Abstract: The present invention relates to copolymers containing polyamide blocks and polyether blocks based on ethoxylated primary amines, these copolymers having a melting point of between 80° C. and 135° C. and an MFI (melt flow index) of between 5 and 80 g/10 min (2.16 kg-150° C.). The invention also relates to adhesives of the HMA (or hot melt adhesive) type consisting of the above copolymers containing polyamide blocks and polyether blocks.

Abstract: A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.

Abstract: In 100 parts by weight of a composition, from 2 to 89 parts by weight of a fluorinated polymer having a fluorine content of at least 65 wt %, from 97 to 10 parts by weight of a non-fluorinated polymer and from 1 to 35 parts by weight of a dispersing agent having a carboxylic acid group or its derivative, or a sulfonic acid group or its derivative, are blended.

Abstract: The present invention provides a polymer in which coumarin, a photo-reactive molecule, is grafted onto a polyimide for preparing liquid crystal alignment layer which has a superior alignment property and an excellent thermal stability in photo-alignment, a process for preparing the said grafted polymer, a process for preparing liquid crystal alignment layer by employing the said grafted polymer, and a liquid crystal alignment layer prepared by the process. The polymer of the invention is prepared by mixing a coumarin compound with a polyimide, dissolving the mixture in an organic solvent, adding a catalyst, and stirring under an environment of N2 gas. The polymer of the invention is superior in terms of the thermal stability, which makes possible its universal application for the development of a novel liquid crystal display(LCD).

Abstract: A nonwoven web and method of preparing a novel nonwoven web of synthetic fiber are disclosed. An aqueous solution amide crosslinked synthetic precursor polymer is extruded under defined conditions through a plurality of die orifices to form a plurality of threadlines. The threadlines are attenuated with a defined primary gaseous source to form fiber under conditions of controlled macro scale turbulence and under conditions sufficient to permit the viscosity of each threadline, as it leaves a die orifice and for a distance of no more than about 8 cm, to increase incrementally with increasing distance from the die, while substantially maintaining uniformity of viscosity in the radial direction, at a rate sufficient to provide fiber having the desired attenuation and mean fiber diameter without significant fiber breakage. The attenuated threadlines are dried with a defined secondary gaseous source. The resulting fibers are deposited randomly on a moving foraminous surface to form a substantially uniform web.

Abstract: The present invention relates to a poly(imide-siloxane) compound useful as passivation layer for packaging tapeless LOC, which is produced by reacting in a polar solvent a diaminosiloxane compound of the formula(1) wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10 are independently an aromatic group, aliphatic group or halogenated hydrocarbon, hydroxy, or ether group, and m and n are integers such that m+n is an integer of 0˜1000; and a diamine compound of the formula(2) H2N—R—NH2   (2) wherein R is at least one selected from the below groups: with an aromatic tetracarboxylic dianhydride of the formula (3) wherein A is at least one selected from the below groups: wherein the number of moles of the compound (3) is the same as the total number of moles of compounds (1) and (2).

Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.

Abstract: The invention relates to a polyamide composition for the production of electrical and electronic components that are suitable for the conditions of the surface mounting technology. In particular, the composition exhibits a high resistance to blistering during the reflow soldering process. The composition according to the invention comprises (a) a polyamide having a melting point higher than 280° C., (b) a polymer having a melting point lower than 230° C., (c) a halogen-containing compound, (d) optionally a synergist for the flame-retardant properties (e) reinforcing material (f) optionally other additives. A particularly good resistance to blistering is achieved if (f) contains at least a compound with acid imide groups.

Abstract: The present invention provides an insulating material showing excellent thermal propeties and electrical properties in semiconductor applications.

Abstract: A reaction between epoxy-terminated polyamide and an acid anhydride compound can yield a modified polyamide resin, into resin skeleton of which carboxy groups to react with epoxy resin are introduced. An adhesive agent having excellent heat-resistance can be provided by the use of a composition of this modified polyamide resin and epoxy resin. Furthermore, an adhesive tape for a semiconductor device having excellent properties can be produced by laminating the adhesive agent and the protective layer on one surface of an organic insulated film.

