With Phenolic Reactant Or Polymer Thereof And Is Free Of 1,2-epoxy Groups Patents (Class 525/109)
  • Patent number: 5130383
    Abstract: Thermoplastic resin compositions comprising polyarylate and polyamide resins as main components, and an epoxy resin of the following formula [1] in a predetermined amount are provided. ##STR1## The thermoplastic resin compositions of the invention have good impact strength along with good heat and solvent resistances and good moldability.
    Type: Grant
    Filed: January 9, 1991
    Date of Patent: July 14, 1992
    Assignee: Kawasaki Steel Corporation
    Inventors: Kenji Yoshino, Kazuya Takemura, Tadahiro Wakui
  • Patent number: 5128435
    Abstract: A resin composition comprising an epoxy resin and an isocyanate group-containing fluorine compound is particularly suitable for covering a magnetic recording medium comprising a non-magnetic substrate and formed thereon a thin magnetic film so as to give excellent sliding durability.
    Type: Grant
    Filed: July 16, 1990
    Date of Patent: July 7, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Mitsuyoshi Shoji, Takayuki Nakakawaji, Yutaka Ito, Shigeki Komatsuzaki, Toshikazu Narahara
  • Patent number: 5114993
    Abstract: The invention relates to an aqueous coating agent, obtained from an epoxy resin, ethylenically unsaturated monomers, some of which contain carboxyl groups, a peroxide initiator in a proportion of at least 2% by weight, relative to the total weight of the monomers, a crosslinking agent, a neutralizing agent, organic solvents, and, if appropriate, further conventional additives, such as plasticizers, stabilizers, wetting agents, dispersion auxiliaries, catalysts and pigments.
    Type: Grant
    Filed: January 8, 1991
    Date of Patent: May 19, 1992
    Assignee: BASF Lacke & Farben AG
    Inventors: Karl-Heinz Scherping, Hans-Jorg Holscher, Uwe Reichelt, Udo Reiter
  • Patent number: 5110847
    Abstract: An o/w water paint having excellent dispersibility and stability is prepared according to a phase conversion process comprising adding ammonia or an amine and water to a solution of an epoxy resin, a hardener resin, and an acrylic resin in an organic solvent or to a molten mixture of these resins to neutralize the acrylic resin. In view of adhesion of a coat to metal and workability, branched alkylamines or heterocyclic amines are suitable as the neutralizing amines. In applying this paint, steam optionally containing fine water droplets is preferably applied to a wet coat prior to drying. Furthermore, a process for the continuous production of an emulsion type water paint comprising a carboxyl group-containing acrylic resin component, an epoxy resin component and a curing agent resin component for the epoxy resin is disclosed.
    Type: Grant
    Filed: December 24, 1990
    Date of Patent: May 5, 1992
    Assignee: Toyo Seikan Kaisha Ltd.
    Inventors: Shunji Kojima, Yoshiki Watanabe, Hiroaki Goto, Toshinori Moriga
  • Patent number: 5093424
    Abstract: Disclosed is a coating composition for metal coating, said coating composition containing (A) at least one of an epoxidized polybutadiene resin and an epoxy group-containing polyhydric phenol-modified epoxidized polybutadiene resin, and (B) at least one of a capped epoxy resin and a methylol group-containing capped epoxy resin.
    Type: Grant
    Filed: August 6, 1990
    Date of Patent: March 3, 1992
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Kaoru Morita, Atsushi Shioda, Kazumi Fukudome, Naruhito Ueno
  • Patent number: 5091474
    Abstract: A two component-type curing agent composition is disclosed which comprises a first curing agent which is capable of cross-linking an epoxy resin and which is at least one member selected from primary amines, phenolic compounds and acid anhydrides, and a second curing agent which is at least one compounds represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attracting group; R is a lower alkyl; and m and n each is an integer of 1-4.
    Type: Grant
    Filed: January 18, 1991
    Date of Patent: February 25, 1992
    Assignee: Toa Nenryo Kogyo Kabushiki Kaisha
    Inventors: Shinkichi Murakami, Osamu Watanabe, Sadahisa Wada, Makoto Miyazaki, Hiroshi Inoue
  • Patent number: 5089560
    Abstract: Fiber reinforced composite structures based on epoxy resin formulations having a phase-separated or multiphase morphology when cured are effectively toughened by adding preformed carboxylated rubber particles to the matrix resin prior to curing the composite.
