Abstract: A method of preventing or treating an oral disease by reducing adhesion of microorganisms, e.g. Candida albicans, to dental appliances fabricated and/or repaired by an autopolymerizing acrylic reinforcement resin comprising zirconium dioxide nanoparticles.

Abstract: The invention relates to an adhesive composition having an added component of rubber-epoxy such as XNBR-epoxy adducts. It was found that the new adhesive composition significantly reduces meander formation in the making of automotive parts.

Abstract: A chemically prepared core shell toner formulation for use in electrophotography having an inventive softening agent consisting of a core shell latex having an encapsulated interpenetrating polymer network microgel in the core of the toner is disclosed. Having this core shell latex with an encapsulated IPN microgel in the core of the toner results in a toner that can simultaneously fuse at a desirable low temperature and survive the temperature extremes associated with shipping and storage.

Abstract: A coating composition, a method for coating a substrate and a pipeline are provided. The coating composition includes at least one epoxy resin and at least one functionalized elastomer. The functionalized elastomer includes an elastomer being grafted with acid anhydride-based groups. The method includes steps of applying the coating composition to the substrate, and curing the coating composition so as to obtain a coating. The pipeline includes a pipe and the coating formed from the coating composition coated on the pipe. The coating has improved flexibility, and improved heat and chemical resistance.

Abstract: Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.

Abstract: Multi-piece, solid golf balls containing an inner core, an intermediate layer surrounding the core, and an outer cover are provided. At least one layer is made from an epoxy composition comprising a curing agent such as zinc diacrylate or zinc dimethacrylate. The epoxy composition is produced by reacting an epoxy prepolymer with a curing agent. Preferably, the epoxy composition is used to form an intermediate and/or cover layer resulting in a golf ball having high resiliency, good impact durability, and soft feel.

Abstract: The composition and preparation of multiple graft low molecular weight polymers useful as dispersants are described. The dispersants described are suitable for controlling sludge and varnish as well as soot. The product is useful as a lubricant additive and a fuel additive.

Abstract: The invention provides a golf ball material comprising components (A), (B) and (C): (A) a mixture of different masterbatches prepared by separately masterbatching two or more different metal ions (A1) or a masterbatch prepared by simultaneously masterbatching two or more different metal ions in itself (A2), (B) one or more polymer selected from the group consisting of diene polymers, thermoplastic polymers and thermoset polymers, and (C) one or more polymer having an acid content of from about 0.5 to about 30 wt % and selected from the group consisting of olefin-unsaturated carboxylic acid copolymers, olefin-unsaturated carboxylic acid-unsaturated carboxylic acid ester terpolymers, unsaturated carboxylic anhydride-containing polymers, unsaturated dicarboxylic acid-containing polymers and unsaturated dicarboxylic acid half ester-containing polymers. The invention also provides a method for preparing such a golf ball material, and a golf ball made of the material.

Abstract: The invention provides a golf ball material composed of (i) a non-ionomeric thermoplastic resin, (ii) an ionomeric resin and/or an acid-containing polymer which is the base polymer of an ionomeric resin, and (iii) a norbornene dicarboxylic anhydride and/or a derivative thereof. Methods for preparing such a material, and a golf ball which includes as a component therein a part made of the golf ball material are also provided. The golf ball material has a good thermal stability, flow and processability, and can thus be used to obtain high-performance golf balls endowed with an excellent rebound resilience, durability and flexibility.

Abstract: The present invention provides a primer for a thermoplastic and/or elastomeric substrate, the primer comprising a film of an epoxy-modified polymer selected from the group consisting of an epoxy-modified-thermoplastic polymer, an epoxy-modified-thermoplastic polymeric composite, an epoxy-modified-elastomeric polymer, an epoxy-modified-elastomeric polymeric composite, a blend thereof, and any mixture thereof. Also provided are methods of repairing, inserting, assembling and coating a thermoplastic or elastomeric substrate using the primer of the present invention.

