Abstract: The present invention relates a mobile electronic device comprising at least one part made of a polymer composition comprising for more than 80% by weight (% wt.) relative to the total weight of the composition (C) of an aromatic polysulfone polymer comprising a residual chlorine content in an amount of less than 25 ?eq/g polymer.

Abstract: The invention provides a polyphenylene sulfide resin composition which comprises polyphenylene sulfide resin and a deformed cross-section glass fiber, wherein the chlorine content of the polyphenylene sulfide resin composition is equal to or lower than 1,000 ppm. The obtained polyphenylene sulfide resin composition is excellent in flowability, toughness and rigidity. The invention further provides a molding prepared from the polyphenylene sulfide resin composition and a manufacturing process for the polyphenylene sulfide resin composition. The polyphenylene sulfide resin composition is particularly suitable for products for forming frames of a portable computer, a mobile phone and a portable electronic device.

Abstract: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R? is R? is R?? is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.

Abstract: The present invention relates to a composition based on poly(ether ether ketone) (PEEK) comprising poly(ether ketone ketone) (PEKK), characterized in that the poly(ether ketone ketone) (PEKK) comprises a mixture of terephthalic and isophthalic units, the percentage by weight of terephthalic units, with respect to the sum of the terephthalic and isophthalic units, being between 55 and 85%, limits included, and preferably between 55 and 70%, the said composition comprising between 1 and 40%, limits included, preferably between 5 and 40% and more preferably still between 10 and 30% by weight of PEKK, with respect to the total weight of the composition.

Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains alumina (Al2O3) and boron nitride (BN).

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).

Abstract: A poly(siloxane) copolymer composition comprising: a first polymer comprising a first repeating unit, and a poly(siloxane) block unit, a second polymer different from the first polymer and comprising of bromine; and optionally, one or more third polymers different from the first polymer and second polymer; wherein siloxane units are present in the composition in an amount of at least 0.3 wt %, and bromine is present in the composition in an amount of at least 7.8 wt %, each based on the sum of the wt % of the first, second, and optional one or more third polymers; and further wherein an article molded from the composition has an OSU integrated 2 minute heat release test value of less than 65 kW-min/m2 and a peak heat release rate of less than 65 kW/m2, and an E662 smoke test Dmax value of less than 200.

Abstract: The present disclosure relates to a polymer composition comprising a polymer blend of Polyaryl Ether Ketone (PAEK) and Poly(2,5-benzimidazole) characterized with enhanced mechanical and wear resistance properties as compared to commercial polymer blends of Polyaryl Ether Ketone and Polybenzimidazole. The present disclosure also relates to shaped articles derived from the polymer composition of the present disclosure.

Abstract: A low copper-containing friction material composition used for brake pad is provided, which consists of 4-6 parts of aramid fiber, 2-2.5 parts of tire powder, 5-6 parts of magnesia, 5-6 parts of red vermiculite, 8-10 parts of ceramic fiber, 3.5-5 parts of magnetite, 7-8 parts of boron-containing phenolic resin, 15-17 parts of calcium sulfate crystal whisker, 16-18 parts of potassium titanate, 15-17 parts of barite, 5.5-7 parts of flake graphite, 6-8 parts of friction powder of cashew nut oil, 6-8 parts of calcined petroleum coke, 1.5-2 parts of boron nitride, 5-7 parts of flake aluminum powder, 0.4-0.5 parts of pure copper fiber, and 0.4-0.6 parts of black silicon carbide. The friction material composition has low content of heavy metal, wherein the content of copper is lower than 0.5%, has a satisfactory high temperature and thermal decay resistant performance, long service life, good abrasion resistance and stable friction coefficient.

