Abstract: A resin composition including a thermoplastic resin, glass balloons, and silica particles, wherein a ratio of a content of the glass balloons is 10% by mass or more and 30% by mass or less when a total content of the thermoplastic resin and the glass balloons is 100% by mass, and a ratio of a content of the silica particles is 0.02 parts by mass or more and 5 parts by mass or less when the total content of the thermoplastic resin and the glass balloons is 100 parts by mass.

Abstract: A blow molded part is provided that includes a first portion consisting of a reinforced resin and a second portion consisting of a non-reinforced resin. The reinforced resin may be fiber-reinforced, and the non-reinforced resin may be a neat resin. In one form, the first portion and the second portion define first and second trim areas, respectively, and the second trim area is directly recyclable. In another form, the second portion comprises a material consisting of a non-reinforced resin and/or a reinforced resin, where the modulus of elasticity of the first portion is higher than the modulus of elasticity of the second portion. Furthermore, a method of forming a blow molded part is provided.

Abstract: A quaternary ammonium compound represented by the following formula (1): [(R1)m(R2)4-mN+]nXn???(1) wherein each R1 independently represents an unsubstituted alkyl group or substituted alkyl group having 1 to 30 carbon atoms; an aryl group having 6 to 20 carbon atoms; an aralkyl group where an unsubstituted alkyl group or substituted alkyl group having 1 to 30 carbon atoms is substituted with at least one aryl group having 6 to 20 carbon atoms; or an alkylaryl group where an aryl group having 6 to 20 carbon atoms is substituted with at least one unsubstituted alkyl group or substituted alkyl group having 1 to 30 carbon atoms; each R2 independently represents a group having 2 to 60 carbon atoms and 2 to 30 oxygen atoms, the group represented by the following formula: —(RO)k-H, wherein R represents a substituted or unsubstituted alkyl group and k represents a natural number of 2 or more.

Abstract: Provided is a thermoplastic resin composition for a radar cover which exhibits excellent mechanical properties as well as a good balance between electromagnetic reflection loss and electromagnetic penetration loss, which is required for a radar protection, by including 85 wt % to 95 wt % of a thermoplastic resin, 1 wt % to 5 wt % of carbon nanotubes, and 3 wt % to 10 wt % of carbon black, wherein a weight ratio of the carbon nanotubes to the carbon black is in a range of 3:7 to 1:7.

Abstract: The embodiments herein relate to a benzoxazine resin composition, a prepreg, and a carbon fiber-reinforced composite material. More specifically, the embodiments herein relate to a benzoxazine resin composition that provides a carbon fiber-reinforced composite material that is suitable for use as a manufacture material due to its superior mechanical strength in extreme use environments, such as high temperature and high moisture, as well as a prepreg, and a carbon fiber-reinforced composite material. An embodiment comprises a benzoxazine resin composition having a multifunctional benzoxazine resin; a multifunctional epoxy resin that is a liquid at 40° C. and has three or more glycidyl groups; a sulfonate ester; and optionally at least one thermoplastic resin. The resin may include an interpenetrating network structure after curing.

Abstract: At least two or more components of thermoplastic resins are compounded by chaotic mixing to form a polymer alloy with a sophisticatedly controlled dispersed phase structure. In the polymer alloy, a dispersed phase having a non-periodic structure with a correlation length of 0.001 ?m to 0.5 ?m and having a compactness (C) of 0.05?(C)?0.8, wherein the compactness (C) can form a molded product that also has transparency while maintaining the original good heat resistance or mechanical properties of the resins blended.

Abstract: Methods and formulations for distortional thermosets are disclosed that display enhanced composite mechanical performances and robust sorption resistance. The composition includes an epoxy resin of formula (I): and a diamine curing agent. The resultant distortional thermoset compositions possess superior out-life requirements and advantageous reaction kinetics for preparing prepreg compositions and materials.

