Abstract: A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa·s and provides a cured product displaying a breaking elongation of at least 5%. The composition comprises (A) at least one of a bisphenol epoxy resin (A1) and a phenol novolak epoxy resin (A2), a polyvalent epoxy resin formed from a mononuclear aromatic backbone (B), an aromatic amine curing agent (C), and a rubber (D).

Abstract: Energy savings are realized during the commercial production of polyethylene terephthalate by partially cooling polyethylene terephthalate pellets exiting a solid stating reactor by contact with water, and using the residual heat stored in the pellets to vaporize associated water to form dry pellets.

Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.

Abstract: A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.

Abstract: A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.

Abstract: Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; each R2 is independently a multivalent hydrocarbon group having 1 to 20 carbon atoms; Y is each R3 and R4 are independently alkyl or aryl groups having 1 to 8 carbon atoms; each Z is independently oxygen or nitrogen; R5 is absent when Z is oxygen and R5 is hydrogen, an alkyl or aryl group having 1 to 20 carbon atoms, or (Y)a —R2— when Z is nitrogen; a and b are integers; a is at least 1; b is 1 to 3; and (b) at least one epoxy-containing resin and/or at least one siloxane-containing resin. The material can optionally be reacted with an acidic hydrogen-containing compound. Some compositions are curable without using crosslinking agents or accelerators.

Abstract: Self-dispersing, hardenable epoxy resins produced by reacting one or more ?,?-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: A curing agent for epoxy agent having N-phenyl-p-phenylenediamine(4-aminodiphenylamine). An epoxy resin combination having a main agent and a curing agent. The main agent has an epoxy resin. The curing agent has a N-phenyl-p-phenylenediamine(4-aminodiphenylamine).

Abstract: The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cured flame retardant epoxy resin is environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications. The phosphorus group of the curing agent has a chemical structure as follows: wherein Ar is a substituted or un-substituted phenyl or phenoxy.

Abstract: Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from imidazole, dicyandiamide, or a mixture of polyamines and tertiary amines. A poiyol mixture is then selected. The first component is combined with the polyol mixture to form a hardener. The hardener is combined with epoxy resin and is cured. A method for selecting a hardener to yield an epoxy-hardener system with good properties after curing at a specified temperature and time includes selecting components for the hardener so the glass transition temperature of the cured epoxy-hardener system is not significantly lower than 45° C. above the cure temperature. The method includes steps for adjusting and controlling the ultimate glass transition temperature to maximize the mechanical properties of the epoxy-hardener system. The method regularly produces hardened epoxy systems having about 90% or more epoxy groups reactect.

Abstract: The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated surface and a second activated surface; cooling the activated adhesive film either while irradiating or immediately after irradiating the film; contacting the first activated surface with a first substrate; contacting the second activated surface with a second substrate; and applying heat and pressure to the first and second substrates to cure the activated adhesive film and to bond the substrates to one another.

Abstract: A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine groups wherein the weight ratio of epoxy resin:adhesion promotor being from about 2:1 to about 20:1, (c) a curative of a nitrogen-containing compound and a transition metal complex; and, optionally, a polysulfide toughening agent.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak ?-alkoxy ester linkages which provide for the reworkable aspect of the invention.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak ?-alkoxy ester linkages providing for the reworkable aspect of the invention.

Abstract: A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature curing agent capable of maintaining its own domain during extrusion which is extruded as one component at a temperature below 220° F. and the extrudate is cooled and pulverized to form a low temperature curable coating powder. The powder cures at a temperature of from about 225 to about 300° F. and produces a coating having an exceptionally smooth surface with either a low or high gloss. The powder is particularly useful for coating heat sensitive substrates such as plastics, paper, cardboard and wood.

Abstract: A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa's, and provides a cured product displays a breaking elongation of at least 5%. The composition comprises (A) at least one of a bisphenol epoxy resin (A1) and a phenol novolak type epoxy resin (A2), a polyvalent epoxy resin formed from a mononuclear aromatic backbone (B), and an aromatic amine curing agent (C).