Abstract: A copper-flee friction material composition for brake pads consists of: 0.43 parts of aramid fiber, 1.9 parts of tire powder, 6 parts of heavy magnesia, 2.55 parts of calcined petroleum coke, 8 parts of ceramic fiber, 6.5 parts of phenolic resin, 14 parts of aluminum silicate fiber, 22 parts of potassium hexatitanate crystal whisker, 25 parts of barite powder, 5 parts of granular graphite, 2 parts of antimony sulfide, 2.8 parts of friction powder of cashew nut oil, 0.9 part of boron nitride, 5 parts of flake aluminum powder, and 0.6 parts of tantalum carbide. Trials show that it has satisfactory high temperature and thermal decay resistant performance, long service life, good abrasion resistance and stable friction coefficient. With the friction material of the present invention used, the brake pad of vehicles is sensitive and stable during braking, produces no screech, is comfortable and has no damage on coupling plate.

Abstract: The invention provides a composition for forming a silicon-containing resist underlayer film comprising: (A) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (1) and one or more hydrolysable compound shown by the following general formula (2), and (B) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (3) and one or more hydrolysable silicon compound shown by the following general formula (4).

Abstract: This invention is directed to a polymer thick film white reflective flexible dielectric composition comprising urethane resin, thermoplastic phenoxy resin, and white reflective powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to reflect light in 3D circuits containing LED's.

Abstract: Polycarbonate blends with a combination of high thin wall flame retardance, low temperature ductility, and good tracking resistance are disclosed. The blends are a combination of a polycarbonate polymer, a polycarbonate-polysiloxane copolymer, non-brominated and non-chlorinated flame retardant, titanium dioxide, and carbon black.

Abstract: The present invention relates to mobile electronic devices comprising at least one structural part made of a polymer composition (C) comprising at least one polyaryletherketone (PAEK), at least one aromatic sulfone polymer (SP) such as poly phenylsulfone (PPSU), polyethersulfone (PESU), polysulfone (PSU) or mixture thereof, and at least one reinforcing filler.

Abstract: Fibers sized with a coating of amorphous polyetherketoneketone are useful in the preparation of reinforced polymers having improved properties, wherein the amorphous polyetherketoneketone can improve the compatibility of the fibers with the polymeric matrix.

Abstract: The present invention relates to an adhesive composition comprising a component A and a component B, wherein said component A comprises bisphenol A resin; a hydrophilic solvent, preferably acetone or ethanol or mixtures thereof; and silica gel (SiO2) or alumina (Al2O3) and said component B comprises aliphatic or aromatic polyamines, preferably polyamidoamines; polythiol; a combination of primary and tertiary amines, preferably 1-(2-aminoethyl)piperazine and ethylenediamine; optionally a hydrophilic solvent and optionally silica (SiO2) or alumina (Al2O3) gel. Said composition has the advantage that it cures, in addition to under dry conditions, in the presence of water or humidity in a time of 30 minutes as much and is flexible. The present invention also relates to a process for obtaining said adhesive composition.

Abstract: The invention includes a cross-linking composition comprising a cross-linking compound and a cross-linking reaction additive selected from an organic acid and/or an acetate compound, wherein the cross-linking compound has the structure according to formula (IV): wherein the cross-linking reaction additive is capable of reacting with the cross-linking compound to form a reactive oligomer intermediate, which is capable of cross-linking an organic polymer. Also included is an organic polymer composition for use in forming a cross-linked organic polymer, comprising a cross-linking compound of Formula (IV), a cross-linking reaction additive and at least one organic polymer. In one embodiment, the at least one organic polymer has at least one halogen-containing reactive group and is dehalogenated by reacting with an alkali metal compound.

Abstract: Fibers sized with a coating of amorphous polyetherketoneketone are useful in the preparation of reinforced polymers having improved properties, wherein the amorphous polyetherketoneketone can improve the compatibility of the fibers with the polymeric matrix.

Abstract: An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C.

Abstract: A phosphorous copolymer, a method for preparing the same, and a flame retardant thermoplastic resin composition including the same is disclosed. The phosphorous copolymer includes a repeat unit represented by Formula 1: wherein each A is independently a single bond, C1 to C5 alkylene, C1 to C5 alkylidene, C5 to C6 cycloalkylidene, —S—, or —SO2—; R1 and R2 are each independently substituted or unsubstituted C1 to C6 alkyl or substituted or unsubstituted C6 to C20 aryl; R3 and R4 are each independently substituted or unsubstituted C1 to C6 alkyl, substituted or unsubstituted C3 to C6 cycloalkyl, substituted or unsubstituted C6 to C12 aryl, or halogen; a and b are each independently an integer from 0 to 4; and m and n are each independently an integer from 1 to 500.