Abstract: The present invention provides a primer for a thermoplastic and/or elastomeric substrate, the primer comprising a film of an epoxy-modified polymer selected from the group consisting of an epoxy-modified-thermoplastic polymer, an epoxy-modified-thermoplastic polymeric composite, an epoxy-modified-elastomeric polymer, an epoxy-modified-elastomeric polymeric composite, a blend thereof, and any mixture thereof. Also provided are methods of repairing, inserting, assembling and coating a thermoplastic or elastomeric substrate using the primer of the present invention.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both a solid epoxy resin and a liquid epoxy resin, each of which is a diglycidyl ether of a polyphenol such as bisphenol A, are used. The epoxy-based prepolymer is mixed with an acrylate-terminated urethane resin (preferably, one based on a polyol having a number average molecular weight of at least about 400) and a heat-activated latent curing agent to make an adhesive composition which can be pumpable at room temperature. Curable adhesives capable of expansion to about 100% with high impact resistance after curing may be obtained by inclusion of expanding agents such as expandable microspheres.

Abstract: A low viscosity (and therefore low VOC) resin can be produced by limiting the molar ratio of the reactants, especially the dicarboxylic acid compound, used in the reaction. Specifically, reacting a reaction mixture comprising (i) one mole of a diepoxide having at least two glycidyl ether type epoxy groups; (ii) 0.5 to 2.0 moles of an unsaturated monocarboxylic acid; (iii) 0.1 to 0.5, preferably 0.1 to 0.3, moles of maleic anhydride; and, (iv) water, until substantially all of the epoxy groups disappear leads to the formation of a resin with a high shear (at least 500 s?1) viscosity of less than 1200 cP when measured in a 70% NVM (non-volatile matter) styrene solution. The resin may be used in barrier coatings, gel coatings, skin coatings and as a laminate resin.

Abstract: An object of the present invention is to substantially improve the compatibility between a radical copolymerizable unsaturated resin and an addition polymerized polymer (thermoplastic resin) which is added for the purpose of low profile and improvement of physical properties. The present invention provides a compatibilizing agent for compatibilizing a radical copolymerizable unsaturated resin with an addition polymerized polymer, characterized in that said compatibilizing agent is a graft copolymer (A) which contains a styrene monomer as a principal component, and has a principal chain (A1) consisting of a copolymer with a (meth)acrylate monomer and a side chain (A2) selected from a ring-opening polymerized polyether side chain consisting of a polyoxyalkylene ether, a polyester side chain, and a polycarbonate side chain, the side chain (A2) being bonded to the principal chain.

Abstract: A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by: CH2=CR2CO−(R1O)n−OCOCR2=CH2  (1) wh

Abstract: This invention relates to an insulating resin composition which exhibits high impact resistance and heat resistance and good adhesiveness to the plating metal, is selectively etchable by a permanganate salt commonly used in a plating operation and suited for an insulating layer in multilayer wiring boards. The insulating resin composition is a photo-polymerizable or thermally polymerizable resin composition comprising 3-10 parts by weight of a crosslinked elastic polymer per 100 parts by weight of a resin component (excluding the crosslinked elastic poly and including monomers) and said crosslinked elastic polymer has carboxyl groups and is dispersed with an average secondary particle diameter in the range of 0.5-2 &mgr;m.

Abstract: A polymer composition containing carboxyl group which is excellent in water solubility, thickening properties and flow characteristics. This composition comprises (A) a cross-linked polymer comprising (a) an &agr;,&bgr;-unsaturated carboxylic acid and (b) a compound having at least two ethylenically unsaturated groups, and (B) at least one polymer selected from among polymers comprising vinylpyrrolidone as an essential monomer and polyethylene oxide.

Abstract: The present invention relates to a high temperature resistant coating composition and a method of using thereof. More particularly, the invention relates to a coating composition comprising a resin containing functional hydroxyl groups (A), a polyfunctional epoxy resin (B), and an anhydride compound.(C).

Abstract: A thermoplastic synthetic resin, especially high-density polyethylene, has its diffusion coefficient especially for hydrocarbons, reduced by the addition of 2 to 8% by weight of an additive consisting essentially of at least one phenoxy and/or epoxy resin, and at least one further component selected from the group which consists of at least one radical forming agent and at least one graft coploymerization catalyst, and optional quantities of an antioxidant selected from the group which consists of at least one phenolic antioxidant, at least one phosphitic antioxidant and mixtures thereof, at least one organosilane ester, at least one UV stabilizer, at least one antistatic composition, and polypropylene.

