Abstract: The present invention relates to a method for increasing the reactivity of lignin, wherein the method comprises the following steps: a) forming, under heating at a temperature of 30-70° C., an aqueous dispersion comprising alkali and lignin, wherein the alkali comprises a hydroxide of an alkali metal; and b) heating the dispersion formed in step a) at a temperature of 50-95° C. for producing alkalated lignin.

Abstract: The invention relates to a method for treating lignin, wherein the method comprises the following steps: a) dissolving lignin into an aqueous composition, which contains a compound selected from the class of phenols, while keeping the temperature of the composition at 0-60° C.; and b) allowing the composition to react while keeping the temperature of the composition at 60-100° C. and the pH of the composition at a pH value of 6-14. The invention relates further to a method for producing a binder composition and to dissolve lignin into an aqueous composition different applications thereof.

Abstract: A sizing composition for insulating products based on mineral wool, in particular glass or rock wool, which includes at least one ammonium lignosulfonate or alkali metal or alkaline earth metal salt of lignosulfonic acid, and at least one carbonyl compound of formula: R—[C(O)R1]x??(I) in which: R represents a saturated or unsaturated and linear, branched or cyclic hydrocarbon radical, a radical including one or more aromatic nuclei which consist of 5 or 6 carbon atoms, a radical including one or more aromatic heterocycles containing 4 or 5 carbon atoms and an oxygen, nitrogen or sulfur atom, it being possible for the R radical to contain other functional groups, in particular hydroxyl or alkoxy groups, especially methoxy groups, R1 represents a hydrogen atom or a C1-C10 alkyl radical, and x varies from 1 to 10.

Abstract: The present invention relates to a method for increasing the reactivity of lignin, wherein the method comprises the following steps: a) forming, under heating at a temperature of 30-70° C., an aqueous dispersion comprising alkali and lignin, wherein the alkali comprises a hydroxide of an alkali metal; and b) heating the dispersion formed in step a) at a temperature of 50-95° C. for producing alkalated lignin.

Abstract: The present invention relates to a method for increasing the reactivity of lignin, wherein the method comprises the following steps: a) forming, under heating at a temperature of 30-70° C., an aqueous dispersion comprising alkali and lignin, wherein the alkali comprises a hydroxide of an alkali metal; and b) heating the dispersion formed in step a) at a temperature of 50-95° C. for producing alkalated lignin.

Abstract: An adhesive composition includes a first part comprising about 15 to about 60 wt % of an epoxy compound, about 35 to about 80 wt % of an epoxy novolac, and about 5 to about 25 wt % of an epoxy-based reactive diluent based on the total weight of epoxy compound, epoxy novolac, and reactive diluent; and a second part comprising less than about 20 wt % of a hydroxyaromatic solvent, about 80 to about 99 wt % of a Mannich base, and about 1 to about 20 wt % of a tertiary amine, based on the total weight of hydroxyaromatic solvent, Mannich base, and tertiary amine, the first and second parts being present in a volume ratio of about 0.8:1 to about 1.2:1. Additives to further enhance the properties may be included. A method of forming an adhesive layer includes applying the adhesive composition to a surface.

Abstract: The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive layer formed from the temporary adhesive for production of semiconductor device, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive for production of semiconductor device as claimed; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

Abstract: Solvent-based inkjet ink formulations including a solvent, a surfactant, and a colorant are provided. The inks have many desirable attributes such as extended decap time.

Abstract: Disclosed and claimed herein is a composition for forming a spin-on hard-mask, having a fullerene derivative and a crosslinking agent. Further disclosed is a process for forming a hard-mask.

Abstract: In lithography, a composition comprising a novolak resin comprising recurring units of fluorescein is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO2 substrates.

Abstract: In lithography, a composition comprising a novolak resin comprising recurring units of hydroxycoumarin is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO2 substrates.

Abstract: In lithography, a composition comprising a novolak resin comprising recurring units derived from a naphtholphthalein is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO2 substrates.