Abstract: An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 ?m or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass.

Abstract: Provided is a molding material comprising a composite of 1 to 50 wt % of a continuous reinforcing fiber bundle (A) and 0.1 to 20 wt % of a poly(phenylene ether ether ketone) oligomer (B); and 30 to 98.9 wt % of a thermoplastic resin (C) adhering to the composite, wherein the component (B) has a melting point of not higher than 270° C. Also provided are a method for molding the molding material, a method for producing the molding material, and a method for producing a fiber-reinforced composite material. A molded article having high heat resistance and dynamic properties can be easily produced without impairing the economic efficiency and productivity during the process for producing a molding material. In addition, a fiber-reinforced composite material can be produced with more ease and high productivity.

Abstract: Ink composition for continuous deflected jet printing, that is liquid at ambient temperature, comprising a solvent containing less than 0.5% by weight of water and less than 0.5% by weight of alcohols relative to the total weight of the ink composition; one or more dye(s) and/or pigment(s) that is (are) insoluble in water, and in mixtures of water and of at least one alcohol; and a binder, comprising at least 50% by weight, relative to the total weight of the binder, of at least one binder resin capable of being obtained by reaction between at least one alkoxysilane and at least one hydroxyaromatic resin.

Abstract: The disclosure provides a melt processible theromoplastic composition, comprising a major proportion of a base polymer comprising a first melt processible thermoplastic polymer having a first Fedor's solubility parameter and a first viscosity; and a combination of a carrier polymer and a surface modifying additive, the carrier polymer comprising a second melt processible thermoplastic polymer which has a second Fedor's solubility parameter that is at least about 2.5 (J/cm3)1/2 lower than the first Fedor's solubility parameter, and a second viscosity, the carrier polymer being adhered to the surface modifying additive, and wherein the first viscosity is at least about 10 times the second viscosity.

Abstract: The present invention relates to thermoplastic molding compositions composed of the following components: (A) at least one polyarylene ether (A1) having an average of at most 0.1 phenolic end groups per polymer chain, and at least one polyarylene ether (A2) having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one fibrous or particulate filler, and (C) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.

Abstract: The present invention relates to novel polycarbonate-polyorganosiloxane and/or polyurethane-polyorganosiloxane compounds, methods for their production, their use, functional formulations containing them, precursors for their production, as well as reactive compositions containing the aforementioned precursors.

Abstract: A phenolic resin molding compound includes (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.

Abstract: An intermediate transfer member that includes a sulfonated poly(ether ether ketone) polymer, an optional conductive component, an optional polymer, and an optional release additive.

Abstract: A curable polymer composition containing: (A) a thermoset benzoxazine resin precursor component; (B) optionally, an arylsulphone-containing benzoxazine component, and (C) a polyarylsulphone thermoplastic toughening agent, wherein in the absence of component (B), component (C) contains one or more benzoxazine pendant-and/or end-groups.

Abstract: A radical-polymerizable acrylic insulating adhesive for NCF-bonding an electronic part to a circuit board includes a (meth)acrylate monomer, a film-forming resin, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. The amount of the inorganic filler is 70 to 160 parts by mass with respect to a total of 100 parts by mass of the (meth)acrylate monomer and the film-forming resin. A radical polymerization cured product of the acrylic insulating adhesive exhibits a glass transition temperature of 150 to 185° C., a linear expansion coefficient (?1) of 30 to 35 ppm in a temperature range that is lower than the glass transition temperature, and a linear expansion coefficient (?2) of 105 to 125 ppm in a temperature range that is equal to or higher than the glass transition temperature. Further, ?2/?1 is greater than or equal to 3.4.

