Abstract: A two part composition formulation is provided with a composition part A including a phenol novolac epoxy in combination with a bisphenol F epoxy, bisphenol A epoxy, or a combination thereof that define a base resin. A resorcinol diglycidyl ether present is present in part A in a ratio of 1.5-25:1 relative to the base resin. A part A inorganic particulate has x-y-z average linear dimension of between 500 and 6,000 microns. An activator part B includes a curative operative to cure the base resin and the resorcinol diglycidyl ether along with a part B inorganic particulate has x-y-z average linear dimension of between 500 and 6,000 microns. A coating is obtained upon mixing and cure in contact with a substrate to form a corrosion and abrasion resistant structure. A process of forming such a structure is also provided.

Abstract: The present invention provides an active ester resin containing a phosphorus atom capable of providing a cured product having all of flame retardancy, heat resistance, and dielectric characteristics, an epoxy resin composition containing the same as a curing agent, a cured product thereof, a prepreg, a circuit board, and a build-up film. The active ester resin containing a phosphorus atom has Structure (I) in which a structural unit (?) in which a plurality of aromatic nuclei (X) are connected through an alicyclic hydrocarbon group is connected with another structural unit (?) through an arylene dicarbonyloxy group, and, at least one of the aromatic nuclei (X) present in the resin has a structural site (Y) represented by any one of the following Structural Formulas (y1) to (y4) as a substituent on the aromatic nucleus.

Abstract: The invention relates to a propped, fractured, subterranean field with (a) a first proppant and (b) a second proppant that exhibits a relatively higher average crush strength and/or an ability to form a particle to particle bonded structure than the first proppant. Preferably, the first proppant is uncoated sand and the second proppant is resin-coated sand. The proppants can be deposited as a substantially homogeneous mixture or in layered structures (vertical or horizontal) within the fractured field. Deformation of the second proppant under closure stress acts to spread out the compression pressures in a mixture so as to reduce failure of the first proppant. Similar protective effects are found when the proppants are deposited in layers. When formed as vertical pillar structures, the second proppant structures can also act as in-situ screens that inhibit formation fines from migrating through the proppant pack to the detriment of field conductivity.

Abstract: An adhesive composition includes a first part comprising about 15 to about 60 wt % of an epoxy compound, about 35 to about 80 wt % of an epoxy novolac, and about 5 to about 25 wt % of an epoxy-based reactive diluent based on the total weight of epoxy compound, epoxy novolac, and reactive diluent; and a second part comprising less than about 20 wt % of a hydroxyaromatic solvent, about 80 to about 99 wt % of a Mannich base, and about 1 to about 20 wt % of a tertiary amine, based on the total weight of hydroxyaromatic solvent, Mannich base, and tertiary amine, the first and second parts being present in a volume ratio of about 0.8:1 to about 1.2:1. Additives to further enhance the properties may be included. A method of forming an adhesive layer includes applying the adhesive composition to a surface.

Abstract: A polymer complex is disclosed which is the reaction product of one or more polymers having a terminal or pendant hydroxyl group, or a terminal or pendent carboxyl group, or combinations thereof, with at least one metal complex and one alkyl phosphate. This polymer complex acts as an adhesion promotion agent as well as a viscosity stabilizer when formulated in a printing ink or coating.

Abstract: A method for producing a semiconductor device includes the steps of: applying a composition for forming a resist underlayer film for EUV lithography including a novolac resin containing a halogen atom onto a substrate having a film to be fabricated for forming a transferring pattern and baking the composition so as to form a resist underlayer film for EUV lithography; and applying a resist for EUV lithography onto the resist underlayer film for EUV lithography, irradiating, with EUV through a mask, the resist underlayer film for EUV lithography and a film of the resist for EUV lithography on the resist underlayer film, developing the film of the resist for EUV lithography, and transferring an image formed in the mask onto the substrate by dry etching so as to form an integrated circuit device.

Abstract: The present invention provides a curable coating composition comprising at least one linear or cyclic polysiloxane containing at least one quaternary ammonium group, a process for producing the aforesaid coating composition, and a process for producing a coating with the curable coating composition, and also the coatings and coating compositions themselves that are obtainable by the processes described.

