Mixed With Carboxylic Acid Or Derivative Reactant Or Polymer Derived Therefrom Patents (Class 525/397)
  • Patent number: 6465083
    Abstract: A modified cyanate ester group curable resin composition, and varnishes, prepregs, laminated boards adhered with metal foil, films, printed circuit boards, and multilayered circuit boards using the same, comprising: (A) a cyanate ester group compound expressed by chemical formula (1), (where, R1 is and respective of and R2 and R3 is any one of hydrogen or methyl group, and the both can be the same or different from each other, (B) a monovalent phenolic group compound expressed by chemical formula (2), or formula (3), where R4 and R5 is any one of hydrogen atom or low alkyl group having 1 to 4 carbon atoms, and the both can be the same or different from each other, n is a positive integer of 1 or 2.  (where, R6 is or  (C) a polyphenylene ether resin,  (D) a flame retardant not reactive with the cyanate ester group compound, and  (E) a metal group reaction catalyst.
    Type: Grant
    Filed: September 20, 2000
    Date of Patent: October 15, 2002
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeo Sase, Yasuyuki Mizuno, Takeshi Sugimura, Harumi Negishi
  • Patent number: 6441104
    Abstract: The present invention provides: a process for producing a high molecular weight thermoplastic resin composition, which can give the high molecular weight thermoplastic resin composition with good reproducibility and stably; and uses of the resultant resin composition. The process for producing a high molecular weight thermoplastic resin composition comprises the step of mixing a thermoplastic resin with pyromellitic dianhydride to carry out a reaction therebetween to convert the thermoplastic resin into a high molecular weight one, and this process is characterized in that the pyromellitic dianhydride has at least one of the following properties in particle form: (1) intrinsically linear or needle-like particle forms; (2) a bulk density of 0.4˜0.9 g/ml; and (3) a rest angle of 50˜70 degrees.
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: August 27, 2002
    Assignee: Nippon Shokubai Co., Ltd.
    Inventor: Hiroyuki Ishida
  • Patent number: 6420491
    Abstract: A catayltic process for the hydrogenation of aromatic polymers is disclosed. The catalyst used in the process is a metal or mixture of metals of sub-group VIII of the periodic table together with a support of silicon dioxide, aluminum oxide or a mixture thereof. The catalyst, having pores is characaterized in that the pores having diameters of 100 to 1,000 Å constitute less than 15 percent of the total volume of pores. The hydrogenation, that is carried out in the presence of at least one oxygen-containing hydrocarbon is characterized in that it is essentially complete and without significant degradation of molecular weights.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: July 16, 2002
    Assignee: Bayer Aktiengesellschaft
    Inventors: Volker Wege, Johann Rechner, Eberhard Zirngiebl
  • Patent number: 6417274
    Abstract: The invention relates to a novel process for preparing functionalized PPE, the process comprising oxidative coupling in a reaction solution at least one monovalent phenol species using an oxygen containing gas and a complex metal catalyst to produce a PPE; and functionalizing the PPE prior to and/or during at least one isolation step for devolatilization of the reaction solvent. The invention also relates to the polyphenylene ether resin made by the process as well as blends and articles containing the polyphenylene ether resin made by the process.
    Type: Grant
    Filed: February 5, 1999
    Date of Patent: July 9, 2002
    Assignee: General Electric Co.
    Inventors: Adrianus J. F. M. Braat, Rene de Jongh, Juraj Liska
  • Patent number: 6414084
    Abstract: High flow polyphenylene ether formulations are obtained with the addition of dendritic polymers. High flow is also obtained with the addition of dendritic polymers to flame retardant polyphenylene ether formulations.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: July 2, 2002
    Assignee: General Electric Company
    Inventor: Adeyinka Adedeji
  • Publication number: 20020062001
    Abstract: The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.
    Type: Application
    Filed: December 18, 2001
    Publication date: May 23, 2002
    Inventors: Adrianus J.F.M. Braat, Herbert Shin-I Chao, Hua Guo, Juraj Liska, Gary William Yeager
  • Publication number: 20020055596
    Abstract: The above described deficiencies and drawbacks are overcome by the process for making poly(arylene ether)-polyamide compositions which comprise about 10 weight percent (wt %) to about 90 wt % poly(arylene ether), about 90 wt % to about 10 wt % polyamide, about 0.01 wt % to about 10 wt % compatibility modifier, and optionally other additives known in the art. The process comprises several components which can be employed singly or in combination, namely: utilizing resins and additives that are substantially free of gaseous oxygen (air-free; e.g. less than about 1.0 vol % oxygen preferred, and less than about 0.5 vol % oxygen especially preferred, and less than about 0.05 vol % especially preferred); melting and compounding under an atmosphere which is substantially air-free; adding up to 20 wt % of polyamide to the poly(arylene ether) before compounding; when employing an extruder with an atmospheric vent, operating with the atmospheric vent open; and performing the injection molding under an inert atmosphere.
