Abstract: Resin compositions including (A) a hollow organic polymer particle, (B) an epoxy resin, and (C) a curing agent provide cured products having a superior smear removal properties.

Abstract: The disclosure relates to methods of manufacturing surface materials for construction or manufacturing use and the surface materials produced by such methods. Substrate materials, such as synthetic or engineered stone or fiber-reinforced resinous panels, can be formed in conventional ways such as casting, molding, or pressing. Layers are printed onto substrate materials to form textures, which may include inks to selectively color the printed texture, thereby enabling a wide variety of high-resolution appearances. A clear, protective topcoat is then applied to the surface materials and cured to provide a finished material.

Abstract: The disclosure relates to methods of manufacturing surface materials for construction or manufacturing use and the surface materials produced by such methods. Substrate materials, such as synthetic or engineered stone or fiber-reinforced resinous panels, can be formed in conventional ways such as casting, molding, or pressing. Layers are printed onto substrate materials to form textures, which may include inks to selectively color the printed texture, thereby enabling a wide variety of high-resolution appearances. A clear, protective topcoat is then applied to the surface materials and cured to provide a finished material.

Abstract: Provided are a curable composition that exhibits favorable adhesiveness without heating at elevated temperatures, and a method for producing a joined structure using the curable composition. As a curable composition for use in forming one or more bonding layers bonding the two or more adherends, in which at least one of the two or more adherends includes a low heat-resistance material, a curable composition that contains an epoxy resin including a structural unit of a specific structure including an epoxy group, and yields a cured product exhibiting a water contact angle of 40° or more and 50° or less by heating at 80° C. or higher and 100° C. or lower and an exposure is used.

Abstract: An expansion joint seal system with a water-activated impregnation solute, and a body of an open-celled and resiliently-compressible foam, where the volume of the water-activated impregnation solute may be combined on-site and on-demand with water and manually impregnated into the body of the foam for insertion.

Abstract: An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.

Abstract: Formulations comprising from 10 to 80% by weight of the formulation of a halogenated epoxy resin; from 1 to 15% by weight of the formulation of an antimony based fire retardant; from 1 to 10% by weight of the formulation of an inorganic or non-polymeric organic phosphorous containing fire retardant; and from 1 to 30% by weight of the formulation of a curative system are provided. The formulations are particularly suitable for producing aircraft interior composite components having good fire retarding properties, low smoke emission, low smoke toxicity and low heat release properties. The formulations also have excellent processing and mechanical properties. Further components may be included in the compositions to improve various properties, including the fire retarding, low smoke emission, low smoke toxicity and low heat release properties and to also further improve the processing and mechanical properties, including toughness.

Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.

Abstract: A resin composition and an article made from the resin composition are provided. The resin composition comprises: 30 parts by weight of thermosetting resin; 50 to 125 parts by weight of maleimide resin; and 5 to 35 parts by weight of monofunctional long-chain alkyl acrylate monomer. The resin composition is capable of achieving a proper viscosity and a good filling property whiling maintaining a high glass transition temperature.

Abstract: An emulsion of a nitrogen atom-containing polymer or salt thereof and a method for producing it are provided. The emulsion has high stability and low dispersity of the particle diameter of emulsified particles. A method for producing particles including a crosslinked nitrogen atom-containing polymer or sat thereof using the emulsion is also provided. The method for producing the emulsion includes a step of mixing a first solution that includes a nitrogen atom-containing polymer or salt thereof and a hydrophilic solvent and has a viscosity of 10 to 2,000 mPa·s, and a second solution that includes a hydrophobic solvent and has a viscosity of 1 to 100 mPa·s, stirring the mixture, and thus obtaining an emulsion of the nitrogen atom-containing polymer or salt thereof, wherein a ratio between the viscosity of the first and second solutions is in a range of 0.1:1 to 300:1.

Abstract: The object of the present invention is to provide a therapeutic agent for hyperphosphatemia capable sufficiently decreasing a serum phosphorus concentration with a small dose. The present invention provides a therapeutic agent for hyperphosphatemia, which comprises, as an active ingredient, a particle containing certain crosslinked polymer (preferably crosslinked polyallylamine).

Abstract: There is disclosed: a wood adhesive composition comprising a protein and a poly(glycidyl ether); a method for using the wood adhesive composition to make a composite wood product; and composite wood products made using the wood adhesive composition.

Abstract: A thermoplastic polyester resin composition is obtained by blending, per 100 parts by weight of (A) a thermoplastic polyester resin, 0.1 to 5 parts by weight of (B) a novolac type epoxy resin having a specific structure, and 0.05 to 10 parts by weight of (C) an epoxy compound having two epoxy functional groups per molecule. Thus, a molded article that exhibits superior melt stability with respect to a wide range of processing temperatures, has excellent mechanical properties and heat resistance, and exhibits superior long-term hydrolysis resistance, chemical resistance, and oxidative deterioration resistance can be obtained.

