With Additional Heterocyclic Reactant Free Of 1,2-epoxy Group Patents (Class 525/114)
  • Patent number: 5789493
    Abstract: The invention relates to a process for preparing a composition contains a polymer and a crosslinking agent which comprises mixing a polymer that is solid at room temperature with a crosslinking agent, the polymer and the crosslinker having complementary reactive groups, at a temperature at which the viscosity of the polymer (measured according to Emila) is less than 5000 dpas, in a means for achieving a homogeneous composition in such a short time that less than 20% of the reactive groups of one of either the polymer or crosslinking agent has reacted, and subsequently cooling and comminuting the composition.The mixing is preferably effected in a static mixer at a temperature higher than 140.degree. C.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: August 4, 1998
    Assignee: DSM N.V.
    Inventors: Josephus M. Van Aaken, Guillaume F. M. Hoedemakers, Johannes S. Van Der Bas, Adrianus J. Van De Werff
  • Patent number: 5639828
    Abstract: A curable coating composition is described comprising two components that are reactive with one another upon curing to form urethane linkages. The urethane-forming components are an active hydrogen groups-containing component and a polyisocyanate, or a carbamate groups-containing component and a carbamate group-reactive component. The composition further comprises a third component that includes one or more epoxide groups. Coatings prepared with this coating composition can be cured and coated with additional coating(s), providing good intercoat adhesion to the subsequent coating.
    Type: Grant
    Filed: April 25, 1996
    Date of Patent: June 17, 1997
    Assignee: BASF Corporation
    Inventors: Rodney L. Briggs, John W. Rehfuss, Walter H Ohrbom, Gregory G. Menovcik
  • Patent number: 5629379
    Abstract: Toughened epoxy resin systems having high temperature capabilities of from 250.degree. to 350.degree. C. prepared by carefully curing blends of epoxy resins having an average epoxy functionality greater than two with bicycloalkene dicarboxylic anhydride hardener, maleinized polybutadiene toughening agent, supplemental hardener selected from the group consisting of aromatic tetracarboxylic dianhydrides and bismaelimides of aromatic diamines, and epoxy/anhydride accelerator.
    Type: Grant
    Filed: October 6, 1995
    Date of Patent: May 13, 1997
    Inventor: John D. Harper
  • Patent number: 5543462
    Abstract: The present invention relates to an impact resistant polystyrene composition which comprises an (A) styrenic polymer having syndiotactic configuration and a (B) rubbery elastomer modified by a modifier having a polar group, or to an impact resistant polystyrene composition which comprises the aforesaid composition and a (C) rubbery elastomer and/or a (D) poly(phenylene ether).The polystyrene compositions according to the present invention are excellent in heat resistance, modulus of elasticity, impact resistance and extensibility and thus are expected to find effective use for molding electric and electronic materials, industrial construction materials, automobile part, domestic electrical appliances, industrial materials such as various machine parts, etc.
    Type: Grant
    Filed: November 2, 1994
    Date of Patent: August 6, 1996
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Akihiko Okada, Nobuyuki Sato
  • Patent number: 5516578
    Abstract: The invention relates to a water and oil repellency imparting composition which comprises:(a) a fluoroaliphatic radical-containing agent; and(b) a polymer comprising cyclic carboxylic anhydride groups.Additionally, the composition may comprise:(c) a softener and/or a plasticizer. The composition provides water and oil repellent properties to fibrous and other substrates treated therewith and it shows high compatibility with the commonly used softeners.
    Type: Grant
    Filed: October 14, 1994
    Date of Patent: May 14, 1996
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Dirk M. Coppens
  • Patent number: 5516846
    Abstract: Coating compositions which comprise:(i) an acid-functional compound having an average of at least two carboxylic acid groups per molecule; and(ii) an anhydride-functional compound having an average of at least two cyclic carboxylic acid anhydride groups per molecule; and(iii) an epoxy-functional compound having an average of at least one epoxy group per molecule; wherein at least one of the compounds (i), (ii), or (iii) comprises a film forming polymer.
    Type: Grant
    Filed: August 25, 1995
    Date of Patent: May 14, 1996
    Assignee: The Sherwin-Williams Company
    Inventors: Mohamad D. Shalati, James A. Marquart, John L. Petty, Rodney M. Harris
  • Patent number: 5512613
    Abstract: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.