Abstract: In lithography, a composition comprising a novolak resin comprising recurring units derived from a phenolphthalein, Phenol Red, Cresolphthalein, Cresol Red, or Thymolphthalein is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO2 substrates.

Abstract: A method of forming a film including forming a film on a substrate by coating a composition for forming a film containing a solvent and a resin by a spin coating method, in which a maximum radius among the radii from the center to the outer periphery of the substrate is 150 mm or more and a thickness of the film is 50 ?m or more, a vapor pressure of the solvent at 25° C. is 0.4 kPa or less, and a viscosity of the solvent measured by a Cannon-Fenske viscometer at 25° C. is 1.5 mPa·s or less.

Abstract: A method for producing solidified fiber bundles includes applying a melt or solution to a carrier web forming a viscous coating, applying parallel filaments under tension to the carrier web, and pressing the filaments into the viscous coating, forming an impregnate. The coating is partially solidified until a plastically deformable state of the impregnate is obtained by vaporizing the solvent, thermal curing and/or cooling. The impregnate is rolled onto a winding core to form a roll while maintaining a winding tension of the filaments in the impregnate. The outer roll is fixed on the winding core by a sleeve and/or by adhesive tape. The impregnate is solidified by vaporizing the solvent, thermal curing and/or cooling. The solidified impregnate is divided up to form solidified fiber bundles. A pressure produced by the winding tension of the filaments in the impregnate is exerted on the roll.

Abstract: To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.

Abstract: Solvent-based inkjet ink formulations including an organic solvent, a resin, a surfactant, and a colorant are provided. The inks have many desirable attributes such as extended decap time.

Abstract: A carrier belt for fabricating a device or component such as an anisotropic conductive film. The carrier belt includes a substrate having a sacrificial image enhancing layer. Microcavities are formed in the carrier by laser ablation through the image enhancing layer. After the image enhancement layer is removed, a plurality of conductive particles are distributed into an array of microcavities formed by laser ablation on a surface of a carrier belt and transferred to an adhesive layer. The image enhancing layer enables one to form microcavities with a fine pitch and spacing and partitions having a high aspect ratio.

Abstract: A phenolic self-crosslinking polymer whose self-crosslinking reaction at a heating step is performed without additives for hardening the polymer, and a composition of resist-underlayer-film containing the same, are disclosed.

Abstract: There is provided a novel phenolic resin which can be used as a coating agent or a resist resin for a semiconductor, which has a high carbon concentration and a low oxygen concentration in the resin, which has a relatively high heat resistance and also a relatively high solvent solubility, and which can be applied to a wet process. There are also provided a material useful for forming a novel photoresist underlayer film which has a relatively high solvent solubility, which can be applied to a wet process, and which is excellent in etching resistance as an underlayer film for a multilayer resist, an underlayer film formed using the same, and a pattern forming method using the same. A resin of the present invention is obtained by reacting a compound having a specified structure and an aldehyde having a specified structure in the presence of an acidic catalyst. In addition, a material for forming an underlayer film for lithography of the present invention includes at least the resin and an organic solvent.

Abstract: The present invention relates to a heat crucible glue or coating for use in connection with refractory materials and ceramics. The glue or coating comprises 25 to 50 weight % silicon powder, 5 to 20 weight % SiC powder, 20 to 60 weight % formaldehyde resin or polyfurfuryl alcohol and 10 to 30 weight % of an organic solvent.

Abstract: This invention relates to a resin preparable by reaction of a phenol/formaldehyde novolak with tetraethyl orthosilicate in a mass ratio above 28:1, wherein the phenol of the phenol/formaldehyde novolak is substituted or unsubstituted hydroxybenzene or a mixture of two or more such phenols, and to a particulate material coated with said resin. Said particles can be used e.g. in the shell molding process for the production of shell molds and shell cores; and as proppants for use in the hydraulic fracturing process.