Abstract: Cascade polymers, containing complex-forming ligands, optionally at least five ions of an element of atomic numbers 21-29, 39, 42, 44 or 57-83, as well as, if desired, cations of inorganic and/or organic bases, amino acids or amino acid amides, are valuable complexing compounds and complexes for diagnostics and therapy.

Abstract: Improvements are disclosed for biphasic polymerization processes in which an aqueous solution of a first monomer that is hydrolytically unstable below a pH of about six or above a pH of about eight is admixed with a water-immiscible organic solvent and there is added to the admixture a catalyst selected from tertiary amine, quaternary amine and phosphonium catalysts, an acid-forming co-monomer for the first monomer, an acid scavenger, after which the resulting polymer is recovered, wherein the improvement includes providing the aqueous solution at a pH between about si and about eight, and adding to the admixture the acid-forming co-monomer and the acid scavenger at relative rates effective to maintain the pH of the admixture between about six and about eight. The catalyst may be added in a molar ratio to the first monomer effective to provide a predetermined weight-average or number-average molecular weight for the resulting polymer.

Abstract: The process for producing polymer blends by reacting at least one aminonitrile with water in the presence of thermoplastic polymers and optionally further polyamide-forming monomers comprises the following steps: (1) reacting at least one aminonitrile with water at a temperature from 90 to 400° C. and a pressure from 0.1 to 35×106 Pa to obtain a reaction mixture, (2) further reacting the reaction mixture at a temperature from 150 to 400° C.

Abstract: The present invention provides a p-hydroxybenzoic ester represented by the formula (1) wherein R1 represents a C6-C10 straight-chain or branched-chain alkyl group, A1 represents a C2-C4 alkylene group and n in an integer of 1 to 8, a plasticizer for at least one polyamide resin selected from nylon 11 and nylon 12 which comprises the ester, a polyamide resin composition comprising the ester and at least one polyamide resin selected from nylon 11 and nylon 12, and a polyamide resin molded article comprising the ester and having excellent high-temperature volatilization resistance and low-temperature impact resistance.

Abstract: A process is disclosed for producing with good productivity a cross-linked polyaspartic acid resin having biodegradability and high water absorbency. The process features inclusion of one of the following steps: (a) a polysuccinimide, which has been brought into a dispersed state by a dispersant, and a cross-linking agent are reacted to produce the cross-linked polyaspartic acid resin; (b) imide rings of a cross-linked polysuccinimide are subjected to a hydrolysis reaction while controlling a swelling degree of a resulting gel, whereby the cross-linked polyaspartic acid resin is produced; and (c) a gel of a cross-linked polysuccinimide, which has been obtained by reacting a cross-linking agent to a solution of a polysuccinimide in an organic solvent, is disintegrated to subject imide rings of the cross-linked polysuccinimide to a hydrolysis reaction, so that the cross-linked polyaspartic acid resin is produced.

Abstract: A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.

Abstract: A novel modified polyimide resin having a polybutadiene sheleton and obtainable by reacting the following three (3) kinds of compounds, i.e., a bifunctional hydroxyl-terminal polybutadiene having a number average molecular weight of 800 to 5,000, a tetrabasic acid dianhydride, and a diisocyanate compound, imparts reduced shrinkage upon setting to a thermosetting resin composition comprising the same and also imparts heat resistance and pliability and the like to a hardened mass or article of such thermosetting resin composition. Therefore, such thermosetting resin composition is an excellent resin composition capable of fully satisfying the requirements with regard to the characteristics of an overcoat agent for a wiring circuit which should be pliable, such as a flexible wiring circuit substrate, a film carrier and the like.

Abstract: A polymide useful as an adhesive for semiconductor assemblies having excellent thermal resistance and adhesive strength at high temperatures.

Abstract: A polyimide represented by the following general formula (1); wherein l, m, and n represent not the order of each repeating unit, but the numbers of each repeating unit existing in the molecule, E1 is a photosensitive group, E2 is a group comprising an alkyl group having 2 to 20 carbon atoms, —A(—E1)—, —A(—E2)—, and B each are a divalent organic group, X and Y each are a tetravalent organic group, X, Y, A, B, E1 and E2 may be identical or different among the repeating units, 1 is an integer of 1 or more, m and n each are an integer of 0 or more. The polyimide and polyimide compositions comprising it has thermoreactivity as well as photoreactivity and photosensitivity.