    Type: Grant
    Filed: March 18, 1994
    Date of Patent: April 30, 1996
    Assignee: International Business Machines Corporation
    Inventors: Ali Afzali-Ardakani, Stephen L. Buchwalter, Jeffrey D. Gelorme, Laura L. Kosbar, Bert H. Newman, Frank L. Pompeo
  • Patent number: 5426150
    Abstract: A storage-stable suspension of an epoxy resin hardener and a toughener useful as a molding composition is prepared via a) the addition of an organic solvent to an aqueous emulsion of the toughener when using a water-sensitive hardener, such as a polycarboxylic anhydride, removing the water as an azeotrope by vacuum distillation, then adding the epoxy resin hardener and removing the residual solvent by vacuum distillation, or b) the addition of an aqueous emulsion of the toughener with or without an organic solvent to the epoxy resin hardener when using a water-insensitive hardener such as a polyamine, and removing the water and any organic solvent by vacuum distillation.
    Type: Grant
    Filed: May 10, 1994
    Date of Patent: June 20, 1995
    Assignee: Ciba-Geigy Corporation
    Inventors: Sameer H. Eldin, Robert P. Peyer, Frans Setiabudi
  • Patent number: 5420202
    Abstract: The present invention provides a toughened cycloaliphatic epoxy resin composition comprising:(a) a curable cycloaliphatic epoxy resin,(b) an epoxidized low viscosity polydiene polymer wherein the polymer contains from 2.0 to 6.0 milliequivalents of epoxy per gram of polymer, and(c) a curing agent.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: May 30, 1995
    Assignee: Shell Oil Company
    Inventors: David J. St. Clair, James R. Erickson
  • Patent number: 5332783
    Abstract: A compatible polymer blend comprising: a curable aromatic epoxy resin, an epoxidized polydiene polymer, and an anhydride or polycarboxylic acid curing agent. The invention also relates to structural adhesive compositions comprising cured compatible polymer blends as described.
    Type: Grant
    Filed: July 12, 1993
    Date of Patent: July 26, 1994
    Assignee: Shell Oil Company
    Inventors: Steven H. Dillman, Michael A. Masse, James R. Erickson
  • Patent number: 5332781
    Abstract: Storage-stable suspension comprised of a solid or liquid epoxy resin hardener and a solid or liquid toughener suspended therein is distinguished by excellent homogeneous dispersion of the toughener in the epoxy resin hardener and are suitable for preparing suspensions of curable epoxy resin compositions.
    Type: Grant
    Filed: June 22, 1993
    Date of Patent: July 26, 1994
    Assignee: Ciba-Geigy Corporation
    Inventors: Sameer H. Eldin, Robert P. Peyer, Frans Setiabudi
  • Patent number: 5317067
    Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.
    Type: Grant
    Filed: February 3, 1992
    Date of Patent: May 31, 1994
    Assignee: Tokyo Tire & Rubber Company Limited
    Inventors: Koji Yagi, Seiichi Fukunaga
  • Patent number: 5302666
    Abstract: A resin composition for fiber reinforced plastic comprising the following components A, B, C, D and E as essential components:A: a bisphenol A epoxy resin having an epoxy equivalent of at most 250 and being liquid at room temperature,B: a bisphenol A epoxy resin having an epoxy equivalent within a range of from 400 to 5,000 and softening point of from 60.degree. to 200.degree. C.,C: a phenol novolak type epoxy resin,D: a nitrile rubber, andE: a curing agent.
    Type: Grant
    Filed: January 4, 1991
    Date of Patent: April 12, 1994
    Assignee: Mitsubishi Kasei Corporation
    Inventors: Seiichi Hino, Jun Enda, Masaki Yamamoto
  • Patent number: 5280068
    Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.
