer, and (D) an impact resistance-improving resin which is either (d1) an acid or epoxy groups-containing vinyl polymer, or (d2) an acid or epoxy groups-containing gum polymer.

Abstract: A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 parts by weight of a mixture of epoxy resins; and (c) less than 50 parts by weight of a curing agent.

Abstract: The present invention provides a method for crosslinking an isoprene-isobutylene rubber, which comprises adding, to 100 parts by weight of an isoprene-isobutylene rubber, 5 to 25 parts by weight of an alkylphenol-formaldehyde resin and 0.1 to 5 parts by weight of a hydrazide compound, or 5 to 25 parts by weight of an alkylphenol-formaldehyde resin, 0.1 to 5 parts by weight of a hydrazide compound and 0.3 to 10 parts by weight of an epoxy compound. According to this method, a crosslinked rubber product of high hardness can be obtained without using any halogen compound or increasing the amount of carbon black used.

Abstract: A multi-layer article which may be provided in the form of a tape comprises a conformable, compressible, melt flow-resistant core layer having first and second major surfaces, a sealant layer on the first major surface of the core layer, and optionally a bonding layer on the second major surface of the core layer. The sealant layer and the bonding layer each have a surface available for contacting a separate substrate. Various thermoset and foam core layers are disclosed as are thermosettable and thermoplastic sealant layers. The articles are useful for sealing two substrates together, particularly where one of the substrates is glass. Thus, the articles are especially adapted for sealing motor vehicle windshields to a frame. Various assemblies and methods for producing the same are also described.

Abstract: A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo[5.2.1.02,6]decane, from 0.2 to 2.0 weight percent of a thermal initiator such as an onium salt, from 0.2-2.0 weight percent of a bonding agent such as 3-glycidyloxypropyltrimethoxysilane, from 0-3.0 weight percent of a flow improver, from 0.2-5.0 weight percent of a metal complex with an organic ligand such as an amino acid, acetate, carbonic acid, amine and acetylacetonate including zinc di-(2-ethylhexanoate) and from 0-4 weight percent of a thixotropic agent and/or a flow modifier.

Abstract: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent or and an amine promoter.

Abstract: The present invention provides a method for crosslinking an isoprene-isobutylene rubber, which comprises adding, to 100 parts by weight of an isoprene-isobutylene rubber, 5 to 25 parts by weight of an alkylphenol-formaldehyde resin and 0.1 to 5 parts by weight of a hydrazide compound, or 5 to 25 parts by weight of an alkylphenol-formaldehyde resin, 0.1 to 5 parts by weight of a hydrazide compound and 0.3 to 10 parts by weight of an epoxy compound. According to this method, a crosslinked rubber product of high hardness can be obtained without using any halogen compound or increasing the amount of carbon black used.

Abstract: A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst; (b) melt-mixing above the glass transition temperature or melt temperature of the thermoplastic polymer, the other of (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst to form a substantially uncured but essentially curable and/or polymerizable composition; (c) optionally forming a shaped product from the melt-mixed composition of (b); and (d) fast-curing and/or fast-polymerizing the optionally formed shaped product.

Abstract: The invention relates to dental compositions containing(a) 5 to 70 wt. %, relative to (a)+(b)+(d), of oligomers and/or polymers,(b) 0 to 95 wt. %, relative to (a)+(b)+(d), of fillers,(c) 0.1 to 3 wt. %, relative to (a), of at least one initiator or one initiator system,(d) 0 to 95 wt. %, relative to (a)+(b)+(d), of the usual adjuncts, including pigments, radiopaque additives and/or thixotropy auxiliaries,characterized in that 5 to 100 wt. % of component (a) comprises oligomers or polymers with the general formula ##STR1## or ##STR2## The dental compositions are suitable for producing filling materials, fixing cements, inlays, onlays, veneers, temporary crown and bridge materials, dentistry and impression materials. In compositions with radical curing, slight volume shrinkage occurs during curing, whereas in cement compositions, better mechanical properties are obtained.

Abstract: The present invention relates to a flexible industrial adhesive composition which effectively bonds thermoplastic polymer substrates and substrates having low stiffness such as fabric, rubbers and asphaltic materials, to materials selected from metals, fabrics, rubbers, engineered materials, and concrete, said flexible industrial adhesive composition comprising:(a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule;(b) a liquid amine terminated polyamide prepared by reacting at least one C.sub.18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0.75:1;(c) one or more optional polyamine(s); and(d) one or more optional filler(s);wherein the tensile modulus of the flexible industrial adhesive composition is less than 500,000 psi and the tensile elongation of the flexible industrial adhesive composition is greater than 10%.