Abstract: The present invention provides PMR-type polyimides that exhibit lower melt viscosities than PMR-type polyimides of the prior art. These PMR-type polyimides are created by incorporating flexible linkages, such as kinked structures and twisted or non-coplanar moietes into the backbone structure of the PMR. Specifically, the present invention provides for the production of PMR-type polyimides having 2,2′-disubstituted biaryls in the polymer backbone.

Abstract: In 100 parts by weight of a composition, from 2 to 89 parts by weight of a fluorinated polymer having a fluorine content of at least 65 wt %, from 97 to 10 parts by weight of a non-fluorinated polymer and from 1 to 35 parts by weight of a dispersing agent having a carboxylic acid group or its derivative, or a sulfonic acid group or its derivative, are blended.

Abstract: The present invention relates to a highly branched polyamide oligomer of the general formula (I) as hereinabove defined, to the process for preparing and branched oligomers and to different uses thereof. As well known to the man skilled in the art, the implementations and efficacy of the different polyamide oligomers may vary, depending on their structure and valency (reactive groups composition). Polyamide oligomers may be used, for example, as epoxy hardeners in the preparation of thermosetting compositions, as thermoplastic hot melt adhesives, as adhesion promoters and many other suitable applications. The highly branched oligomers disclosed have been shown to be highly efficient, for example, as epoxy hardeners, inter alia, in the formation of glue, lacquer, enamel or sealant mixtures.

Abstract: A substantially non-crosslinked polymer cementitious composition dispersant for the improvement of the fluidity of cementitious compositions comprising hydrophilic side chain substituted polyimide or polyamide backbone units, having at least some proportion of grafted oligomeric or polymeric hydrophilic side chains linking at least one of amides, esters, and thioesters, wherein the polymer cementitious composition is water soluble, and wherein crosslinking is such that in a statistical sampling there is greater than zero to less than 0.1 mole % of backbone units involved in crosslinking.

Abstract: The invention is in a conductive prepolymer composition which when polymerized and cured is used to coat a substrate material such as steel, stainless steel, iron, brass, copper, aluminum, platinum, titanium, silver, gold, Telfon, plastics, glass, or combinations thereof. It comprises: (a) from 25 to 99 parts by weight of a poly(amide-imide) prepolymer; (b) from 1 to 25 parts by weight of a trifunctional ester selected from the group consisting of trifunctional methacrylate ester, trifunctional acrylate ester, and mixtures thereof; (c) from 0.5 to 15 parts by weight of an organo-reactive silane consisting of an amino group containing alkoxysilane having the formula NH2(CH2)nSi(OC2H5)3, where n is an integer from 1 to 20; and (d) a conductive additive. The invention also provides polymer coated substrates having a tenaciously bound polymer layer which is corrosion resistant, has advantageous properties of conductivity and can be soldered.

Abstract: A thermoplastic or thermosetting curable adhesive composition for bonding an electronic component to a substrate in which the adhesive is cured in situ comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.

Abstract: Addition-cured polyimides that contain the reaction product of an aromatic triamine or trianhydride analogue thereof, a reactive end group such as 5-norbornene-2, 3-dicarboxylic acid, ester derivatives of 5-norbornene-2,3-dicarboxylic acid, anhydride derivatives of 5-norbornene-2,3-dicarboxylic acid, or 4-phenylethynylphthalic anhydride, an aromatic diamine, and a dialkyl ester of an aromatic tetracarboxylic acid. The resultant starlike polyimides exhibit lower melt flow viscosity than its linear counterparts, providing for improved processability of the polyimide. Also disclosed are methods for the synthesis of these polyimides as well as composite structures formed using these polyimides.

Abstract: A method for preparing polyamic acid and polyimide, which is suitable for use in adhesives or adhesive tapes for electronic parts. The polymers have such three-dimensional molecular structures that a significant improvement can be brought about in solvent solubility, thermal resistance, mechanical properties, and adhesive properties onto various substrates. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III. The polyamic acid is converted into polyimide through thermal or chemical imidization.