    Type: Grant
    Filed: May 26, 1992
    Date of Patent: January 18, 1994
    Assignee: The B.F. Goodrich Company
    Inventors: Alan R. Siebert, Robert J. Bertsch
  • Patent number: 5276125
    Abstract: The present invention relates to heat-curable coating compositions containingA) a prepolymer having an average of 2-4 ketoxime-blocked NCO groups, having an average moleculer weight of 500-15,000 and prepared from aliphatic, cycloaliphatic and aromatic polyisocyanates and one or more polyhydroxy components which contain 0 to 30% by weight of ethylene oxide units andB) a crosslinking agent of the formula ##STR1## wherein R and R.sup.1 represent H or C.sub.1 -C.sub.4 -alkyl, the ratio of equivalents of blocked NCO groups in A) to NH.sub.2 groups in B) being 1.35:1 to 0.
    Type: Grant
    Filed: November 21, 1990
    Date of Patent: January 4, 1994
    Assignee: Bayer Aktiengesellschaft
    Inventors: Josef Pedain, Wilhelm Thoma, Walter Schroer, Waldemar Kling, Manfred Dietrich
  • Patent number: 5268435
    Abstract: A polyol resin substantially free of epoxy groups is useful as a coating material and is prepared by(i) reacting a bisphenol epoxy resin with a compound having one active hydrogen per molecule and optionally a bisphenol to form a polyol resin having secondary hydroxyl groups, and(ii) esterifying part of the secondary hydroxyl groups with a lactone or a monocarboxylic acid (ester) to form a polyol resin with graft-polymerized polyester moieties.
    Type: Grant
    Filed: June 12, 1991
    Date of Patent: December 7, 1993
    Assignees: Mitsui Petrochemical Industries, Ltd., Ricoh Company, Ltd.
    Inventors: Hideo Nakamura, Masaru Wakizaka, Yohzoh Yamamoto
  • Patent number: 5242980
    Abstract: A heat curable hot melt adhesive system is disclosed. The system uses an epoxy-crosslinking ethylene polymer component, a tackifier compatible therewith and an epoxy crosslinking agent having an epoxide functionality of at least 2. The ethylene polymer component may be either an ethylene copolymer of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid, or an ethylene copolymer of an ethylenically unsaturated alcohol used in combination with a dicarboxylic acid anhydride. The dicarboxylic acid anhydride and/or the epoxy can be encapsulated to inhibit premature crosslinking. The formulation is applied to a substrate surface as a hot melt at a moderate temperature, and subsequently cured by heating the adhesive composition to a higher curing temperature.
    Type: Grant
    Filed: November 2, 1992
    Date of Patent: September 7, 1993
    Assignee: Exxon Chemical Patents Inc.
    Inventor: Mun F. Tse
  • Patent number: 5229458
    Abstract: Powder coating compositions are provided including a thermosetting or thermoplastic particulate resinous material and as a flow modifier, a copolymer of maleic anhydride or a substituted maleic anhydride and a copolymerizable material selected from among cycloalkenes and aliphatic olefins, with said copolymer optionally chemically modified with a primary amine or alcohol. Such flow modifiers can provide the cured coating with recoat adhesion and crater control.
    Type: Grant
    Filed: October 21, 1991
    Date of Patent: July 20, 1993
    Assignee: PPG Industries, Inc.
    Inventors: Karl F. Schimmel, Paul H. Pettit, Jr.
  • Patent number: 5227243
    Abstract: Coating compositions which comprise: (i) a hydroxy-functional compound containing in the molecule an average of at least two hydroxyl groups; (ii) an anhydride-functional compound containing in the molecule an average of at least two cyclic carboxylic acid anhydride groups; and (iii) an epoxy-functional compound containing in the molecule an average of at least two cycloaliphatic epoxy groups, provide low temperature cure response and excellent durability.
    Type: Grant
    Filed: February 19, 1991
    Date of Patent: July 13, 1993
    Assignee: The Sherwin-Williams Company
    Inventors: Mohamad D. Shalati, James A. Marquart, John R. Babjak, Rodney M. Harris
  • Patent number: 5206289
    Abstract: The present invention relates to a rubber stock containing 0.1 to 10.0 phr of a polyhydric phenoxy resin. The polyhydric phenoxy resins may be used as a replacement for resorcinol and function as a methylene acceptor. The rubber stocks of the present invention exhibit improved tensile strength at break without the inherent fuming problems associated with resorcinol containing rubber stocks. These beneficial properties are obtained while maintaining high low strain stiffness and cord adhesion associated with resorcinol containing stocks.