Abstract: The invention concerns a reagent kit designed to produce elements of synthetic resin for anchoring fixation elements in place by bonding them in multi-cavity plugs. The reagent kit comprises (a) a reagent mixture containing 2,2-bis-[4-(methacryloxyethoxy)phenyl]propane and an optionally unsaturated polyester resin, vinyl resin or acrylic resin or a mixture of these, (b) an accelerator component comprises an organic peroxide and (c) a filler component, the accelerator component (b) being kept separate from the reagent mixture (a) before use.

Abstract: A one-component thermosetting coating composition containing of one or more chemically setting binders, at least one curing or crosslinking agent, and one or more toughening substances, the composition being semisolid and tackfree at temperatures <50.degree. C., wherein the chemically setting binders have an average molecular weight (M.sub.w) of between 500 and 250,000, a melting point of more than 50.degree. C., a glass transition temperature of more than 20.degree. C. and cure fully at temperatures in the range from 80 to 250.degree. C.

Abstract: A thermoplastic polymer composition contains at least two distinct polymers, characterized in that it comprises at least one polymer P1 containing at least one reactive function and at least one modified polyolefin P2 containing at least one succinimide ring substituted on the nitrogen by a reactive group, the ring being carried either by the main chain or by a side chain, and optionally at least one third polymer P3 selected from the group formed by polymers and copolymers obtained by polymerisation of one or more olefinic compounds. A mixture of polymers comprises at least one composition as defined above and at least one other polymer P5 which is identical to or different from polymer P3 and optionally at least one other polymer P6 which is identical to or different from polymer P1.

Abstract: An adhesive comprising (1) 100 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 5,000 and a curing agent, (2) 10 to 40 parts by weight of a high-molecular weight component being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, (3) 20 to 100 parts by weight of a high-molecular weight component being incompatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, and (4) 0.1 to 5 parts by weight of a cure accelerator. The adhesive is excellent not only in moisture resistance, heat resistance, adhesive strength at high temperature, heat dissipation, reliability of insulation, crack resistance and flexibility but also in circuit filling and tight adhesion, and exhibits suitable flow properties.

Abstract: A novel class of interpenetrating polymer networks which are dispersible in conventional coating solvents is disclosed. Such dispersions are useful in preparing protective and/or decorative film coatings and are particularly useful in photosensitive or imaging formulations such as photoresists, solder masks and the like. These polymer networks are comprised of at least two interpenetrating crosslinked polymers. At least one of the polymer networks is formed by polymerization in a solvent. In one embodiment of this invention, at least one polymer network is prepared from macromers to produce a polymer system having functionalized branch or graft linear segments. The solvent dispersible interpenetrating networks of this invention are particularly useful as binders in addition polymerizable photosensitive compositions containing crosslinking monomers such as solder masks. Upon exposure to actinic radiation and suitable thermal curing, solder mask coatings of such photosensitive compositions form multiple, e.g.

Abstract: A polymerizable composition for the production of high quality ophthalmic lenses is disclosed that includes:a) between 20 and 90 weight percent, and preferably, at least 50 weight percent, of urethane, epoxy, or polyester oligomers end terminated with acrylate or methacrylate (or mixtures of acrylate and methacrylate);b) between 5 and 50 to 80 percent, preferably between 10 and 40 percent, by weight of an optional diluent, such as a hydrocarbon diol end terminated with acrylate or methacrylate, or mixtures thereof, or a crosslinkable tri-, tetra-, or poly-acrylate or methacrylate, or mixtures thereof; andc) conventional optional additives, including but not limited to free radical initiators, UV absorbers, mold release agents, stabilizers, dyes, antioxidants, and wetting agents.The invention also includes ophthalmic lenses prepared from this composition and an apparatus for the production of lenses using sequential polymerization.

Abstract: A thermoplastic synthetic resin, especially high-density polyethylene, has its diffusion coefficient especially for hydrocarbons, reduced by the addition of 2 to 8% by weight of an additive consisting essentially of at least one phenoxy resin, and at least one further component selected from the group which consists of at least one radical forming agent and at least one graft coploymerization catalyst, and optional quantities of an antioxidant selected from the group which consists of at least one phenolic antioxidant, at least one phosphitic antioxidant and mixtures thereof, at least one organosilane ester, at least one UV stabilizer, at least one antistatic composition, and polypropylene.