Abstract: Composite products made with binder compositions that include one or more tannins, one or more multifunctional aldehydes, and one or more Lewis acids and methods for making same. The method can include contacting a plurality of substrates with the binder composition and at least partially curing the binder composition to produce a composite product. The one or more multifunctional aldehyde compounds can include (1) two or more carbon atoms and two or more aldehyde functional groups, or (2) two or more carbon atoms, at least one aldehyde functional group, and at least one functional group other than an aldehyde functional group. A carbon atom of at least one aldehyde functional group can have a first bond with a first tannin molecule and a second bond with (a) the first tannin molecule, (b) a second tannin molecule, or (c) an oxygen atom of the at least one aldehyde functional group.

Abstract: The present invention encompasses polymer compositions comprising aliphatic polycarbonate chains containing functional groups that increase the polymer's ability to wet or adhere to inorganic materials. In certain embodiments, chain ends of the aliphatic polycarbonates are modified to introduce silicon-containing functional groups, boron-containing functional groups, phosphorous-containing functional groups, sulfonic acid groups or carboxylic acid groups.

Abstract: This invention relates to novel and useful toluene and styrene derived telomer distributions, such distributions being desirable substrates for the preparation of brominated flame retardants.

Abstract: A composition for producing an artificial graphite element and a method for producing the same are provided. The composition includes a carbon-containing raw material such as fly ash, an adhesive, and a dispersant. The method for producing the artificial graphite element of the present invention includes the steps of mixing the above composition; baking the mixed composition to obtain powder having a plurality of particles; screening the powder to select particles having suitable particle diameters; molding the plurality of screened particles into an article; heating the article at 500 to 1000° C.; and graphitizing the heated article to obtain the artificial graphite element. The method of the present invention is simple and cost-effective. The artificial graphite element produced has a considerably large specific surface area due to its porous property, such that it is suitable for use as a heat-dissipating substrate.

Abstract: Provided are a composition for printing for use in a printing method which uses a silicon-based blanket, including: 1) a binder resin, 2) a low-boiling point solvent having a boiling point of 100° C. or less, and 3) a high-boiling point solvent having a boiling point of 180° C. or more, wherein the high-boiling solvent has a difference in solubility parameter with the binder resin of 3 (cal·cm)1/2 or less, a difference in solubility parameter with the silicon-based blanket of 4 (cal·cm)1/2 or more, and a swelling parameter for the silicon-based blanket of 2 or less, and a printing method using the same.

Abstract: The invention relates to a method for manufacturing a mineral fibre-containing composite and the novel mineral fibre-containing element produced by that method.

Abstract: The present invention relates to a production process for a phenols novolac resin obtained by reacting phenols with formaldehydes, wherein they are reacted in the presence of a metal compound used as a catalyst for the reaction described above, and a chelating agent is further added in order to deactivate a catalytic action of the metal compound and a resin-coated sand prepared by using the above phenols novolac resin. It is possible to provide a process for producing a phenols novolac resin having an ortho rate of 30 to 60%, suitably 40 to 55% at a good yield (70% or more) and a resin-coated sand having a high curing property prepared by using the above phenols novolac resin.

Abstract: A pattern-forming method includes: (1) a resist underlayer film-forming step of providing a resist underlayer film on an upper face side of a substrate by coating a resist underlayer film-forming composition containing a resin having a phenolic hydroxyl group; (2) a resist pattern-forming step of forming a resist pattern on an upper face side of the resist underlayer film; (3) a pattern-forming step of dry etching at least the resist underlayer film and the substrate, with the aid of the resist pattern as a mask to form a pattern on the substrate; and (4) a resist underlayer film-removing step of removing the resist underlayer film on the substrate with a basic solution, in the order of (1) to (4).