Abstract: The present invention relates to a resol resin consisting of at least one aromatic component with a phenolic OH group and at least one aldehyde component, wherein areas embedded in the resol resin matrix consisting of organically-modified polysiloxane, with said polysiloxane containing hydrocarbon groups that are at least partially bonded to said silicon in the form of non-substituted or substituted alkyl, alkenyl, aryl, arylalkyl or alkyl-aryl groups and that are not linked by covalent bonds to reactive groups of said resol resin. The invention additionally relates to moulded articles manufactured from said resin, composites from a sheet material impregnated with said resin, which was subsequently hardened, as well as methods for manufacturing said resin, said moulded articles, and said composites.

Abstract: Ink composition for continuous deflected jet printing, that is liquid at ambient temperature, comprising a solvent containing less than 0.5% by weight of water and less than 0.5% by weight of alcohols relative to the total weight of the ink composition; one or more dye(s) and/or pigment(s) that is (are) insoluble in water, and in mixtures of water and of at least one alcohol; and a binder, comprising at least 50% by weight, relative to the total weight of the binder, of at least one binder resin capable of being obtained by reaction between at least one alkoxysilane and at least one hydroxyaromatic resin.

Abstract: Polyamide compositions and articles shaped therefrom have good dimensional stability and contain at least one novolac resin and nanometric flake structure filler material; the articles shaped therefrom, e.g., by injection molding, are useful in a various of applications, for example as engineering plastics.

Abstract: The present invention has an objective to provide a molding material which has the improved specific strength and specific elastic modulus and which has excellent molding properties. According to the present invention, a molding material including a phenolic resin, carbon fibers, and a polyethersulfone and/or a polyetherimide is provided.

Abstract: This invention relates to a resin preparable by reaction of a phenol/formaldehyde novolak with tetraethyl orthosilicate in a mass ratio above 28:1, wherein the phenol of the phenol/formaldehyde novolak is substituted or unsubstituted hydroxybenzene or a mixture of two or more such phenols, and to a particulate material coated with said resin. Said particles can be used e.g. in the shell molding process for the production of shell molds and shell cores; and as proppants for use in the hydraulic fracturing process.

Abstract: A flame retardant capsule may contain a flame retardant, a polymer shell encapsulating the flame retardant, and at least one functional group orthogonal to the surface of the polymer shell. This flame retardant capsule may be covalently bonded into a polymeric material by the orthogonal functional group. The flame retardant capsules may be formed through microencapsulation.

Abstract: Resin systems and methods for making and using same are provided. The resin system can include a first aqueous resin comprising at least two polymerized monomers and a second aqueous resin comprising at least two polymerized monomers. The first aqueous resin can be present in an amount of about 5 wt % to about 95 wt %, based on the total weight the resin system. The second aqueous resin can be present in an amount of about 5 wt % to about 95 wt %, based on the total weight the resin system. The at least two polymerized monomers of the first and second aqueous resins can be the same monomers.

Abstract: A composition useful for reducing catalyst fines in an FCC slurry oil from a fluid catalytic cracking process is disclosed wherein the composition comprises a first resin which is an nonyl-phenol formaldehyde resin that has been ethoxylated and a second resin which is a p-t-amyl-phenol formaldehyde resin that has been ethoxylated.

Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

Abstract: A fluorine-containing novolac resin represented by the following formula, as well as a fluorine based surfactant and a fluorine based surfactant composition, which include the fluorine-containing novolac resin. In the formula, R represents a fluorinated alkyl-containing substituent, R? represents a hydrogen atom or a methyl group, R? represents a hydrogen atom or a non-fluorinated substituent, —X— represents any one of following four types of linking groups, —X? represents any one of three following types of substituents, n represents 0 or an integer of 1 or more, m represents an integer of 1 or more, and n+m is an integer of 2 or more.

Abstract: This invention provides a screen printable dielectric composition comprising finely divided particles of talc dispersed in a curable liquid composition containing an acrylated urethane resin oligomer, an alkyl acrylate, and phosphoric acid.