Abstract: The invention relates to a resin composition comprising epoxy resin, a cross linking agent for the epoxy resin in the form of a carboxylic anhydride, and at least one allyl network forming compound. According to the invention, the anhydride-functional compound is a copolymer of an ethylenically unsaturated anhydride and a vinyl compound. Notably suitable are styrene-maleic anhydride copolymers known as SMA Type 1. Surprisingly, it was found that the presence of at least 2 wt.% of triallyl cyanurate (TAC) results in an increase in Tg, such that even with simple difunctional epoxy compounds resins can be obtained which have a glass transition temperature of 130.degree. C. and higher. It was further found that the processing as prepreg of epoxy resins cross-linked using anhydride-vinyl copolymers will be greatly enhanced by the presence of at least 10 % of allyl.

Abstract: An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.

Abstract: The present invention relates to relatively inexpensive multi-purpose expandable vibration damping material compositions particularly useful in constrained layer applications. The composition essentially includes an elastomeric polymer, plasticizer, thermoplastic polymer, foaming agent, adhesion promoters and filler. In addition to the aforementioned, under certain embodiments, the expandable vibration damping material compositions may also employ rheological modifiers such as cross-linking agents and epoxy curing agents.

Abstract: A resin composition curable through a Michael reaction between (a) a component having a plurality of .alpha., .beta.-unsaturated carbonyl groups and (b) a component having a plurality of activated methylene, activated methyne or hydroxyl groups is disclosed. The curing reaction is catalyzed with a quaternary ammonium, quaternary phosphonium or tertiary sulfonium salt in the presence of an epoxy compound independently added to the composition or covalently attacted to either component (a) or component (b).

Abstract: Moldings having improved surface properties are produced using BMC molding materials which contain crystalline unsaturated polyesters.

Abstract: A thermosetting powder coating composition resistant to overspray incompatibility defects that comprises solid particulates of a uniform mixture of (a) a polyester resin having an average of two or more carboxyl groups, (b) a first crosslinker that is reactive toward the carboxyl groups of the polyester resin, (c) from 1% to 20% of a reactive acrylic copolymer having a weight average molecular weight of from 10,000 to 40,000, and (d) a second crosslinker that is reactive toward the reactive functionality of the acrylic copolymer is described.

Abstract: The invention pertains to aqueous dispersed, crosslinked microgel polymers useful as a polymeric binder in protective coatings. The microgel polymeric binder comprises epoxy-acrylic graft copolymer dispersed into water, emulsion copolymerized monoethylenically unsaturated monomer, and emulsion copolymerized divinyl benzene adapted to crosslink in the emulsion copolymerization step with the monoethylenic monomers to produce the crosslinked microgel polymer particles. The microgel polymer is particularly useful as binder for can coatings adapted to be heat cured to form a protective film.

Abstract: Coating compositions which comprise:(i) an acid-functional compound having an average of at least two carboxylic acid groups per molecule; and(ii) an anhydride-functional compound having an average of at least two cyclic carboxylic acid anhydride groups per molecule; and(iii) an epoxy-functional compound having an average of at least one epoxy group per molecule; wherein at least one of the compounds (i), (ii), or (iii) comprises a film forming polymer.

Abstract: This invention is the polycapped oligomer adduct of a long chain fatty acid with a multi hydroxy functional or multi epoxy functional compound. This polycapped oligomer is useful in resin compositions to enhance the performance of thermoplastic low profile additives which improve the surface quality of molded composites such as automotive body panels.

Abstract: Flexible coated bundles of fibers are provided that are both encapsulated and impregnated with a coating of one or more independently partially crosslinkable polyurethane. The fibers in the bundle can have a first chemical treatment or size and the bundle of these fibers is treated to have the coating of the polyurethane. The coating impregnates the bundle so that a majority of the fibers have a substantial portion of their surfaces covered with the coating. The independently partially crosslinkable polyurethane is selected from polyurethane polymers that are solvent-soluble, dispersible or emulsifiable that produce a thermoplastic elastomeric film. The partial crosslinkability is from one or more of the following types of crosslinking: self-crosslinkable, internally crosslinkable and/or in-situ crosslinkable. Additional components other than external crosslinking agents can also be present in the coating composition.