    Type: Application
    Filed: November 16, 2001
    Publication date: May 9, 2002
    Inventors: Piet J. Bolluijt, Jasper R. Bouma, Herve Cartier, Ulrich Hofmann, Jan P. H. Keulen, Christiaan Henricus Koevoets, Eric Reitjens, Peter O. Stahl, Geert Tamboer, Werner Woerhle
  • Patent number: 6384176
    Abstract: The invention relates to a novel process for the manufacture of polyphenylene ether resin containing residual aliphatic unsaturation. The invention also relates to the polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, and thermoplastics such as polyolefins.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: May 7, 2002
    Assignee: General Electric Co.
    Inventors: Adrianus J. F. M. Braat, Herbert Shin-I Chao, Hua Guo, Juraj Liska, Gary William Yeager
  • Patent number: 6369183
    Abstract: A composition of matter, comprising: a chemically functionalized carboxylate-alumoxane that is functionalized with a chemically reactive substituent, and a reactive compound, wherein the chemically reactive substituent reacts with the reactive compound so as to link the carboxylate-alumoxane to the reactive compound and form a polymer matrix. The functional groups on the carboxylate-alumoxane can vary depending on the desired properties of the matrix. Also, the composition of matter may comprise a cross-linked matrix in which the cross-linked components consist of functionalized alumoxanes.
    Type: Grant
    Filed: August 13, 1998
    Date of Patent: April 9, 2002
    Assignee: Wm. Marsh Rice University
    Inventors: Ronald Lee Cook, Andrew Ross Barron, Kevin Joseph Gleason, David Brent MacQueen, Georgette Laila Siparsky, Yoshihiro Koide, Cullen Taylor Vogelson
  • Patent number: 6365677
    Abstract: The above described deficiencies and drawbacks are overcome by the process for making poly(arylene ether)-polyamide compositions which comprise about 10 weight percent (wt %) to about 90 wt % poly(arylene ether), about 90 wt % to about 10 wt % polyamide, about 0.01 wt % to about 10 wt % compatibility modifier, and optionally other additives known in the art. The process comprises several components which can be employed singly or in combination, namely: utilizing resins and additives that are substantially free of gaseous oxygen (air-free; e.g. less than about 1.0 vol % oxygen preferred, and less than about 0.5 vol % oxygen especially preferred, and less than about 0.05 vol % especially preferred); melting and compounding under an atmosphere which is substantially air-free; adding up to 20 wt % of polyamide to the poly(arylene ether) before compounding; when employing an extruder with an atmospheric vent, operating with the atmospheric vent open; and performing the injection molding under an inert atmosphere.
    Type: Grant
    Filed: March 1, 2000
    Date of Patent: April 2, 2002
    Assignee: General Electric
    Inventors: Piet J. Bolluijt, Jasper R. Bouma, Herve Cartier, Ulrich Hofmann, Jan P. Keulen, Christian Henricus Koevoets, Eric Rietjens, Peter O. Stahl, Geert Tamboer, Werner Woerhle
  • Patent number: 6362263
    Abstract: Impact modified, compatibilized poly(phenylene ether)-polyamide compositions containing either a polybutene or an organosiloxane mixture give molded parts with good surface appearance, improved flow at high shear rate, and improved low temperature impact strength in comparison to control blends without added organosiloxane mixture or polybutene.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: March 26, 2002
    Assignee: General Electric Company
    Inventors: Sterling Bruce Brown, Norberto Silvi, Mark Howard Giammattei, Navjot Singh, Farid Fouad Khouri
  • Patent number: 6353050
    Abstract: A thermoplastic composition comprising a poly(arylene ether), a polyamide, a compatibilizing agent, and a polyester ionomer exhibits reduced moisture absorption and improved paint adhesion. Use of the polyester ionomer allows use of lower amounts of conductive fillers.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: March 5, 2002
    Assignee: General Electric Co.
