Solid Polymer Derived From Imide Reactant Patents (Class 525/422)
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Patent number: 5804649Abstract: The present invention discloses a water-soluble self-acid-doped polyaniline, and its sodium salt, which can be cast into free-standing films from their aqueous solutions. A process for preparing a water-soluble self-acid-doped polyaniline is also disclosed, which comprises reacting a polyaniline with a strong base to convert the amino nitrogen thereof to anionic nitrogen; reacting sultone with the anionic nitrogen to form a side chain alkanesulfonic acid group; doping with protonic acid to form precipitate; dissolving (undoping) the precipitate in an alkaline aqueous solution; removing excess alkali from the alkaline aqueous solution; and contacting the resulting aqueous solution with a H.sup.+ -type ion exchange resin. Moreover, an aqueous solution of the present water-soluble self-acid-doped PAn can be easily mixed with an additional water soluble polymer or polymer emulsion, which can then be cased into a polymer blend film having improved mechanical properties and coupling strength to a substrate.Type: GrantFiled: July 21, 1997Date of Patent: September 8, 1998Assignee: National Science CouncilInventors: Show-An Chen, Gue-Wuu Hwang
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Patent number: 5773509Abstract: A heat resistant resin composition comprising, as the main components,(A) 100 parts by weight of an organic solvent-soluble polyimide resin having a glass transition temperature of 350.degree. C. or less,(B) 5 to 100 parts by weight of an epoxy compound having at least two epoxy groups in one molecule, and(C) 0.1 to 20 parts by weight of a compound having an active hydrogen group which can react with the epoxy compound (B),a heat resistant film adhesive comprising, as the main components, the above components (A), (B) and (C), and a process for producing a heat resistant film adhesive by casting a solution of the above heat resistant resin composition on one side or both sides of a support.Type: GrantFiled: March 7, 1995Date of Patent: June 30, 1998Assignee: Sumitomo Bakelite Company LimitedInventors: Tatsuhiro Yoshida, Keizo Takahama, Syusaku Okamyo
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Patent number: 5760168Abstract: Controlled molecular weight phenylethynyl terminated imide oligomers (PETIs) have been prepared by the cyclodehydration of precursor phenylethynyl terminated amic acid oligomers. Amino terminated amic acid oligomers are prepared from the reaction of dianhydride(s) with an excess of diamine(s) and subsequently endcapped with phenylethynyl phthalic anhydride(s) (PEPA). The polymerizations are carried out in polar aprotic solvents such as N-methyl-2-pyrrolidinone or N,N-dimethylacetamide under nitrogen at room temperature. The amic acid oligomers are subsequently cyclodehydrated either thermally or chemically to the corresponding imide oligomers. Direct preparation of PETIs from the reaction of dianhydride(s) with an excess of diamine(s) and endcapped with phenylethynyl phthalic anhydride(s) has been performed in m-cresol. Phenylethynyl phthalic anhydrides are synthesized by the palladium catalyzed reaction of phenylacetylene with bromo substituted phthalic anhydrides in triethylamine.Type: GrantFiled: October 21, 1996Date of Patent: June 2, 1998Assignee: The United States of America as represented by the Administrator of the National Aeuonautics and Space AdministrationInventors: Paul M. Hergenrother, Joesph G. Smith, Jr.