    Type: Grant
    Filed: January 5, 1990
    Date of Patent: February 18, 1992
    Assignee: Amoco Corporation
    Inventors: Hugh C. Gardner, Richard H. Newman-Evans
  • Patent number: 5080968
    Abstract: Fiber reinforced composites are comprised of a vinyl resin composition and fibrous reinforcement material which is coated with a uniformly thin and continuous elastomeric coating. The coating is prepared from an aqueous dispersion containing a reactive liquid polymer composition, an epoxy resin and a curing agent.
    Type: Grant
    Filed: February 20, 1990
    Date of Patent: January 14, 1992
    Assignee: The B. F. Goodrich Company
    Inventors: Changkiu K. Riew, Alan R. Siebert, Frrederick J. McGarry, Philip L. Kinson
  • Patent number: 5075378
    Abstract: A multifunctional coating composition comprising a fluorocarbon polymer, an epoxy resin and a fluorinated curing agent resulting in a fluorinated epoxy resin network with improved properties of corrosion resistance and hydrophobicity.
    Type: Grant
    Filed: June 24, 1987
    Date of Patent: December 24, 1991
    Assignee: The Standard Oil Company
    Inventors: Richard C. Smierciak, Paul J. Giordano
  • Patent number: 5073601
    Abstract: The invention relates to compositions containing A) a liquid copolymer based on butadiene and at least one polar, ethylenically unsaturated comonomer, and B) a polyether prepolymer capped with hydroxyarylcarboxylic or hydroxyaralkylcarboxylic acids, or a capped polyester, polythioester or polyamide containing polyether segments. The phenolic hydroxyl group in component B) can also be etherified with epichlorohydrin and this product can be converted to an episulfide, if desired, or the phenolic hydroxyl group can be reacted with cyanogen halide to form a cyanate group.The stock compositions can be used in combination with epoxy resins to manufacture structural adhesives or sealing compounds.
    Type: Grant
    Filed: July 25, 1989
    Date of Patent: December 17, 1991
    Assignee: Ciba-Geigy Corporation
    Inventors: Rolf Mulhaupt, Werner Rufenacht
  • Patent number: 5071914
    Abstract: The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.
    Type: Grant
    Filed: August 17, 1989
    Date of Patent: December 10, 1991
    Assignee: H. B. Fuller Company
    Inventors: John M. Zimmel, Pamela M. Klinkenberg, William L. Bunnelle, Keith C. Knutson
  • Patent number: 5068266
    Abstract: An o/w water paint having excellent dispersibility and stability is prepared according to a phase conversion process comprising adding ammonia or an amine and water to a solution of an epoxy resin, a hardener resin, and an acrylic resin in an organic solvent or to a molten mixture of these resins to neutralize the acrylic resin. In view of adhesion of a coat to metal and workability, branched alkylamines or heterocyclic amines are suitable as the neutralizing amines. In applying this paint, steam optionally containing fine water droplets is preferably applied to a wet coat prior to drying. Furthermore, a process for the continuous production of an emulsion type water paint comprising a carboxyl group-containing acrylic resin component, an epoxy resin component and a curing agent resin component for the epoxy resin is disclosed.
    Type: Grant
    Filed: October 25, 1989
    Date of Patent: November 26, 1991
    Assignee: Toyo Seikan Kaisha Ltd.
    Inventors: Shunji Kojima, Yoshiki Watanabe, Hiroaki Goto, Toshinori Moriga
  • Patent number: 5057552
    Abstract: Flexible thermoplastic epoxy resins are prepared by reacting (1) an advanced epoxy resin prepared by reacting a mixture of an aromatic based epoxy resin and an aliphatic based epoxy resin with a polyhydric phenol in the presence of an advancement catalyst with (2) a monocarboxylic acid or anhydride thereof; reacting the resultant product with a mixture of an aromatic based epoxy resin and a monofunctional material reactive with vicinal epoxy groups; and reacting the resultant product with a carboxyl terminated elastomer. These resins are particularly useful in formulating pavement marking paints.