    Inventors: Jozef H. P. Bastiaens, Bret Ja Chisholm, Christiaan Henricus Koevoets, Lennea T. Petersson
  • Patent number: 6322882
    Abstract: There is provided a polyphenylene ether resin composition comprising: (i) a polyphenylene ether resin; (ii) a phosphoric ester; and (iii) a dispersed substance having an aspect ratio of not less than about 2, and which composition has superior heat resistance and flame resistance without use of any halogen-containing flame retardant or any halogen-containing anti-dripping agent as an essential or mandatory component.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: November 27, 2001
    Assignee: Sumitomo Chemical Company, Limited
    Inventor: Satoru Moritomi
  • Patent number: 6316046
    Abstract: The invention relates to wire enamels comprising as binders polyesterimide and/or polyamideimide, the binders comprising as monomeric building blocks polyoxyalkylenediamine having terminal amino groups. The polyoxyalkylenediamines are preferably selected from the group polyoxyethylenediamine, polyoxypropylenediamine and polyoxyethylenepropylenediamine. The invention also encompasses the use of the novel wire enamels for coating copper wires, especially thick round wires or profiled wires.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: November 13, 2001
    Assignee: Schenectady International
    Inventors: Klaus-Wilhelm Liener, Gerold Schmidt, Helmut Lehmann
  • Patent number: 6316551
    Abstract: Compatible polyphenylene ether-polyamide blends are prepared without the need for compatibilizing compounds such as citric acid or maleic anhydride. The preparation method includes melt blending of the constituents, with other materials such as impact modifiers and fillers optionally being present, at an apparatus temperature maintained no lower than about 295° C. and a pressure maintained below about 200 torr. Blending is preferably by extrusion, with filler and optionally a portion of the polyamide being introduced downstream.
    Type: Grant
    Filed: April 12, 2000
    Date of Patent: November 13, 2001
    Assignee: General Electric Company
    Inventors: Norberto Silvi, Mark Howard Giammattei
  • Publication number: 20010034418
    Abstract: Carboxy-functionalized polyphenylene ethers containing structural units with a carboxyalkyl group in the 2-position are prepared by redistribution of a polyphenylene ether with a 2-carboxyalkylphenol such as 2-(3-carboxypropyl)phenol (melilotic acid), or by oxidative coupling of a suitable phenol with such a 2-carboxyalkylphenol. The products form compatibilizing copolymers with polymers containing carboxylic acid-reactive functional groups, such as polyesters, polyamides and epoxy resins.
    Type: Application
    Filed: May 31, 2001
    Publication date: October 25, 2001
    Inventors: Gary William Yeager, Yiqun Pan
  • Patent number: 6306978
    Abstract: The invention relates to methods of capping poly(phenylene ether) resin having an intrinsic viscosity between 0.05 and 0.35 dl/g. More particularly, the methods comprise capping a poly(phenylene ether) resin having an intrinsic viscosity between 0.05 and 0.35 dl/g in a solvent to produce a capped poly(phenylene ether) resin having an intrinsic viscosity between 0.05 and 0.35 dl/g and isolating the capped poly(phenylene ether) resin by removal of the solvent, preferably in a process other than precipitation. The invention also relates to the capped poly(phenylene ether) resin having an intrinsic viscosity between 0.05 and 0.35 dl/g.
    Type: Grant
    Filed: February 5, 1999
    Date of Patent: October 23, 2001
    Assignee: General Electric Company
    Inventors: Adrianus J. F. M. Braat, Adrie Landa, Juraj Liska
  • Patent number: 6303708
    Abstract: A composition is provided which comprises a functionalized poly(phenylene ether) resin, poly(arylene sulfide) resin, epoxy functional alpha-olefin elastomer, elastomeric block copolymer, and a metal salt. The composition is preferably prepared by premixing a poly(phenylene ether) resin with an organic acid and a vinyl aromatic-diene block copolymer to form a premix, and then compounding the premix with an epoxy functional alpha-olefin elastomer, a poly(arylene sulfide) resin and a metal salt of an organic acid. The composition has enhanced levels of mechanical properties such as impact strength, and is suitable for making molded articles such as vertical automotive body panels.