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Patent number: 5750633Abstract: A dope for cast formation comprising a fluorine including polyimide resin and an organic solvent (P) as main components. The fluorine including polyimide resin has at least one --CF.sub.3 group in the repeating molecular unit. The organic solvent (P) is present during the resin polymerization of the fluorine including polyimide resin. The organic solvent (P) is diethylene glycol dimethyl ether.Type: GrantFiled: October 24, 1995Date of Patent: May 12, 1998Assignee: Nitto Denko CorporationInventors: Tomomi Ohara, Hisao Hachisuka
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Patent number: 5747615Abstract: Heat-curable resin systems containing at least one liquid monomer and one solid component, and which have superior tack and drape, may be prepared by slurry mixing a slurry compatible solid into at least one liquid monomer such that the finished resin system contains the solid as a discontinuous phase having a particle size of less than about 20 .mu.m.Type: GrantFiled: June 2, 1995Date of Patent: May 5, 1998Assignee: Cytec Technology Corp.Inventor: Linas Norman Repecka
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Patent number: 5726248Abstract: This invention relates to a novel class of polymeric compositions which have molecular weights ranging from 300 to 10,000 and are the reaction product of (a) an N-aryl or N-alkaryl substituted diphenyldiamine and (b) a conjugated or nonconjugated diene. These polymeric N-aryl substituted and N-alkaryl diphenyldiamine compounds are particularly useful as an antioxidant in diene containing polymers.Type: GrantFiled: January 22, 1997Date of Patent: March 10, 1998Assignee: The Goodyear Tire & Rubber CompanyInventors: Lawson Gibson Wideman, Paul Harry Sandstrom, Denise Jeannette Keith
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Patent number: 5705574Abstract: Polyimide oligomers include (1) linear, mono-functional crosslinking oligomers prepared by condensing a monoanhydride end cap with a diamine that includes alternating ether and "sulfone" (--SO.sub.2 --, --S--, --CO--, --(CF.sub.3).sub.2 C--, or --(CH.sub.3).sub.2 C--) linkages connecting alternating aromatic radicals and with a dianhydride (or dianhydride mixture), particularly the unsaturated, aliphatic dianhydride commonly known as MCTC; (2) linear, mono- or difunctional crosslinking oligomers prepared by condensing an amine end cap with a diamine and a dianhydride; and (3) multidimensional, crosslinking oligomers having an aromatic hub and at least three radiating arms connected to the hub, each arm including a crosslinking end cap at its distal end and at least one imide linkage.Blends, prepregs, and composites can be prepared from the oligomers.Type: GrantFiled: June 5, 1995Date of Patent: January 6, 1998Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard
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Patent number: 5670564Abstract: Rigid-rod macromonomers, and methods for preparing such macromonomers, having a polyaromatic backbone, solubilizing side groups, and reactive end groups are provided. The macromonomers are chemically incorporated into polymer systems to provide stronger, stiffened polymers.Type: GrantFiled: June 1, 1995Date of Patent: September 23, 1997Assignee: Maxdem IncorporatedInventors: Robert R. Gagne, Matthew Louis Marrocco, III, Mark Steven Trimmer, Neil H. Hendricks
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Patent number: 5654396Abstract: We achieve solvent resistance and extended use life for advanced polyimides by including at least some solvent-resistant linkages in the backbone in place of phenoxyphenyl sulfone linkages and using diPEPA or PEPA crosslinking end caps.Type: GrantFiled: June 5, 1995Date of Patent: August 5, 1997Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard
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Patent number: 5648432Abstract: In the process of the present invention, a non-polar, aprotic solvent is removed from an oligomer/polymer solution by freeze-drying in order to produce IPNs and semi-IPNs. By thermally quenching the solution to a solid in a short length of time, the size of the minor constituent-rich regions is greatly reduced as they are excluded along with the major constituent from the regions of crystallizing solvent. The use of this process sequence of controlling phase morphology provides IPNs and semi-IPNs with improved fracture toughness, microcracking resistance, and other physical-mechanical properties as compared to IPNs and semi-IPNs formed when the solvent is evaporated rather than sublimed.Type: GrantFiled: June 7, 1995Date of Patent: July 15, 1997Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Ruth H. Pater, Marion G. Hansen