Abstract: The invention relates to heat treatment of polymorphic semicrystalline or crystallizable polymers to increase the content of the highest melting crystalline form. Such heat treatment results in a polymer powder that has a consistent, uniform melting range, improved flow and improved durability of the powder particle size for applications that require powder flow at elevated temperatures. In addition to improved powder properties, the articles produced from the powders also exhibit better physical properties in both appearance and in mechanical properties. Thus the invention also includes polymer powders and articles produced by the described processes.

Abstract: A resin composition for encapsulation according to the present invention includes: a phenol resin-based curing agent (A) essentially containing a polymer component (A-1) in which a biphenylene group-containing structural unit bonds a monovalent hydroxyphenylene structural unit and a polyvalent hydroxyphenylene structural unit together and a polymer component (A-2) in which the biphenylene group-containing structural unit bonds the polyvalent hydroxyphenylene structural units together; an epoxy resin (B); and an inorganic filler (C). This makes it possible to economically obtain a resin composition for encapsulation having soldering resistance, flame resistance, continuous moldability, flowability and high temperature storage stability in an excellent balanced manner, and an electronic component device produced by encapsulating an element with a cured product thereof and having high reliability.

Abstract: Disclosed is an aqueous polyurethane resin dispersion which comprises a polyurethane resin which is obtained by reacting (A) a polyurethane prepolymer obtained by reacting (a) a polycarbonate polyol having an alicyclic structure in the main chain, (b) an acidic group-containing polyol compound and (d) a polyisocyanate, and (B) a chain-elongating agent, being dispersed in an aqueous medium, a carboxylic acid group content of the above-mentioned (A) polyurethane prepolymer based on a solid component of (A) the polyurethane prepolymer is 2.0 to 13.0% by weight, and a number of a hydroxyl equivalent of a mixture of the above-mentioned (a) polycarbonate polyol having an alicyclic structure in the main chain, the above-mentioned (b) acidic group-containing polyol compound, and, if necessary, (c) a polyol other than (a) and (b) is 70 to 270.

Abstract: A polyaryletherketone polymeric material, for example polyetheretherketone and composite materials comprising said polymeric material are described. The polymeric material has a melt viscosity (MV) in the range 0.05 to 0.12 kNsm?2, preferably in the range 0.085 to 0.095 kNsm?2.

Abstract: The invention relates to a method of making a coating composition for coating glass. The method includes the steps of combining an epoxy resin component, a methacrylate component, a silane coupling agent, an epoxy curing agent, and an initiator agent.

Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, and a silicone compound. The coating is substantially free of fluorocarbon resin. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.

Abstract: Polymer compositions comprising poly(aryl ether ketone)s and graphene materials. In particular, a polymer composition comprising: A) a poly(arylether ketone) and B) 0.1 to 70 wt. %, based on the combined weight of A) and B), of at least one non-tubular graphene material. Use of such polymer compositions for the manufacture of molded or extruded articles. Molded or extruded articles made from such polymer compositions.

Abstract: Provided are a process for producing a compatibilized resin including reacting a cyanate compound, a siloxane resin having a hydroxyl group at an end thereof, and an epoxy resin at a specified rate of reaction; a thermosetting resin composition containing (A1) a compatibilized resin produced by the foregoing process or (A2) a thermosetting resin obtained by reacting a cyanate compound and a siloxane resin having a hydroxyl group at an end thereof at a specified rate of reaction, and (B) fused silica having been subjected to a surface treatment with a trimethoxysilane compound; and a prepreg, a laminate, and a wiring board each using the same.

Abstract: A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 v, wherein a content weight ratio of the components (II) and (III) is 1 to 41.

Abstract: The invention concerns a non-stick coating for a substrate consisting of a metallic material, glass, ceramic, stone or enamel, which is characterised by at least one layer applied directly to the substrate and consisting of at least 33 wt. % polyetherketone and/or polyetheretherketone (PEEK), at least 33 wt. % of one or more fluoropolymers and no more than 16 wt. % additives.