Abstract: A curable molding material comprises a coherent phase of a free-radical curable, unsaturated polyester resin in which finely particulate polyolefin particles are dispersed as disperse phase, the two phases being chemically bound to one another at the interfaces by ionic bonds.

Abstract: Vinyl ester resins of the type already having reactive liquid polymers reacted into the backbone of the resins, are cured in the presence of a reactive liquid polymer additive admixed with the prereacted vinyl ester resin. Heating of the system during cure causes the reactive liquid polymer additive to miscibilize with the vinyl ester base resin. The vinyl ester resin modified in the manner described above shows a significant enhancement in toughness as measured by fracture energy over unmodified counterparts or counterparts modified by known methods of adduction or admixing alone.

Abstract: A structural adhesive composition containing an epoxy compound, an amine hardener and a hydroxy-substituted aromatic compound having a pKa ranging from about 5 to 9.7 and a boiling point greater than about 210.degree. C. The utilization of a hydroxy-substituted aromatic compound having a pKa and a boiling point within the stated ranges provides for an adhesive composition which develops significant green strength, undergoes minimal sinkage during the bonding and curing process, and is capable of withstanding high temperature conditions.

Abstract: An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable latent curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

Abstract: A curable molding material based on a dispersion of a finely divided ethylene polymer in an unsaturated polyester resin is prepared by a process in which a melt of the ethylene polymer is uniformly distributed in a melt of an unsaturated polyester in an extruder or stirred kettle.

Abstract: A rubber composition which is vulcanizable with organic peroxides and provides vulcanized rubber excellent in oil resistance, heat resistance, low-temperature resistance and compression set.

Abstract: Adhesive compositions of a selected class of epoxy resins combined with a selected class of carboxylic group-containing acrylonitrile-butadiene and methacrylonitrile-butadiene copolymers, maleimide derivatives and an imidazole compound. The resultant compositions are electrically insulative, thermally resistant, highly capable of fabrication at low pressure and storage stable.

Abstract: A water reducible resin for use in a coating composition is produced by grafting in organic solvent a thermoplastic polymer onto a thermosetting polymer that has been copolymerized with acid group-containing monomers to render the resultant polymer water soluble. Thermoplastic polymer is also grafted onto a phosphatized polyepoxide for the sake of adhesion of a coating to a substrate. A film formed from a waterborne coating composition containing the grafted polymers as a binder has both the toughness properties characteristic of a thermoplastic and the flexibility properties of a thermosetting resin.

Abstract: Coating compositions which comprise: (i) a hydroxy-functional compound containing in the molecule an average of at least two hydroxyl groups; (ii) an anhydride-functional compound containing in the molecule an average of at least two cyclic carboxylic acid anhydride groups; and (iii) an epoxy-functional compound containing in the molecule an average of at least two cycloaliphatic epoxy groups, provide low temperature cure response and excellent durability.

Abstract: A thixoropic adhesive composition exhibiing good sag resistance is prepared comprising a mixture of a polymer-modified epoxy resin and a rheological control agent. The polymer-modified epoxy resin is preferably a dispersion of acrylic elastomer in an epoxy resin in which the acrylic elastomer particles have added hydroxyl functionality which interacts favorably with rheological control agents, such as fumed silica. Acrylic epoxy resin dispersions containing added hydroxyl functionality give improved rheological control.

Abstract: A method for producing a vinyl resin comprising the steps of dissolving or dispersing a polymerizable vinyl monomer in a polymerization solvent containing a silicone oil, and polymerizing the polymerizable vinyl monomer in the presence of a polymerization catalyst.

Abstract: The present invention concerns the polyolefin resin compositions wherein acrylic oligomers, polydiene and chlorinated polyolefins which contain 10-60 weight % chlorine are graft copolymerized. Films of the polyolefin resin compositions have good adhesive properties, moisture-resistant properties and appearance.

Abstract: Polyolefin type coating resin compositions obtained by copolymerizing acrylic type oligomers, polydienes, acrylic type monomers and chlorinated polyolefins containing 10-60 weight % chlorine in the existence or the absence of the Hardener. The obtained copolymers are used for coatings, printing inks or adhesives applying as one coat finish or primer to give excellent coating films of adhesive property, solvent resistance and the appearance.