    Type: Grant
    Filed: March 17, 1995
    Date of Patent: October 16, 2001
    Assignee: General Electric Company
    Inventors: Sterling Bruce Brown, Chorng-Fure Robin Hwang, Hiromi Ishida, James Joseph Scobbo, Jr., John Bennie Yates, III
  • Patent number: 6300387
    Abstract: A molding composition comprises (A) an aggregate, at least one of (B) an unsaturated polyester and (C) an unsaturated polyester-polyamide, and (D) a radical generator comprising a peroxide represented by formula: R1OOC(CH3)2—R3—C(CH3)2OOR2 wherein R1 and R2, which may be the same or different, each represent an alkyl group having 3 to 10 carbon atoms or an arylalkyl group having 7 to 17 carbon atoms; and R3 represents an arylene group.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: October 9, 2001
    Assignee: Kao Corporation
    Inventors: Takashi Yamaguchi, Tadashi Sakuma, Kuniyasu Kawabe
  • Patent number: 6221283
    Abstract: The invention relates to a method of making a conductive thermoplastic composition containing at least one dispersed phase polymer with a continuous phase polymer and at least one conductivity imparting agent wherein the bulk resistivity of the composition is at least partially determined by the particle size of the dispersed phase within the continuous phase. The thermoplastic composition preferably comprises a compatibilized blend of at least one polyphenylene ether resin, at least one polyamide resin, and at least one conductivity imparting agent, and optionally, one or more of impact modifiers, stabilizers, antioxidants, lubricants, and fillers.
    Type: Grant
    Filed: November 16, 1999
    Date of Patent: April 24, 2001
    Assignee: General Electric Company
    Inventors: Raja Dharmarajan, Robert Hossan, Biswaroop Majumdar, Alan Oshinski, Christiaan H. Koevoets, Jan P H Keulen, Antoinette C. van Bennekom, Johannes Matthijssen, Ilse Schlosser
  • Patent number: 6218501
    Abstract: The present invention relates to a cinnamatic photo-polymerization type homopolymeric or copolymeric alignment material, in which polymaleimide is singly used as the main chain, or is combined with styrene, hydroxystyrene or acrylonitrile to form a copolymer so as to be used as the main chain, or polyimide is used as the main chain.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: April 17, 2001
    Assignees: Cheil Industries Inc., Samsung Electronics Co., Ltd.
    Inventors: Hwan Jae Choi, Joo-Young Kim
  • Patent number: 6166137
    Abstract: The present invention is directed to a unique poly(arylene ether)/polyetherimide composition having improved impact strength, as well as other improved mechanical and physical properties. This composition comprises: about 40 to about 90 pbw of a polyetherimide resin; about 8 to about 60 pbw of a functionalized poly(arylene ether) resin having a base titratable functionality level of at least 30 .mu.eq/g; and about 0.2 to about 35 pbw of a copolymer of an olefin and an epoxy-functionalized monomer; and may further include catalysts, gloss improvers, stabilizers, and other additives.
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: December 26, 2000
    Assignee: General Electric Company
    Inventors: Sterling Bruce Brown, Brenda A. Giles, Yimin Jin, Darryl Nazareth, Steven Thomas Rice, Robert Puyenbroek, Barbara J. McKinley
  • Patent number: 6130289
    Abstract: An aqueous phenolic resin dispersion that includes an aqueous continuous phase and, dispersed within the aqueous phase, the reaction product of a phenolic resin precursor and a modifying agent wherein the modifying agent includes at least one ionic group and at least one functional moiety that enables the modifying agent to undergo condensation with the phenolic resin precursor. The resulting dispersed phenolic resin reaction product includes at least one phenolic ring to which is bound the ionic group from the modifying agent. The pendant ionic group is a sulfate, sulfonate, sulfinate, sulfenate or oxysulfonate and the reaction-enabling moiety preferably is a hydroxy or hydroxyalkyl.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: October 10, 2000
    Assignee: Lord Corporation
    Inventor: Helmut W. Kucera
  • Patent number: 6107415
    Abstract: Compatible polyphenylene ether-polyamide blends are prepared without the need for compatibilizing compounds such as citric acid or maleic anhydride. The preparation method includes melt blending of the constituents, with other materials such as impact modifiers and fillers optionally being present, at an apparatus temperature maintained no lower than about 295.degree. C. and a pressure maintained below about 200 torr. Blending is preferably by extrusion, with filler and optionally a portion of the polyamide being introduced downstream.
    Type: Grant
    Filed: September 8, 1998
    Date of Patent: August 22, 2000
    Assignee: General Electric Company
    Inventors: Norberto Silvi, Mark Howard Giammattei
  • Patent number: 6100345
    Abstract: The present invention provides a thermally resistant resin composition containing PS and PPO, wherein at least one of PS and PPO has an acid group and the acid group is neutralized with a basic metal compound containing a metal element of the group 2B, 3B, 4B or 5B of the periodic table; thermally resistant PS and PPO each with an acid group which is also neutralized in the same manner as described above; and a method for miscible preparation of PS and PPO, wherein at least one of PS and PPO has an acid group and the acid group is neutralized similarly.