    Type: Grant
    Filed: January 27, 1992
    Date of Patent: April 27, 1993
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: Mark S. Sinsky, Richard G. Bauer, Paul H. Sandstrom, Jerry L. Brenner
  • Patent number: 5140068
    Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.
    Type: Grant
    Filed: March 22, 1991
    Date of Patent: August 18, 1992
    Assignee: The B. F. Goodrich Company
    Inventors: Alan R. Siebert, Robert J. Bertsch
  • Patent number: 5140069
    Abstract: Curable compositions containingA) an epoxy resin having on average more than one epoxy group per molecule,B) a carboxylic anhydride curing agent for component A) andC) about 5 to 40% by weight, relative to the amount of the components A), B) and C), of a liquid mixture of C1) a polyalkylene glycol based on polypropylene glycol or polybutylene glycol having two to about six hydroxyl, carboxyl, carboxylic anhydride or glycidyl end groups and of C2) an elastomeric copolymer based on butadiene, a polar, ethylenically unsaturated comonomer and, if appropriate, further ethylenically unsaturated comonomers having carboxylic acid, hydroxyl, mercapto or glycidyl ether end groups are described. Components C1) and C2) can also occur together in a segmented copolymer.
    Type: Grant
    Filed: February 16, 1990
    Date of Patent: August 18, 1992
    Assignee: Ciba-Geigy Corporation
    Inventors: Rolf Mulhaupt, Werner Rufenacht
  • Patent number: 5110867
    Abstract: Polymeric materials comprising an interpenetrating network (IPN) prepared from allyl polymers and epoxy resins. The allyl polymers are crosslinked under the influence of a radical initiator, the epoxy resin is crosslinked by a curing agent. The curing agent is a cyclic anhydride containing a polymerizable double bond. The two networks are interlinked as a result of the double bond being involved in the curing reaction of the allyl polymers. The cyclic anhydride preferably is maleic anhydride. Preferred IPN's are prepared form triallylcyanurate or triallylisocyanurate-based allyl polymers and phenol-type epoxy resin.
    Type: Grant
    Filed: September 12, 1990
    Date of Patent: May 5, 1992
    Assignee: Akzo NV
    Inventors: Jan A. J. Schutyser, Antonius J. W. Buser, Pieter H. Zuuring, Hendrik J. Slots
  • Patent number: 5075378
    Abstract: A multifunctional coating composition comprising a fluorocarbon polymer, an epoxy resin and a fluorinated curing agent resulting in a fluorinated epoxy resin network with improved properties of corrosion resistance and hydrophobicity.
    Type: Grant
    Filed: June 24, 1987
    Date of Patent: December 24, 1991
    Assignee: The Standard Oil Company
    Inventors: Richard C. Smierciak, Paul J. Giordano
  • Patent number: 5043220
    Abstract: A substrate coated with a basecoat of a pigmented film-forming polymer and a clearcoat applied to the basecoat of a film-forming polymer wherein the clearcoat and/or the basecoat is a curable composition comprising(i) an acid-functional compound having an average of at least two carboxylic acid groups per molecule; and(ii) an anhydride-functional compound having an average of at least two cyclic carboxylic acid anhydride groups per molecule; and(iii) an epoxy-functional compound having an average of at least one epoxy group per molecule; and(iv) a hydroxy-functional compound having an average of at least two hydroxyl groups per molecule;wherein at least one of the compounds (i), (ii), (iii) or (iv) comprises a film forming polymer.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: August 27, 1991
    Assignee: The Sherwin-Williams Company
    Inventors: Mohamad D. Shalati, James A. Marquart, Sandra H. Angelo, Rodney M. Harris
  • Patent number: 5025067
    Abstract: An epoxy resin comprising an active hydrogen compound having at least three active hydrogen atoms capable of reacting with an epoxy group in its molecule or butadine or isoprene as a main monomer is modified with an oligomer having on average at least 1.5 equivalents of active hydrogen capable of reacting with an epoxy group in its molecule. An epoxy resin modified with a bisphenol and a compound having active hydrogen or acid anhydride groups capable of reacting with an epoxy group is also provided. A toner containing the epoxy resin as a binder is useful in electrostatography.