    Type: Grant
    Filed: February 28, 1989
    Date of Patent: October 15, 1991
    Assignee: The Dow Chemical Company
    Inventors: Michael B. Cavitt, David J. Duncan
  • Patent number: 5025045
    Abstract: Damage tolerant composites comprising high strength filaments in the form of bundles or tows of continuous fiber and a tough phase separated, crosslinked epoxy resin matrix are disclosed. The crosslinked epoxy resin matrix comprises infusible particles that reside primarily between plies of the composite and critically have a median particle size between 10-75 microns. Prepregs for making the damage tolerant composites and methods of making such prepregs and the epoxy resin compositions thereof are also disclosed. The epoxy resin compositions comprise the infusible particles which become segregated as to size on a surface layer of the prepreg during the process of combining the high strength filaments of the prepreg and the resin containing the epoxy resin composition. Alternatively, the infusible particles may be disposed directly on the epoxy resin surface of the prepreg.
    Type: Grant
    Filed: December 20, 1988
    Date of Patent: June 18, 1991
    Assignee: Hercules Incorporated
    Inventors: Irena Gawin, Brian J. Swetlin
  • Patent number: 5025067
    Abstract: An epoxy resin comprising an active hydrogen compound having at least three active hydrogen atoms capable of reacting with an epoxy group in its molecule or butadine or isoprene as a main monomer is modified with an oligomer having on average at least 1.5 equivalents of active hydrogen capable of reacting with an epoxy group in its molecule. An epoxy resin modified with a bisphenol and a compound having active hydrogen or acid anhydride groups capable of reacting with an epoxy group is also provided. A toner containing the epoxy resin as a binder is useful in electrostatography.
    Type: Grant
    Filed: November 16, 1988
    Date of Patent: June 18, 1991
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Yohzoh Yamamoto, Goro Suzuki, Hideo Nakamura, Kiyomi Yasuda
  • Patent number: 5019608
    Abstract: An epoxy adhesive composition for the bonding of SMC to metal substrates and other SMC parts having an improved cure rate and hence rate of initial lap shear strength development has been discovered. The adhesive composition comprises an epoxy resin and a polyacrylate or polymethacrylate cured with a combination of an amine-functional butadiene-acrylonitrile rubber and at least one polyamidoamine.
    Type: Grant
    Filed: February 7, 1989
    Date of Patent: May 28, 1991
    Assignee: Lord Corporation
    Inventor: Dilipkumar N. Shah
  • Patent number: 5017650
    Abstract: A resin composition comprising 100 parts by weight of a polyester composition comprised of(A) 5-95% by weight of an aromatic polyester, and(B) 95-5% by weight of a polyphenylene ether having a repeating unit of ##STR1## and/or a modified polyphenylene ether obtained by reacting 0.05-20% by weight of an active functional group containing monomer to said polyphenylene ether,(C) 0.05-30 parts by weight of an epoxy compound represented by the formula ##STR2## and (D) 1-60 parts by weight of an impact modifier.
    Type: Grant
    Filed: May 11, 1989
    Date of Patent: May 21, 1991
    Assignee: Toray Industries, Inc.
    Inventors: Kiyokazu Nakamura, Kiichi Kometani, Akihiko Koshino, Kenjiro Horiuchi
  • Patent number: 5008334
    Abstract: The present invention provides a resin which is a mixture of (a) the product of a diol and one or more diepoxides and (b) an A-B-A block copolymer wherein A represents blocks of an epoxy/diol copolymer which is the reaction product of a diol and a diepoxide, and B represents blocks of an epoxy-capped, carboxyl-terminated polybutadiene or polybutadiene/acrylonitrile copolymer.Amine resins, produced by reaction of this resin with an amine are useful as the principal resin in electrocoating formulations which produce deposited films having excellent corrosion resistance and improved impact and chip resistance.
    Type: Grant
    Filed: February 28, 1989
    Date of Patent: April 16, 1991
    Assignee: BASF Corporation
    Inventors: Paul J. Harris, Ronald T. Wojcik
  • Patent number: 5006610
    Abstract: A resin composition comprising 100 parts by weight of a polyester composition comprised of(A) 5-95% by weight of an aromatic polyester, and(B) 95-5% by weight of a polyphenylene ether having a repeating unit of ##STR1## and/or a modified polyphenylene ether obtained by reacting 0.05-20% by weight of an active functional group containing monomer to said polyphenylene ether, and(C) 0.05-30 parts by weight of an epoxy compound represented by the formula ##STR2## is superior in moldability and dimensional stability, and its molded article is distinguished in mechanical property and solvent resistance.
    Type: Grant
    Filed: May 11, 1989
    Date of Patent: April 9, 1991
    Assignee: Toray Industries, Inc.