    Type: Grant
    Filed: October 29, 1998
    Date of Patent: August 8, 2000
    Assignee: Sony Corporation
    Inventors: Yasuhito Inagaki, Tsutomu Noguchi, Hidemi Tomita
  • Patent number: 6090898
    Abstract: A polyester film, comprising a non-liquid crystal polyester (A) and a copolyester (B) containing mesogen groups in the main chain to form a phase separated structure in the non-liquid crystal polyester (A), and the dispersed domains of the copolyester (B), having forms to satisfy the following formulae (1) and (2):0.02<(I/J)<50 (1)K<1/2.times.S[I, J] (2)where I, J and K are form indicators expressing the average form of the plurality of domains existing in the film: I is the average length of the dispersed domains of the copolyester (B) in the machine direction of the film; J, that in the transverse direction; and K, that in the normal direction: and S is a function for selecting the shorter value of the lengths I and J; if I>J, S[I, J] means J, and if I<J, S[I, J] means I. If the copolyester (B) has such geometrical forms, the polyester film obtained is excellent in rigidity, high toughness, heat shrinkage, clarity, surface properties, long-time thermostability, electric properties, etc.
    Type: Grant
    Filed: February 24, 1998
    Date of Patent: July 18, 2000
    Assignee: Toray Industries, Inc.
    Inventors: Tetsuya Tsunekawa, Masaaki Kotoura, Kenji Tsunashima
  • Patent number: 6080822
    Abstract: A copolymer comprisinga) a segment A with a number-average molar mass Mn of from 1000 to 20,000 g/mol, which hasi) units 1, which have been derived from structures of the formula (I) ##STR1## where the radicals R.sup.1 and R.sup.2, independently of one another, are a hydrogen, fluorine, chlorine or bromine atom or a branched or unbranched alkyl or alkoxy radical having from 1 to 6 carbon atoms; and/orii) units 2, which are derived from structures of the formula (II) ##STR2## and b) a segment B, derived from a polyarylene sulfide structure of the formula (IV) ##STR3## where Ar is an aromatic radical, or more than one condensed aromatic radicals, and n is a number from 2 to 100, in particular from 5 to 20, together with a process for its preparation, and also its use for compatibilizing blends made from polyarylene sulfides and aromatic polyesters.
    Type: Grant
    Filed: September 22, 1998
    Date of Patent: June 27, 2000
    Assignee: Ticona GmbH
    Inventors: Michael Haubs, Arnold Schneller, Frank Bohme, Dennis Kappler, Doris Pospiech
  • Patent number: 6075116
    Abstract: The present invention provides a highly impact resistant polyamide composition which comprises a polyamide resin and an acid modification product of a metallocene catalyzed polyolefin elastomer. The invention also provides a less hygroscopic and highly impact resistant polyamide composition which comprises a polyamide resin, novolak phenol and an acid modification product of a metallocene catalyzed polyolefin elastomer. Used as the polyamide resin is less expensive nylon 6.
    Type: Grant
    Filed: June 30, 1998
    Date of Patent: June 13, 2000
    Assignee: Kishimoto Sangyo Co., Ltd.
    Inventors: Takeshi Moriwaki, Toshiharu Sakaguchi
  • Patent number: 6063875
    Abstract: Carboxy-functionalized polyphenylene ethers containing structural units with a carboxyalkyl group in the 2-position are prepared by redistribution of a polyphenylene ether with a 2-carboxyalkylphenol such as 2-(3-carboxypropyl)phenol (melilotic acid), or by oxidative coupling of a suitable phenol with such a 2-carboxyalkylphenol. The products form compatibilizing copolymers with polymers containing carboxylic acid-reactive functional groups, such as polyesters, polyamides and epoxy resins.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: May 16, 2000
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Yiqun Pan
  • Patent number: 6051662
    Abstract: Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: April 18, 2000
    Assignee: General Electric Co.
    Inventors: James E. Tracy, Gary William Yeager
  • Patent number: 6008302
    Abstract: Oligomeric materials contain ultraviolet light absorbing compounds that are covalently bound to the oligomer backbone through an ester or amide linkage. These ultraviolet light absorbing oligomers may be combined with polymers such as polyolefins to provide protection against the harmful effects of ultraviolet light.