    Type: Grant
    Filed: November 16, 1988
    Date of Patent: June 18, 1991
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Yohzoh Yamamoto, Goro Suzuki, Hideo Nakamura, Kiyomi Yasuda
  • Patent number: 5017435
    Abstract: A coating composition useful for a finish for automobiles and trucks in which the film forming binder contains reactive binder components of about(a) 25-90% by weight, based on the weight of the binder, of an acrylic polymer having at least two reactive anhydride groups composed of polymerized monomers of an ethylenically unsaturated anhydride and polymerized monomers from the group consisting of alkyl methacrylate, alkyl acrylate and any mixtures thereof, wherein the alkyl groups have 1-8 carbon atoms and the polymer has a weight average molecular weight of about 2,000-50,000;(b) 5-50% by weight, based on the weight of the binder, of a glycidyl component having at least two reactive glycidyl groups;(c) 5-40% by weight, based on the weight of the binder, of a monomeric or oligomeric anhydride component; andthe composition contains about 0.1-5% by weight, based on the weight of the binder, of a catalyst.
    Type: Grant
    Filed: June 27, 1988
    Date of Patent: May 21, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Robert J. Barsotti, Lili W. Altschuler, Lee R. Harper
  • Patent number: 4959399
    Abstract: Poly(vinyl chloride) plastisol compositions modified with epoxy and acid anhydrides can be painted wet-on-wet with acid catalyzed, high solids enamel paints, followed by curing at 120.degree. C. or lower, to give strongly adherent products on electrodeposition coatings and dry, tack-free painted surface. The compositions are also stabilized by the addition of an imide, which provides storage stability at 40.degree. C. for more than three days.
    Type: Grant
    Filed: May 20, 1988
    Date of Patent: September 25, 1990
    Assignee: W. R. Grace & Co.-Conn.
    Inventor: Truc-Chi Huynh-Tran
  • Patent number: 4871803
    Abstract: The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.
    Type: Grant
    Filed: February 3, 1988
    Date of Patent: October 3, 1989
    Assignee: H. B. Fuller
    Inventors: John M. Zimmel, Pamela M. Klinkenberg, William L. Bunnelle, Keith C. Knutson
  • Patent number: 4871801
    Abstract: Thermoplastic polymers exhibiting improved physical properties and a method for preparing same are described. The method of preparing these polymer compositions comprises reacting a functionalized base polymer composition having pendant cyclic anhydride groups with a coreactive second moiety. Said functionalized base polymer comprises the reaction product of:I. a hydroxyl containing base polymer comprising the reaction product of:(a) a vinyl halide monomer; and(b) at least one other ethylenically unsaturated monomer having at least one pendant hydroxyl functional group; andII. a cyclic polyanhydride functionalizing agent.
    Type: Grant
    Filed: November 25, 1988
    Date of Patent: October 3, 1989
    Assignee: The B. F. Goodrich Company
    Inventor: Zaev Sharaby
  • Patent number: 4871806
    Abstract: Curable compositions which comprise:(i) an acid-functional compound having an average of at least two carboxylic acid groups per molecule; and(ii) an anhydride-functional compound having an average of at least two cyclic carboxylic acid anhdyride groups per molecule; and(iii) an epoxy-functional compound having an average of at least one epoxy group per molecule; and(iv) a hydroxy-functional compound having an average of at least two hydroxyl groups per molecule;wherein at least one of the compounds (i), (ii), (iii) or (iv) comprises a film forming polymer.
    Type: Grant
    Filed: November 16, 1987
    Date of Patent: October 3, 1989
    Assignee: The Sherwin-Williams Company
    Inventors: Mohamad D. Shalati, James A. Marquart
  • Patent number: 4782116
    Abstract: Homogeneous thermoset terpolymers which may be used in the preparation of laminates for circuitry boards will comprise a diepoxide of a polyether of a polyphenol, a dicyanate ester of a polyether of a polyphenol and an alkenyl aryl compound. The polymers are prepared by admixing a solution of the diepoxide of a polyether of a polyphenol and an alkenyl aryl compound with a second solution of the dicyanate ester of a polyether of a polyphenol and the alkenyl aryl compound at elevated temperatures. The resulting terpolymer will possess desirable characteristics such as high glass transition temperature and low dielectric constant.