Abstract: The present invention provides a compound represented by following formula (1), wherein R1 represents a 2n-valent group having 1 to 30 carbon atoms, each of R2 to R5 independently represents a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen atom, a thiol group or a hydroxyl group, provided that at least one selected from R1 to R5 represents a group including an iodine atom and at least one R4 and/or at least one R5 represent/represents one or more selected from the group consisting of a hydroxyl group and a thiol group, each of m2 and m3 independently represents an integer of 0 to 8, each of m4 and m5 independently represents an integer of 0 to 9, provided that m4 and m5 do not represent 0 at the same time, n represents an integer of 1 to 4, and each of p2 to p5 independently represents an integer of 0 to 2.

Abstract: The present invention relates to an amine-based curing agent comprising at least 1% by weight of at least one tertiary amine and, optionally, primary and/or secondary amines. The tertiary amine is preferably an N-substituted piperidine tertiary amine and, more preferably, N-hydroxyethyl piperidine (NHEP). The present invention also relates to an epoxy resin composition formed using this amine-based curing agent and a method of making the epoxy resin composition. These tertiary amines enhance desirable properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with tertiary amine-based curing agents.

Abstract: A polymer composition comprising star macromolecules is provided. Each star macromolecule has a core and five or more arms, wherein the number of arms within a star macromolecule varies across the composition of star molecules. The arms on a star are covalently attached to the core of the star; each arm comprises one or more (co)polymer segments; and at least one arm and/or at least one segment exhibits a different solubility from at least one other arm or one other segment, respectively, in a reference liquid of interest.

Abstract: Guanylurea alcohol phosphate salts are disclosed. Flame retardant thermoplastic and thermoset polymers can be made by incorporating said guanylurea alcohol phosphate salts into polymers and these polymers have improved properties over similar thermoplastic or thermoset polymers where guanylurea phosphate salts are added as flame retardant dispersions to said polymer. Flame retardant polyurethane foams where the guanylurea alcohol phosphate salts have been incorporated into the polyurethane are a particularly preferred embodiment.

Abstract: Embodiments of the present disclosure are directed to a composition and composite for protecting a transmission/reception device. The composite can include a reinforcing material and a cured epoxy composition impregnating the reinforcing material. The cured epoxy composition can contain reaction constituents including less than 50% stoichiometric amount of an anhydride curing agent to an epoxy resin. The composite can exhibit synergistic improvements in mechanical strength, weatherability, and signal transmission properties.

Abstract: A continuous device (1) is provided for impregnating, in a single step, strands or ribbons of natural fibers (100) with a specific aqueous polymer dispersion to consolidate the fibers at the core of the fiber bundle and to improve their mechanical strength without any need for twisting. The device includes a stretching component (10) for elongating by the strand or the ribbon of natural fibers by stretching to give them a required yarn count, an impregnating component (20) for impregnating the fibers with the aqueous dispersion, a shaper for shaping/calibrating the wrung fibers, a dryer (40) for drying the shaped/calibrated fibers, and a conditioner (50) for conditioning the dried fibers to transform them into yarn or ribbon.

Abstract: The present invention relates to a tetramethylbiphenol type epoxy resin having a content of a sodium ion of 1 to 12 ppm which is determined by measurement by the atomic absorption spectrometry using a solution wherein a sample is dissolved in N-methylpyrrolidone.

Abstract: The present invention relates to a medical tube article comprising a polymer mixture of a thermoplastic or thermo-curing polymer base material and an amphiphilic block copolymer.

Abstract: The present invention relates generally to thermally conductive adhesives for thermal interfaces in electronic packaging, and more particularly, to a polymer-based composite thermal interface material (“TIM”) with an inter-penetrating network (IPN) polymer matrix consisting of polyurethane and an epoxy that is fully crosslinked. The IPN polymer matrix is designed to improve overall thermal conductivity by the altering the dispersion/distribution of thermally conductive fillers, the filler/polymer interfaces, and/or phonon scattering behaviors in the composite.

Abstract: An object of the present invention is to provide a multilayer separation membrane having excellent performance on both removal of suspended solids in water and adsorptive removal of metal ions in water. A multilayer separation membrane of the present invention includes: a porous adsorption layer including substantially a polymer having chelating functional groups; and a porous clarification layer, and the porous clarification layer is disposed neater to a raw water-side than the porous adsorption layer.

Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.