    Type: Grant
    Filed: April 29, 1997
    Date of Patent: December 28, 1999
    Assignee: 3M Innovative Properties Company
    Inventors: David B. Olson, David M. Burns
  • Patent number: 6005050
    Abstract: There is disclosed an impact resistant polystyrene composition which comprises 5 to 98% by weight of an (a) styrenic polymer having a syndiotactic configuration and 2 to 95% by weight of a (b) styrene/diolefin diblock copolymer, styrene/diolefin/styrene triblock copolymer or styrene/diolefin random compolymer, each having a hydrogenation rate of 70 to 98 mol %, and optionally a (c) rubbery elastomer having an olefinic component or polyolefin, a (d) poly(phenylene ether), etc. The above composition is greatly enhanced in its impact resistance and elongation properties without deterioration of heat resistant stability of color tone, etc.
    Type: Grant
    Filed: January 13, 1997
    Date of Patent: December 21, 1999
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Akihiko Okada, Nobuyuki Sato, Akitoshi Masuyama
  • Patent number: 5952417
    Abstract: The invention provides a composition for a platable resinous substrate having enhanced heat performance comprising: a thermoplastic mixture of at least one polyphenylene ether and at least one poly(alkenylaromatic) compound, at least one rubber compound, and at least one inorganic filler material.
    Type: Grant
    Filed: December 17, 1996
    Date of Patent: September 14, 1999
    Assignee: General Electric Co.
    Inventors: Herbert Shin-I Chao, Geoffrey Henry Riding, Carol Lynn Fasoldt
  • Patent number: 5939490
    Abstract: Compositions are provided for compatibilized blends comprising compatibilizing poly(phenylene ether) resins and epoxy-functional polyolefins that exhibit improved resistance to delamination while providing high impact strength and other improved physical properties. Articles made from the compositions are useful for automotive lighting and under hood components.
    Type: Grant
    Filed: June 12, 1997
    Date of Patent: August 17, 1999
    Assignee: General Electric Company
    Inventors: Sterling Bruce Brown, John Robert Campbell, Chorng-Fure Robin Hwang, Steven Thomas Rice, Patric A. Rodgers, James Joseph Scobbo, Jr., John Bennie Yates
  • Patent number: 5936030
    Abstract: A block copolymer containing one or more polyoxyethylene blocks and one or more polyoxy(higher alkylene) blocks, wherein at least some of the blocks are linked together by an oxymethylene group, can be prepared by reacting one or more dihydroxy terminated polymers selected from poly(ethylene glycol), poly(higher alkylene glycol), and block copolymers thereof in solution with a dihalomethane in the presence of a base. Such copolymers can be used as surfactants and surface modifiers. The reaction can be conducted at ambient temperature, and does not require the addition of heat.
    Type: Grant
    Filed: August 14, 1997
    Date of Patent: August 10, 1999
    Assignee: Nanosystems
    Inventors: Christian Vaughan Nicholas, Malcolm Donald Purbrick
  • Patent number: 5929168
    Abstract: The present invention concerns polymer blends and processes for the preparation thereof. The present blends contain a) 5 to 95 parts by weight of poly(2,6-dimethyl-1,4-phenylene)ether, b) 95 to 5 parts by weight of a second polymer which is immiscible therewith, and c) a component (a compatibilizer) which enhances the compatibility of the polymers. According to the invention the component enhancing the compatibility of the polymers comprises 0.1 to 10%, preferably about 1.5 to 10%, calculated on basis of the total weight of components a and b, of at least one compound C, which has the formulaA.sub.i --B.sub.j IwhereinA stands for a group which contains at least one ring with 3 to 7 members, capable of forming ring-to-ring interactions with the phenyl rings of poly(2,6-dimethyl-1,4-phenylene)ether,B is a polar group,i is an integer 1 to 20, andj is an integer 0 to 20,whereati+j is greater than or equal to 2,the melting point of compound C is above 50.degree. C. and the boiling point thereof above 200.degree.
    Type: Grant
    Filed: November 19, 1996
    Date of Patent: July 27, 1999
    Assignee: Optatech, Corporation
    Inventors: Olli Ikkala, Lars-Olof Pietila, Riitta Holsti-Miettinen, Nikitas Katsaras, Maaria Selantaus, Heidi Osterholm, Christer Bergstrom
  • Patent number: 5916970
    Abstract: Polymer blend compositions comprise (a) a polyphenylene ether polymer, (b) a polyphthalamide comprising the reaction product of (i) hexamethylene diamine or a mixture of hexamethylene diamine and trimethylhexamethylene diamine, and (ii) terephthalic acid, and optionally (iii) at least one acid selected from the group consisting of isophthalic acid and adipic acid, provided that a mixture of said diamines is employed if reactant (iii) is absent, and (c) at least one compatibilizer. The compositions may further include an aliphatic polyamide and/or an impact modifier.