    Type: Grant
    Filed: July 6, 1987
    Date of Patent: November 1, 1988
    Assignee: Allied-Signal Inc.
    Inventor: Mark D. Holte
  • Patent number: 4777213
    Abstract: Promoters for a crosslinking reaction involved in the curing of a system comprising crosslinkable polymers are bound to polymeric microparticles having a diameter of about 0.01 to 6 microns prepared by polymerizing a mixture of ethylenically unsaturated monomers. The microparticles carrying the crosslinking reaction promoter may be incorporated to coating compositions, printing inks, sealants, adhesives and other polymeric products in place of conventional crosslinking reaction promoters.
    Type: Grant
    Filed: March 2, 1987
    Date of Patent: October 11, 1988
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Kazunori Kanda, Shinichi Ishikura, Keizou Ishii, Akio Kashihara
  • Patent number: 4601944
    Abstract: Disclosed is a composition that includes a liquid prepolymer that is the reaction product of a monoanhydride, a cycloaliphatic epoxy, and an alcohol. Also included in the composition is a maleated polybutadiene that is a reaction product of butadiene, maleic anhydride, and an oxygen scavenger. The composition also includes a tertiary amine accelerator, a free-radical initiator, and a solvent. A prepreg is prepared from the composition by immersing a porous substrate into the composition, drying and curing to the B-stage. A laminate is prepared by forming a stack of prepregs and heating under pressure to the C-stage.
    Type: Grant
    Filed: June 5, 1985
    Date of Patent: July 22, 1986
    Assignee: Westinghouse Electric Corp.
    Inventor: Melvin P. Zussman
  • Patent number: 4601769
    Abstract: A method is described for stabilizing the viscosity of a liquid epoxy-anhydride system which is a blend of a liquid epoxy resin, a liquid anhydride curing agent and a quaternary ammonium salt promoter for an epoxy-anhydride reaction. This system is especially useful in the manufacture of tubing, piping and other geometric structures. The method employs at least one of the following modifications:(1) adding a minor amount of a solid epoxy resin to the liquid epoxy resin;(2) adding to the liquid anhydride a minor amount of solid anhydride of high reactivity;(3) adding to the epoxy-anhydride system a solid resinous particulate material in finely ground form which is capable of reacting with the epoxy resin and acid anhydride, and is soluble in the epoxy-anhydride system at temperatures below the gelation temperature; and(4) adding a metallo-organic compound which lowers the initiation temperature or accelerates the epoxy-anhydride reaction.
    Type: Grant
    Filed: September 27, 1985
    Date of Patent: July 22, 1986
    Inventor: Ronald L. DeHoff
  • Patent number: 4480056
    Abstract: An antifouling compound is formed of the esterification product of tributin oxide combined with the copolymer of styrene and maleic anhydride. An antifouling coating formulation is prepared by combining the esterification product with a selected blend of Bisphenol-A and novolac epoxies, fillers, pigment, solvent containing a ketone portion, and an amido amine based accelerator.
    Type: Grant
    Filed: June 29, 1981
    Date of Patent: October 30, 1984
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Albert R. Parks
  • Patent number: 4468497
    Abstract: A novel bis-imide matrix resin system especially useful for high temperature, high performance, graphite fiber composites is disclosed. Microcracking of composites is reduced and transverse strength is increased by the addition to the resin system of 1 to 15 percent of compatible elastomers, such as polyether sulfones, bis-phenol linear homopolymeric epoxies or polyacrylic esters. The resin system comprises 50 to 95 percent by weight of ethylenically unsaturated bis-imides, preferably a low melting mixture of a major portion of maleimides of aromatic amines with a minor portion of maleimides of an aliphatic amine and 5 percent to 35 percent by weight of a diunsaturated low-temperature cross-linking agent such as divinyl benzene which gels the bis-imide at low temperatures. Room temperature tackiness, heat resistance and cross-link density are improved by the presence of 1 to 10 percent of a trifunctional curing agent.