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Patent number: 5643998Abstract: A recyclable polymer is formed of a plurality of oligomer units obtained by polymerizing a fixed number of monomers, and linkage units for linking the oligomer units through a chemical bond which is different from a bond between monomers constituting the oligomer units, thereby allowing repetitive scission and re-bonding of the linkage units by a predetermined treatment not cleaving the bond between monomers. The recyclable polymer is decomposable into oligomers and the oligomers can be linked again into the original polymer without degrading the quality of the polymer. A process for producing the recyclable polymer, a method for recovering the recyclable polymer, and a method for regenerating the recyclable polymer are also provided.Type: GrantFiled: March 8, 1995Date of Patent: July 1, 1997Assignee: Kabushiki Kaisha Toyota Chuo KenkyushoInventors: Mitsuru Nakano, Arimitsu Usuki, Akane Okada, Osami Kamigaito
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Patent number: 5637387Abstract: The present invention relates to storage-stable advanced polymaleimide compositions and prepreg products manufactured therefrom comprising (A) an advanced polymaleimide reaction product resulting from the advancement reaction of a polyimide and an alkenyl phenol; and (B) a phenothiazine added to component (A) after advancement.Type: GrantFiled: June 2, 1995Date of Patent: June 10, 1997Assignee: Ciba-Geigy CorporationInventors: Benjamin G. Chin, Roger Tietze
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Patent number: 5608013Abstract: A polyimide obtained by reacting an acid dianhydride such as catechol bistrimellitate dianhydride, bisphenol A bistrimellitate dianhydride, etc. with a diamine such as 4,4'-diamino-3,3',5,5'-tetraisopropyl-diphenylmethane, etc. has high solubility in organic solvents and good moldability at low temperatures, and can provide a thermosetting resin composition together with a polymaleimide.Type: GrantFiled: March 7, 1995Date of Patent: March 4, 1997Assignee: Hitachi Chemical Company, Ltd.Inventors: Hidekazu Matsuura, Yasuo Miyadera
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Patent number: 5602213Abstract: A heat resistant composition comprising a mixture of (a) a polyurethane or a modified polyurethane and (b) a bismaleimide oligomer, in which the bismaleimide oligomer is in an amount of about 1 to 35 percent by weight based on overall solid contents. The polyurethane is formed by reacting a diisocyanate-containing compound with a dihydroxy diol-compound. Then the polyurethane is reacted with a trimellitic anhydride, a diacid or a mixture thereof to form the modified polyurethane. The bismaleimide oligomer is formed by reacting a bismaleimide resin with a barbituric acid or a derivative thereof.Type: GrantFiled: July 9, 1993Date of Patent: February 11, 1997Assignee: Industrial Technology Research InstituteInventors: Sheng-Yaw Hsu, Tzong-Ming Lee, Jing-Pin Pan
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Patent number: 5596073Abstract: The present invention relates to solutions which can be directly shaped in anhydrous dimethylalkyleneurea, based on a polyimide obtained from an aromatic dianhydride and an aromatic diisocyanate.It also relates to the process for the production of the above solutions, as well as to a process for spinning these solutions and to the yarns and fibres thus obtained.Type: GrantFiled: April 14, 1995Date of Patent: January 21, 1997Assignee: S.N.C. KermelInventors: Philippe Michaud, Jean Russo
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Patent number: 5578686Abstract: A phenolic allyl ether is provided which can be prepared by reacting a polyphenol with an allyl halide, said polyphenol described by the formula ##STR1## in which Ar is an aromatic moiety, L is a divalent cyclohexanenorbomane linking moiety, L' is a divalent cycloaliphatic moiety, Allyl is a phenolic allyl ether group, and each of m and n is a number within the range of 0 to about 10. Such phenolic allyl ethers include the reaction product of allyl halide with the product of the addition reaction of a phenol and a cyclohexenenorbornene compound such as 5-(3-cyelohexen-1-yl)bicyclo[2.2.1]hept-2-ene. The resulting phenolic allyl ether resins are useful as processing agents for polymaleimides.Type: GrantFiled: July 24, 1995Date of Patent: November 26, 1996Assignee: Shell Oil CompanyInventors: Pen-Chung Wang, Donald R. Kelsey
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Patent number: 5536792Abstract: A process is disclosed for making circuit elements by photolithography comprising depositing an antireflective polyimide or polyimide precursor layer on a substrate and heating the substrate at 200.degree. C. to 500.degree. to provide a functional integrated circuit element that includes an antireflective polyimide layer. The antireflective polyimide layer contains a sufficient concentration of at least one chromophore to give rise to an absorbance sufficient to attenuate actinic radiation at 405 or 436 nm. Preferred chromophores include those arising from perylenes, naphthalenes and anthraquinones. The chromophore may reside in a dye which is a component of the polyimide coating mixture or it may reside in a residue which is incorporated into the polyimide itself.Type: GrantFiled: April 19, 1995Date of Patent: July 16, 1996Assignee: International Business Machines CorporationInventors: Dennis P. Hogan, Harold G. Linde, Ronald A. Warren