Abstract: The invention relates to modified polyamides, and more particularly to polyamides containing units of the type obtained by reacting a diacid with a diamine, modified with a multifunctional compound. The finished articles shaped from these polyamides or from compositions based on these polyamides have excellent mechanical properties and also a very good surface aspect. The modified polyamide according to the invention is obtained by melt-blending polyamides of different natures, in the presence of a multifunctional compound.

Abstract: Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.

Abstract: The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) arcylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.

Abstract: A resin composition useful in the fabrication of circuit boards comprises (i) 1˜15 W % of bismaleimide modified by barbituric acid (BTA) and its derivatives; and (ii) 20˜50 wt % of polyphenylene ether (PPE) chain-broken in a phenol resin; wherein the phenol resin is terpene phenol resin or dicyclopentadiene phenol resin. Other additives, such as curing agent, catalyst or inorganic particle additive can be added as well, based on requirements. According to the invention, terpene novolac resin and initiator (peroxide) are added in polyphenylene ether so that molecules are rearranged to form a PPE resin having lower molecular weight and higher crosslinking density. Furthermore, BMI/epoxy resin/PPE are combined in different weight percentages. Semi-interpenetrating polymer network structures are thus formed. Consequently, Tg and resistances both to heat and solvent of the resin are increased.

Abstract: The invention relates to high purity fluoropolymers and processes for making such materials. These polymers are particularly suited for applications in the semiconductor industry. The process comprises removal of unstable polymer end groups by fluorination and removal of heavy metal impurities by extraction with an aqueous acid medium.

Abstract: An epoxy resin hardener having a cure temperature of between about 60° C. and 100° C. comprises a mixture of: a) an imidazole or a trihydric compound having methylol groups at the 2- and 6-positions formed by reacting a 4-alkylphenol with 2 moles of formaldehyde, b) trimethylopropane, and c) tetramethylguanidine or a tetramethylguanidine derived from the reaction of a monepoxide, a diepoxide, a phenol and formaldehyde, or a dihydric phenol and formaldehyde.

Abstract: Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.

Abstract: A process for producing an epoxy resin composition for photosemiconductor element encapsulation which, even when a filler or the like is not contained therein, can have a viscosity necessary for molding and hence be satisfactorily molded to give a cured resin less apt to have defects such as burrs or bubbles. The process, which is for producing an epoxy resin composition for photosemiconductor element encapsulation comprising an epoxy resin, a hardener and a hardening accelerator as constituent ingredients, comprises: a first step of melt-mixing the ingredients together; and a second step of regulating viscosity of the molten mixture obtained in the first step at a given temperature.

Abstract: The invention relates to high purity fluoropolymers and processes for making such materials. These polymers are particularly suited for applications in the semiconductor industry. The process comprises removal of unstable polymer end groups by fluorination and removal of heavy metal impurities by extraction with an aqueous acid medium.

Abstract: Thermosetting resin compositions useful as underfill sealants for mounting a semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.

Abstract: A curing agent for epoxy resins comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and optionally, a monoepoxide to obtain an epoxide group-containing precursor, the precursor further reacted with a primary monoamine and/or a primary or secondary polyamine in at least a 10% molar excess relative to the epoxide groups of the precursor, the reaction product being substantially free of non-reacted amines; b) an amine-terminated adduct of an epoxy resin and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines; and c) an amine-terminated adduct of an epoxide group-containing reactive thinning agent and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines, wherein the epoxy resin of component b) and epoxide group-containing reactive thinning agent of c) are added to the epoxide group-containing precursor of component a) before the reaction

Abstract: Curable mixtures based on epoxy resins and amine hardeners, if required additionally using solvents, water, plasticisers, UV stabilisers, colourants, pigments, fillers, which mixtures contain as accelerator at least one compound of general formula (I), wherein R1, R2, R3, R4 are each independently of one another H or an unbranched or branched alkyl radical containing 1 to 15 carbon atoms, and n is 0 to 10.