    Type: Grant
    Filed: January 24, 1983
    Date of Patent: August 28, 1984
    Assignee: Hitco
    Inventors: Sidney W. Street, Don A. Beckley
  • Patent number: 4454283
    Abstract: A novel bis-imide matrix resin system comprising 50 to 95 percent by weight of ethylenically unsaturated bis-imides, preferably a low melting mixture of a major portion of maleimides of aromatic amines such as toluene diamine and methylene dianiline with a minor portion of maleimide of an aliphatic amine such as trimethyl hexamethylene diamine and 5 percent to 35 percent by weight of a diunsaturated low-temperature cross-linking agent such as divinyl benzene which gels the bis-imide at low temperatures. This reduces stress between the matrix resin and the surface of the reinforcing fiber, thus reducing the tendency to form microcracks. Room temperature stability is improved by the presence of 0.5 to 5 percent of an oxidation inhibitor such as hydroquinone. The resin is useful as a matrix resin for high performance, graphite fiber reinforced composites.CROSS REFERENCE TO RELATED APPLICATIONThis application is a continuation of Ser. No. 248,978, filed Mar. 30, 1981, now U.S. Pat. No.
    Type: Grant
    Filed: January 24, 1983
    Date of Patent: June 12, 1984
    Assignee: HITCO
    Inventors: Sidney W. Street, Don A. Beckely
  • Patent number: 4436869
    Abstract: A process for the preparation of moldings, in particular resilient elements, which by virtue of a densified surface zone with substantially closed cells, have only a low water absorption, wherein a mixture comprising:(a) 100 parts by weight of an NCO-containing prepolymer, having an NCO content of from 3 to 6% by weight and based on organic diisocyanates and substantially linear polyester-polyols or polytetramethylene ether glycol,(b) from 0.5 to 1.6 parts by weight of water,(c) one or more catalysts, preferably a tertiary amine, in an amount of from 0.01 to 2.0 parts by weight and(d) assistants, with or without additives, is reacted in a closed mold, while undergoing densification, the surface temperature of the inner wall of the mold being from 50.degree. to 70.degree. C.
    Type: Grant
    Filed: March 30, 1982
    Date of Patent: March 13, 1984
    Assignee: Elastogran GmbH
    Inventors: Otmar Zipp, Heinz Bollmann, Herbert Stutz, Wolfgang Scholz
  • Patent number: 4388451
    Abstract: A copolymer formed by reacting maleic anhydride or a maleimide or a mixture of these with an allylphenol, a methallylphenol, or substituted allyl or methallylphenol. The anhydride polymers are characterized as having a 1:1 molar ratio of maleic anhydride to phenol or substituted phenol. The maleic anhydride copolymers are water soluble materials, useful as epoxy resin modifiers and curatives, as ion exchange resins or membranes, laminates, and detergent additives and builders. The maleimide containing copolymers are also useful as epoxy resin modifiers and useful in the production of laminates, composites and coatings.
    Type: Grant
    Filed: September 28, 1981
    Date of Patent: June 14, 1983
    Assignee: Ashland Oil, Inc.
    Inventors: Billy M. Culbertson, Larry K. Post, Ann E. Aulabaugh
  • Patent number: 4384093
    Abstract: Copolymers and terpolymers formed by reacting either 4,7-dihydro-1,3-dioxepins or 6,7-dihydro-1,3-dioxepins with maleic anhydride and/or a maleimide. The copolymers are characterized as linear, low molecular weight, water soluble alternating copolymers. These copolymers are useful as a water soluble polymer, as epoxy resin modifies and curing agents. The copolymers formed from 4,7-dihydro-1,3-dioxepins and maleic anhydride can be rearranged to form a poly (.gamma.
    Type: Grant
    Filed: April 15, 1981
    Date of Patent: May 17, 1983
    Assignee: Ashland Oil, Inc.
    Inventors: Billy M. Culbertson, Ann E. Aulabaugh
  • Patent number: 4376844
    Abstract: Resin-forming polyepoxides are mixed with polyoxazolidinyl compounds or polymers containing pendant oxazolidinyl groups in which the carbon atom in the 2-position of the heterocyclic ring is substituted with saturated hydrocarbon groups, such as dialkyl, or with an alkylene group forming a saturated ring with the carbon atom in the 2-position of the oxazolidinyl ring to form, in the absence of water, a stable composition which can be stored in closed containers for months without undergoing gelation. When such compositions are spread into films and the films exposed to moisture at ambient temperature, e.g., to ambient air having a relative humidity of at least 20% and temperature of about 15.degree. to 25.degree. C., the polymer serves to react with and cure the polyepoxide.