Abstract: A film is used as a TAB leader tape. The film comprises 45 parts by mass or more of a polyphenylene ether-based resin and 55 parts by mass or less of at least one component selected from a thermoplastic resin and a plasticizer based on 100 parts by mass of the film. The film optionally includes inorganic filler and other additional components.

Abstract: A thermoplastic composition comprises: a compatibilized blend of a poly(arylene ether), an aliphatic-aromatic polyamide and a polymeric compatibilizer; and an impact modifier; wherein the aliphatic-aromatic polyamide is composed of units derived from a dicarboxylic acid and units derived from a diamine and the units derived from a dicarboxylic acid comprise 60 to 100 mol % of units derived from terephthalic acid and the units derived from a diamine comprise 60 to 100 mol % of units derived from 1,9-nonanediamine, 2-methyl-1,8-octanediamine, or a combination of 1,9-nonanediamine and 2-methyl-1,8-octanediamine.

Abstract: A curing agent composition for a water-soluble phenol resin used to produce a mold, which comprises a branched ester compound that is derived from a carboxylic acid having a branched chain, and an alcohol, and has 5 to 13 carbon atoms.

Abstract: Thermoplastic compositions having miscible and compatible immiscible polymer blends are disclosed. The miscible polymer blends have a single glass transition temperature. The compatible polymer blends have two glass transition temperatures.

Abstract: A fiber comprises a composition including a poly(phenylene ether). The poly(phenylene ether) has less than or equal to 240 parts per million by weight of hydroxyl groups associated with ethylene bridge groups and less than or equal to 800 parts per million by weight of hydroxyl groups associated with rearranged backbone groups, both amounts based on the weight of the poly(phenylene ether). A method of spinning a fiber from the poly(phenylene ether) is disclosed. The fiber can be spun at a low denier.

Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.

Abstract: Described are polyesters comprising (a) a dicarboxylic acid component comprising 80 to 100 mole % terephthalic acid residues; optionally, 0 to 20 mole % aromatic dicarboxylic acid residues or aliphatic dicarboxylic acid residues; 20 to 30 mole % of 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues; and 70 to 80 mole % 1,4-cyclohexanedimethanol residues. The polyesters may be manufactured into articles such as fibers, films, bottles or sheets.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A thermoplastic composition is prepared by melt blending a poly(arylene ether) and an other resin, where the poly(arylene ether) has a particular molecular weight distribution. The thermoplastic composition exhibits significantly increased melt flow compared to compositions containing poly(arylene ether)s with similar intrinsic viscosities but different molecular weight distributions. The increased melt flow facilitates preparation of the thermoplastic composition and subsequent article fabrication procedures.

Abstract: A poly(phenylene ether)-poly(hydroxy ether) block copolymer is used to compatibilize blends of polar polymers and non-polar polymers. The resulting compatibilized blends exhibit physical property improvements relative to blends without a compatibilizer and blends with a poly(hydroxy ether).

Abstract: Described are polyesters comprising (a) a dicarboxylic acid component comprising terephthalic acid residues; optionally, aromatic dicarboxylic acid residues or aliphatic dicarboxylic acid residues; 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues; and cyclohexanedimethanol residues. The polyesters have a desirable combination of inherent viscosity and glass transition temperature (“Tg”). The polyesters can have an inherent viscosity from 0.35 to 1.2 dL/g as determined in 60/40 (wt/wt) phenol/tetrachloroethane at a concentration of 0.5 g/100 ml at 25° C. and a Tg of 85 to 115° C. The polyesters may be manufactured into articles such as fibers, films, bottles or sheets.

Abstract: The invention is generally directed to baby bottles and other articles produced by blow molding from polymeric materials having glass transition temperatures ranging from 100° C. to 130° C., as well as to processes for producing them. These articles can be exposed to boiling water and can be produced by using a suitable combination of a stretch ratio of less than 3 and a preform temperature at least 20° C. greater than the glass transition temperature (Tg) of the polymeric material.