    Type: Grant
    Filed: January 6, 1997
    Date of Patent: June 29, 1999
    Assignee: General Electric Company
    Inventors: Gim Fun Lee, Jr., John Bennie Yates, Ronald James Wroczynski, Kevin Sheehan
  • Patent number: 5907010
    Abstract: Graft copolymers are obtainable by reactingA) polyarylene ethers,B) polyamides andC) copolymers which contain cyclic, .alpha.,.beta.-unsaturated dicarboxylic anhydridesand are used for the preparation of thermoplastic molding materials or as compatibilizers for polymer blends based on polyarylene ethers and polyamides.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: May 25, 1999
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Norbert Guntherberg
  • Patent number: 5880221
    Abstract: The present invention deals with the distribution of polyphenylene ethers 1. by reacting the polyphenylene ether in solution with a phenolic compound, wherein special phenolic compounds are used. The redistribution reaction can be performed in toluene or in toluene/alcohol blends. The reaction can be run in the presence or the absence of a catalyst.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: March 9, 1999
    Assignee: General Electric Company
    Inventors: Juraj Liska, Hubertus Adrianus Maria van Aert, Gert De Wit
  • Patent number: 5863963
    Abstract: Disclosed is a process which comprises the steps of (a) providing a polymer containing at least some monomer repeat units with halomethyl group substituents which enable crosslinking or chain extension of the polymer upon exposure to a radiation source which is electron beam radiation, x-ray radiation, or deep ultraviolet radiation, said polymer being of the formula ##STR1## wherein x is an integer of 0 or 1, A is one of several groups as specified in the claims, B is one of several groups as specified in the claims, and n is an integer representing the number of repeating monomer units, and (b) causing the polymer to become crosslinked or chain extended through the photosensitivity-imparting groups. Also disclosed is a process for preparing a thermal ink jet printhead by the aforementioned curing process.
    Type: Grant
    Filed: August 29, 1996
    Date of Patent: January 26, 1999
    Assignee: Xerox Corporation
    Inventors: Ram S. Narang, Timothy J. Fuller
  • Patent number: 5861437
    Abstract: A poly(phenylene ether) resin composed of structural units represented by the general formula: ##STR1## (wherein R.sup.1, R.sup.2 and R.sup.3 represent each alkyl, cycloalkyl, etc. or H (provided that two or more of R.sup.1, R.sup.2 and R.sup.3 do not represent H at the same time), or one of R.sup.1, R.sup.2 and R.sup.3 represents alkyl or H while the others together form a saturated ring, or R.sup.1, R.sup.2 and R.sup.3 together form an aromatic ring; A represents alkyl; p is an integer of from 3 to 5; and Y.sup.- represents a pharmaceutically acceptable acid residue) and/or structural units represented by the general formula: ##STR2## (wherein R.sup.4, R.sup.5 and R.sup.6 represents each alkyl, cycloalkyl, etc. or H (provided that two or more of R.sup.4, R.sup.5 and R.sup.6 do not represent H at the same time), or one of R.sup.4, R.sup.5 and R.sup.6 represents alkyl or H while the others together form a saturated ring, or R.sup.4, R.sup.5 and R.sup.6 together form an aromatic ring; and A, p and Y.sup.
    Type: Grant
    Filed: October 7, 1997
    Date of Patent: January 19, 1999
    Assignee: Kissei Pharmaceutical Company, Ltd.
    Inventors: Hiromu Harada, Yukihiko Hotei, Hideki Hujikura, Yoshinori Nonaka, Koji Kamata, Mitsuhiro Ichihara, Hiroshi Kusama, Humiyasu Satoh
  • Patent number: 5861462
    Abstract: The present invention relates to a method for forming the LCP composite having LCP fibers dispersed in the matrix resin even if the LCP content may be smaller than the lower limit of the fiber formable range.The method is characterized in that a resin composite reinforced by the LCP fiber in a mixture ratio beyond the fiber formable range or the preferred fiber formable range by means of an extrusion or injection molding of a resin mixture containing a liquid crystal resin composite extruded in the fiber formable range or the preferred fiber formable range.