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Patent number: 5530075Abstract: The instant invention pertains to a curable resin composition comprised of A) 100 parts by weight curable resin, and B) 0.1-500 parts by weight of an organopolysiloxane having organic groups that contain epoxy groups, which is expressed by the formula: ##STR1## wherein R.sup.1 is a univalent hydrocarbon group excluding alkenyl groups, R.sup.2 is a hydrogen atom or a univalent hydrocarbon group excluding alkenyl groups, R.sup.3 is an alkoxysilylalkyl group or an organic group that contains epoxy groups, a is 0 or a positive integer, b is a positive integer and c is a positive integer, where a/c has the value of 0 to 4, b/c has the value of 0.05 to 4 and (a+b)/c has the value of 0.2 to 4. The curable resin composition of the instant invention has superior flowability that produces a hardened resin with superior flexibility and adhesion.Type: GrantFiled: August 15, 1994Date of Patent: June 25, 1996Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Yoshitsugu Morita, Noriyasu Yokoyama
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Patent number: 5527863Abstract: Copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition were obtained by reacting maleic acid, an additional polycarboxylic acid and ammonia in a stoichiometric excess, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., to provide copolymers of polysuccinimide. In a second embodiment, a polyamine was added to the reaction mix. These intermediate polysuccinimide copolymers could then be converted to the salts of copolymers of polyaspartic acid by hydrolysis with a hydroxide.Such copolymers are useful in preventing deposition of scale from water and find applications in treating water. Other applications include scale prevention additives for detergents. In addition, such copolymers inhibit dental tartar and plaque formation.Type: GrantFiled: January 27, 1995Date of Patent: June 18, 1996Assignee: Bayer AGInventors: Louis L. Wood, Gary J. Calton
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Patent number: 5525703Abstract: There is disclosed novel cross linked polyanhydroaspartic acid which is the product of the reaction of a polysuccinidmide with triaminononoane (TAN). Depending upon the amount a cross linking agent employed compositions of varying degrees of cross linking are produced. Mole ratio of polysuccinimide to TAN such as from 3 to 1 provides a water insoluble material while a mole ratio of 102 to 1 provides a water soluble material at 28% by weight. Such compounds find utility as thickeners, deflocculants, flocculants and water absorbers.Type: GrantFiled: December 27, 1994Date of Patent: June 11, 1996Assignee: Monsanto CompanyInventor: Dennis J. Kalota
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Patent number: 5525682Abstract: A process for preparing a novel superabsorbent polymer which is readily hydrolyzed and conform to environment by reacting a polysuccinimide with a diamine in an aqueous solution or an organic solvent to partially crosslink the polysuccinimide, and subsequently or concurrently hydrolyzing the remaining imide ring with an alkali while controlling the pH; and the superabsorbent polymer thus obtained.Type: GrantFiled: June 7, 1995Date of Patent: June 11, 1996Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Akinori Nagatomo, Hiroaki Tamatani, Masanobu Ajioka, Akihiro Yamaguchi
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Patent number: 5523383Abstract: A process for the preparation of a photocurable resin which comprises the steps of(I) (a) imidating 20 to 80 mole % of the acid arthydride groups present in an adduct prepared by the addition reaction of an .alpha.,.beta.-unsaturated dicarboxylic acid arthydride to a conjugated diene polymer or copolymer with a primary amine to produce water and an amide,(b) reacting the thus formed water as a by-product with at least a part of the remaining acid arthydride groups in said adduct to produce the succinic acid groups by opening the ring of said acid arthydride groups,(II) dehydrating the thus produced succinic acid groups by heating to cause ring closure again thereby forming acid anhydride groups and(III) reacting at least a part, preferably at least 50 mole %, of the acid anhydride rings present in the polymer with an .alpha.,.beta.-unsaturated monocarboxylic acid ester having an alcoholic hydroxyl group to conduct a half-esterification by opening the ring of said acid arthydride groups.Type: GrantFiled: May 11, 1994Date of Patent: June 4, 1996Assignee: Nippon Petrochemicals Co., Ltd.Inventors: Nobuo Ikeda, Teruhisa Kuroki, Tatsuo Yamaguchi, Hiroyoshi Oomiya