Abstract: A sterilized article comprising a hydrogen peroxide plasma or hydrogen peroxide vapor sterilized polymer composition, the polymer composition comprising from 20 to 80 weight % of a polyphenylene ether sulfone; and from 20 to 80 weight % of a polyetherimide. When sterilized with a hydrogen peroxide plasma, or hydrogen peroxide vapor, the articles have surprisingly improved resistance to changes in color and clarity as well as resistance to loss of mechanical properties.

Abstract: The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E).

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: Methods of making miscible and compatible immiscible polymer blends are disclosed. The polymer blends have a polyimide as a component. The miscible polymer blends have a single glass transition temperature. The compatible polymer blends have two glass transition temperatures. The polymer blends may optionally include one or more fillers.

Abstract: Disclosed are random copoly(phosphonate carbonate)s with the high molecular weight and narrow molecular weight distribution exhibiting a superior combination of properties compared to prior art.

Abstract: Provided is a pigment dispersant for improving the dispersibility of an azo pigment for a water-insoluble solvent. More specifically, provided is a polyester, including at least one unit represented by one of the following formula (1) and the following formula (2): in the formula (1) and the formula (2): R1 represents an alkyl group having 1 to 6 carbon atoms or a phenyl group; R2 to R6 each represent a hydrogen atom, a COOR7 group, or a CONR8R9 group, provided that at least one of the R2 to R6 represents the COOR7 group or the CONR8R9 group; and the R7 to R9 each represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.

Abstract: Embodiments include methods of forming a composite. The methods can include providing a foam core, wherein the foam core includes a foam having a softening point of 90° C. to 110° C., covering a portion of the foam core with a prepreg, contacting the prepreg that covers the portion of the foam core with a curable composition, and curing the prepreg and the curable composition to form the composite, wherein the prepreg insulates the foam core during the curing so that the foam maintains a temperature that is below the softening point. Embodiments include a composite obtained by curing the prepreg and the curable composition. Embodiments include B-stageable formulation having a resin component and a hardener component.

Abstract: A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

Abstract: Described are polyester compositions comprising at least one polyester which comprises terephthalic acid residues, 2,2,4,4-tetramethyl-l,3-cyclobutanediol, and 1,4-cyclohexanedimethanol, wherein the inherent viscosity of said polyester is from 0.55 to 0.68 dL/g as determined in 60/40(wt/wt) phenol/tetrachloroethane at a concentration of 0.5 g/100 ml at 25° C.; wherein said polyester has a Tg from 110 to 160° C.; wherein the polyester composition comprises no polycarbonate; wherein the melt viscosity of the polyester is less than 10,000 poise as measured at 1 radian/second on a rotary melt rheometer at 290° C.; and wherein the polyester has a notched Izod impact strength, of at least 7.5 ft-lb/in.ch at 23° C. according to ASTM D256 with a 10-mil notch in a ? inch thick bar. The polyesters may be manufactured into articles of manufacture as fibers, films, bottles or sheets.

Abstract: Thermoplastic compositions having miscible and compatible immiscible polymer blends are disclosed. The miscible polymer blends have a single glass transition temperature. The compatible polymer blends have two glass transition temperatures.