Abstract: Provided are alkenyl and/or alkyl succinimides formed from at least one alkenyl or alkyl succinic anhydride and at least one aliphatic amine having one or two primary amino groups in the molecule. These succinimides are characterized in that each alkenyl or alkyl group thereof contains in the range of 16 to 30 carbon atoms. Such group is bifurcated on its alpha carbon atom into two branches neither of which contains less than 2 carbon atoms, one such branch being free of any side chain, and the other such branch either being free of any side chain or containing at most one methyl or methylene side chain. In addition the succinimide has a viscosity at 80° C. of less than about 100 centistokes. These succinimides are especially useful as internal and external sizing agents for paper and paper products.

Abstract: The present invention is directed to polyimide systems which simultaneously offer low toxicity, a high glass transition temperature, excellent thermal oxidative stability, and desirable processing characteristics. These various polyimide systems include mixtures of monomeric reactants, polyimide-precursor reaction products, polyimides, and polyimide-containing articles. In one aspect of the invention, the mixture of monomeric reactants includes at least one dia-nhydride or a derivative thereof, and at least one diamine. The diamine may be 4,4′-[1,4-phenylene-bis(1-methylethylidene)]bisaniline, 4,4′-[1,3-phenylene-bis(1-methylethylidene)]bisaniline, and/or a derivative thereof. The diamine also may include a phenylenediamine, 2,2-bis[4-(4-aminophenoxyl)phenyl]propane, 4,4′(1,4-phenylene-bismethylene)bisaniline, and/or a derivative thereof. In addition, the mixture may include a reactive end-capping agent and/or a non-reactive end-capping agent.

Abstract: Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of a non-reactive endcapper, such as phthalic anhydride. Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. Polyimides that are more rigid in nature require more APB to impart processability than polyimides that are less rigid in nature. The copolymers that result from using APB to enhance processability have a unique combination of properties including: excellent thin film properties, low pressure processing (200 psi and below), improved toughness, improved solvent resistance, improved adhesive properties, improved composite mechanical properties, long term melt stability (several hours at 390 C.), and lower melt viscosities.

Abstract: The present invention is directed to oxidative and reductive methods of fabricating electrically conducting polymers and precursors thereof in particular polyanilines in which the polymer chains are deaggregated. Such deaggregated conducting polymers and precusors thereof exhibit better processability and higher electrical conductivity than do the corresponding aggregated polymers. Substituted and unsubstituted polyanilines in the substantially non oxidized or non reduced form (emeraldine form) are converted to an intermediate deaggregated reduced or oxidized form. The intermediate reduced or oxidized deaggregated form is processed into an article. The articles is subsequently treated with a dopant and an oxidizing or reducing agent to reform the original substantially non oxidized or non reduced form. The methods described herein permit the formation of articles such as shaped articles and films having deaggregated structure and higher electrical conductivity.

Abstract: The invention is directed to a polymer dispersant comprising a substituted polyimide or polyamide backbone, having at least some proportion of oligomeric or polymeric grafted side chains including one of amides, esters, and thioesters, having the general formula: wherein X is at least one of hydrogen, an alkali earth metal ion, an alkaline earth metal ion, ammonium ion, and amine; R is at least one of C.sub.1 to C.sub.6 alkyl(ene) ether and mixtures thereof and C.sub.1 to C.sub.6 alkyl(ene) imine and mixtures thereof; Q is at least one of oxygen, nitrogen, and sulfur; p is a number from 1 to about 300 resulting in at least one of a linear and branched side chain; R.sub.1 is at least one of hydrogen, C.sub.1 to C.sub.

Abstract: A multilayer wiring substrate using a resin composition comprising polyquinoline compound and bismaleimide compound as essential ingredients between wiring-carrying resin layers as insulating layers forms no void at the time of lamination, has an excellent adhesive property at various interfaces, has a heat stability after lamination and is high in reliability, so that, it is applicable to many fields not only including the multilayer wiring substrates capable of mounting LSI or tip carrier directly but also including multilayer wiring substrate for work station, mounting substrates for small-sized electronic devices such as camera and video for people's use, and high frequency multitip module multilayer substrate.

Abstract: A thermoplastic resin composition that contains a polyetherimide resin, a mineral filler and a gloss-enhancing additive selected from linear polysiloxane polymers, polyethylene resins and crystalline thermoplastic resins imparts improved surface gloss to shaped articles molded therefrom.