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Patent number: 5516876Abstract: Polyimide oligomers include (1) linear, monofunctional crosslinking oligomers prepared by condensing a monoanhydride end cap with a diamine that includes alternating ether and "sulfone" (--SO.sub.2 --, --S--, --CO--, --(CF.sub.3).sub.2 C--, or --(CH.sub.3).sub.2 C--) linkages connecting alternating aromatic radicals and with a dianhydride (or dianhydride mixture), particularly the unsaturated, aliphatic dianhydride commonly known as MCTC; (2) linear, mono- or difunctional crosslinking oligomers prepared by condensing an amine end cap with a diamine and a dianhydride; and (3) multidimensional, crosslinking oligomers having an aromatic hub and at least three radiating arms connected to the hub, each arm including a crosslinking end cap at its distal end and at least one imide linkage. Blends, prepregs, and composites can be prepared from the oligomers.Type: GrantFiled: April 25, 1994Date of Patent: May 14, 1996Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard
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Patent number: 5510427Abstract: Higher molecular weight copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition may be obtained by reacting maleic acid and ammonia in a stoichiometric excess, with a diamine or a triamine, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., and then converting the copolymer of polysuccinimide formed to a salt of a copolymer of polyaspartic acid by hydrolysis with a hydroxide.Type: GrantFiled: May 17, 1995Date of Patent: April 23, 1996Assignee: SRCHEM, Inc.Inventor: Louis L. Wood
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Patent number: 5510426Abstract: Higher molecular weight copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition may be obtained by reacting maleic acid and ammonia in a stoichiometric excess, with a diamine or a triamine, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., and then converting the copolymer of polysuccinimide formed to a salt of a copolymer of polyaspartic acid by hydrolysis with a hydroxide.Type: GrantFiled: May 17, 1995Date of Patent: April 23, 1996Assignee: SRCHEM, Inc.Inventor: Louis L. Wood
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Patent number: 5510425Abstract: A polymide comprises structural units represented by the following formula: ##STR1## wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.Type: GrantFiled: July 1, 1994Date of Patent: April 23, 1996Assignee: Hitachi Chemical Company, Ltd.Inventors: Hidekazu Matsuura, Yoshihide Iwasaki, Kaori Ikeda, Takayuki Suzuki, Masashi Tanaka, Yasuo Miyadera
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Patent number: 5502117Abstract: Higher molecular weight copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition may be obtained by reacting maleic acid and ammonia in a stoichiometric excess, with a diamine or a triamine, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., and then converting the copolymer of polysuccinimide formed to a salt of a copolymer of polyaspartic acid by hydrolysis with a hydroxide.Type: GrantFiled: May 17, 1995Date of Patent: March 26, 1996Assignee: Srchem, Inc.Inventor: Louis L. Wood
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Patent number: 5496914Abstract: Polymers of maleic, fumaric or malic acids or maleic, fumaric or malic acid and ammonia with amino acids are prepared by heating at 180.degree.-350.degree. C., preferably 200.degree.-300.degree. C. The polymer formed may be converted to a salt by hydrolysis with a metal hydroxide or ammonium hydroxide.Type: GrantFiled: January 18, 1995Date of Patent: March 5, 1996Assignee: SRCHEM, Inc.Inventors: Louis L. Wood, Gary J. Calton
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Patent number: 5476908Abstract: A cured resin product has a strain energy release rate (GIC) of at least 400 J/m.sup.2, a flexural modulus of at least 300 Kg/mm.sup.2, and a glass transition temperature (Tg) of at least 120.degree. C. The cured resin composition comprises a thermoset resin component (A), optionally including a curing agent (B), and a thermoplastics resin component (C), the thermoplastics resin and thermoset resin components (C) and (A) being present at least partly in respective phases (1) and (2) each being elongate in at least one direction and each preferably having a three dimensionally continuous structure. Phase (1) may contain a silicon containing compound providing a concentration therein of elemental silicon higher than that in any other phase, and/or the cured resin product may additionally include regions where one of the phases (1) and (2) essentially surrounds the other.Type: GrantFiled: April 12, 1993Date of Patent: December 19, 1995Assignee: Toray Industries, Inc.Inventors: Hajime Kishi, Nobuyuki Odagiri, Kuniaki Tobukuro