Abstract: Embodiments of the present disclosure include polycyclopentadiene compounds represented by Formula (I): in which each X is either a hydrogen or a cyano group (N?C—), n has an average value from zero to 20; each m independently has a value of zero to 3; p has a value of zero to 20; each R is independently a halogen, a nitrile group, a nitro group, an alkyl group, an alkoxy group, an alkenyl group, or an alkenyloxy group, where the alkyl group, the alkoxy group, the alkenyl group, and the alkenyloxy group each independently contain 1 to 6 carbon atoms; and each Q is independently hydrogen or an alkyl group containing 1 to 6 carbon atoms. Embodiments of the present disclosure also include a curable composition that includes the polycyclopentadiene compound(s) of Formula (I) and a curing amount of a resin or a catalyst amount of a catalyst and/or a cure accelerating amount of an accelerating agent.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: There are provided a thermoplastic resin composition excellent in a balance between fluidity and low outgassing, and a molded product and a sheet including the thermoplastic resin composition. The thermoplastic resin composition may include from 70 to 99% by mass of (A) a polyphenylene ether, from 1 to 30% by mass of (B) a copolymer including an aromatic vinyl compound and an unsaturated dicarboximide derivative as constituent monomers, and from 0 to 20% by mass of (C) a copolymer including an aromatic vinyl compound and a cyanided vinyl compound as constituent monomers, based on 100% by mass of the total of the (A) component, the (B) component and the (C) component, wherein the (B) component has a weight-average molecular weight of from 70,000 to 250,000.

Abstract: The present invention provides a polyamide-polyphenylene ether resin composition comprising a polyamide having an alicyclic structure and composed of dicarboxylic acid units comprising from 20 to 100 mol % of cyclohexanedicarboxylic acid units and diamine units comprising aliphatic diamine units with from 6 to 12 carbon atoms, a polyphenylene ether, and a compatibilizer for a polyamide and a polyphenylene ether.

Abstract: Described are container(s) comprising polyesters comprising (a) a dicarboxylic acid component comprising terephthalic acid residues; optionally, aromatic dicarboxylic acid or aliphatic dicarboxylic acid residues; and (b) a glycol component comprising 15 to 50 mole % 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues and 50 to 85 mole % 1,4-cyclohexanedimethanol residues; wherein the total mole % of said dicarboxylic acid component is 100 mole %, and the total mole % of said glycol component is 100 mole %; wherein the inherent viscosity of the polyester is from 0.50 to 0.75 dL/g as determined in 60/40 (wt/wt) phenol/tetrachloroethane at a concentration of 0.5 g/100 ml at 25° C.; wherein said polyester has a notched Izod impact strength of at least 7.5 ft-lb/inch at 23° C. according to ASTM D256 with a 10-mil notch in a 1/8-inch thick bar; and wherein the melt viscosity of said polyester is less than 10,000 poise as measured at 1 radian/second on a rotary melt rheometer at 290° C.

Abstract: To provide a structure material having excellent mechanical characteristics and a functional material having excellent regularity, provided are a polymer alloy which is composed of at least two components of thermoplastic resins and of which the structure can be controlled finely and evenly dispersed and a production method of the polymer alloy. With respect to a polymer alloy composed of at least two or more components of thermoplastic resins, a precursor (A) of at least one thermoplastic resin among the thermoplastic resin components composing the polymer alloy is chemically reacted in the co-presence of the remaining thermoplastic resin component (B1) and/or a precursor (B2) of the thermoplastic resin component to induce spinodal decomposition, so that it is made possible to obtain a polymer alloy having excellent regularity and of which the structure is finely controllable and the structure is evenly dispersed.

Abstract: Described as one aspect of the invention are polyester compositions containing: (I) at least one polyester which comprises: (a) dicarboxylic acid component comprising: (i) 70 to 100 mole % of terephthalic acid residues; (ii) 0 to 30 mole % of aromatic dicarboxylic acid residues having up to 20 carbons atoms; and (iii) 0 to 10 mole % of aliphatic dicarboxylic acid residues having up to 16 carbon atoms; and (b) a glycol component comprising: (i) 1 to 99 mole % of 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues; and (ii) 1 to 99 mole % of cyclohexanedimethanol residues; and (II) at least one thermal stabilizer chosen from at least one alkyl phosphate esters, aryl phosphate esters, mixed alkyl aryl phosphate esters, reaction products thereof, and mixtures thereof; wherein the total mole % of the dicarboxylic acid component is 100 mole %, and wherein the total mole % of the glycol component is 100 mole %.