Abstract: A process is disclosed for producing with good productivity a cross-linked polyaspartic acid resin having biodegradability and high water absorbency. The process features inclusion of one of the following steps: (a) a polysuccinimide, which has been brought into a dispersed state by a dispersant, and a cross-linking agent are reacted to produce the cross-linked polyaspartic acid resin; (b) imide rings of a cross-linked polysuccinimide are subjected to a hydrolysis reaction while controlling a swelling degree of a resulting gel, whereby the cross-linked polyaspartic acid resin is produced; and (c) a gel of a cross-linked polysuccinimide, which has been obtained by reacting a cross-linking agent to a solution of a polysuccinimide in an organic solvent, is disintegrated to subject imide rings of the cross-linked polysuccinimide to a hydrolysis reaction, so that the cross-linked polyaspartic acid resin is produced.

Abstract: An optical alignment composition including a first polymer selected from a cinnamate-series polymer and a coumarin-series polymer, and a second polymer selected from polyimide having a long-chain alkyl group at its side chains and polyimide having an alkyl group at its both ends, an alignment layer formed using the same, and a liquid crystal display having the alignment layer are provided. According to the present invention, the thermal stability of the alignment layer and pretilt angle characteristic of the liquid crystal are improved.

Abstract: The present invention provides, as heteroaromatic compounds made functional so as to be used for nonlinear optical materials, compounds represented by the following general formula (1), and also provides polymers obtained from these and nonlinear optical parts comprising such polymers. In the formula, Ar.sup.1 and Ar.sup.2 each represents a divalent aromatic group; R.sup.1, R.sup.2 and R.sup.3 each represents an atom or a group independently selected from a hydrogen atom or an alkyl group and an aromatic group; X.sup.1 represents a monovalent organic group; n represents an integer of 2 to 12; and Z.sup.1 and Z.sup.2 each represents a group independently selected from electron attractive functional groups.

Abstract: Fibers having increased strength and small diameters can be produced from compositions comprising long chain branched syndiotactic vinyl aromatic polymers. Due to the increased fiber strength, less strand breakage occurs during processing which increases process productivity and yield.

Abstract: Molecular dispersions of rigid-rod polybenzobisazole polymer/copolymer in thermoplastic matrices in a weight ratio of about 1:99 to 50:50 are prepared by dissolving the rigid-rod polymer in an alcoholic or aprotic solvent, dissolving the thermoplastic polymer in an alcoholic or aprotic solvent, combining the two solutions and recovering the resulting molecular composite from the combined solution. These molecular dispersions consist essentially of rigid-rod polybenzobisazole polymer/copolymer having sulfonic acid groups pendant to the polymer/copolymer backbone and thermoplastic polymers selected from the group consisting of polyvinylpyridines, poly(arylene ether ketone)s with a pyridyl functionality, aromatic poly(pyridine ether)s and poly(pyridine ether sulfone) copolymers, and polyimides with a pyridyl functionality.

Abstract: The invention relates to belts made of thermoplastic polymer (A) and comprising a sufficient amount of a polymer (B) to render them antistatic, the said polymer (B) comprising polyethylene glycol blocks. Use is advantageously made of polymers (A) containing polyamide-6 (PA-6) or polyamide-12 (PA-12) blocks and polytetramethylene glycol blocks and polymers (B) containing PA-6 or PA-12 blocks and polyethylene glycol blocks.

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces.

Abstract: Polydiacetylenes prepared from 2,4-hexadiyne monomers substituted with at least one side chain component, exhibit an absorption maximum wavelength maximum greater than that exhibited by polydiacetylenes formed from 1,6-di-N-carbazolyl 2,4-hexadiyne. Preferably, the polydiacetylenes exhibit an absorption maximum that is in the range of visible light. Examples of suitable side chain components of the polydiacetylenes include cyanovinyl aromatic substituents and quinoid substituents. The polydiacetylenes exhibit useful third order nonlinear optical behavior for electromagnetic radiation in the visible and near-infrared electromagnetic wavelength range and can be formed by thermally-based synthesis methods.