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Patent number: 5470942Abstract: There is disclosed a process for preparing polyaspartic acid by thermal condensation of L-aspartic acid in a novel catalyst which shortens the reaction time and increases the molecular weight of the polymer. The novel catalyst is a catalytically effective methylenephosphonic acid. Typical catalysts are 1-hydroxyethylidene-1,1-diphosphonic acid and aminotris(methylenephosphonic acid). The methylenephosphonic acid is blended with the amino acid in a molar ratio of amino acid to catalyst in the range of from about 1:1 to 40:1.Type: GrantFiled: February 16, 1995Date of Patent: November 28, 1995Assignee: Monsanto CompanyInventors: Gregory C. Alexander, Mark E. Jason, Dennis J. Kalota
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Patent number: 5470922Abstract: Polymeric blends of polyimide precursor resins and polyamides or polyesters, preferably in the form of liquid crystal polymers, provide polyimide products with excellent physical characteristics and injection molding capability.Type: GrantFiled: May 10, 1994Date of Patent: November 28, 1995Assignee: E. I. Du Pont de Nemours and CompanyInventors: Mureo Kaku, Robert R. Luise
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Patent number: 5470920Abstract: The present invention relates to impregnating solutions consisting:of an active principle A+B in which: A denotes at least one thermoplastic poly(imide-amide) oligomer functionalized at the chain ends with an alkenyloxy, maleimido or nadimido group, B denotes a coreactant chosen from: B1=an imide ingredient, B2=an acrylate ingredient, B3=an alkenylphenol ingredient, B4=a novolac resin, B5=a vinyl ingredient, B6=an epoxy resin, B7=an amino ingredient and B8=a mixture of a number of ingredients B1 to B7;and of one or a number of aprotic polar solvent(s), the concentration of the active principle in the solution being between 2 and 80% by weight.These solutions are employed especially for the production of preimpregnated intermediate articles.Type: GrantFiled: October 1, 1993Date of Patent: November 28, 1995Assignee: Ciba-Geigy CorporationInventors: Yves Camberlin, Rene Dien, Philippe Michaud
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Patent number: 5466760Abstract: Higher molecular weight copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition may be obtained by reacting maleic acid and ammonia in a stoichiometric excess, with a diamine or a triamine, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., and then converting the copolymer of polysuccinimide formed to a salt of a copolymer of polyaspartic acid by hydrolysis with a hydroxide.Type: GrantFiled: January 17, 1995Date of Patent: November 14, 1995Assignee: Srchem, Inc.Inventor: Louis L. Wood
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Patent number: 5460746Abstract: A terminal modified imide oligomer fusible at a relatively low temperature and usable for prepregs free from solvent or as a hot melt-type binder, includes (A) an unsaturated imide compound prepared by a reaction of a substituted nadic anhydride with an aromatic diamine and provided with terminal unsaturated hydrocarbon groups and imide groups located in inside portions of the compound molecule and (B) a terminal modified imide oligomer prepared by a reaction of (a) a carboxylic acid component comprising (i) 2,3,3',4'-biphenyltetracarboxylic anhydride and (ii) a substituted or unsubstituted nadic anhydride, with (b) a diamine component comprising at least one aromatic diamine, provided with terminal unsaturated hydrocarbon groups and imide groups located in inside portions of the oligomer molecule and having a logarithmic viscosity number of 0.03 to 1.0, determined in a concentration of 0.5 g/100 ml in N-methyl-2-phyrrolidone at 30.degree. C.Type: GrantFiled: July 20, 1993Date of Patent: October 24, 1995Assignee: UBE Industries, Ltd.Inventors: Shinji Yamamoto, Kazuyoshi Fujii, Takefumi Taga
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Patent number: 5453467Abstract: A graft polymer obtainable by grafting a polymer substrate with a compound of formula (I), in which the groups R are the same or different and each is a straight or branched C.sub.1 -C.sub.4 alkyl group; X is an aryl group or a straight or branched C.sub.1 -C.sub.20 alkylene group, optionally containing one or more carbon-carbon double or triple bonds, ether linkages or aryl groups; the aryl groups being unsubstituted or substituted by one or more C.sub.1-4 alkyl groups; n is from 2 to 4; and A is a reactive group, is useful as a biocompatible material in contact lenses, biomedical devices and blood-containing devices. In a preferred embodiment A is a polymerizable group and the graft polymer is produced by radical initiated polymerization of the compound of formula (I) on the substrate which is initiated by a radical-forming group on the substrate.Type: GrantFiled: April 28, 1994Date of Patent: September 26, 1995Assignee: Biocompatibles LimitedInventors: Clement H. Bamford, Kadem G. Al-Lamee, Yiannakis Yianni, Martin C. Wiles, Trevor O. Glasbey