Abstract: There is provided a water treatment method using a water treatment flocculant that suffers from minimal secondary contamination with flocculation residues and contains an alkaline solution of a phenolic resin. A water treatment method involving the addition of a flocculant to water to be treated and subsequent membrane separation treatment. The flocculant contains an alkaline solution of a phenolic resin having a melting point in the range of 130° C. to 220° C. The water treatment flocculant is produced by a resole-type second-order reaction in the presence of an alkaline catalyst in which an aldehyde is added to an alkali solution of a novolak phenolic resin. The novolak phenolic resin is produced by a reaction between a phenol and an aldehyde in the presence of an acid catalyst.

Abstract: Branched polydiorganosiloxane polyamide, block copolymers and methods of making the copolymers are provided. The method of making the copolymers involves reacting one or more amine compounds including at least one polyamine with a precursor having at least one polydiorganosiloxane segment and at least two ester groups.

Abstract: The present invention relates to a novel polymer, an adhesive composition including the same, and a rubber reinforcing material treated with the same, and more particularly to an organic polysiloxane including a certain repeating unit, an adhesive composition including the same, and a rubber reinforcing material treated with the same. Because the organic polysiloxane and the adhesive composition including the same is superior in reactivity to a hydroxyl group, an amide group, or an amine group, and has high thermal resistance and low stiffness, the composition is preferably used for surface-treating a rubber reinforcing material such as a tire cord and make it possible to provide a rubber reinforcing material such as a tire cord having good properties.

Abstract: Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

Abstract: Phenolic resin binder systems for sand molds, used in metal casting, which improve the quality of thermally reclaimed sand, are described. The substantial or complete elimination of calcium compounds (e.g., calcium stearate and calcium hydroxide, conventionally employed as a mold lubricant and a resin curing catalyst, respectively) allows the thermally reclaimed sand to be reused over multiple thermal reclamation cycles without the adverse effects previously encountered.

Abstract: Ink composition for continuous deflected jet printing, that is liquid at ambient temperature, comprising a solvent containing less than 0.5% by weight of water and less than 0.5% by weight of alcohols relative to the total weight of the ink composition; one or more dye(s) and/or pigment(s) that is (are) insoluble in water, and in mixtures of water and of at least one alcohol; and a binder, comprising at least 50% by weight, relative to the total weight of the binder, of at least one binder resin capable of being obtained by reaction between at least one alkoxysilane and at least one hydroxyaromatic resin.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: A method of preparation for a layer of material for use with a power and/or telecommunications cable includes mixing a composition including a thermoplastic polymer matrix and a phenolic resin. The phenolic resin is selected from the group consisting of novolac phenol-formaldehyde resins and novolac cyanate ester resins. The phenolic resin is hardened within the thermoplastic polymer matrix to obtain nodules of hardened phenolic resin dispersed throughout the material.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin and diaminodiphenylsulfone mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: A composition is disclosed, which comprises a hydroxyaromatic-aldehyde resole resin comprising an aldehyde and a hydroxyaromatic compound, modified with a urea-aldehyde condensate. The hydroxyaromatic-aldehyde resole resin is prepared without ammonia or a primary amine and the composition does not contain a triazone or a substituted triazone compound. The composition has improved premix stability, improved cure efficiency, comparable tensile strength, and lower volatiles than the hydroxyaromatic-aldehyde resole resin unmodified with a urea-aldehyde condensate. Also disclosed are articles prepared therefrom.

Abstract: Epoxy resin compositions which comprise an epoxy resin (A), an active ester compound (B), and a triazine-containing cresol novolac resin (C), when cured and roughened, exhibit a roughed surface which has a high adhesion strength to a metal plated conductor, even though the roughness of the roughed surface is small, and provide an insulating layer which has a low coefficient of linear expansion and a low dielectric loss tangent.

Abstract: The invention relates to solid thermosetting resin compositions and resin-coated foils, glass cloth reinforced resin-coated foils using the same and their use in the manufacturing of printed circuit boards.