Abstract: The invention is generally directed to baby bottles and other articles produced by blow molding from polymeric materials having glass transition temperatures ranging from 100° C. to 130° C., as well as to processes for producing them. These articles can be exposed to boiling water and can be produced by using a suitable combination of a stretch ratio of less than 3 and a preform temperature at least 20° C. greater than the glass transition temperature (Tg) of the polymeric material.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: Methods of making miscible and compatible immiscible polymer blends are disclosed. The polymer blends have a polyimide as a component. The miscible polymer blends have a single glass transition temperature. The compatible polymer blends have two glass transition temperatures.

Abstract: A thermoplastic polymer composition capable of exhibiting excellent impact resistance, durability and destaticizing property containing (A) 50 to 95% by mass of an aliphatic polyester-based resin and (B) 5 to 50% by mass of a block copolymer of (B1) a hard segment block with at least one of a polyamide, polyester, polyolefin or polyurethane, and (B2) a soft segment block having an ether bond.

Abstract: A thermoplastic composition comprising recovered poly(arylene ether), less than or equal to 0.1 weight percent based on the total weight of the thermoplastic composition of a second recovered thermoplastic that gives off greater than or equal to 10 percent by mass of volatiles at a processing temperature for the thermoplastic composition; 0.025 to 4.0 weight percent, based on the total weight of the thermoplastic composition, of a third recovered thermoplastic selected from the group consisting of polyolefin, acrylonitrile-butadiene-styrene, polycarbonate, polycarbonate/acrylonitrile-butadiene-styrene blend, polymethyl methacrylate, polyamide, polyester, polycarbonate/polyester blend and combinations of two or more of the foregoing third recovered thermoplastics, wherein combinations of two or more of the foregoing third recovered thermoplastics are present in an amount of less than or equal to 10 weight percent, based on the total weight of the thermoplastic composition; and an optional virgin thermoplastic.

Abstract: Absorbable polyurethanes, polyamides and polyester urethanes prepared from at least one compound selected from: or the corresponding diamines or diisocyanates thereof, wherein each X independently represents —CH2COO—, —CH(CH3)COO—, —CH2CH2OCH2COO—, —CH2CH2CH2CH2CH2COO—, —(CH2)yCOO— where y is 2 to 4 or 6 to 24, or —(CH2CH2O)z?CH2COO— where z? is 2 to 24; each Y represents —COCH2O—, —COCH(CH3)O—, —COCH2OCH2CH2O—, —COCH2CH2CH2CH2CH2O—, —CO(CH2)mO— where m is 2 to 4 or 6 to 24, or —COCH2O(CH2CH2O)n— where n is 2 to 24; R? is hydrogen, benzyl or straight-chained or branched alkyl; p is 1 to 4; and Rn represents one or more members selected from H, alkoxy, benzyloxy, aldehyde, halogen, carboxylic acid and —NO2, which is attached directly to an aromatic ring or attached through an aliphatic chain. Absorbable polymers prepared from these compounds are useful for drug delivery, tissue engineering, tissue adhesives, adhesion prevention and other implantable medical devices.

Abstract: Described as one aspect of the invention are polyester compositions containing: (I) at least one polyester which comprises: (a) a dicarboxylic acid component comprising: (i) 70 to 100 mole % of terephthalic acid residues; (ii) 0 to 30 mole % of aromatic dicarboxylic acid residues having up to 20 carbon atoms; and (iii) 0 to 10 mole % of aliphatic dicarboxylic acid residues having up to 16 carbon atoms; and (b) a glycol component comprising: (i) 1 to 99 mole % of 2,2,4,4-tetramethyl-1,3 -cyclobutanediol residues; and (ii) 1 to 99 mole % of cyclohexanedimethanol residues; and (II) at least one thermal stabilizer chosen from at least one of alkyl phosphate esters, aryl phosphate esters, mixed alkyl aryl phosphate esters, reaction products thereof, and mixtures thereof; wherein the total mole % of the dicarboxylic acid component is 100 mole %, and wherein the total mole % of the glycol component is 100 mole %.