Abstract: Described is paper or cardboard packaging produced from mineral oil contaminated, (e.g., recycled) paper, wherein the packaging includes a barrier layer obtainable by applying an aqueous polymer dispersion comprising a copolymer obtainable by emulsion polymerization of C1-C4 alkyl (meth)acrylates, acid monomers, e.g., acrylic acid or methacrylic acid, 0-20 wt % of acrylonitrile and 0 to 10 wt % of further monomers in an aqueous medium in the presence of a carbohydrate compound, preferably in the form of a degraded starch, wherein the glass transition temperature of the copolymer is in the range from +10 to +45° C. The barrier layer may be situated on one of the surfaces of the packaging or form one of multiple layers of a multilayered packaging coating or be situated as a coating on one side of an inner bag situated within the packaging.

Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl-or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.

Abstract: The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 ?m as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance.

Abstract: A polyurethane based asphalt composition includes an asphalt component and a polyurethane resin system that is the reaction product of an isocyanate component that includes at least one polyisocyanate and an isocyanate-reactive component that includes a cardanol-modified epoxy polyol. The cardanol-modified epoxy polyol is a reaction product of an epoxy component and an epoxy-reactive component at a ratio of epoxy groups to epoxy reactive groups from 1:0.95 to 1:5. The epoxy-reactive component includes a cardanol component.

Abstract: Disclosed is a method for preparing a vinyl aromatic hydrocarbon-conjugated diene block copolymer using a coupling reaction with improved ion stability. The method comprises (a) polymerizing a vinyl aromatic hydrocarbon monomer in a hydrocarbon solvent with an organic lithium compound as a polymerization initiator to prepare a first mix solution comprising a vinyl aromatic hydrocarbon block; and (b) adding a conjugated diene monomer to the first mix solution of step (a) to form a conjugated diene block on an end of the vinyl aromatic hydrocarbon block and to thereby prepare a second mix solution comprising a vinyl aromatic hydrocarbon block-conjugated diene block, wherein the method further comprises (c) adding a Lewis acid to the first mix solution before, during or after polymerization of the vinyl aromatic hydrocarbon monomer of step (a).

Abstract: A pressure sensitive adhesive composition is described comprising at least 50 wt-% of polymerized units derived from alkyl meth(acrylate) monomer(s); and 0.2 to 15 wt-% of at least one cross-linking monomers comprising a (meth)acrylate group and a C6-C20 olefin group, the olefin group being optionally substituted. In another embodiment, an adhesive composition is described comprising a syrup comprising i) a free-radically polymerizable solvent monomer; and ii) a solute (meth)acrylic polymer comprising polymerized units derived from one or more alkyl (meth)acrylate monomers; wherein the syrup comprises at least one crosslinking monomer or the (meth)acrylic solute polymer comprises polymerized units derived from at least one crosslinking monomer, the crosslinking monomer comprising a (meth)acrylate group and a C6-C20 olefin group, the olefin group being optionally substituted. In yet other embodiments, methods of preparing adhesive compositions are described.

Abstract: A vibration damping material according to one aspect of the present invention comprises a composition as a main component, the composition being prepared by mixing based on 100 parts by weight of acrylic rubber, at least, in an external ratio, 0.01 to 15 parts by weight of organic peroxide that can crosslink between epoxy-based crosslinking points with each other, 25 to 50 parts by weight of carbon black having a mean particle diameter of 22 to 45 nm, and 15 to 35 parts by weight of carbon black having a mean particle diameter of 70 to 85 nm; and crosslinking crosslinking points in the acrylic rubber with each other through the organic peroxide.

Abstract: There is provided a ring-opening polymer of cyclopentene wherein a cis ratio of the cyclopentene-derived structural units is 30% or more, a weight average molecular weight (Mw) is 100,000 to 1,000,000, and a functional group containing a structure represented by the general formula (1) or (2) is included at an end of the polymer chain. —Y—H??(1) (in the above general formula (1), Y represents an oxygen atom or a sulfur atom.) —NH-Q??(2) (in the above general formula (2), Q represents a hydrogen atom or a hydrocarbon group or a silyl group which may have a substituent group.

Abstract: Fast cure resin system comprise semisolid epoxy resins and finely divided curatives of particle size less than 25 microns. The resins are dry to the touch, can be readily combined with fibrous reinforcement to provide prepregs which can be rapidly cured in a short moulding cycle.

Abstract: The invention relates to a polyethylene composition comprising a mixture of flame retardants which are bromine-containing polymers. The polyethylene composition is useful in the manufacture of pallets. A process for making the polyethylene composition through a masterbatch route is also disclosed.

Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.

Abstract: An epoxy adhesive composition is provided that has superior wash-off resistance after pre-gelling, and may be used, e.g., in manufacturing processes, e.g., in the automobile industry. The compositions comprise an epoxy resin, a gelling agent, and a phenolic agent, and may optionally comprise other components. Methods of making and using the compositions are also provided.