Abstract: A curing agent for epoxy resins comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and optionally, a monoepoxide to obtain an epoxide group-containing precursor, the precursor further reacted with a primary monoamine and/or a primary or secondary polyamine in at least a 10% molar excess relative to the epoxide groups of the precursor, the reaction product being substantially free of non-reacted amines; b) an amine-terminated adduct of an epoxy resin and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines; and c) an amine-terminated adduct of an epoxide group-containing reactive thinning agent and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines, and up to 50 mol % relative to the amino groups of a reactive thinning agent containing one or more epoxide groups per molecule.

Abstract: Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combination of nitrogen containing compounds and transition metal complexes, and a polysulfide toughening agent.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: A conductive resin composition includes between 40 and 140 parts by weight of reactive epoxy resin, between 15 and 40 parts by weight of a reactive monofunctional glycidyl material, a cure accelerant, and 40 to 200 parts by weight of a conductive particulate material. The conductive resin composition forms a defect-free conductive coating on a substrate after mixing a one part epoxy resin composition under vacuum at a temperature insufficient to induce thermal cure. Adding a liquid epoxy resin to the one part epoxy resin composition to form a mixture combining 40 to 200 parts by weight of conductive particulate with the mixture and dispersing the combined conductive particulate and the mixture under vacuum until a homogeneous conductive resin paste results where the dispersing time for the combined conductive particulate and the mixture under vacuum is greater than or equal to the period of time of vacuum mixing the liquid one part epoxy composition.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing: (A) an epoxy resin and (B) a phenol resin represented by the following general formula (1): wherein R1 and R2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.

Abstract: An epoxy resin composition comprising an epoxy resin, a first curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth reaction and crosslinking reaction of the epoxy resin optimizes the reaction conditions to B-stage, giving a semi-cured film having a minimized variation. A laminate includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

Abstract: Hardeners for epoxy resins are disclosed which have the capability of curing at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. These novel hardeners include a range of reactivity which results in a range of pot lives from minutes to months. These materials co-cure readily with polyamines and have little or no amine odor. Mixture viscosity can be controlled over a wide range independent of filler concentration which allows a broad range of applications from coating and casting to adhesives. Class I hardeners contain a mixture of polyols, polyamines and tertiary amines and cure at temperatures between 20-50° C., while class II hardeners have the same polyols mixed with one or more tertiary amines and cure between 65-100° C. Class III hardeners contain the same polyols combined with either imadazole or dicyandiamide, and optionally, a tertiary amine and cure at 120° C.

Abstract: A latent curing agent is disclosed for epoxy resin, comprising a reaction product obtainable by allowing (A) an epoxy compound having more than one epoxy groups on the average in the molecule and (B) a compound having in the molecule both a tertiary amino group and at least one functional group selected from the group consisting of OH group, SH group, NH group, NH2 group, COOH group and CONHNH2 group, to react on each other in the presence of 0.05-5.0 equivalents of water per 1 equivalent of the epoxy group of Compound (A); and a curable epoxy resin composition comprising such curing agent and an epoxy compound having more than one epoxy group on the average in the molecule.

Abstract: An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or isocyanurate ring, and a compound containing less than 60 weight percent nitrogen, but not containing a urea derivative. A printed circuit board comprising the epoxy resin composition has low water absorption, excellent heat endurance, and a good adhesion with copper foil.

Abstract: A phosphorus-containing polymer having phenolic units and an epoxy rein composition are provided. The epoxy resin composition suitably comprises an epoxy resin and a hardener, wherein the epoxy resin may be obtained by reacting the polymer with epihalohydrin, and the polymer may further act as the hardener.

Abstract: A curing agent for epoxy resin comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and, optionally, a monoepoxide to obtain an epoxide group-containing precursor, the precursor further reacted with a primary monoamine and/or a primary or secondary polyamine in at least a 10% molar excess relative to the epoxide groups of the precursor, the reaction product being substantially free of non-reacted amines; b) an amine-terminated adduct of an epoxy resin and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines; and c) an amine-terminated adduct of an epoxide group-containing reactive thinning agent and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines.

Abstract: A cyanate ester-epoxy resin composition that can be cured to obtain a product which has excellent mechanical properties is provided. More particularly, a cyanate ester composition comprising (A) a cyanate ester in which the total content of impurities containing imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols is 5% or less, or a prepolymer thereof and (B) an epoxy resin is provided.