Abstract: There is provided an ink composition for forming a light shielding film in an organic semiconductor device which is capable of stably forming a fine pattern when forming a finely patterned light shielding film by the letterpress reverse printing method or microcontact printing method, which can be baked at a temperature equal to or less than the substrate heatproof temperature, and which is also capable of providing light shielding property and mechanical strength, the ink composition for forming a light shielding film in an organic semiconductor device which is an ink composition for forming a light shielding film in an organic semiconductor device comprising a black pigment; a resin component; a surface energy modifier; a quick-drying organic solvent; a slow-drying organic solvent; and a mold releasing agent, wherein the resin component comprises a solid resin that is in a solid state at 200° C. or less and a liquid resin that is in a liquid state at 10 to 50° C. at a ratio (solid resin/liquid resin) of 0.

Abstract: A method for forming a fine pattern, including forming a resist film by applying, on a substrate, a resist composition containing a base material having a solubility, in a developer liquid including an organic solvent, that decreases according to an action of an acid, a compound which generates an acid upon irradiation, and an organic solvent; exposing the resist film; forming a resist pattern using the developer liquid; applying, on the resist pattern, a coating agent for pattern fining including a resin and an organic solvent; and heating the resist pattern on which a coating film is formed.

Abstract: A polymer-bonded polycyclic aromatic hydrocarbon compound of general formula (1): (P—O)x-Q-(Y)w??(1) wherein P represents a polymeric moiety having at least three repeating units which comprise an optionally substituted phenyl ring; Q represents a perylene, quaterrylene or terrylene moiety; Y is selected from (i) halogen and (ii) optionally substituted N-heterocycloaliphatic groups having from 3 to about 8 ring members which are bonded to Q through an N atom, provided that at least one Y represents (ii); x represents an integer of from 1 to 4; w represents an integer of from 1 to 4. Also, are provided processes of producing the compounds, polymers, markings and articles, and methods of authenticating.

Abstract: Particulate binder compositions and methods for making and using same are provided. The binder composition for producing composite lignocellulose products can include an aldehyde based resin and a filler, an extender, or a combination thereof. The binder composition can be in the form of particulates. The particulates can each comprises the filler, the extender, or the combination thereof and the aldehyde based resin.

Abstract: Provided is a phenolic resin molding compound including (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.

Abstract: A resist underlayer film-forming composition includes a polymer including a structural unit shown by a formula (1), and having a polystyrene-reduced weight average molecular weight of from 3000 to 10000, and a solvent. Each of R3 to R8 independently represents a group shown by a formula (2), a hydrogen atom, a hydroxyl group, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, an alkoxycarbonyl group having 2 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms, or a glycidyl ether group having 3 to 6 carbon atoms, wherein at least one of R3 to R8 represents the group shown by the formula (2).

Abstract: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), and one or more kinds of compounds, represented by the following general formulae (2-1) and/or (2-2), and/or equivalent bodies thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.

Abstract: A hard mask composition, a method of forming a pattern, and a semiconductor integrated circuit device, the hard mask composition including a solvent; and an aromatic ring-containing compound, the aromatic ring-containing compound including at least one of a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2:

Abstract: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formula (1-1) and/or general formula (1-2), and one or more kinds of compounds and/or equivalent bodies thereof represented by the following general formula (2). There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.

Abstract: The invention herein disclosed comprises the use of oxazolidines, nitroalcohols, nitrones, halonitroparaffins, oxazines, azaadamantanes, hexamethylenetetramine salts, nitroamines, imidazolidines, triazines, nitrooxazolidines, and imidazolidine-oxazolidine hybrids to serve as hardeners for curing phenolic resins. The hardeners and accelerators/catalysts described in the invention can be applied in any application were phenolic resins are used, including but not limited to fiber reinforced composite applications such as pultrusion, filament winding, bulk molding compound (BMC), sheet molding compounds (SMC), vacuum assisted resin transfer, prepregs, adhesives, foundry materials, abrasives, friction materials, insulation, laminates, coatings, electronics, fire resistant, and flame-retardant end uses.