Abstract: This invention provides an acoustic vibrational material containing various fibers as the reinforcement material and having the epoxy resin as the matrix resin, wherein the epoxy resin is modified by a polybutadiene base elastomer containing not less than 90 mole percent of 1,2-linked units. The epoxy resin modified with the above polybutadiene elastomer exhibits a maximum value of loss coefficient at the temperature region near the room temperature. Thus compatibility between large internal loss and high elastic modulus is achieved.

Abstract: The present invention relates to a method for crosslinking an isoprene-isobutylene rubber with resins, and a crosslinked rubber product obtained by said method. According to the present invention, there are provided:a method for crosslinking an isoprene-isobutylene rubber, which comprises adding, to 100 parts by weight of an isoprene-isobutylene rubber, 8-25 parts by weight of an alkylphenol-formaldehyde resin and 0.3-10 parts by weight of an epoxy resin such as bisphenol A epoxy resin, anda crosslinked rubber product obtained by the above method.

Abstract: An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.

Abstract: Epoxy resin compositions which containa) at least one epoxy resin containing, on average, more than one 1,2-epoxy group per molecule,b) an anhydride hardener for the epoxy resin a),c) a toughener, andd) a compound containing two active hydrogen atoms which is capable of reacting with the epoxy resin a) have an outstanding toughness and are suitable as casting resins, laminating resins, moulding compounds, coating compounds and encapsulation systems for electrical and electronic components.

Abstract: A composition useful as a sheet or bulk molding compound comprises a urethane-modified vinyl ester resin (A), or acid-addition vinyl ester resn (A') obtained by reacting the hydroxyl groups in (A) with a polybasic acid anhydride (B), and a double bond(s)-containing monomer (C), wherein (A) is prepared by reacting a vinyl ester resin (F) derived from the reaction of an epoxy resin (D) and an unsaturated monobasic acid (E), with a polyisocyanate (H) and, optionally, a hydroxyl group(s)-containing (meth)acrylate (G) in an isocyanate:hydroxyl groups equivalent ratio of from 0.01-1.2:1.

Abstract: Polymerizable materials that contain "oxetanes" (trimethylene oxides) shrink only slightly when polymerized in the presence of a cationic polymerization catalyst. The materials are particular appropriate for coatings and for medical and dental purposes.

Abstract: A method of manufacturing a castable epoxy resin composition which comprises as components an epoxy resin, an acid anhydride in an amount sufficient for hardening, an inorganic filler, and acrylic rubber particles having a thermoplastic resin skin, said thermoplastic resin skin being 1 to 50 wt % of said acrylic rubber particles, wherein each of said acrylic rubber particles has epoxy groups on a surface thereof, and said acrylic rubber particles are present in an amount ranging between 2 and 40 parts by weight based on 100 parts by weight of said epoxy resin, wherein said inorganic filler is an alumina powder having a mean particle size by volume of 6 to 16 .mu.m, and a particle size of at least 10 volume % of said alumina powder particles is 20 .mu.m or greater, and wherein at least 90 volume % of said rubber particles are dispersed as discrete particles with a particle size by volume of 1 .mu.

Abstract: An aqueous coating composition includes: an inorganic particulate substance whose surface is modified with a silane coupling agent having at least one functional group selected from a group consisting of vinyl group, (meth)acryloyl group, epoxy group, and amino group; and an aqueous resin having a functional group which is reactive with the functional group of the silane coupling agent. The aqueous coating composition has excellent storage stability, pigment dispersion, coloring property, adhesion to various substrates, and printing properties, and can be used for various applications, such as printing ink, coating materials, adhesives, fiber treatment agents, surface treatment agents, and the like.

Abstract: An anticorrosive primer composition comprises (1) 100 parts by weight of an epoxy resin having a number-average molecular weight of from 500 to 10,000, (2) from 10 to 60 parts by weight of an aromatic polyamine containing from 2% to 30% by weight, based on the aromatic polyamine, of a promoter selected from the group consisting of phenol compounds and cresol compounds, (3) from 10 to 60 parts by weight of a polyisocyanate, (4) from 10 to 40 phr, based on the sum of components (1), (2), and (3), of silica particles of colloidal silica or fumed silica or a mixture of these, (5) from 0.5 to 5 phr of a lubricant, and (6) an organic solvent. The composition is particularly suitable for use to apply onto the chromate coating of a chromated, zinc-plated steel sheet.

Abstract: A lubricating paint including a resin mix, a lubricant additive and silica. The resin mix consists of a urethane resin with molecular weight of over 3,000 and an epoxy resin, with the solids of the urethane resin accounting for 50-97 wt % of the solids of the resin mix. The lubricant additive accounts for 2-40 wt % of all of the solids in the lubricating paint. The silica accounts for 5-100 wt % of all of the resin solids in the lubricating paint. The lubricating paint of the invention exhibits improved formability, corrosion resistance (rust resistance) and lubricity as compared with prior art paints. It also has improved weldability, stain resistance and chemical resistance.