Abstract: An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature; wherein the adhesive composition optionally contains a liquid resin other than component (A) and/or an organic solvent and wherein the liquid resin including component (A), the organic solvent or both constitute from 10 to 55% by weight of the composition, and the use of this interlaminar adhesive composition to prepare a multilayer printed wiring board, and the process for preparing the multilayer printed wiring board are provided.

Abstract: The present invention provides an epoxy resin composition having excellent moldability, flame retardancy and soldering resistance and low in water absorption. More specifically, it provides an epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin in which the proportion of the carbon atoms of aromatic derivation to the whole carbon atoms in the epoxy resin is 70% or more, (B) a phenol resin in which the proportion of the carbon atoms of aromatic derivation to the whole carbon atoms in the phenol resin is 70% or more and whose phenolic hydroxy equivalent is 140 to 300, (C) a curing accelerator, and (D) an inorganic filler whose content W (wt %) in the whole epoxy resin composition satisfies 88≦W≦94, characterized in that the combustion starting temperature in thermogravimetric analysis of the cured epoxy resin composition in the air atmosphere is 280° C. or higher, or the retention A (wt %) of the cured product in said TG analysis satisfies W+[0.

Abstract: A curable mixture comprising at least one cyanate resin, at least one epoxide compound with more than one epoxy group per molecule, and a metal formula selected from the group consisting of MLxBy, M[SR]xBy, M[SR]x(N)y, M(PHal)m and M(PHal)m(N)n wherein M is a cation of a complexing metal, SR is an organic or inorganic acid residue, L is a chelating ligand, B is a Lewis base, PHal is an ion of a pseudohalide, N is a nitrogen base, x is an integer from 1 to 8, y is an integer from 1 to 5, z is an integer from 7 to 8, m is an integer from 2 to 3 and n is an integer from 1 to 2.

Abstract: The invention relates to curable mixtures based on epoxy resins and aminic hardeners and cure accelerators, and, optionally solvents, plasticisers, UV stabilisers, dyes, pigments and/or fillers, wherein there is used as cure accelerator from 1 to 20% by weight, based on epoxy resin, of at least one heterocyclic compound of the general formula (I) wherein R1, R2 and R3, which may be the same or different, are —(CH2)a—N—[(CH2)b—CH3]2 radicals in which a=2 or 3 and b=0 or 1.

Abstract: The present invention provides a thermosetting resin composition useful as an underfilling sealant composition which rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by short-time heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component and a latent hardener component. The latent hardener component includes a cyanate ester component and an imidizole component.

Abstract: Herein are disclosed a latent curing agent for epoxy resin, comprising a reaction product obtainable by allowing (A) an epoxy compound having more than one (1) epoxy groups on the average in the molecule and (B) a compound having in the molecule both a tertiary amino group and at least one functional group selected from the group consisting of OH group, SH group, NH group, NH2 group, COOH group and CONHNH2 group, to react on each other in the presence of 0.05-5.0 equivalents of water per 1 equivalent of the epoxy group of Compound (A), and a curable epoxy resin composition comprising (y) such curing agent and (x) an epoxy compound having more than one epoxy groups on the average in the molecule. The epoxy resin composition is an epoxy resin composition excellent in storage stability and rapidly curable at low temperatures.

Abstract: A self-dispersing curable epoxy composition is prepared upon contacting an epoxy resin with a polyoxyalkylenemonoamine having a molecular weight of from about 3,000 to about 15,000 in a ratio of about 0.001 to 0.060 reactive equivalents of polyoxyalkylenemonoamine to about 1.0 reactive equivalents of epoxy resin. The self-dispersing curable epoxy resin forms an aqueous dispersion upon mixing with water. When cured, the dispersion is useful as a coating composition.

Abstract: The invention provides aqueous, solvent based, and solvent-free curable coating compositions which include (A) the reaction product of an epoxy resin, acid, and tertiary amine; (B) a reactive diluent, and, optionally, (C) a curing agent. The compositions are useful for forming cured coated substrates, that are especially suitable for food and beverage packaging.