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Patent number: 5424391Abstract: A method for producing polysuccinimide is provided. Thermal polymerization of fumaramic acid at a temperature of from about 160.degree. C. to about 330.degree. C. produces polysuccinimide. The reaction is optionally conducted in the presence of one or more processing aids, solvents or diluents. The polysuccinimide is particularly useful as a detergent additive.Type: GrantFiled: July 20, 1993Date of Patent: June 13, 1995Assignee: Rohm and Haas CompanyInventors: Yi H. Paik, Graham Swift, Ethan S. Simon, Michael B. Freeman
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Patent number: 5391642Abstract: Higher molecular weight copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition may be obtained by reacting maleic acid and ammonia in a stoichiometric excess, with a diamine or a triamine, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., and then converting the copolymer of polysuccinimlde formed to a salt of a copolymer of polyaspartic acid by hydrolysis with a hydroxide.Type: GrantFiled: June 17, 1994Date of Patent: February 21, 1995Assignee: SRCHEM IncorporatedInventor: Louis L. Wood
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Patent number: 5380820Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.Type: GrantFiled: December 7, 1993Date of Patent: January 10, 1995Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Masahiro Ohta, Masao Yoshikawa
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Patent number: 5357004Abstract: Higher molecular weight copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition may be obtained by reacting maleic acid and ammonia in a stoichiometric excess, with a diamine or a triamine, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., and then converting the copolymer of polysuccinimide formed to a salt of a copolymer of polyaspartic acid by hydrolysis with a hydroxide. Alkyl or substituted alkyl groups may be incorporated in the backbone of the polymer by adding a alkyl or substituted alkyl monoamine to maleic acid and ammonia and heating at 120.degree. C. or more until polymerization has occurred.Type: GrantFiled: February 14, 1994Date of Patent: October 18, 1994Assignee: Srchem IncorporatedInventors: Gary J. Calton, Louis L. Wood
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Patent number: 5344894Abstract: Polyimide oligomers include (1) linear, monofunctional crosslinking oligomers prepared by condensing a monoanhydride end cap with a diamine that includes alternating ether and "sulfone" (--SO.sub.2 --, --S--, --CO--, --(CF.sub.3).sub.2 C--, or --(CH.sub.3).sub.2 C--) linkages connecting alternating aromatic radicals and with a dianhydride (or dianhydride mixture), particularly the unsaturated, aliphatic dianhydride commonly known as MCTC; (2) linear, mono- or difunctional crosslinking oligomers prepared by condensing an amine end cap with a diamine and a dianhydride; and (3) multidimensional, crosslinking oligomers having an aromatic hub and at least three radiating arms connected to the hub, each arm including a crosslinking end cap at its distal end and at least one imide linkage.Blends, prepregs, and composites can be prepared from the oligomers.Type: GrantFiled: November 23, 1992Date of Patent: September 6, 1994Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard
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Patent number: 5340890Abstract: An epoxy resin composition containing an anhydride-functional cyclobutene which can be represented by the formula ##STR1## in which each R is independently selected from hydrogen, C.sub.1-10 alkyl, aryl, halide and C.sub.1-10 heteroatomic.Type: GrantFiled: January 28, 1993Date of Patent: August 23, 1994Assignee: Shell Oil CompanyInventor: Larry S. Corley
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Patent number: 5328962Abstract: Miscible polymer blends of high heat resistant acrylate-maleimide polymers containing from 1 to 99% or more by weight of the maleimided polymer with conventional poly (methyl methacrylate) polymer, the blends having higher glass transition temperatures than poly (methyl methacrylate) but substantially the same optical and mechanical properties as poly (methyl methacrylate) and compatible blends of high heat resistant acrylate-maleimide polymers, conventional acrylic impact modifier, and, optionally, conventional poly (methyl methacrylate).Type: GrantFiled: February 19, 1993Date of Patent: July 12, 1994Assignee: ICI Acrylics, Inc.Inventor: Jyi-Sheng J. Shen
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Patent number: 5321096Abstract: A thermoplastic resin composition comprise 99.9.about.50 parts by weight of one or more thermoplastic resin selected from the group consisting of aromatic polyimide, aromatic polyetherimide, aromatic polyamideimide, aromatic polyethersulfone and aromatic polyether ketone and 0.1.about.50 parts by weight of one or more liquid crystal type aromatic polyimide having recurring structural units represented by the formula (1): ##STR1## wherein R.sub.1 .about.R.sub.5 is a hydrogen atom, fluorine atom, trifluoromethyl, methyl, ethyl or cyano and may be the same or different, and R is a tetravalent radical having 6.about.27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member.Type: GrantFiled: March 22, 1993Date of Patent: June 14, 1994Assignee: Mitsui Toatsu Chemical, IncorporatedInventors: Yuichi Okawa, Nobuhito Koga, Hideaki Oikawa, Tadashi Asanuma, Akihiro Yamaguchi
