Polymer Derived From Ethylenic Reactants Only Patents (Class 523/467)
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Patent number: 4767802Abstract: Epoxy resin composition comprising a uniform mixture of an epoxy resin and fine particles of a rubber adhered uniformly on the surface thereof with fine particles of an inorganic material, said composition having improved peel strength and toughness when cured and being useful as an adhesive or a molding material.Type: GrantFiled: October 20, 1987Date of Patent: August 30, 1988Assignee: Sunstar Giken Kabushiki KaishaInventors: Toshimori Sakakibara, Hirohide Tomoyasu
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Patent number: 4761441Abstract: Acid-curable resin compositions are described which comprise a mixture of a furan resin and a minor amount of an acid-curable epoxy resin. The acid-curable resin compositions may contain other components such as catalysts, solid particulate materials, etc. The procedures for curing such acid-curable resin compositions as well as methods for forming shaped, filled bodies such as sand cores and molds also are described. Sand cores and molds produced in accordance with the method of the invention exhibit good compression strength, good chemical resistance and increase resistance to stress cracking.Type: GrantFiled: July 1, 1985Date of Patent: August 2, 1988Assignee: CL Industries, Inc.Inventor: Wayne D. Woodson
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Patent number: 4751129Abstract: A one-part composition for application to a substrate, e.g., automotive metal body panels, to provide reinforcement thereto is a thixotropic admixture containing as essential components (a) a heat curable epoxy resin system including the reaction product in the presence of a catalyst of at least one epoxy resin with a carboxy terminated elastomer, (b) dicyandiamide, and (c) a plurality of inorganic particulate filler materials, at least one of which is capable of imparting thixotropic properties to the composition. The method of reinforcing the substrate involves spraying the one-part epoxy resin containing composition onto at least a portion thereof in a heated condition and thereafter curing the composition at a temperature higher than the spraying temperature. Resulting reinforced substrates have tenaciously adhered thereto on at least a portion of one surface thereof a thermoset layer formed by the hot spraying and then curing thereon of the thixotropic composition.Type: GrantFiled: August 10, 1987Date of Patent: June 14, 1988Assignee: Century Adhesives Inc.Inventors: Balasubramaniam Ramalingam, George W. Ritter, II, Mohan V. Kulkarni
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Patent number: 4611015Abstract: Polymer concrete compositions comprising an unsaturated thermosettable resin(s) and/or ethylenically unsaturated monomer(s), an aggregate component and a water absorbent polymer are cured to provide polymer concrete with enhanced adhesion to substrates, especially wet concrete. A primer or coating composition for concrete comprising a water absorbent polymer and an unsaturated thermosettable composition is also disclosed.Type: GrantFiled: December 13, 1984Date of Patent: September 9, 1986Assignee: The Dow Chemical CompanyInventors: Robert E. Hefner, Jr., Deborah I. Haynes
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Patent number: 4546131Abstract: Novel thermosettable compositions comprising a mixed cyanate of a polyphenol containing a copolymer of an ethylenically unsaturated compound and an alkenylphenyl cyanate are disclosed. These compositions are also useful in the preparation of novel epoxy resin compositions.Type: GrantFiled: January 15, 1985Date of Patent: October 8, 1985Assignee: The Dow Chemical CompanyInventor: Robert E. Hefner, Jr.
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Patent number: 4529755Abstract: An epoxy resin composition for encapsulating semiconductors and semiconductor elements is disclosed. This epoxy resin composition mainly comprises (a) a polyfunctional epoxy compound, (b) a styrene type block copolymer or styrene type block copolymer and liquid rubber, (c) a hardener for the epoxy compound and (d) an inorganic filler.Type: GrantFiled: October 21, 1983Date of Patent: July 16, 1985Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Hiroshi Nishikawa, Ueki Saruta, Shin-ichiro Asai
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Patent number: 4524162Abstract: This invention is directed to curable molding compositions containing a mixture of a poly(acrylate); a polymerizable ethylenically unsaturated monomer which serves to crosslink the poly(acrylate) to a thermoset product; a crosslinkable vinyl monomer having a reactivity ratio (r.sub.1) with styrene of greater than one and at least one of the following: (i) a second crosslinkable vinyl monomer having a reactivity ratio (r.sub.1) with styrene of greater than one, (ii) an epoxy compound having at least one 1,2-epoxy group per molecule, and (iii) an unsaturated fatty acid ester; and a thermoplastic polymer low profile additive. The curable molding compositions exhibit improved shrink control during the curing reaction. This invention is also directed to fiber reinforced thermoset resin articles which exhibit generally improved surface appearance quality and can be produced by a rapid injection molding process from the curable molding compositions.Type: GrantFiled: May 26, 1983Date of Patent: June 18, 1985Assignee: Union Carbide CorporationInventor: Linda A. Domeier
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Patent number: 4503174Abstract: A low temperature curing coating composition containing 10-80% by weight of binder and 20-90% by weight of an organic solvent in which the binder is(1) an acrylic polymer containing monomers having reactive groups such as acrylamide, methacrylamide, methacrylic acid, acrylic acid and glycidyl methacrylate,(2) an epoxy resin,(3) a polyamine curing agent,(4) phenol and(5) a bicyclic amindine;The composition is used as a primer or topcoating for metal substrates and curings at temperatures of 0.degree. C. to ambient temperatures and provides a primer that has excellent adhesion to the substrate and provides a durable, corrosion resistant finish.Type: GrantFiled: September 6, 1983Date of Patent: March 5, 1985Assignee: E. I. Du Pont de Nemours and CompanyInventor: Joseph A. Vasta