Abstract: Described are restaurant smallware, comprising polyester based composition, comprising dicarboxylic acid component as terephthalic acid residues and optionally, aromatic dicarboxylic acid residues or aliphatic dicarboxylic acid residues and glycol component, comprising 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues and cyclohexanedimethanol residues. The polyester composition has the inherent viscosity from 0.55 to 0.0.68 dL/g as determined in 60/40 (wt/wt) phenol/tetrachloroethane at a concentration of 0.5 g/100 ml at 25° C., glass transition temperature Tg of 110° C. to 160° C., notched Izod impact strength of at least 7.5 ft-lb/inch at 23° C. according to ASTM D256 with a 10-mil notch in a ?-inch thick bar, melt viscosity is less than 10,000 poise as measured at 1 radian/second on a rotary melt rheometer at 290° C. and does not contain polycarbonate.

Abstract: The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.

Abstract: A poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst has a monomodal molecular weight distribution with a reduced content of very high molecular weight species. It also exhibits increased morpholine incorporation in the high molecular weight fraction. Compared to commercially available poly(2,6-dimethyl-1,4-phenylene ether) prepared using a di-n-butylamine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits reduced odor. Compared to other poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits improved molecular weight build during compounding and improved compatibilization with polyamides.

Abstract: Described are film or sheet, comprising polyester based composition, comprising dicarboxylic acid component as terephthalic acid residues and optionally, aromatic dicarboxylic acid residues or aliphatic dicarboxylic acid residues and glycol component, comprising 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues and cyclohexanedimethanol residues. The polyester composition has the inherent viscosity from 0.55 to 0.68 dL/g as determined in 60/40 (wt/wt) phenol/tetrachloroethane at a concentration of 0.5 g/100 ml at 25° C., glass transition temperature Tg of 110° C. to 160° C., notched Izod impact strength of at least 7.5 ft-lb/inch at 23° C. according to ASTM D256 with a 10-mil notch in a ?-inch thick bar, melt viscosity is less than 10,000 poise as measured at 1 radian/second on a rotary melt rheometer at 290° C. and does not contain polycarbonate.

Abstract: Described are polyester compositions comprising at least one polyester which comprises terephthalic acid residues in the amount from 80 to 100 mole %, 2,2,4,4-tetramethyl-1,3- cyclobutanediol in the preferable amount from 30 to 40 mole % and 1,4-cyclohexanedimethanol in the preferable amount from 60 to 70 mole % , wherein the total mole % of the dicarboxylic acid component is 100 mole %, and the total mole % of the glycol component is 100 mote %; and the inherent viscosity of polyester is from 0.55 to 0.68 dL/g as determined in 60/40 (wt/wt) phenol/tetrachtoroethane at a concentration of 0.5 g/100 ml at 25° C., polyester has a Tg from 110 to 160° C. and polyester composition comprises no polycarbonate. The polyesters may be manufactured into articles such as fibers, films, bottles or sheets.

Abstract: Described are articles, comprising polyester based composition, comprising dicarboxylic acid component as terephthalic acid residues and optionally, aromatic dicarboxylic acid residues or aliphatic dicarboxylic acid residues and glycol component, comprising 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues and cyclohexanedimethanol residues. The polyester composition has the inherent viscosity from 0.60 to 0.75 dL/g as determined in 60/40 (wt/wt) phenol/tetrachloroethane at a concentration of 0.5 g/100 ml at 25° C., glass transition temperature Tg of 100° C. to 130° C., notched Izod impact strength of at least 7.5 ft-lb/inch at 23° C. according to ASTM D256 with a 10-mil notch in a ?-inch thick bar, melt viscosity is less than 10,000 poise as measured at 1 radian/second on a rotary melt rheometer at 290° C. and does not contain polycarbonate. Composition can be manufactured into articles as fibers, films, bottles or sheets.