    Inventors: Kiyokazu Nakamura, Kiichi Kometani, Akihiko Koshino, Kenjiro Horiuchi
  • Patent number: 5001193
    Abstract: Epoxy adhesives for bonding automotive parts, particularly those made of BMC of SMC, are improved by incorporating in the adhesive a Mannich Base having more than one primary or secondary amino groups.
    Type: Grant
    Filed: December 22, 1988
    Date of Patent: March 19, 1991
    Assignee: American Cyanamid
    Inventor: Michael R. Golden
  • Patent number: 4977214
    Abstract: Curable compositions comprise(A) a polyglycidyl ether of a polyhydric phenol,(B) a polyglycidyl ether of a polyhydric alcohol,(C) a nitrogen-containing latent hardener for epoxide resins and(D) as cure accelerator dispersed as a powder in the composition, a solid solution of a polymeric phenol with an aliphatic polyamine having two or more amine groups, each of the amine groups being tertiary and at least two of the amine groups being dimethylamino groups.The compositions are useful as adhesives, sealants, laminating resins and coatings.
    Type: Grant
    Filed: October 12, 1989
    Date of Patent: December 11, 1990
    Assignee: Ciba-Geigy Corporation
    Inventor: Madan M. Bagga
  • Patent number: 4970256
    Abstract: A resin composition which comprises(A) 60 to 99% by weight of a composition comprising 1 to 99% by weight of a polyarylene ester and 99 to 1% by weight of a polycarbonate or a polyalkylene terephthalate, and(B) 40 to 1% by weight of an ethylene copolymer consisting of 50 to 90% by weight of ethylene, 5 to 49% by weight of an .alpha..beta.-unsaturated carboxylic acid alkyl ester and 0.5 to 10% by weight of maleic anhydride,said resin composition having significantly improved impact properties with less dependency on the radius of notched part without deteriorating the excellent heat distortion resistance or excellent processability, barrier properties, chemical resistance, heat resistance of (A) of the composition comprising a polyarylene ester and a polycarbonate or a polyalkylene terephthalate and being useful for utilities such as parts for electric and/or electronic equipment, parts of automobiles and parts of office automation equipment which have been desired to be miniaturized and to have a thin-wall.
    Type: Grant
    Filed: February 28, 1989
    Date of Patent: November 13, 1990
    Assignee: Sumitomo Chemical Company Limited
    Inventors: Masakazu Inoue, Kuniaki Asai, Yasuro Suzuki
  • Patent number: 4963602
    Abstract: Heat curable coating compositions particularly suitable as coatings for metal can ends are made from aqueous dispersions of epoxy resins, acrylic resins which are copolymers of polymerizable acids and other monomers, phenoxy resins, alkylated phenol novolac resins and resol resins.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: October 16, 1990
    Assignee: Hi-Tek Polymers, Inc.
    Inventor: Hirendra K. Patel
  • Patent number: 4927742
    Abstract: A multilayer printed wiring board is described having (1) an inner layer conductive pattern on an organic insulating base material, (2) a poly(vinyl acetal)-phenolic resin coating containing an amine substituted organic zirconate or titanate coupling agent, (3) a dielectric insulating layer, (4) a bonding composition capable of being adhesion promoted for electroless metal deposition comprising a phenolic resin having at least two methylol groups and substantially free of methyl ether groups, a heat resistant aromatic or cyclic resin having functional groups capable of reacting with the methylol groups without the evolution of water, and (5) an outer conductive pattern, the multilayer board being capable of withstanding at least five soldering cycles of at least 255.degree. C. for 2 seconds without blistering or delamination. Processes for manufacturing the multilayer board are also described.
    Type: Grant
    Filed: November 23, 1988
    Date of Patent: May 22, 1990
    Assignee: Kollmorgen Corporation
    Inventor: Thomas S. Kohm
  • Patent number: 4916187
    Abstract: An adhesive composition which results from the mixture of two components, the first component comprising a polyepoxide and the second component comprising a finely dispersed solid salt of a polyamine and a polyphenol in a liquid adduct of a poly(alkylene oxide) polyamine and a polyphenol and the use of this non sagging, high performance adhesive in structural applications is described.
    Type: Grant
    Filed: September 2, 1988
    Date of Patent: April 10, 1990
    Assignee: Ashland Oil, Inc.
    Inventor: Anil B. Goel
  • Patent number: 4900848
    Abstract: A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiber-reinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.