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: January 19, 1999
    Assignee: Mazda Motor Corporation
    Inventors: Keita Sasaki, Masatoshi Shinomori
  • Patent number: 5859176
    Abstract: Disclosed is a polyamide resin composition comprising a melt-kneaded product of (A) a polyamide; (B) a polyphenylene ether; (C) a styrene polymer; and (D) a compound having in a molecule thereof a carbon-to-carbon double bond and at least one functional group selected from a carboxylic acid group, an acid anhydride group, an epoxy group, an amino group and a hydroxyl group, wherein the polyamide (A) is present as a continuous phase in which the polyphenylene ether (B) and the styrene polymer (C) are dispersed individually, independently or in mixture thereof to form a dispersion phase having an average particle diameter of 5 .mu.m or less, and wherein the (B)/(C) weight ratio is from 20/80 to 70/30, and the styrene polymer (C) in the melt-kneaded product has a reduced viscosity of 0.70 dl/g or more.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: January 12, 1999
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Jun-ichi Nakahashi, Mitsuhiro Horio, Kazuo Yoshida
  • Patent number: 5852134
    Abstract: A process for the preparation of polymeric alloys from polyester resins and polymers containing groups capable of giving addition reaction with functional compounds containing at least two reactive groups comprising the melt state mixture stage of polyester resin, reactive polymer and functional compound of mixture pelletizing and following polyaddition reaction in the solid state at temperatures between 150.degree. and 220.degree. C. to obtain an increase of the polymer intrinsic viscosity of 0.1 dl/g in comparison with the starting polyester resin.
    Type: Grant
    Filed: December 5, 1996
    Date of Patent: December 22, 1998
    Assignee: Sinco Engineering S.p.A.
    Inventor: Hussain Ali Kashif Al Ghatta
  • Patent number: 5834565
    Abstract: Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: November 10, 1998
    Assignee: General Electric Company
    Inventors: James E. Tracy, Gary William Yeager
  • Patent number: 5827907
    Abstract: A composition having enhanced fracture resistance comprising a heat curable reaction product of a fluorine-containing thermoset material and a fluorine-containing homopolymer, wherein the cured reaction product comprises the thermoset material having a plurality of discrete phases of said fluorine-containing homopolymer dispersed therein, the homopolymer phases being in the range of micron to submicron size.
    Type: Grant
    Filed: August 30, 1993
    Date of Patent: October 27, 1998
    Assignee: IBM Corporation
    Inventors: Jeffrey Thomas Gotro, Jeffrey Curtis Hedrick, Konstantinos Papathomas, Niranjan Mohanlal Patel, Alfred Viehbeck, William Joseph
  • Patent number: 5824750
    Abstract: Polymers (A) containing oxazine groups are prepared by reacting a polymer (T) containing nitrile groups with a monoaminoalcohol in the presence of a catalyst by a process in which the polymer T is reacted in the melt with the monoaminoalcohol in the presence of the catalyst and in the absence of a solvent.
    Type: Grant
    Filed: December 5, 1996
    Date of Patent: October 20, 1998
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Rolf Mulhaupt, Jorg Kressler, Philipp Muller, Rudiger Schafer
  • Patent number: 5811032
    Abstract: A water-soluble polymer prepared by melting and reacting a mixture of an oxycarboxylic acid having a melting point of 170.degree. C. or less and maleamic acid, or a mixture of a plurality of oxycarboxylic acids including at least one oxycarboxylic acid having a melting point of 170.degree. C. or less and maleamic acid, at a temperature of 170.degree. C. or less at the start of the reaction to obtain a polymer; and then hydrolyzing the polymer.
    Type: Grant
    Filed: September 19, 1996
    Date of Patent: September 22, 1998
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Ryozo Kawai, Hiroshi Kurata, Yukari Shimizu, Shoichiro Kajiwara
  • Patent number: 5804629
    Abstract: Molding materials comprise polyarylene ethers, copolymers containing units which are derived from aromatic vinyl compounds and cyclic .alpha.,.beta.-unsaturated carboxylic anhydrides and carboximides, and furthermore fillers and rubber impact modifiers.
    Type: Grant
    Filed: June 13, 1994
    Date of Patent: September 8, 1998
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Norbert Guentherberg
  • Patent number: 5789492
    Abstract: For optical applications, transparent amorphous thermo-plastics, such as polyaryl ether ketones, are of considerable interest. However, polyaryl ether ketones have inadequate UV stability and weathering resistance while amorphous polyaryl esters do not have these negative properties. The properties can be improved by means of polymer alloys, giving weathering-resistant materials from homogeneously mixed polymers which comprise at least one amorphous polyaryl ether ketone and at least one amorphous polyaryl ester.
    Type: Grant
    Filed: June 9, 1992
    Date of Patent: August 4, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Michael-Joachim Brekner, Hansotto Drotloff, Otto Hermann-Schonherr, Arnold Schneller