Abstract: An abrasive product includes a plurality of abrasive particles and a resin cured with a polythiol group. A method of preparing the abrasive product includes contacting the plurality of abrasive particles with a curable composition that includes a resin and a polythiol group, and curing the curable composition to produce the abrasive product. A method of abrading a work surface includes applying an abrasive product to a work surface in an abrading motion to remove a portion of the work surface. A curable composition includes a formaldehyde resin and a polythiol group. A formaldehyde resin is crosslinked by a polythiol group. A method of crosslinking the formaldehyde resin includes reacting the polythiol group with the formaldehyde resin.

Abstract: An object of the present invention is to improve the fluidity of a thermosetting powder adhesive and clear the blocking with a powder adhesive in a constant amount supplying apparatus or a delivery pathway. The present invention has attained the object by a powder adhesive containing a thermosetting adhesive particle and an inorganic filler present on the surface of the thermosetting adhesive particle.

Abstract: Adhesive, comprising silanized, structurally modified, pyrogenically prepared silicas containing on their surface fixed vinyl groups or vinylsilyl groups, with hydrophobic groups, such as trimethylsilyl and/or dimethylsilyl and/or monomethylsilyl, additionally being fixed on the surface.

Abstract: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formula (1-1) and/or (1-2), and one or more kinds of compounds and/or equivalent bodies thereof represented by the following general formula (2). There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, namely, an underlayer film having optimum n-value and k-value, excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.

Abstract: This invention relates to alkaline resol phenol-aldehyde binder compositions and their use in the production of articles of bonded particulate material such as foundry moulds, foundry cores, or feeders.

Abstract: A composite radius filler for use in an aircraft structure. The aircraft structure includes structural composite parts assembled together to form the aircraft structure. The composite radius filler is arranged between rounded sections of the structural composite parts for filling a gap formed between the structural composite parts. The composite radius filler is made structural by a nanostructure arranged within the composite radius filler for the reinforcement of the interface between the radius filler and the structural composite part. A method for producing an aircraft structure including a nano-reinforced radius filler.

Abstract: An adhesive composition for use in the manufacture of wood-based boards, wherein the adhesive composition is foamable and comprises a resin, a filler and a foaming agent without any cationic acrylamide copolymer. According to the invention, the adhesive composition contains 40-80 wt % resin, 5-30 wt % filler, 0-40 wt % solvent, and 0.1-10 wt % foaming agent, which has been selected from organic and/or inorganic surface-active sulfate, sulfonate, phosphate or phosphonate compounds or their derivatives or mixtures.

Abstract: The present invention relates to fiber glass strands, yarns, fabrics, composites, prepregs, laminates, fiber-metal laminates, and other products incorporating glass fibers formed from glass compositions. The glass fibers, in some embodiments, are incorporated into composites that can be used in reinforcement applications. Glass fibers formed from some embodiments of the glass compositions can have certain desirable properties that can include, for example, desirable electrical properties (e.g. low Dk) or desirable mechanical properties (e.g., specific strength).

Abstract: Phenolic resin binder systems for sand molds, used in metal casting, which improve the quality of thermally reclaimed sand, are described. The substantial or complete elimination of calcium compounds (e.g., calcium stearate and calcium hydroxide, conventionally employed as a mold lubricant and a resin curing catalyst, respectively) allows the thermally reclaimed sand to be reused over multiple thermal reclamation cycles without the adverse effects previously encountered.

Abstract: A monolithic refractory castable material comprises from about 25 to about 80 weight percent of graphite, from about 1 to about 15 weight percent of a water dispersible, curable phenolic novolac resin, and from about 70 to about 15 weight percent of one or more refractory aggregates, based on the weight of the monolithic refractory castable material. The monolithic refractory castable material is water dispersible and may be delivered to a structure surface by casting, pumping, shotcreting or gunning processes. In one embodiment, the monolithic refractory castable material may be employed to install or replace a blast furnace lining.