    Type: Grant
    Filed: March 29, 1988
    Date of Patent: February 13, 1990
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhisa Saito, Katsuya Watanabe, Kohichi Okuno, Kunimasa Kamio, Akira Morii, Hiroshi Nakamura
  • Patent number: 4895895
    Abstract: A thickened moulding composition comprises fibrous reinforcement, an ethylenically unsaturated polymer, a monomer copolymerizable therewith and a crystalline unsaturated polyester having a glycol component derived from at least two symmetrical glycols.Preferably, the crysatlline polyester has a molecular weight per double bond of no more than about 210 and a melting point of from 50.degree.-115.degree. C.
    Type: Grant
    Filed: June 17, 1987
    Date of Patent: January 23, 1990
    Assignee: Scott Bader Company Limited
    Inventors: Trevor R. Osborne, Stephen J. Thompson
  • Patent number: 4879324
    Abstract: Thermoplastic molding compositions contain as essential components(A) from 1 to 90% by weight of a polycarbonate,(B) from 1 to 90% by weight of a polyester,(C) from 1 to 90% by weight of a polyamide,(D) from 0.5 to 30% by weight of a polymeric component having hydroxyl groups and in addition(E) from 0 to 30% by weight of an impact-modifying rubber and(F) from 0 to 60% by weight of a fibrous or particulate filler.
    Type: Grant
    Filed: February 16, 1989
    Date of Patent: November 7, 1989
    Assignee: BASF Aktiengesellschaft
    Inventors: Dietrich Lausberg, Erhard Seiler, Hans-Georg Braun
  • Patent number: 4877502
    Abstract: A coating composition which is a uniformly dispersed admixture ofA. a fluid carrier; andB. a homopolymer or copolymer containing monomer units of the formula ##STR1## wherein R.sub.1 and R.sub.2 are preferably hydroxyalkyl and the polymer has a preferred average molecular weight in the range of from about 5,000 to about 30,000; andC. a poly(epoxide).
    Type: Grant
    Filed: July 18, 1988
    Date of Patent: October 31, 1989
    Assignee: Hoechst Celanese Corporation
    Inventors: Donna L. Keene, Darrell D. Hicks
  • Patent number: 4876295
    Abstract: Flexible thermoplastic epoxy resins are prepared by reacting (1) an advanced epoxy resin prepared by reacting a mixture of an aromatic based epoxy resin and an aliphatic based epoxy resin with a polyhydric phenol in the presence of an advancement catalyst with (2) a monocarboxylic acid or anhydride thereof; reacting the resultant product with a mixture of an armotic based epoxy resin and a monofunctional material reactive with vicinal epoxy groups; and reacting the resultant product with a carboxyl terminated elastomer. These resins are particularly useful in formulating pavement marking paints.
    Type: Grant
    Filed: April 18, 1988
    Date of Patent: October 24, 1989
    Assignee: The Dow Chemical Company
    Inventors: Michael B. Cavitt, David J. Duncan
  • Patent number: 4866134
    Abstract: An electric metal foil-plated laminate sheet which is obtained by laminating a cured layer of a thermosetting resin composition with electroconductive foils, said thermosetting resin composition comprising 30-85% by weight of (A) a rubber-modified vinyl ester obtained by reacting,(a) an epoxy resin,(b) a carboxyl group containing rubbery polymer derived from a conjugated diene, and(c) at least one unsaturated monocarboxylic acid selected from the group consisting of acrylic acid and methacrylic acid to react one another in amounts such that, based on 100 parts by weight of (a) the epoxy resin, (b) the carboxyl group containing rubbery polymer accounts for a proportion in the range of 5 to 80 parts by weight and that the total number of carboxylic group contained in (b) the rubbery polymer and (c) the unsaturated monocarboxylic acid falls in the range of 1.3 to 1.5 per each of the epoxy groups contained in (a) the epoxy resin at a temperature of 90.degree. to 120.degree. C.
    Type: Grant
    Filed: April 21, 1988
    Date of Patent: September 12, 1989
    Assignees: Matsushita Electric Works, Ltd., Nippon Shokubai Kagaku Kogyo Co., Ltd.
    Inventors: Hidekazu Takano, Tetsuo Kunitomi, Shigehiro Okada, Toshio Awaji, Katsuaki Shindo, Daisuke Atobe
  • Patent number: 4866133
    Abstract: Curable liquid compositions comprise(A) a liquid epoxide resin and(B) as curing agent for (A), more than 10% by weight, based on the weight of (A), of a solid solution of a polymeric phenol, such as a polymer of p-vinyl phenol or a phenolic novolak resin, and a polyamine having at least one primary amine group, such as diethylenetriamine or triethylenetetramine, the solid solution (B) being disposed as a powder in the epoxide resin. The compositions are useful as adhesives.