Abstract: A paint composition, in particular an anti-corrosive paint, for rare earth permanent magnets, has an epoxy resin mixture, a curing accelerator, an epoxy-functional adhesion promoter based on silane and a solvent. Due to the paint compositions, rare earth permanent magnets can be bonded simultaneously to a magnet system in a one method step and can be protected against corrosion. Due to the anti-corrosive paint, magnet systems which have excellent anti-corrosion properties, a satisfactory adhesive strength even at high temperatures and display good electric insulation properties, are provided.

Abstract: An organic solvent free process to make an aqueous co-dispersion of epoxy resins and at least phenolic novolac resins is reported. The compositions of such co-dispersions are based on blends of epoxy resins and at least a phenolic novolac resin within the profile viscosity versus temperature in the ranges from 1 500 000 to 300 mPas at 80° C. and 10 000 to 20 mPas at 120° C.

Abstract: The present invention relates to a non-thermosetting composition made by reacting epichlorohydrin and a primary amine, to the use of that composition for making thermosetting (curable) adhesives suitable for bonding composites, to a method of preparing composites using the thermosetting (curable) adhesives, and to the related composites bonded with the thermosetting (curable) adhesives.

Abstract: The invention relates to aminoplast or phenoplast resins comprising the reaction product of the following compounds: a substituted or unsubstituted amine derivative or a substituted or unsubstituted phenol derivative; at least one glyoxal monoacetal; and glyoxylic acid, and also the compositions containing them and their uses as adhesives or binders.

Abstract: Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another.

Abstract: [Constitution] A coatings composition having vibration-damping of two-components type and coating type which can be cured at the normal temperature comprising: a combination of not less than two kinds of an epoxy resins which can be provided with a curing compounds having each different glass transition temperature and a curing agent for an epoxy resin, and a filler. [Effect] The coatings composition having vibration-damping of two-components type and coating type which can be cured at normal temperature can be provided. Specially, said coatings composition which a drying oven for baking such as conventional example is not necessary because its composition can be cured at the normal temperature in a short time can be provided.

Abstract: A fluorine-containing novolac resin represented by the following formula, as well as a fluorine based surfactant and a fluorine based surfactant composition, which include the fluorine-containing novolac resin. In the formula, R represents a fluorinated alkyl-containing substituent, R? represents a hydrogen atom or a methyl group, R? represents a hydrogen atom or a non-fluorinated substituent, —X— represents any one of following four types of linking groups, —X? represents any one of three following types of substituents, n represents 0 or an integer of 1 or more, m represents an integer of 1 or more, and n+m is an integer of 2 or more.

Abstract: A thermosetting resin material is provided with: (A) a thermosetting resin having a dihydrobenzoxazine ring; and (B) a condensed polycyclic aromatic hydrocarbon resin is described.

Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.

Abstract: The present invention discloses a latent thermosetting ink formulation for ink jet applications comprising a phenolic resin, an amino resin and a polyol. The formulation is characterized as having a viscosity of lower than 50 Cps at a shear rate of 10 to 100,000 sec-1 at a temperature lower than 100 C and a surface tension lower than 40 dynes/cm.

Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a composition comprising b1) 40-100 wt % of a reaction product from the reaction of b1a) at least one diglycidyl- and/or at least one monoglycidylether with b1b) a composition comprising a volatile monoamine and a polyamine, said composition b1b) is used in an amount to provide an excess amino groups relative to epoxy groups from b1a), and whereby the excess of monoamine is removed off from the reaction product, b2) 0-60 wt % of a polyamine, and b3) 0-25 wt % of a polyphenol novolac, and whereby the sum of components b1), b2) and b3) is 100 wt %, providing long pot life combined with fast cure times at low temperatures, thus making said compositions especially useful for marine and offshore coatings, industrial maintenance, construction, tank and pipe linings, adhesive, automobile and electrical potting applications.

Abstract: A self-healing composite material comprising a fibre-reinforced polymeric matrix, wherein the polymeric matrix comprises a thermosetting polymer and a thermoplastic polymer.