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Patent number: 4482660Abstract: A prepreg for making a composite is disclosed. The prepreg comprising reinforcing fibers impregnated with a resin composition comprising (A) an epoxy resin, (B) a reaction product of an epoxy resin and a butadiene-acrylonitrile copolymer having carboxyl groups on at least both terminals of the molecular chain of the copolymer, and (C) 4,4'-diaminodiphenylsulfone as a curing agent. A composite produced by curing this prepreg is high in both tensile elongation and heat resistance and is used with advantage as primary and secondary structural materials in aircraft.Type: GrantFiled: January 14, 1983Date of Patent: November 13, 1984Assignee: Toho Beslon Co., Ltd.Inventors: Tsuyoshi Minamisawa, Masato Andoh
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Patent number: 4465542Abstract: An adhesive composition containing: (a) a nitrogen atom-free epoxy compound, (b) a poly N-glycidyl type epoxy resin, (c) a nitrile rubber having a carboxyl group, and optionally (d) a finely divided silica, a clay substance treated with an onium compound, or a mixture thereof. The compounding ratio by weight of the components (a), (b), (c) and (d) is as follows:0.05.ltoreq.(b)/(a).ltoreq.190.05.ltoreq.[(a)+(b)]/(c).ltoreq.1.750.0125.ltoreq.(d)/(c).ltoreq.0.75This adhesive composition has excellent adhesion strength, soldering heat resistance, flexibility, and chemical resistance, and has a small resin flow property.Type: GrantFiled: February 17, 1983Date of Patent: August 14, 1984Assignee: Mitsui Petrochemical Industries, Ltd.Inventor: Toshikazu Furihata
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Patent number: 4414342Abstract: Glass fiber reinforced thermoplastic resins composing glass fiber, a thermoplastic resin and a copolymer of an ethylenically-unsaturated monomer and from about 1 to about 20 wt. % of copolymerizable functional monomer exhibit a marked improvement in impact properties, heat distortion values and ductility, and improved adhesion between matrix resin and fiber.Type: GrantFiled: December 7, 1981Date of Patent: November 8, 1983Assignee: Borg-Warner CorporationInventors: John C. Falk, Klementina F. Khait
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Patent number: 4394418Abstract: An aqueous sizing composition for glass fibers and the resultant sized glass fiber strands are provided, where the sized glass fiber strands have an improved slip/flow property and resultant thermosetting articles reinforced with the sized glass fiber strands have improved impact properties. The aqueous sizing composition has a poly(vinyl acetate) silane copolymer, epoxy polymer, one or more lubricants, an organo silane coupling agent, which may be an amino-silane coupling agent, lubricant modified-amino-organo silane coupling agent, epoxy-containing silane coupling agent or a mixture of one or more of these coupling agents, one or more nonionic surfactants, a polyethylene-containing polymer, a wax, a hydrocarbon acid and water. The aqueous sizing composition is applied to glass fibers which are then produced into wet chopped glass fiber strands or continuous sized glass fiber strands.Type: GrantFiled: December 24, 1981Date of Patent: July 19, 1983Assignee: PPG Industries, Inc.Inventor: Chester S. Temple
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Patent number: 4374177Abstract: Glass fibers reinforced polymeric polymers can be produced with high strength properties such as tensile strength, flexural strength and impact strength by using sized glass fiber strands of the present invention. The sized glass fiber strands have a residue of an aqueous sizing composition comprising: aqueous dispersible, emulsifiable, or solubilizable polyurethane polymer, polyepoxide polymer, polyethylene-containing polymer, and wax, where the weight ratio of the polyethylene containing polymer to the wax is in the range of about 25 to 1 to about 1 to 25, and one or more amino silane coupling agents. In addition to the amino silane coupling agent, the sizing composition may have an epoxy silane coupling agent and/or a lubricant modified silane coupling agent. The wax can be deleted from the composition, when the polyethylene-containing polymer has limited branching. The sized glass fiber strands can be produced by conventional forming process or by a wet chopped glass fiber forming process.Type: GrantFiled: December 24, 1981Date of Patent: February 15, 1983Assignee: PPG Industries, Inc.Inventors: Ed C. Hsu, L. Dow Moore, Chester S. Temple
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Patent number: 4361661Abstract: A thermally conductive composition comprises an essentially homogeneous mixture of sand or sand-like particulate material with a binder, wherein the binder comprises an organic adhesive having an inorganic fine particle filler therein. The binder is present in at least an amount sufficient to begin to form a binder meniscus between adjacent sand particles, while the filler is present in the binder in an amount which significantly increases the effective thermal conductivity of the composition as compared to the same composition without filler.Type: GrantFiled: May 22, 1980Date of Patent: November 30, 1982Assignee: Western Electric Company, IncorporatedInventor: Kenneth W. Jackson
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Patent number: 4320047Abstract: A curable thixotropic composition comprising an amine terminated liquid polymer and a novel combination of fumed silica and a mildly alkaline particulate substance in sufficient amount to accelerate gel time of the composition.Type: GrantFiled: November 13, 1980Date of Patent: March 16, 1982Assignee: The B. F. Goodrich CompanyInventors: Walter T. Murphy, Clifford D. Guiley, Jr.