    Type: Grant
    Filed: September 14, 1987
    Date of Patent: September 12, 1989
    Assignee: Ciba-Geigy Corporation
    Inventors: Christopher M. Andrews, Madan M. Bagga
  • Patent number: 4857131
    Abstract: A two-part, heat stable, peroxide-free adhesive that can be mixed in equal parts with rapid cure for the bonding of plastics and metals has been discussed. Part A of the adhesive contains a polymeric material, an olefinically unsaturated monomer, an acid material, a compound containing a sulfonyl halide group, and a compound containing a transition metal; and Part B contains a polymeric material (preferably a phenoxy resin) and monomer of the same class and a Zn, Cu or Cd metal powder.
    Type: Grant
    Filed: November 27, 1987
    Date of Patent: August 15, 1989
    Assignee: Lord Corporation
    Inventors: Dennis J. Damico, Kenneth W. Mushrush, Ruth M. Bennett
  • Patent number: 4837248
    Abstract: Flexible thermoplastic epoxy resins are prepared by reacting (1) an advanced epoxy resin prepared by reacting a mixture of an aromatic based epoxy resin and an aliphatic based epoxy resin with a polyhydric phenol in the presence of an advancement catalyst with (2) a monocarboxylic acid or anhydride thereof; reacting the resultant product with a mixture of an aromatic based epoxy resin and a monofunctional material reactive with vicinal epoxy groups; and reacting the resultant product with a carboxyl terminated elastomer. These resins are particularly useful in formulating pavement marking paints.
    Type: Grant
    Filed: April 18, 1988
    Date of Patent: June 6, 1989
    Assignee: The Dow Chemical Company
    Inventors: Michael B. Cavitt, David J. Duncan
  • Patent number: 4826921
    Abstract: A coating composition comprising an anhydride polymer (A) containing at least two cyclic carboxylic acid anhydride functional groups and a polymer (B) containing at least two functional groups reactive with anhydride groups and selected from hydroxyalkylamino, hydroxyalkoxyalkylamino, hydroxysubstituted acyloxyalkylamino, hydroxysubstituted polyacyloxyalkylamino, mercaptoalkylamino and oxazolidino groups. One of the polymers (A) and (B) comprises at least one flexible polymer chain selected from polyether, polyester, silicone, diene polymer, hydrogenated diene polymer, polyurethane, polyisobutylene and polyacrylate chains. The functional groups characteristic of that polymer are each present as a terminal group at the end of a flexible polymer chain.
    Type: Grant
    Filed: September 2, 1987
    Date of Patent: May 2, 1989
    Assignee: International Paint public limited company
    Inventors: Adrian F. Andrews, Nicholas S. Hugh, Michael J. Nunn
  • Patent number: 4826617
    Abstract: Disclosed is a new partial capping synthesis wherein resinous mixtures containing controlled amounts of phenolic hydroxyl and/or mercapto functionality, and aliphatic hydroxyl functionality are synthesized. Such synthesis comprises providing one or more resins which in total contain aliphatic primary and/or secondary hydroxyl functionality and oxirane functionality. A single resin or blend of resins may provide the requisite functionality. The one or more resins then are reacted with a carboxyl-functional capping agent bearing phenolic hydroxyl functionality and/or mercapto functionality. This reaction is conducted under reaction conditions and for a time such that the carboxyl functionality of the capping agent selectively reacts with the oxirane functionality of the one or more resins to produce a resinous product containing aliphatic hydroxyl functionality and containing phenolic hydroxyl functionality and/or mercapto functionality.
    Type: Grant
    Filed: October 27, 1987
    Date of Patent: May 2, 1989
    Assignee: Ashland Oil, Inc.
    Inventor: Laurence G. Dammann
  • Patent number: 4822832
    Abstract: Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardner and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K.sub.IC, of at least 1.0 MPam.sup.1/2.
    Type: Grant
    Filed: April 7, 1987
    Date of Patent: April 18, 1989
    Assignee: Hercules Incorporated
    Inventors: Sung G. Chu, Harold Jabloner, Brian J. Swetlin
  • Patent number: 4818601
    Abstract: A rubber-cord composite body used for cord reinforcing rubber articles is produced by embedding fiber cords treated with an epoxy compound and further with a particular resorcin-formaldehyde-rubber latex adhesive into a particular rubber composition containing 0.5.about.10 parts by weight of each of a bismaleimide compound and sulfur.