    Type: Grant
    Filed: January 20, 1982
    Date of Patent: March 15, 1983
    Assignee: Rohm and Haas Company
    Inventors: William D. Emmons, Wayne E. Feely
  • Patent number: 4351932
    Abstract: A novel bis-imide matrix resin system comprising 50 to 95 percent by weight of ethylenically unsaturated bis-imides, preferably a low melting mixture of a major portion of maleimides of aromatic amines with a minor portion of maleimide of an aliphatic amine and 5 percent to 35 percent by weight of a diunsaturated low-temperature cross-linking agent such as divinyl benzene which gels the bis-imide at low temperatures. This reduces stress between the matrix resin and the surface of the reinforcing fiber, thus reducing the tendency to form microcracks. Microcracking is further reduced and transverse strength is increased by the addition of 0 to 15% of compatible elastomers to the resin and cross-linking agent. Room temperature tackiness, heat resistance and cross-link density are improved by the presence of 0 to 10% of a trifunctional curing agent.
    Type: Grant
    Filed: March 27, 1980
    Date of Patent: September 28, 1982
    Assignee: Hitco
    Inventors: Sidney W. Street, Don A. Beckley
  • Patent number: 4308356
    Abstract: Resin-forming polyepoxides are mixed with polyoxazolidinyl compounds or polymers containing pendant oxazolidinyl groups in which the carbon atom in the 2-position of the heterocyclic ring is substituted with saturated hydrocarbon groups, such as dialkyl, or with an alkylene group forming a saturated ring with the carbon atom in the 2-position of the oxazolidinyl ring to form, in the absence of water, a stable composition which can be stored in closed containers for months without undergoing gelation. When such compositions are spread into films and the films exposed to moisture at ambient temperature, e.g., to ambient air having a relative humidity of at least 20% and temperature of about 15.degree. to 25.degree. C., the polymer serves to react with and cure the polyepoxide.
    Type: Grant
    Filed: January 30, 1980
    Date of Patent: December 29, 1981
    Assignee: Rohm and Haas Company
    Inventors: William D. Emmons, Wayne E. Feely
  • Patent number: 4265803
    Abstract: The invention entitled "Polymers containing polyalkylpiperidines and use thereof as stabilizers" provides a class of polymers in which groups containing sterically hindered polyalkylpiperidines are linked in the main chain of the polymers via bridging members containing 2-hydroxy-1,3-trimethylene groups.The polymers show superior stabilizing effects for various synthetic polymers such as polyolefins against degradation thereof induced by light and/or heat. The polymers have advantages, as compared with known stabilizer compounds, that they hardly volatile upon processing with heating or during storage of articles containing thereof, and that they are resistant to extraction with solvents from articles containing thereof.
    Type: Grant
    Filed: August 7, 1978
    Date of Patent: May 5, 1981
    Assignee: Sankyo Company Limited
    Inventors: Nobuo Soma, Syoji Morimura, Takao Yoshioka, Tomoyuki Kurumada
  • Patent number: 4163097
    Abstract: The invention relates to organic polymers which can be crosslinked under the action of light and which are suitable for carrying out photomechanical processes. These polymers are photochemically considerably more sensitive than known comparable polymers and their sensitivity can additionally also be further increased by means of a combination with sensitizers. The molecular weight is at least 1,000. The polymers contain, as light-sensitive groups, groups of the formula I ##STR1## wherein R and R.sub.1 independently of one another denote alkyl groups with at most 4 C atoms, or R and R.sub.1 conjointly denote the remaining part of a 5-membered to 6-membered carbocyclic ring.
    Type: Grant
    Filed: December 27, 1977
    Date of Patent: July 31, 1979
    Assignee: Ciba-Geigy Corporation
    Inventors: Niklaus Baumann, Hans Zweifel, Marcus Bauman, John S. Waterhouse