Abstract: Molecular dispersions of rigid-rod polybenzobisazole polymer/copolymer in thermosetting matrices in a weight ratio of about 1:99 to 50:50 are prepared by dissolving the rigid-rod polymer in an alcoholic or aprotic solvent, dissolving the thermosetting polymer in an alcoholic or aprotic solvent, combining the two solutions and recovering the resulting molecular composite from the combined solution. These molecular dispersions consist essentially of rigid-rod polybenzobisazole polymer/copolymer having sulfonic acid groups pendant to the polymer/copolymer backbone and thermosetting polymers selected from the group consisting of iminobis(N-propyl-2-phenylethynyl-phthalimide), N-ethyl-(2,6-di-benzocyclobutenoxy)benzylamine, iminobis(N-propylnadic imide) and difunctional benzoxazine monomers of the formula ##STR1## wherein X is a single bond, --CO-- or --C(CH.sub.3).sub.2 -- and Q is --CH.sub.3 or --C.sub.6 H.sub.5.

Abstract: The instant invention teaches a method for enabling the formation of a high damping, soft polymer gel. The method includes: reacting a poly(maleimide-co-alkenyl benzene) polymer with a nylon and an alkyl diamine under substantially dry conditions sufficient to form a nylon grafted poly(maleimide-co-alkenyl benzene) polymer product; and, dispersing the nylon grafted poly(maleimide-co-alkenyl benzene) polymer product with an extender oil sufficient to form the gel. The instant invention also contemplates a polymer gel composition, a polymer composition and an article manufactured from the polymer gel composition.

Abstract: A thermoplastic resin composition containing a polyetherimide resin; a siloxane-polyetherimide copolymer; one or more resins selected from the group consisting of polycarbonate resins and copolyester-carbonate resins; and one or more component selected from glycidyl ester impact modifiers and siloxane-polycarbonate copolymers exhibits improved ductility and low temperature impact properties.

Abstract: Thermomechanical and thermo-oxidative stabilities in resin composites across the range of aerospace "engineering thermoplastic" resins are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities of the general formula: ##STR1## wherein Z= ##STR2## .beta.=the residue an organic radical selected from the group consisting of: ##STR3## R.sub.R =a divalent organic radical; X=halogen;Me=methylT=allyl or methallyl.G=--CH.sub.2 --,--S--, --CO--, --SO--, --O--, --CHR.sub.3 --, or --C(R.sub.3).sub.2 --;i=1 or 2;R.sub.3 =hydrogen, lower alkyl, lower alkoxy, aryl, or aryloxy; and.theta.=--C.tbd.N, --O--C.tbd.N, --S--C.tbd.N, or --CR.sub.3 .dbd.C(R.sub.3).sub.

Abstract: Fibers having increased strength and small diameters can be produced from compositions comprising long chain branched syndiotactic vinyl aromatic polymers derived from the polymerization of a vinyl aromatic monomer in the presence of from 10 to 1000 ppm, based on the amount of vinyl aromatic monomer, of a multifunctional monomer having more than one olefinic functionality. Due to the increased fiber strength, less strand breakage occurs during processing which increases process productivity and yield.

Abstract: Thermosetting polymers with high temperature capability for composite and adhesive applications are disclosed. Inhibitors for improving pot life, gel time and storage stability are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.

Abstract: This invention relates to resin solution compositions for electronic materials consisting of organic solutions of 100 parts by weight of siloxanepolyimidepolyamic acid copolymers composed of imide segments formed by polycondensation of aromatic tetracarboxylic acid dianhydrides and siloxanediamines and amic acid segments formed by polyaddition of aromatic tetracarboxylic acid dianhydrides and aromatic diamines other than siloxanediamines and represented by the following general formula (1) (in which X is the residue of an aromatic tetracarboxylic acid dianhydride, Y is the residue of a siloxanediamine, Z is the residue of an aromatic diamine, l and m are integers independent of each other, and n is an integer of 1 or more) and 1 to 50 parts by weight of epoxy resins. The compositions are storage-stable and curable at relatively low temperature and yield cured products with an excellent balance of heat resistance, high-frequency characteristics, chemical resistance and stress relaxation characteristics.

Abstract: The invention relates to belts made of thermoplastic polymer (A) and comprising a sufficient amount of a polymer (B) to render them antistatic, the said polymer (B) comprising polyethylene glycol blocks. Use is advantageously made of polymers (A) containing polyamide-6 (PA-6) or polyamide-12 (PA-12) blocks and polytetramethylene glycol blocks and polymers (B) containing PA-6 or PA-12 blocks and polyethylene glycol blocks.