    Type: Grant
    Filed: February 9, 1988
    Date of Patent: April 4, 1989
    Assignee: Bridgestone Corporation
    Inventors: Michio Itoh, Tadashi Saito, Nobuyuki Okamura, Hisao Yamamoto, Yutaka Iseda, Hirohiko Takagi
  • Patent number: 4814365
    Abstract: A curable resin composition is disclosed which comprises (A) a polymer having a (meth)acryloyl group in a side chain, (B) an unsaturated alkyd which is formed by the esterification of a polyvalent alcohol component and an .alpha.-.beta.unsaturated polybasic acid or an anhydride thereof with or without a polybasic acid, the polyvalent alcohol component comprising a phenol-modified epoxy resin which is obtained by the reaction of an epoxy group of an epoxy resin and a phenolic hydroxyl group of a phenol, or the reaction product of a polyvalent phenol compound and a monoepoxide, (C) a polymerizable monomer, and (D) a curing agent. It is suitable for underwater linings, putties, sealing materials, and the like.
    Type: Grant
    Filed: June 24, 1987
    Date of Patent: March 21, 1989
    Assignee: Showa High Polymer Co., Ltd.
    Inventors: Eiichiro Takiyama, Akira Yokoyama, Ryushi Ogura
  • Patent number: 4804575
    Abstract: A multilayer printed wiring board is described having (1) an inner layer conductive pattern on an organic insulating base material, (2) a poly(vinyl acetal)-phenolic resin coating containing an amine substituted organic zirconate or titanate coupling agent, (3) a dielectric insulating layer, (4) a bonding composition capable of being adhesion promoted for electroless metal deposition comprising a phenolic resin having at least two methylol groups and substantially free of methyl ether groups, a heat resistant aromatic or cyclic resin having functional groups capable of reacting with the methylol groups without the evolution of water, and (5) an outer conductive pattern, the multilayer board being capable of withstanding at least five soldering cycles of at least 255.degree. C. for 2 seconds without blistering or delamination. Processes for manufacturing the multilayer board are also described.
    Type: Grant
    Filed: January 14, 1987
    Date of Patent: February 14, 1989
    Assignee: Kollmorgen Corporation
    Inventor: Thomas S. Kohm
  • Patent number: 4804581
    Abstract: A coated article having improved chip resistance and a method of providing such a chip resistant coated article are disclosed. The article includes a metal substrate, a coating layer of an elastomer-modified epoxy derived from a polyepoxide and from 5 to 35 percent by weight of a functionally-terminate diene-containing polymer, and a carboxyl-functional material having a carboxyl-functionality of at least two such as a carboxyl-functional polyester, a carboxyl-functional acrylic polymer or a di- or polycarboxylic acid, and at least one additional coating layer having a different composition than the elastomer-modified epoxy containing layer.
    Type: Grant
    Filed: May 14, 1987
    Date of Patent: February 14, 1989
    Assignee: PPG Industries, Inc.
    Inventors: Denise M. Geary, Paul H. Pettit, Jr., Susan K. Vicha
  • Patent number: 4803232
    Abstract: An epoxy adhesive composition for the bonding of SMC to metal substrates and other SMC parts having an improved cure rate and hence rate of initial lap shear strength development has been discovered. The adhesive composition comprises an epoxy resin and a polyacrylate or polymethacrylate cured with a combination of an amine-functional butadiene-acrylonitrile rubber, at least one aliphatic or aromatic polyamine and at least one polyamide.
    Type: Grant
    Filed: July 30, 1987
    Date of Patent: February 7, 1989
    Assignee: Lord Corporation
    Inventor: Dilipkumar N. Shah
  • Patent number: 4786675
    Abstract: For use in sealing semiconductors, an epoxy resin composition is provided which comprises an epoxy resin, a curing agent, a filler and a modifier, wherein the modifier is a diene polymer or acrylic polymer having an iodine number of not more than 120 or both included in an amount of 1 to 50 parts by weight per 100 parts by weight of the epoxy resin.