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Patent number: 5300576Abstract: The thermal properties, such as heat distortion temperature of biodegradable polymers, such as polylactic acid, polyglycolides, polybutyric acid and copolymers of butyric and valeric acid, may be increased by blending them with a polymer having Tg from 75.degree. C. to 200.degree. C. and a Hildebrand parameter (.sigma.) of not more than 3 MPA.sup.1/2 different from the biopolymer.Type: GrantFiled: October 3, 1991Date of Patent: April 5, 1994Assignee: Camelot Technologies, Inc.Inventors: Speros P. Nemphos, Gregory B. Kharas
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Patent number: 5300588Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer wherein component (B) and/or (C) has a double bond conjugated with an aromatic group and component (B) and/or (C) has a naphthalene ring. The composition is easily workable and cures to products having improved adhesion, heat resistance, low thermal expansion, and low water absorption.Type: GrantFiled: April 3, 1992Date of Patent: April 5, 1994Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toshio Shiobara, Kazutoshi Tomiyoshi, Hisashi Shimizu, Manabu Marumi
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Patent number: 5290908Abstract: Aromatic polyimides with acetylenic end groups are cured by coupling together thermally or catalytically using cuprous salts as catalysts to increase molecular weight with little or no by-product formation. These polyimides can be shaped and formed prior to the coupling.The acetylenic end-capped aromatic polyimides are formed by the reaction of an aromatic dianhydride, an acetylenic organic monoamine compound which will provide the reactive end groups and optionally an aromatic diamine.Type: GrantFiled: January 24, 1975Date of Patent: March 1, 1994Assignee: The University of Notre Dame du LacInventor: Gaetano F. D'Alelio
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Patent number: 5290882Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.Type: GrantFiled: August 11, 1992Date of Patent: March 1, 1994Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toshio Shiobara, Hisashi Shimizu, Manabu Narumi
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Patent number: 5286810Abstract: Higher molecular weight copolymers of polyaspartic acid which are suitable for the inhibition of scale deposition may be obtained by reacting maleic acid and ammonia in a stoichiometric excess, with a diamine or a triamine, at 120.degree.-350.degree. C., preferably 180.degree.-300.degree. C., and then converting the copolymer of polysuccinimide formed to a salt of a copolymer of polyaspartic acid by hydrolysis with a hydroxide.Type: GrantFiled: April 7, 1993Date of Patent: February 15, 1994Assignee: SRCHEM IncorporatedInventor: Louis L. Wood
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Patent number: 5286811Abstract: A preferred class of polyimide oligomers include (1) linear, difunctional crosslinking oligomers prepared by condensing an imidophenylamine end cap with a lower alkylene diamine or a polyaryldiamine such as 3,3'-phenoxyphenylsulfone diamine and with a dianhydride, particularly 4,4'-phenoxyphenylsulfone dianhydride; and (2) multidimensional, crosslinking, polyimide oligomers having an aromatic hub and at least two radiating arms connected to the hub, each arm including a crosslinking imidophenylamine end cap at its distal end and at least two imide linkages.Blends, prepregs, and composites can be prepared from the oligomers.Type: GrantFiled: May 21, 1992Date of Patent: February 15, 1994Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard
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Patent number: 5270401Abstract: Disclosed is a plastics composition comprising a thermoplastic blend comprising: (1) 5-95 wt % of a polyamide (PA) and 95-5 wt % of a polyester (PE) incorporating 1-50 wt % of an aliphatic dimer fatty acid, (2) 0.01-30 parts by weight of a compound having at least one ethylenically unsaturated group or propylene group and further having a carboxylic, acid anhydride, acid amide, imido, carboxylic ester, amino or hydroxyl group per 100 parts by weight based on the combined weight of PA and PE, (3) 0-90 parts by weight of a polyester not modified with dimer fatty acid per 100 parts by weight based on the combined weight of PA and PE. Preferably the polyester (PE) is a polyethylene terephthalate or polybutylene terephthalate modified with di-oleic acid. The blends have a greatly improved elongation at break and are readily spinnable.Type: GrantFiled: October 11, 1991Date of Patent: December 14, 1993Assignee: DSM N.V.Inventors: Chi K. Sham, Wilhelmus T. M. Jansen, Martin A. Doherty