Abstract: A glass printing ink and a glass printing lacquer comprising at least one pigment, at least one photoinitiator, at least two resins and radicial photoinitiators. One resin is an epoxy resin having an average molecular weight based on bisphenol A, diluted in a UV hardening monomer. The other resin is a resin which contains free functional amino, hydroxy, epoxy, acid, acid anhydride and/or acrylate groups. Also, the use of the glass printing ink and glass printing lacquer when printing a glass substrate and to a method for printing a glass substrate.

Abstract: The present invention discloses a composition for preparing a bonding material for use in a circuit board comprising a polymerizable acrylate system and a curable epoxy resin system, the composition being photocurable. The present invention also provides a circuit board comprising the bonding material.

Abstract: The present invention is directed to a method of making a copolymer, comprising the steps of at least partially epoxidizing a polyisoprene to produce an epoxidized polyisoprene; reacting the epoxidized polyisoprene with a dithiol to produce a thiol functionalized polyisoprene; and reacting the thiol functionalized polyisoprene with a thiolophile-functionalized polymer derived from a monomer having a hydrogen bond donor site and hydrogen bond acceptor site to form the copolymer.

Abstract: A poly(arylene ether)-poly(hydroxy ether) block copolymer includes at least one poly(hydroxy ether) block and at least one poly(arylene ether) block, and the mole ratio of poly(hydroxy ether) blocks to poly(arylene ether) blocks is 0.95:1 to about 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be prepared by reacting a telechelic poly(arylene ether) having terminal hydroxyl groups with a telechelic poly(hydroxy ether) epoxy resin having terminal epoxy groups, wherein the mole ratio of the telechelic poly(hydroxy ether) to the telechelic poly(arylene ether) is 0.95:1 to 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be shaped into an article by extrusion, thermoforming, or molding, and is a compatibilizing agent for non-polar and polar polymers.

Abstract: A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acrylated epoxy resin, and a latent epoxy-curing agent.

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: To provide a flame-retardant resin composition that has superior adhesion subsequent to curing and molding when used as a printed wiring board adhesive and that provides superior printed wiring board electrical characteristics; and a flexible printed wiring board metal-clad laminate, a coverlay, a flexible printed wiring board adhesive sheet, and a flexible printed wiring board employing this resin composition. (SOLUTION) The flame-retardant resin composition comprises a thermosetting resin, a hardener, and a phosphorus-containing polymer.

Abstract: This invention relates to a composite material for biomedical applications, in particular dental applications, which possesses self-healing capacity and is able to incorporate a system for the release of active ingredients at the stage of application and use.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: Composition comprising polypropylene and (a) at least one phenolic antioxidant (A) (b) at least one hindered amine light stabilizer (B) (c) at least one slip agent (C) being a fatty acid amide, (d) a bisphenol A epoxy resin with an average molecular weight (Mw) below 2000 g/mol (D), and (e) talc (E).

Abstract: An epoxy resin composition, a cured object thereof, and an optical semiconductor sealing material using the cured object are described. The epoxy resin composition includes an alicyclic epoxy resin (A) and a vinyl polymer particle (B). An acetone soluble part of the vinyl polymer particle (B) is 30 mass % or more. The mass average molecular weight of the acetone soluble part is 100,000 or more. The volume average primary particle diameter (Dv) is 200 nm or more. The epoxy resin composition is rapidly turned into a gel state by heating for a short time, and the transparency of the obtained cured object is good.

Abstract: An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.

Abstract: A composition of matter comprising an article derived from a composition containing: a. from about 30 to 80 wt. % of a polycarbonate component, b. from about 5 to about 50 wt. % of a polyester component, wherein when polybutylene terephthalate is present in the composition, the polybutylene terephthalate is present in conjunction with at least one other polyester that is not polybutylene terephthalate; c. about 2 to about 25 wt. % of an impact modifier; and d. a gloss reducing effective amount of a multifunctional additive comprising at least one epoxy group. The invention also includes injection molding processes, thermoforming processes for making articles.

Abstract: The invention discloses a cross-linked polymer particle for an epoxy resin, an epoxy resin composition containing the cross-linked polymer particle, the epoxy resin and a curing agent, and an epoxy cured material having qualities of colorless transparency and crack resistance as a result of curing the resin composition. The cross-linked polymer particle for the epoxy resin contains a (meth)acrylate monomer unit and a crosslinking monomer unit, wherein a volume average primary particle diameter is 0.5 to 10 ?m, and a glass transition temperature of the monomer components excluding the crosslinking monomer is 30° C. or more by FOX formula calculation, and the refractivity at 23° C. is 1.490 to 1.510.