Abstract: An allergen reducing agent is provided that contains a terpenoid polymer or copolymer as an active component, and that functions to reduce allergens such as mites and pollen, and is capable of suppressing coloring.

Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

Abstract: A mixture of a functionalized polyfluoropolyether and a benzoxaine resin in a weight ratio of from about 1/99 to about 99/1.

Abstract: A resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 25 parts by weight of nitrogen and oxygen containing heterocyclic compound; (C) 5 to 75 parts by weight of polyphenylene oxide resin; and (D) 5 to 100 parts by weight of oligomer of phenylmethane maleimide. By using specific components at specific proportions, the resin composition of the invention offers the features of low dielectric constant and low dissipation factor and can be made into prepreg that may be used in printed circuit board.

Abstract: To obtain injection molded objects having biodegradability and excellent flame retardance and mechanical strength, the injection molded object includes a lactic acid based resin; and a metal hydroxide in a ratio of 5 to 40 mass parts per 100 mass parts of the lactic acid based resin. The metal hydroxide is surface-treated, and Na2O (w-Na2O) present on a surface of grains of the metal hydroxide is 0.1 mass % or less based on the total mass of the metal hydroxide. Preferably, the injection molded object contains an aliphatic polyester other than the lactic acid based resin or an aromatic-aliphatic polyester in a ratio of 20 to 80 mass parts per 100 mass parts of the lactic acid based resin.

Abstract: The invention provides a composition for forming a silicon-containing resist underlayer film comprising: (A) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (1) and one or more hydrolysable compound shown by the following general formula (2), and (B) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (3) and one or more hydrolysable silicon compound shown by the following general formula (4). There can be provided a composition for forming a resist underlayer film applicable not only to a resist pattern obtained in a negative development but also to a resist pattern obtained in a conventional positive development, and a patterning process using this composition.

Abstract: A poly(arylene ether)-poly(hydroxy ether) block copolymer includes at least one poly(hydroxy ether) block and at least one poly(arylene ether) block, and the mole ratio of poly(hydroxy ether) blocks to poly(arylene ether) blocks is 0.95:1 to about 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be prepared by reacting a telechelic poly(arylene ether) having terminal hydroxyl groups with a telechelic poly(hydroxy ether) epoxy resin having terminal epoxy groups, wherein the mole ratio of the telechelic poly(hydroxy ether) to the telechelic poly(arylene ether) is 0.95:1 to 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be shaped into an article by extrusion, thermoforming, or molding, and is a compatibilizing agent for non-polar and polar polymers.

Abstract: A railway vehicle component, wherein the component is a partition or a light cover, and wherein the component is molded or formed from a thermoplastic polymer composition comprising: a siloxane-containing copolymer in an amount effective to provide a total of 0.2 to 6.5 wt % of siloxane units based on the total weight of the polymers in the thermoplastic polymer composition, a bromine-containing polymer in an amount effective to provide 9 to 13 wt % of bromine, based on the total weight of the polymers in the thermoplastic polymer composition, and optionally a third polymer, wherein the wt % of the siloxane-containing copolymer, the bromine-containing polymer, and the optional third polymer, sum to 100 wt %, and 0.05 to 10 wt % of a light diffuser additive, based on the total weight of polymers in the thermoplastic polymer composition.

Abstract: An aircraft component wherein the component is a partition or a light cover, and wherein the aircraft component is molded or formed from a thermoplastic polymer composition including: a siloxane-containing copolymer in an amount effective to provide a total of 0.2 to 6.5 wt % of siloxane units based on the total weight of the polymers in the thermoplastic polymer composition, a bromine-containing polymer in an amount effective to provide 9 to 13 wt % of bromine, based on the total weight of the polymers in the thermoplastic polymer composition, and optionally a third polymer, wherein the wt % of the siloxane-containing copolymer, the bromine-containing polymer, and the optional third polymer, sum to 100 wt %, and 0.05 to 10 wt % of a light diffuser additive, based on the total weight of polymers in the thermoplastic polymer composition.