Abstract: Storage stable aqueous dispersions of a heat-reactive hydrophilic phenolic resin (e.g., phenol/formaldehyde) are disclosed. The dispersions comprise a base resin that is the reaction product of an aromatic alcohol and an aldehyde, and an etherified resin component selected from the group consisting of an etherified phenol/aldehyde resin, an etherified cresol/aldehyde resin, and mixtures thereof. The dispersions further comprise a protective colloid (e.g., polyvinyl alcohol). The addition of the etherified resin component in an amount of at least about 20% by weight of the base resin provides storage stability, but does not adversely affect the desirable physical and chemical characteristics (e.g., chemical resistance) of end products made from such dispersions. Moreover, the dispersions of the present invention can avoid the use of etherified resin components derived from bisphenol-A and/or xylenols, which present heath concerns in food coating applications.

Abstract: A curing accelerator for a curing resin of the invention is represented by the following general formula (I). R1 to R3 in the formula (I) represent a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 18 carbon atoms, and each may be the same or different. Two or more of R1 to R3 may be bonded to have a ring structure. R4 to R7 represent a hydrogen atom or a substituted or unsubstituted monovalent organic group having 1 to 18 carbon atoms, and each may be the same or different. Y? represents a group in which one proton is discharged from a monovalent group having 0 to 18 carbon atoms and having at least one proton capable of being discharged. Two or more of R4 to R7 and Y? may be bonded to have a ring structure. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

Abstract: The present invention provides a power and/or telecommunications cable including at least one layer of a material obtained from a composition comprising: a thermoplastic polymer matrix; and a phenolic resin; wherein said phenolic resin is selected from novolac phenol-formaldehyde resins and novolac cyanate ester resins, and wherein said material includes nodules of hardened phenolic resin dispersed throughout the material.

Abstract: A composition for the treatment of metal surfaces and for the deposition of metals or metal alloys on plastics surfaces contains a) at least one polymer as component A, composed of the structural element (1) and at least three structural elements selected from the group consisting of b) water or another solvent which is suitable for dissolving, dispersing, suspending or emulsifying the polymer, as component B; c) if required, surface-active compounds, dispersants, suspending media and/or emulsifiers as component C. In a process for the treatment of a metal surface and a process for the deposition of metals or metal alloys on a plastics surface, the metal or plastics surface is brought into contact with a polymer (component A). Furthermore, polymers (component A) are used for the treatment of metal surfaces and for the deposition of metals or metal alloys on a plastics surface, and polymers composed of special components A?a, A?b and A?c.

Abstract: A composition is disclosed, which comprises a hydroxyaromatic-aldehyde resole resin comprising an aldehyde and a hydroxyaromatic compound, modified with a urea-aldehyde condensate. The composition has improved premix stability, improved cure efficiency, comparable tensile strength, and lower volatiles than the hydroxyaromatic-aldehyde resole resin unmodified with a urea-aldehyde condensate. Also disclosed are articles prepared therefrom.

Abstract: The invention herein disclosed comprises the use of oxazolidines, nitroalcohols, nitroamines, aminonitroalcohols, imines, hexahydropyimidines, nitrones, hydroxylamines, nitro-olefins and nitroacetals to serve as hardeners and/or as catalysts for curing phenolic resins. The hardeners and catalysts described in the invention can be applied in any application where phenolic resins are used, including but not limited to adhesives, molding, coatings, pultrusion, prepregs, electronics, composites, fire resistant, and flame-retardant end uses.

Abstract: The invention herein disclosed comprises the use of oxazolidines, nitroalcohols, nitrones, halonitroparaffins, oxazines, azaadamantanes, hexamethylenetetramine salts, nitroamines, imidazolidines, triazines, nitrooxazolidines, and imidazolidine-oxazolidine hybrids to serve as hardeners for curing phenolic resins. The hardeners and accelerators/catalysts described in the invention can be applied in any application where phenolic resins are used, including but not limited to fiber reinforced composite applications such as pultrusion, filament winding, bulk molding compound (BMC), sheet molding compounds (SMC), vacuum assisted resin transfer, prepregs, adhesives, foundry materials, abrasives, friction materials, insulation, laminates, coatings, electronics, fire resistant, and flame-retardant end uses.