Abstract: Vinyl-terminated polyesters and vinyl-terminated aliphatic polycarbonates are described which improve the flexibility and elongation at failure of cured samples of unsaturated polyesters or vinyl ester resins both at room temperature and at high temperatures, and without significant loss of surface quality or other mechanical properties. Further, these polymers do not phase separate from uncured polyester resin/styrene solutions, do not significantly increase the initial viscosity of molding compositions in which they have been incorporated, and do not negate the effect of low shrinkage additives during cure.

Abstract: A polycarbonate blend of good impact and flexural strength, good weldline properties, and good solvent resistance prepared by admixing with polycarbonate an aromatic polyester, an olefinic epoxide-containing modifier, and a thermoplastic elastomer. Optionally, a graft copolymer of the core-shell type and a rubber-modified styrene/acrylonitrile copolymer may be used as an additional impact modifiers.

Abstract: This invention is directed to a setting resin composition comprising (A) a radically polymerizable monomer, (B) a thermoplastic resin soluble or dispersible in said monomer (A), (C) an epoxy resin, (D) at least one polyfunctional carboxylic acid compound selected from said group consisting of polyfunctional carboxylic acids and anhydrides thereof, and (E) an inorganic filler and using said components in proportions such that, based on said amount of said radically polymerizable monomer (A) taken as 100 parts by weight, the amount of said thermoplastic resin (B) is in the range of 5 to 75 parts by weight, that of said epoxy resin (C) in the range of 10 to 100 parts by weight, that of said inorganic filler (E) in the range of 100 to 1,000 parts by weight, and that of said polyfunctional carboxylic acid compound (D) in the range of 0.5 to 4.

Abstract: A paper felt or mat is made from an aqueous slurry or dispersion of kraft wood pulp, a number of compounding ingredients such as finely divided inorganic pigments and fillers, a binder, an anionic latex of a copolymer wherein the core of the copolymer comprises a copolymer of a vinyl aryl monomer and a dicarboxylic acid monomer such as fumaric acid and/or itaconic acid and wherein the shell comprises a copolymer or a vinyl aryl monomer, a conjugated diene monomer, a glycidyl monomer such as glycidyl acrylate and/or glycidyl methacrylate and optionally a monocarboxylic acid monomer such as acrylic acid and/or methacrylic acid. The mat of this invention exhibits improved properties over mats made from other latex binders.

Abstract: An epoxy adhesive composition for the bonding of SMC to metal substrates and other SMC parts having an improved cure rate and hence rate of initial lap shear strength development has been discovered. The adhesive composition comprises an epoxy resin and a polyacrylate or polymethacrylate cured with a combination of an amine-functional butadiene-acrylonitrile rubber and at least one polyamidoamine.

Abstract: An epoxy resin based powder coating composition is disclosed, comprising an epoxy resin, a reaction product of dicyclopentadiene and maleic anhydride, and a cure accelerator.The coating composition may further comprise an aromatic acid anhydride based curing agent, an impact modifier and a surface smoothing agent.The coating composition has stable powder characteristic and provides good heat resistance and electrical insulation.

Abstract: An end dam nosing material useful for expansion joints and having high levels of bonding strength, tensile strength, compressive strength, flexural capabilities, resiliency, and resistance to chemical action is disclosed. The end dam nosing material of the present invention does not require the addition of external heat for curing. The end dam nosing material of the present invention comprises a mixture of a dipolymerized elastomer, an epoxy resin, a filler material and an amount of a curing agent effective to cure the epoxy resin and generate sufficient heat to cure the dipolymerized elastomer.

Abstract: An epoxy adhesive composition for the bonding of SMC to metal substrates and other SMC parts having an improved cure rate and hence rate of initial lap shear strength development has been discovered. The adhesive composition comprises an epoxy resin and a polyacrylate or polymethacrylate cured with a combination of an amine-functional butadiene-acrylonitrile rubber, at least one aliphatic or aromatic polyamine and at least one polyamide.

Abstract: A modified epoxy resin composition having improved flexibility which comprises a reaction product of an epoxy resin and a synthetic rubber reactive with an epoxy resin in the presence of a nonionic or anionic surfactant, which has uniform and stable dispersion state of the rubber in epoxy resin without increase of viscosity. The epoxy resin composition is useful as a material for adhesives and coating agents.

Abstract: Application of hydrophobic silica to an anisotropic-melt forming polyester yarn reduces interfilament and intrafilament fusion during heat-strengthening. Improvements in adhesion of yarn to certain matrices are noted.