    Type: Grant
    Filed: April 29, 1987
    Date of Patent: November 22, 1988
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Riso Iwata, Yoichiro Kubo
  • Patent number: 4783506
    Abstract: Damage tolerant composites comprising high strength filaments in the form of bundles or tows of continuous fiber and a tough phase separated, crosslinked epoxy resin matrix are disclosed. The crosslinked epoxy resin matrix comprises infusible particles made from a rubber polymer that reside primarily between piles of the composite and critically have a median particle size between 10-75 microns. Prepregs for making the damage tolerant composites and methods of making such prepregs and the epoxy resin compositions thereof are also disclosed. The epoxy resin compositions comprise the infusible particles which become segregated as to size on a surface layer of the prepreg during the process of combining the high strength filaments of the prepreg and the resin containing the epoxy resin composition.
    Type: Grant
    Filed: March 30, 1987
    Date of Patent: November 8, 1988
    Assignee: Hercules Incorporated
    Inventor: Irena Gawin
  • Patent number: 4782116
    Abstract: Homogeneous thermoset terpolymers which may be used in the preparation of laminates for circuitry boards will comprise a diepoxide of a polyether of a polyphenol, a dicyanate ester of a polyether of a polyphenol and an alkenyl aryl compound. The polymers are prepared by admixing a solution of the diepoxide of a polyether of a polyphenol and an alkenyl aryl compound with a second solution of the dicyanate ester of a polyether of a polyphenol and the alkenyl aryl compound at elevated temperatures. The resulting terpolymer will possess desirable characteristics such as high glass transition temperature and low dielectric constant.
    Type: Grant
    Filed: July 6, 1987
    Date of Patent: November 1, 1988
    Assignee: Allied-Signal Inc.
    Inventor: Mark D. Holte
  • Patent number: 4775728
    Abstract: An adhesive composition which results from the mixture of two components, the first component comprising a polyepoxide and the second component comprising a finely dispersed solid salt of a polyamine and a polyphenol in a liquid adduct of a poly(alkylene oxide) polyamine and a polyphenol and the use of this non sagging, high performance adhesive in structural applications is described.
    Type: Grant
    Filed: February 24, 1987
    Date of Patent: October 4, 1988
    Assignee: Ashland Oil, Inc.
    Inventor: Anil B. Goel
  • Patent number: 4773624
    Abstract: Into a material based on a caoutchouc-type or caoutchouc-containing mixture for producing hard rubber, there is incorporated a pre-mix containing high-strength organic fibers and a liquid hardenable plastic material. The high-strength and temperature resistant material thus obtained is particularly suitable for the attenuation of noise in combustion engines when heavy-weight fillers are also added to such material. Engine components like, for example, valve covers, timing gear covers and oil pans can be manufactured from this material.
    Type: Grant
    Filed: April 28, 1986
    Date of Patent: September 27, 1988
    Assignee: Semperit Aktiengesellschaft
    Inventors: Josef Affenzeller, Wolf-Dieter Jost
  • Patent number: 4755542
    Abstract: Flexible thermoplastic epoxy resins are prepared by reacting (1) an advanced epoxy resin prepared by reacting a mixture of an aromatic based epoxy resin and an aliphatic based epoxy resin with a polyhydric phenol in the presence of an advancement catalyst with (2) a monocarboxylic acid or anhydride thereof; reacting the resultant product with a mixture of an aromatic based epoxy resin and a monofunctional material reactive with vicinal epoxy groups; and reacting the resultant product with a carboxyl terminated elastomer. These resins are particularly useful in formulating pavement marking paints.
    Type: Grant
    Filed: March 11, 1987
    Date of Patent: July 5, 1988
    Assignee: The Dow Chemical Company
    Inventors: Michael B. Cavitt, David J. Duncan
  • Patent number: 4751256
    Abstract: Heat curable coating compositions particularly suitable as coatings for metal can ends are made from aqueous dispersions of epoxy resins, acrylic resins which are copolymers of polymerizable acids and other monomers, and alkylated phenol novolac resins.
    Type: Grant
    Filed: January 21, 1986
    Date of Patent: June 14, 1988
    Assignee: Interez, Inc.
    Inventors: Hirendra K. Patel, Ronald Golden
  • Patent number: 4734458
    Abstract: Ionene elastomers are prepared by reaction of polymeric diamines and certain dihalide linking agents. These elastomers have utility in coating compositions, adhesive compositions, and in the fabrication of elastomeric articles. Certain novel dihalide linking agents are also claimed.
    Type: Grant
    Filed: November 24, 1986
    Date of Patent: March 29, 1988
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Charles M. Leir, John E. Stark